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While battery life is crucial for a laptop, it’s even more so for laptops running artificial intelligence (AI) applications that tend to consume a lot more power. So, Renesas has teamed up with Intel to develop a custom power management solution for laptops based on the new Intel Core Ultra 200V series.

The custom power solution encompasses a power management IC (PMIC), a pre-regulator, and a battery charger. These three purpose-built power devices collectively facilitate a compact form factor optimized for low-power mobile computing applications.

PMIC is purpose-built for Intel processors serving AI-enabled laptops. Source: Renesas

Start with the RAA225019 PMIC, which is configurable for Lunar Lake applications and features fully integrated power MOSFETs and current sensing circuitry. The highly integrated PMIC supports high switching frequencies, making it well-suited for small form factor applications without compromising efficiency.

Next, the RAA489301 pre-regulator is a 3-level buck converter designed to provide an optimized voltage range for the RAA225019 PMIC. This pre-regulator’s architecture bolsters thermal performance compared to traditional 2-level buck designs, enabling it to support a broad input and output voltage range. That also facilitates superior efficiency in compact, high-power-density applications, making it highly suitable for demanding power solutions.

These power management solutions come alongside tested reference designs and application support.

This announcement shows how AI-enabled mobile solutions are unleashing a new wave of design innovation in the power management realm. PMICs are likely to be at the forefront of this shift in power management needs catalysed by powerful processors serving AI applications.

Related Content

• Power Consumption and Battery Life Analysis
• How PMICs operate in image sensor-based designs
• Overview of power supply design using online tools
• Designs from Automotive to Wearables Tap PMICs for Power Efficiency
• PMIC with Two Independent Sources Opens Up Energy-Harvesting Possibilities

The post How AI laptops are remaking power management designs appeared first on EDN.

We’re all familiar with thermally activated fuses, where the conducting element self-heats due to current flow, melts at a defined current value, and breaks the flow path. They are simple in concept (although they have their own subtleties, of course), reliable, do one thing, do it well, and provide a first (or last) line of defense against overcurrent damage in a system.

They come in many variations including fast acting, time-delay, and slow-blow, to best-fit the needs of the application. Among the reasons their use is mandated by regulatory codes in so many installations is that they need no initialization, set-up, or software, and can’t be hacked or overridden, all of which adds to their credibility and confidence in their performance.

Current-handling ranges of fuses that most engineers encounter span a fraction of an amp to tens of amps. They come in myriad packages, ranging from the classic 3AG to larger cartridges, as well as blade style used in many cars, Figure 1.

Figure 1 Fuses are available with different current ratings, of course, but also countless packages, including the 3AG glass cylinder, ceramic cartridges of various sizes, and the automotive “blade” style. Sources: RS-Online; Automation Direct; and Harbor Freight Co.

But then I started to wonder: How do they make fuses for hundreds of amps? What’s their packaging? Do the fuses simply get proportionally larger as the current goes to those levels?

My “ignorance” is largely due to lack of exposure to the topic. Higher-power engineering was not a big thing at most engineering schools for many years. That specialty, which encompasses larger-scale power generation, storage, transmission, battery energy storage systems, and solar/wind installations, was considered a backwater niche and not as exciting as designing data networks, devising and coding algorithms, or building faster computers.

But that was then, and times have changed. Today, power engineering is a hot area with all the activity related to electrified vehicles (EVs and HEVs), renewable energy, powering data centers, backup power systems, and more. Look at it this way: an EV draws on the order of 100 A and more, so fusing capabilities must be ramped up to meet appropriate engineering and regulatory requirements. Clearly, this is not a place where electric fuses (e-fuses) alone are suitable.

Would such a fuse be ten times bigger than a standard 10-A fuse? Were there any design shifts of which I should be aware?

I looked into it, and I found there’s a large subclass of thermal fuses dubbed “high rupturing capacity” (HRC) fuses which may be bigger but otherwise look like regular fuses on the outside, yet have an invisible, inside twist: they are filled with sand (silica) or other material, Figure 2.

Figure 2 (left) The HRC fuse features a filler, usually sand; (right) the actual internal construction is more complicated, as shown by this one version (there are others, as well).  Sources: Electrical Maker and Swe-Check Pty Ltd

The main design elements that differentiate an HRC fuse from a lower-current conventional fuse—called a low breaking capacity (LBC) fuse—are:

• A heat-resistant, strong outer-fuse body, usually constructed from ceramic or fiberglass; LBC devices instead often have glass enclosures which are more likely to fragment when fusing action is initiated and the overload current is high.
• The cavity inside the fuse body is filled with fine silica sand or quartz to absorb the heat and energy of an over-current. In some cases, other materials such as powdered chalk, plaster of paris, or marble dust are used, but purified sand is most common.
• The metal caps or tags are solidly attached to the fuse body to create an air-tight seal to prevent any energy escaping in the event of an overload.

Why bother to do this? To my simplistic lower-current thinking, it seemed that once the fuse link overheats and opens, there’s not much to worry about.

But in the reality of the high-current world, that sort of simplistic thinking is misguided and even dangerous. The purpose of sand in the fuse is primarily to act as a heat-absorbing medium and to prevent the arc from continuing once the fuse element melts, Figure 3. That allows the fuse to safely interrupt very high fault currents (often several thousand amps) without causing damage to the fuse holder or surrounding equipment.

Figure 3 The current versus time characterization of the HRC fuse has some interesting transitions and jumps. Source: Electrical Maker

The sand or other filler in these fuses plays multiple roles:

• Cooling: When the fuse element melts due to excessive current, the sand absorbs heat, helping to cool the area and prevent fire or damage to surrounding components.
• Arc suppression: If a fuse blows, it can create an electrical arc. The sand helps to extinguish this arc by absorbing energy and providing a medium in which the arc can dissipate safely.
• Isolation: The sand can help to isolate the molten metal of the fuse element, preventing it from causing further short circuits or damage.
• Enhanced safety: By reducing the risk of arcing and overheating, sand contributes to the overall safety and reliability of the fuse.

In short: in an ordinary fuse—a length of exposed wire—the wire will melt and thus break the circuit; so far, so good. However, if a large current is flowing, the wire will also partially vaporize, and permit an arc to be formed. This arc may not be quenched even by the AC zero-volt crossing (and certainly won’t be for a DC circuit) but can continue for many cycles. The sand in the HRC fuse prevents the arc from forming, allowing the circuit to be opened safely and remain so.

There are two points here. First, it is not just a matter of “scaling up”. As with almost every other technical component, when you push the boundaries of capacity or size, things change and important enhancements to existing solutions are needed. While the laws of physics don’t change, their manifestations do. After all, in the electromagnetic spectrum, both gigahertz/terahertz waves and optical waves are defined by Maxwell’s equations, but their realities are very different. This is the case with high-current arcing across the open circuit presented by the blown fuse wire.

The second point nothing is as simple as it seems to be. When someone says, “what’s the big deal? It’s just a fuse” of similar, it really means they don’t know what’s involved. Even a simple function such as a fuse has its own design and fabrication issues that need to be understood and resolved.

Have you ever encountered a component which had unexpected design aspects due to its need to operate under harsh conditions or parameter extremes such as (but not limited to) voltage, current, temperature, or physical stress? Did you come to understand what had been done, and why?

Bill Schweber is an EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features.

Related Content

• E-fuses: warming up to higher-current applications
• Goodbye 3AG fuse, we’ll miss you
• Is there anything silicon can’t do?
• Fuse failures
• An accurate resettable fuse

The post High rupture capacity fuses: same idea, different reality appeared first on EDN.

Microchip’s RTG4 FPGAs with lead-free flip-chip bumps have achieved QML Class V qualification, the highest level for space components. This status, designated by the Defense Logistics Agency, ensures exceptional reliability and longevity for critical space missions. QML Class V-qualified products also help customers streamline their design and certification processes.

According to Microchip, the RTG4 radiation-tolerant FPGA with lead-free flip-chip bumps is the first of its kind to gain QML Class V status. Flip-chip bumps are used to connect the silicon die and the package substrate, while the lead-free material extends the longevity of the product. The flip-chip bump is contained within the FPGA package, so converting to these new RTG4 FPGAs has no impact on the user’s design, reflow profile, thermal management, or board assembly process.

With a flash-based fabric, RTG4 FPGAs deliver high density and performance for space applications, consuming significantly less power than equivalent SRAM-based FPGAs. They also exhibit zero configuration upsets in radiation environments, eliminating the need for mitigation measures.

The RTG4 FPGAs are supported by development kits, mechanical samples, and daisy chain packages for board validation and testing. To learn more, click the product page link below.

RTG4 series product page

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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With a 2000-V breakdown voltage, Infineon’s IDYH80G200C5A CoolSiC Schottky diode suits systems with DC link voltages up to 1500 V. The Gen 5 silicon carbide (SiC) diode offers current ratings from 10 A to 80 A, making it well-suited for solar and EV charging applications.

The diode comes in a TO-247PLUS-4-HCC package with 14-mm creepage and 5.4-mm clearance, supporting up to 80A. This enables developers to reach higher power levels with half the component count compared to 1200-V solutions. The reduced component count simplifies the overall design and eases the transition from multilevel to two-level topologies.

Infineon’s .XT interconnection technology enhances the Schottky diode’s resistance to humidity, extending system lifetime. According to the company, it also significantly reduces thermal resistance and impedance, improving heat management.

The IDYH80G200C5 CoolSic Schottky diode is available now.

IDYH80G200C5 product page

Infineon Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post SiC diode handles high DC link voltages appeared first on EDN.

The RX260 and RX261 groups of 32-bit MCUs from Renesas feature a capacitive touch sensing unit with high noise immunity and water resistance. These 64-MHz microcontrollers consume 69 µA/MHz when active, dropping to 1 µA in standby mode. With their low-power operation and touch capabilities, the RX260/RX261 MCUs are well-suited for home appliances, building and factory automation, e-bikes, and smart locks.

Based on an RXv3 CPU core, the devices achieve a CoreMark score of 355 at 64 MHz, up to 2.5 times higher than comparable 64-MHz MCUs. Renesas also reports 25% lower active current and 87% lower standby current than similar MCUs, enabling customers to meet strict energy regulations for home appliances and extend the operating time of battery-powered equipment.

The capacitive touch IP (CTSU2SL), included as an HMI function, offers multi-frequency scanning to reduce false detection due to external noise and an automatic judgement function to detect touch events without CPU activation. QE for Capacitive Touch V4.0.0, a development assistance tool, simplifies the initial settings of the touch user interface and sensitivity tuning.

In addition, RX261 microcontrollers feature RSIP-E11A security IP with built-in AES, ECC, and SHA encryption engines and security management features. They also add full-speed USB and CAN FD interfaces.

Both the RX260 and RX261 groups of MCUs are available now from Renesas and authorized distributors.

RX260 product page 

RX261 product page 

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Vishay’s 299 PHL-4TSI series of snap-in aluminum electrolytic capacitors includes a diverse selection of 350-V, 500-V, 550-V, and 600-V devices. Recent additions significantly broaden the capacitance-voltage combinations available to designers, with a rated capacitance range of 270 µF to 3300 µF.

The 299 PHL-4TSI devices are polarized aluminum electrolytic capacitors with a non-solid electrolyte, suitable for smoothing, filtering, and energy storage in applications such as power supplies and renewable energy converters. Their 4-terminal configuration enhances mechanical stability and ensures keyed polarity. Cylindrical case sizes range from 35×50 mm to 45×100 mm.

The snap-in capacitors feature ripple current ratings ranging from 1.9 A to 7.6 A and operate over a temperature range of -40°C to +105°C. They also provide a useful life of over 5000 hours at +105°C, enhancing end-product longevity.

Samples are available in small quantities from catalog houses. All 299 PHL-4TSI values are currently available in production quantities, with lead times of 18 weeks.

299 PHL-4TSI product page 

Vishay Intertechnology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Capacitor lineup expands capacitance-voltage combinations appeared first on EDN.

Several series of AC/DC controllers from Nexperia provide lower standby current and higher conversion efficiency for flyback converters. The NEX806xx and NEX808xx are quasi-resonant/multi-mode flyback controllers that operate over a VCC range of 10 V to 83V, while the NEX81801 and NEX81802 are adaptive synchronous rectifier (SR) controllers. These components are suited for applications like power delivery (PD) chargers, adapters, industrial and auxiliary power supplies, wall sockets, and strip sockets.

The ICs work with Nexperia’s NEX52xxx PD controllers and other discrete power devices to create a turnkey flyback converter solution. This setup optimizes current sense voltage levels and PFM mode, reduces standby power, and ensures high efficiency across all load ranges.

The primary side controller directly drives either a silicon MOSFET or a GaN HEMT. Additionally, the SR controller employs an adaptive control method to prevent mis-conduction in switching devices, improving overall system reliability.

All of the devices are available in TSOT23-6 packages with low thermal resistance. To learn more about Nexperia’s AC/DC controller ICs, click here.

Nexperia

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post AC/DC controllers boost efficiency in flyback design appeared first on EDN.

Audi’s Q6 e-Tron, hitting the road in 2024, will sport handsfree secure car access via a smart mobile device and this capability is built around an ultrawideband (UWB) semiconductor device to precisely identify the driver’s location in relation to the car. The car, which only needs a single UWB device to measure distance, can locate a person near a door or tailgate and then respond according to driver preferences.

UWB, a wireless technology that enables extra security capabilities and has already gained traction in smartphones for identification features, adds location sensing to a vehicle key fob to mitigate security challenges like key fob spoofing. In other words, it precisely identifies the location of the driver in relation to the car, allowing the doors to be unlocked only when the driver is near the car.

Source: NXP

Drivers can unlock and start their car handsfree using a digital key on a UWB-enabled smartphone or wearable, which can remain in the driver’s pocket or bag. In addition to handsfree access to cars, UWB can support other use cases such as automated electric vehicle (EV) charging.

Audi Q6 e-tron’s handsfree car entry is powered by NXP’s Trimension NCJ29Dx family of UWB chips that deliver high localization resolution and power optimization for battery-powered devices like key fobs. These USB devices also offer maximum protection against car theft through relay attacks with on-chip support for a wide range of cryptographic operations.

It’s worth mentioning that NXP’s Trimension NCJ29Dx family is part of NXP’s larger portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range microcontroller. And these two devices are also part of Audi’s secure car access platform.

NXP’s Trimension NCJ29Dx devices—compliant with 802.15.4, Car Connectivity Consortium (CCC), and FiRa Consortium standards—have a production win in Audi vehicles, and that cements UWB’s place in real-time, accurate distance measurement between driver and vehicle. Other UWB features besides precise and secure real-time localization could also be in play in upcoming vehicles.

Related Content

• The Future of Automotive Connectivity
• Ceva’s UWB Radar Detects Child Presence in Cars
• Enhancing security of passive keyless entry with UWB technology
• NXP Adds Latest Automotive UWB chip as BMW Drives Digital Key 3.0
• Volkswagen and NXP Show First Car Using UWB To Combat Relay Theft

The post UWB enables handsfree, secure car access via smartphone appeared first on EDN.

First please read this earlier post where I noted how Hydrotherapy equipment for my physical therapy after a foot surgery had “scalding” temperatures set to 120°F (Figure 1).

Figure 1 Hydrotherapy equipment with scalding water temperature is 120oF and beyond.

Then see this more recent post and be prepared for a shock.

The post on Inside Edition describes how a man was killed after being exposed to a water shower where the hot water temperature was 150 degrees Fahrenheit (150°F). This was way, way higher than the scalding threshold of 120°F mentioned in the earlier EDN post.

No mention was made, but I rather suspect, that the man who was killed may have let the hot water run for a while before stepping into the shower to avoid being chilled by cold water and that he did not test the shower water by hand first. Had he checked, he would have avoided the scalding.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related articles:

• Understanding circular polarization
• How hot is too hot to touch?
• Misconception revealed: Can a heat sink be too big?
• Goodbye, thermal grease; hello, integral heat sink?
• Non-electronic instrument measures water depth and temperature
• Common-impedance plumbing
• The case of the too-hot laptop

The post Part 2: How hot is too hot to touch?  appeared first on EDN.

An electromagnetic wave or signal traveling from “here” to “there” has an electrostatic field component that we call its E-field and whose direction we assign as the signal’s polarity. Often, the E-field is either vertical or horizontal as developed by a dipole structure or a ground plane antenna, but it can also be rotary which means it can be rotating around the signal’s axis of travel. The conventional terminology for that case however is not the word “rotary”, it is the word “circular”. We thus speak of vertical polarization, horizontal polarization, and circular polarization.

What grammarian made that decision is anyone’s guess, but that’s how things are.

It isn’t hard to create a circularly polarized signal. Please see Figure 1.

Figure 1 Making a circularly polarized signal is achieved by feeding both polarizations at the same time but with a 90o signal phase shift between the two.

A circularly polarized signal has a handedness which is defined from the point of view of the signal’s recipient. If the E-field is rotating clockwise from the recipient’s observation point, the signal is right hand polarized (RHP). If the E-field is rotating counterclockwise from the recipient’s observation point, the signal is left hand polarized (LHP). When I was at Sirius Satellite Radio prior to the merger with XM Radio, I learned that their Sirius satellite signals were LHP.

If you the recipient of an incoming signal point your right-hand thumb along the axis of signal arrival, your remaining four fingers will curl to your right for RHP, the direction of E-field rotation. If you the recipient of an incoming signal point your left-hand thumb along the axis of signal arrival, your remaining four fingers will curl to your left for LHP, the direction of E-field rotation.

Got that?

One advantage of circular polarization is a reduced susceptibility to signal fading over long distances. Various factors can affect the polarization of the traveling signal, and the degree of fading can be different between different degrees of polarization angle. Vertical and horizontal polarizations share this vulnerability.

Circular polarization is less susceptible to signal fading since the polarization most easily propagated is achieved whatever the intervening propagation environment might happen to be. In ham radio, this is a noted advantage of “cubical quad” antennas over multi-element Yagi antennas. Cubical quads deliver circular polarization.

Please see this article.

Where “QSB” stands for signal fading and “DX” stands for long distance communication, we find the following:

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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• RFID Basics: Antenna Polarization
• Tutorial: Radio Basics for UHF RFID–Part VI
• Take advantage of smaller beam widths and higher frequencies in antenna designs
• Minimize lightning damage on satellite antennae

The post Understanding circular polarization appeared first on EDN.

Figure 1 is a cheap and cheerful voltage inverter I offered awhile back in “A simple, accurate, and efficient charge pump voltage inverter for $1”.

Figure 1 The generic and versatile xx4053 provides the basis for a cheap, efficient, and accurate voltage inverter.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Shortly thereafter the idea morphed into an uncomplicated, inexpensive, and fairly fast (1 MHz), low power voltage to frequency converter (VFC): “Voltage inverter design idea transmogrifies into a 1 MHz VFC”. See Figure 2.

Figure 2 Modified voltage inverter becomes power thrifty 1 MHz VFC.

 An interesting quirk of the Figure 2 circuit is that, although it is described as a voltage to frequency converter, it could just as accurately be called a current to frequency converter. That’s because input current =Vin/R1 charges C3 making transconductance amplifier Q1, Q2 complete a feedback loop through the charge pump oscillator. The loop continuously adjusts Fpump to balance pump current to be equal and opposite to input current,

Ipump = 5*C2*Fpump = Iin

Fpump = Iin / (5 C2 R1) = Iin / (5*100pF) = 2 kHz/µA

This makes possible some unusually simple and economical sensor interface topologies like the one in Figure 3.

Figure 3 Eight thermistors can share a single excitation resistor.

A typical NTC thermistor’s datasheet (e.g., Molex 2152723605) summarizes its characteristics with four parameters like these from the 2152723605 sheet, shown in parentheses.

To = rated/calibration temperature (25°C = 298.15K)     (1)

Ro = resistance at To (10k+/-1%)                                       (2)

b = beta (3892K)                                                                   (3)

dissipation (self-heating) factor (1.5 mW/°C)                (4)

Then thermistor resistance (Rt) as a function of temperature (T) in Kelvin is predicted by:

Rt = Ro exp(b(T-1 – To-1))                                                     (5)

 Choosing a value for excitation resistor R1 requires estimating the highest temperature (Tmax) any of the thermistors is expected to be immersed in, and hence the lowest resistance to be read. Then we figure

Rx = Ro exp(b(Tmax-1 – To-1))                                             (6)

R1 = 10k – Rx                                                                        (7)

If calculation #7 calls for R1 < 0, then R1 is of course simply omitted. Taking for example Tmax = 100oC and numbers from the 2152723605 datasheet, Rx = 725, R1 = 10000 – 725 = 9275, to which the nearest standard 1% value is 9310.

The addressing of the thermistor to be read is done by output of the connected microcontroller by its three-bit binary U2 address on general purpose output lines GP0-2. A microcontroller internal counter-timer peripheral connected to input CTPin is then enabled to accumulate VFC pulses for 216 µs = 65.536 ms. Call the accumulated 16-bit integer ADC. Then the calculation of acquired temperatures, assuming 2152723605 sheet numbers again, would proceed thusly:

X = ADC/216 = 10k / (R1 + Rt)

X*(R1 + Rt) = 10k

Rt = 10k/X – R1 = 10k/X – 9310

T = (Ln(Rt/Rx)/b + Tmax-1)-1

oK = (Ln(Rt/725))/3892 + 0.002680)-1

oC = K – 273.15

 The conversions are inherently radiometric, therefore insensitive to 5-V rail noise and tolerance, and integrating, making them highly noise pickup resistant. Which are not bad features for a two buck ADC.

Multiplexor U2’s error contributions—Ron and Roff—are, respectively, small (~60 ohms) and large (~100 Mohms) enough to not be significant factors.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

Related Content

• A simple, accurate, and efficient charge pump voltage inverter for $1 (in singles)
• Voltage inverter design idea transmogrifies into a 1MHz VFC
• Turn negative regulator “upside-down” to create bipolar supply from single source
• Single supply 200kHz VFC with bipolar differential inputs
• New VFC uses flip-flops as high speed, precision analog switches
• Inexpensive VFC features good linearity and dynamic range

The post Capture 16-bit readings of 8 thermistors in less than 1 second for $2 appeared first on EDN.

RVA23 Profile, a major release for the RISC-V software ecosystem, has been ratified, and it’s expected to help accelerate widespread implementation among toolchains and operating systems. Before ratification, it underwent a lengthy development, review, and approval process across numerous working groups. RVA23 Profile has now received the final ratification vote by the RISC-V Board of Directors.

RISC-V has more than 80 technical working groups that collectively advance the RISC-V ISA capabilities. They aim is to address the need for portability across vendors with standard ISA Profiles for applications and systems software.

RVA Profiles—which align implementations of RISC-V 64-bit application processors running rich operating system (OS) stacks from standard binary OS distributions—are crucial for software portability across many hardware implementations and thus help avoid vendor lock-in.

Each Profile specifies which ISA features are mandatory or optional, providing a common target for software developers. Mandatory extensions are assumed to be present, while optional extensions can be discovered at runtime and leveraged by optimized middleware, libraries, and applications.

“Profiles are the foundations of application and systems software portability across RISC-V implementations,” said Andrea Gallo, VP of technology at RISC-V International. “A large software ecosystem is only possible with a standard Profile for software vendors to target and within which multiple suppliers can work together.”

Vector extension and hypervisor extension are key components of the RVA23 Profile. Vector extension, which aims to accelerate math-intensive workloads such as AI/ML, cryptography, and compression/decompression, is critical for better performance in mobile and computing applications. RVA23 is the baseline requirement for the Android RISC-V ABI.

Next, hypervisor extension enables virtualization for enterprise workloads in both on-premises server and cloud computing applications. That, in turn, accelerates the development of RISC-V-based enterprise hardware, operating systems, and software workloads.

An Omdia research forecasts that RISC-V processors will account for almost a quarter of the global market by 2030. Then, there is a statement from Calista Redmond, CEO of RISC-V International, which claims that the RISC-V community has grown tremendously to more than 16,000 engineers worldwide.

The ratification of the RVA23 Profile is expected to aid RISC-V’s community growth as it will enable software vendors to successfully sell their software and services on a wide variety of RISC-V products.

Related Content

• Startups Help RISC-V Reshape Computer Architecture
• RISC-V migration to mainstream one startup at a time
• Amidst export restrictions, RISC-V continues to advance
• Accelerating RISC-V development with network-on-chip IP
• Certifying RISC-V: Industry Moves to Achieve RISC-V Core Quality

The post RVA23 Profile ratification bolsters RISC-V software ecosystem appeared first on EDN.

A full-bridge converter provides an efficient solution for isolated power conversion (Figure 1). Within this topology, the choice of control method will affect the overall performance of the converter. Most engineers only consider a hard-switched full bridge (HSFB) or a phase-shifted full bridge (PSFB). In this power tip, I will demonstrate a simple modification to a pulse width modulation (PWM)-controlled full bridge that can improve efficiency by achieving zero-voltage switching (ZVS) and eliminate the resonant ringing on the transformer windings.

Figure 1 An example of a synchronous HSFB converter power stage. Source: Texas Instruments

An HSFB converter uses two output signals (OUTA and OUTB) that are 180 degrees out of phase to control the diagonal pair of FETs on the primary-side bridge, shown in Figure 1. The controller allows three states for the primary-side FETs: OUTA high and OUTB low, OUTB high and OUTA low, and both OUTA and OUTB low. To maintain regulation, the controller modulates the ratio of time spent in each state.

Figure 2 shows (from bottom to top) the OUTA and OUTB signals, the switch-node voltages on each side of the primary bridge, and the primary winding current. The switch nodes return to half of the input voltage during the dead time when both OUTA and OUTB are low.

Figure 2 Conventional configuration for driving opposite FETs on the primary side (1 µs/div). Source: Texas Instruments

When no primary-side FETs are on during the dead time, the secondary current will continue to freewheel through the synchronous rectifiers. At this time, leakage energy stored on the primary side resonates with the output capacitance of the primary-side FETs, creating a large leakage spike when either OUTA or OUTB go low. This resonance impacts all four FETs on the primary side. Figure 3 shows how large the leakage spike can get. In practice, a large leakage spike may require you to use higher-voltage components.

Figure 3 Primary switching nodes with a conventional configuration (400 ns/div). Source: Texas Instruments

An alternate approach is to control the primary FETs with complementary logic on each half of the bridge. In this method, PWM high turns the high-side FET on, and PWM low turns the low-side FET on. Figure 4 shows a diagram using this approach.

Figure 4 An example of a synchronous ZVS full-bridge converter power stage. Source: Texas Instruments

Figure 5 shows the PWM, switch-node voltages and primary current for this approach. With complementary signals on each side of the primary bridge, both low-side FETs are now on during the dead time. This enables the primary current to continue to freewheel through the two low-side FETs during what used to be the dead time in the conventional approach.

Figure 5 Complementary PWMs for driving FETs on the primary side (1 µs/div). Source: Texas Instruments

 The freewheeling current on the primary side has many benefits. First, the primary-side FETs achieve ZVS. Figure 6 shows the primary switch nodes and PWM logic for one side of the full bridge during ZVS events. The drain-to-source voltage falls to zero before the introduction of the gate-drive signal, which indicates ZVS.

Figure 6 Primary switching nodes with complementary PWM configuration (400 ns/div). Source: Texas Instruments

 Another benefit is less noise throughout the converter. The large leakage spike and resonant ringing are eliminated when going from the primary switch-node waveforms in Figure 3 to Figure 6. The secondary rectifier also has reduced noise after changing the primary to get ZVS.

Figure 7 compares the drain-to-source voltage of the secondary rectifiers for both design options. The HSFB variation has noticeably more ringing that needs a snubber to mitigate stress at the expense of decreased overall system efficiency. Changing to ZVS on the primary leads to less ringing on the secondary FET. There is still a leakage spike present, however for this case a diode clamping circuit is more suitable than a snubber.

Figure 7 Conventional configuration (400 ns/div) (left); using complementary PWM signals (1.00 µs/div) (right). Source: Texas Instruments

The introduction of ZVS alone provides an efficiency boost across loading conditions. Figure 8 compares a modified HSFB reference design, the “100W, 5V Output Hard-Switched Full-Bridge Converter Reference Design for 100kRad Applications”, that uses ZVS logic on the primary side to the initial data that was an HSFB. The logic to the primary FETs was the only change; optimizations to the primary-side FET driver and improvements to the secondary-side protection circuit would further increase the benefits of this approach.

Figure 8 The total power loss versus output power for conventional (TI HSFB reference design revision B) and PWM (modified board) configurations. Source: Texas Instruments

Using complementary logic on a full-bridge converter can enable the primary FETs to achieve ZVS. This approach has many benefits for system efficiency, and the approach is easy to implement.

In test cases, a standard synchronous full-bridge converter only needs the logic adjusted to generate the complementary signals. You can make this adjustment by using a logic NOR gate; alternately, some drivers such as the Texas Instruments TPS7H6003-SP gate driver used in the HSFB reference design have a PWM mode where a single input signal drives the high-side FET when the signal is high, and drives the low-side FET when the signal is low. As you can see, this subtle change in control logic can pay big dividends in system performance.

John Dorosa is a Systems Engineer in Texas Instrument’s Power Design Services team focused on industrial and aerospace applications. Since joining the team in 2017 John has developed over 100 unique SMPS reference design boards to meet custom power requirements. His work covers a broad range of non-isolated and isolated topologies that were optimized for a few milliwatts to 500 watts. He received a Bachelor of Science in electrical engineering from Michigan State University in East Lansing, MI.

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Mid-last year, in one of my more recent LED light bulb-themed teardowns, I noted the feature set extension that manufacturers were undertaking with the aspirations of differentiation, competitive isolation and consequent profitability:

Such innovations are fundamentally enabled by LEDs’ inherent low power consumption and heat dissipation, along with their inherent reliance on a DC voltage source. Several of these differentiated offerings (color temperature, multi-color, network connectivity) have also found their way to my teardown table, while others (integrated speakers, candelabra and other shapes) are still awaiting their turns in the analysis spotlight.

What I admittedly didn’t expect, however, were devices that were lightbulb-shaped (to not draw attention to themselves) but that (mostly, at least) dispensed with the illumination function, leveraging the AC power coming out of the socket for other purposes (including, it turns out, speakers). Today’s teardown victim, LaView 4 Mpixel Bulb Security Camera, is one such example:

(there’s also a nifty 360° product view on the company’s website)

Back in February I picked up a two-pack on sale for $35.06 plus tax at Amazon. One’s showcased today; the other is destined for donation to charity. The broader product family is quite diverse:

• Colors:
  • White (mine)
  • Black
• Connectivity:
  • 4 GHz Wi-Fi only (mine)
  • 4 and 5 GHz Wi-Fi
  • LTE
  • 5G and 2.4 GHz Wi-Fi
• Quantity:
  • Single
  • Pair (mine)
  • Five-pack
  • Eight-pack

As usual, I’ll start with a series of packaging shots:

Lift the lid and move aside the flaps on the outer box and the camera pair comes into view:

Next comes extraction of one of the two:

The literature suite:

includes one sliver of paper specifically devoted to initial setup:

To get the camera as close as possible to the Wi-Fi broadcast source during this initialization process, LaView included an adapter (as usual accompanied by a 0.75″/19.1 mm diameter U.S. penny in the following photos for size comparison purposes) to temporarily alternatively power the unit via a conventional AC plug:

LaView also included an extender in case the camera won’t as-is fit in the intended final-destination light bulb enclosure:

And here’s today’s patient, for which I can’t find standalone dimensions-and-weight specifications online, only those for the packaged unit(s). My tape measure suggests that it’s about 6.5” long and 3.25” at its widest point, and the kitchen scale reports it weighs 10.8 oz.

Reviews on the device are at-best mixed, but I’ll give LaView kudos for at least (and in contrast to other devices I’ve dissected) making the “remove plastic before using” warning prominent:

The left- and right-side views are predominantly unmemorable, so I’ll point out the mid-body seam that enables side-to-side camera rotation (with implementation to be revealed shortly), along with a more subtle lower seam around the “globe”:

The back, thankfully, is a bit more interesting:

A clarification before proceeding: the camera can perhaps obviously be mounted at any angle to the horizontal, depending on the mated light bulb socket’s orientation. However, for consistency purposes (aligned with the frontside markings), I’m going to assume that it’s installed thusly:

Therefore, I’m claiming that this sticker is toward the top:

And the speaker (used to communicate via the mobile-device app with a front-door potential burglar, for example) is toward the bottom:

Orientation also matters when it comes to water resistance. LaView claims that the device has an IP 66 rating, which is:

• Totally dust tight. Full protection against dust and other particulates, including a vacuum seal, tested against continuous airflow (first “6” digit), and has
• Protection against direct high-pressure (fluid) jets (second “6” digit)

Again, user feedback both on the company’s own website (awkward) and at Amazon, for example, renders these claims a “bit” dubious. But they’re clearly only valid at all if the ventilation vents on the bottom end are pointed downward, away from rainfall and such:

On the top end, of course, is the base, cap-protected as packaged, that screws into the socket:

Time to dive inside. The aforementioned “more subtle lower seam around the globe” seems like a promising place to start:

Voila:

And there’s the speaker!

It turns out that, reminiscent (at least to me) of a couple of Matryoshka dolls:

there’s an inner case, too:

Yep, you guessed it:

A wiring-passage orifice, a couple of airflow vents, and four more screws to go:

In the midst of popping open the inner case, by the way, I came across the flap-covered access to the microSD card slot and reset button shown in the earlier “stock” diagram:

Here’s what it looks like on the other (intact) unit, after I rotate the camera lens out of the way:

And now back to our patient; we’re finally inside at least this portion of the device:

To the right is the formerly screw-attached motor whose bracket affords vertical pivots:

And to the left is a PCB, connected the remainder of the device’s electronics by several cable harnesses (one of which had a connector glued in place, which I therefore initially left as-is):

and held in place by six screws:

We have liftoff:

Hey, look, it’s a camera! (duh):

For reasons I’ll explain shortly, I suspect there’s no IR filter over the image sensor in the center:

The IC in the upper left, AltoBeam’s ATBM6012B, is the Wi-Fi transceiver (as if you hadn’t already guessed from the embedded-antenna markings in its upper right corner on the PCB). The IC doesn’t also support Bluetooth, but as this setup video shows, it’s not necessary; cleverly, the camera instead receives its initial network setup information visually:

One other comment before proceeding; notice the (unpopulated) matching IC site to the upper right of the ATBM6012B? Always makes me wonder what was originally planned to be there.

On the PCB’s other side is (among other ICs) the system SoC, an Ingenic T31 toward the left:

In its upper right corner is a Winbond W25Q64JV 64 Mbit serial NOR flash memory, presumably storing the system firmware. Above it is another set of PCB-embedded Wi-Fi antenna markings. And at far right are the enclosure for the microSD card slot and the reset switch.

Now let’s return our attention to the earlier-glimpsed front bezel. Behind that glob of adhesive is the microphone:

Remove the three screws shown:

And the front cover comes off:

Two more to go:

And the LED assembly is free:

Let’s pause on this last photo for a minute. LaView’s website makes the following claims:

Vibrant Nights with Starlight Color Night Vision

 Illuminate the darkness like never before with our cutting-edge security camera, featuring Starlight Color Night Vision. Equipped with a powerful starlight sensor, our device captures crystal-clear, full-color images even in the faintest lighting conditions. Rest assured, whether it’s day or night, you’ll experience unparalleled visibility and security for your home.

I found this assertion confusing when I read it. Typically, in dim lighting, a security camera will bypass the IR filter normally ahead of the image sensor, resulting in still-meaningful albeit monochrome captured images. The lens assembly’s wiring harness, shown in earlier shots, whose on/off status controls the positioning of the IR filter, suggests that a similar technique finds use here, not to mention the seeming mix of conventional (primarily intended, via mobile-device app control, to shine light on a front-door potential burglar, for example) and IR LEDs in the above photo.

How, then, is LaView getting dim light full color (or at least a semblance) images out of the camera? A clue comes from the “Starlight” branding. My guess is that the Ingenic T31 (which touts a “Starlight ISP” with “Dedicated optimizations for low light and surveillance scenarios”) is mixing together whatever conventional ambient light remains usable from the image sensor with IR augmentation. So, is it “full color”? Arguably. But (maybe) still better than IR-only.

Speaking of which, let’s take one more look at that lens assembly from multiple angles:

A revisit of the PCB, this time with that final originally glued connector now severed:

And, last but not least, let’s see if we can figure out how the camera rotates horizontally (per that earlier mentioned thicker seam running around the center of the device). The answer, I suspect, lies behind this single screw:

Alas, what’s underneath is thoroughly “potted” (aside from the obvious additional motor):

Oh well. That’s all for today, then. Share your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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• Freeing a three-way LED light bulb’s insides from their captivity
• Teardown: A19 LED bulb
• Teardown: Blink XT security camera

The post Dissecting incandescent-reminiscent stealth security appeared first on EDN.

As wearables get smaller, and foldable devices gain popularity, they’re running into a common challenge. Their rigid components—batteries, in particular—limit how compact or flexible they can be. While shrinking their size has yielded some success, a more promising solution is to develop stretchable, pliable power cells.

Researchers have experimented with flexible lithium-ion (Li-ion) batteries throughout the past decade to varying degrees of success. Historically, maintaining acceptable performance after bending and twisting has been difficult, as repeated deformation often degrades electrodes. Physical damage, high costs and complex manufacturing have likewise proved challenging.

Despite these obstacles, the industry is getting closer. The American Chemical Society recently developed a Li-ion battery that can stretch up to 5,000% times its original length while remaining stable. Instead of placing hard components in a flexible medium, the scientists made every part of it stretchable. While the battery is only reliable for 70 charge cycles, it’s an impressive step forward.

Another solution, which used carbon nanotubes and a gel polymer electrolyte, retained 93% of its capacity after 150,000 cycles of deformation. The electrodes were also 1.6 times as energy dense as conventional components, allowing a smaller battery to deliver the same amount of power.

Source: Panasonic

Success stories like these are becoming increasingly common. As that trend continues, it may not be long before flexible Li-ion batteries are ready for large-scale adoption in the electronics industry.

Viability of flexible batteries

The advent of bendable batteries could have massive implications for electronics designers. Large versions would spur marked improvements in electric vehicles (EVs). Over one in four passenger vehicles will be an EV by 2030, but as they grow, so do concerns about Li-ion cells’ safety. A flexible battery is less likely to combust and can absorb more impact, making it a safer option.

Consumer electronics would likely gain the most from pliable batteries of any segment. Foldable phones could become thinner and give designers additional options for how to arrange components around moving parts. Wearables could get smaller without sacrificing battery life.

Within the wearable umbrella, smart textiles would see particularly strong growth. Researchers have already developed connected shoes and yoga mats that can predict motion with 99% accuracy, and flexible batteries would take similar applications further. Clothing could monitor health factors like body heat and perspiration, and worker safety vests could come with built-in location tracking.

Flexible batteries reshaping wearables

Currently, wearables designers face a choice between the functionality batteries enable or the flexibility of energy harvesting systems. Thin, bendable power cells combine these benefits to open new possibilities. Breaking past conventional constraints would lead to greater freedom of design and novel ways to serve niche markets.

Flexible batteries still require some advancement before they’re ready for industrial-scale implementation. However, the sector could get there sooner than some may expect. Given how big the implications are, electronics engineers should stay up to date with how this technology progresses.

Capitalizing on stretchable power cells would improve electronics safety, create more functional wearables, and open the door to new markets. That’s too great an opportunity to overlook. Learning about the potential today is the first step to making the most of it tomorrow.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

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• Flexible Batteries, Electronics Expand
• Flexible electronics tech shows progress
• Unveiling Trends and Insights in Solid-State Battery Technology
• Flexible battery tech could support wearable, textile applications
• Will EV Battery Design Developments Help or Hinder the Second-Life Battery Market?

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Engineers working on embedded systems or Internet of Things (IoT) projects must contend with the trade-offs between performance and cost that affect every aspect of that design. Security is as much a part of that equation as processing speed and memory capacity.

When it comes to enforcing security in any cost-constrained application, a balance needs to be struck between the protections that the application needs and the capabilities of a device that meets the cost profile of the target market. It is easy to assume that a microcontroller that incorporates some security mechanisms will deliver the protections needed.

But there are many ways in which the hardware, firmware and system environment interact that can lead to unforeseen vulnerabilities. Developers need to be aware of the distinctions between different forms of hardware support for embedded-systems security.

Ideally, a hardware platform will contain several elements designed to protect firmware, data and communications that act together to provide a root of trust.

Figure 1 A hardware root of trust is the foundation of a IoT device and network security. Source: PSA Certified

Manufacturers will often incorporate those functions into a module integrated into the main processor or system-on-chip (SoC) in the IoT device. Alternatively, a secure element connected to a serial port of the main processor provides the required functionality.

Hardware suppliers must make choices that balance cost and functionality, which will affect development and could compromise security more than expected if the developer does not consider details of the implementation. Even within the same product family, the support for hardware security can vary widely.

For example, the Espressif ESP32 SoC is used in many IoT platforms. Some will be accompanied by a separate secure element, such as the Microchip’s ATECC608. Some versions of the ESP32 include an on-chip controller that manages the device’s security infrastructure. This on-chip controller often includes features like a digital signing peripheral with eFuse support, which enhances the security capabilities of the device.

The electrical fuse (eFuse) technology facilitates permanent storage of security-critical data, such as encryption keys or device-specific information, making it harder for attackers to compromise the system. However, some platforms include neither the on-chip controller nor a separate secure element, which means more of the security apparatus needs to be implemented in software.

Basic protections

Microcontrollers for many years have offered a basic level of memory protection, such as protecting firmware and configuration memory against illegal writes by application code. Another common protection mechanism, usually to protect intellectual property (IP), is to encrypt the firmware, which is typically stored in flash memory. This protects against basic reverse engineering techniques and provides a way to protect data, such as data-encryption keys, that should remain private.

A microcontroller will usually store the memory-decryption key in on-chip configuration memory, possibly using e-fuses to guarantee immutability and strong protection. At rest, the data encrypted using that key sits in flash memory. This protects it from being used by an attacker who tries to read the block directly.

However, once sensitive data and keys held in the encrypted flash blocks are moved into memory, they are available in plaintext form. If an attacker can probe the memory of a running device, the presence of the copies makes the keys far more vulnerable than in devices where more advanced security measures are in place.

Developer choices can affect the efficacy of security even for the basic option of flash-memory encryption. Historically, device makers have used an encryption key that is common to all members of a product family. If a key is compromised on one device, all the others in that family are equally vulnerable. Ideally, OEMs and integrators make the memory-encryption key unique for each device. They also need to follow through with individual keys for higher-level functions.

Management at the individual device level is vital for the overall security of an IoT service. When devices enrol on the network to exchange data with the cloud, operators and users need to be sure that all the connected devices are legitimate and have not been compromised.

Online services verify the identity and the legitimacy of devices using a set of digital certificates and signatures implemented using a public key infrastructure (PKI). Each device needs its own unique set of keys and certificates, ideally inserted at the point of manufacture, to show to other legitimate users that it is not a counterfeit and is running approved firmware.

Firmware checks

Valid certificates cannot on their own guarantee that an individual device has not been compromised. They do, however, support processes such as secure or measured boot. These processes provide high confidence in the authenticity of the firmware the device is running. Secure boot uses digital certificates and signatures to check the provenance of any software update the device receives. It ensures that only valid images are used to boot the device to readiness.

If an image fails any of the checks performed using a secure boot, the device will reject the firmware and will instead try to load a known good version if it is available. Unless valid firmware is available, the device cannot start up and connect to the IoT, which protects the rest of the network.

Secure boot relies on the presence of a bootloader image that a user cannot change without the required credentials. To achieve this, the hardware platform stores the bootloader together with root keys and certificates in one-time-programmable (OTP) memory to provide immutability.

For the highest level of protection against changes, manufacturers will implement this memory using e-fuses. However, some devices instead reserve an area of flash to be used in OTP mode once a protection fuse is blown.

In principle, secure boot is possible without further hardware support. However, entirely software-based boot-management processes cannot protect against runtime interference where an attacker can tamper with the SRAM or DRAM into which the bootloader code may need to be loaded before it can run.

Microcontrollers with hardware-based separation between secure and non-secure operating modes provide a higher degree of protection. An example is Arm’s TrustZone, implemented in different forms in the Cortex-A and Cortex-M series of embedded processors. TrustZone provides the ability to restrict access to peripherals and memory regions based on security attributes.

Access should be granted only if the attributes are in place for that I/O or memory access command. By default, the processor starts in its secure mode, which provides access to secure areas. When the processor completes its boot process and moves out of secure mode, it will deny a return to the secure areas unless the code passes authentication checks. In principle, systems such as TrustZone can successfully protect the boot process.

However, care needs to be taken to ensure there is no opportunity for an attacker to snoop on data in plaintext form. For example, the processor should load encrypted data into internal SoC memory before decryption takes place to avoid memory-bus snooping.

Figure 2 TrustZone architecture separates secure and non-secure operating modes in hardware. Source: Arm

A hardware secure element provides a way of providing greater security to the boot and encryption processes with or without secure execution modes. Its strongest guarantee comes from its ability to implement a root of trust that guards the keys and certificates stored in non-volatile memory. Every off-chip transaction involving a key will be encrypted.

The secure element may be implemented on the microcontroller or embedded-processor SoC, such as the digital-signature unit on an ESP32 or a full Trusted Platform Module (TPM) on multicore SoCs, or deployed in an external device, such as the ATECC608, and accessed through a direct serial port.

Even in the presence of secure elements, some attacks remain possible if not addressed directly. One is the rollback attack. This is where the attacker tries to load an old, but valid software image that contains a vulnerability that can be exploited. Anti-rollback uses a device’s secure storage to hold a counter that is allowed only to increase monotonically. Some IC vendors support this using a combination of hardware and firmware.

Solving hardware dependencies

Though hardware vendors may offer broadly similar features, there will often be significant differences in implementation and support for standards. For example, some secure elements are designed to implement RSA protocols for PKI alongside AES. Others will use elliptic-curve technologies or even newer technologies.

To access and control these features, developers will need to understand and employ different APIs, which adds to overall project time on top of the analysis needed to perform the threat modelling needed to assess the importance of each hardware and software components of the security model.

One way of addresses these complex device security issues is to deploy a common security framework that interfaces with the diverse silicon architectures. That determines which hardware features are available on a target platform, such as the presence of a trusted-execution mode or a TPM and uses those to deliver a framework that achieves the highest possible security for that combination of features.

Figure 3 Platforms like QuarkLink are multi-function tools that can be used to automate and streamline the process of implementing IoT security during and after embedded development. Source: Crypto Quantique

Though there are many choices hardware suppliers make when implementing security features on their products, each of which has a knock-on effect on firmware and lifecycle management, a comprehensive, integrated platform enables developers to work on a common programming interface and take full advantage of the hardware security features implemented in each of the devices they use.

David Haslam is head of software engineering at Crypto Quantique. He is a strong advocate for agile methodologies and DevOps practices, driving efficiency and collaboration across cross-functional teams.

Related Content

• Getting Ready for IoT Security in the AI Era
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• Hardware Root of Trust: The Key to IoT Security in Smart Homes
• What’s Driving the Shift from Software to Hardware in IoT Security?

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Renesas has introduced the CCE4511 four-channel IO-Link master IC and the ZSSC3286, an IO-Link-ready sensor signal conditioner IC. Widely used in industrial automation, the IO-Link digital communication protocol enables seamless communication between sensors, actuators, and other devices in an automation system.

The CCE4511 four-channel master transceiver delivers 500 mA of drive current per channel. It integrates an IO-Link frame handler to offload lower-layer communication tasks, reducing microcontroller loads. This high-voltage interface IC offers both overvoltage and overcurrent protection and operates at ambient temperatures up to 125°C. It also detects ready pulses from IO-Link devices, supporting the IO-Link Safety System Extension.

With its embedded IO-Link compliant stack, the ZSSC3286 dual-path sensor signal conditioner eliminates the need for an external microcontroller for stack operation. It accurately amplifies, digitizes, and corrects sensor signals, supporting most resistive bridge sensors and external voltage-source elements. A 32-bit Arm-based math core handles digital compensation for offset, sensitivity, temperature drift, and nonlinearity, using a correction algorithm with calibration data stored in reprogrammable nonvolatile memory.

Both the CCE4511 and ZSSC3286 are available now from Renesas and authorized distributors.

CCE4511 product page 

ZSSC3286 product page 

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Infineon is set to debut its HybridPack Drive G2 Fusion, a power module combining silicon and silicon carbide (SiC), at next month’s electronica 2024 trade show. Intended for traction inverters in the e-mobility sector, the plug-and-play module balances performance and cost for optimized inverter design.

SiC offers higher thermal conductivity, breakdown voltage, and switching speed than silicon, making it more efficient but also more expensive. The new module reduces SiC content per vehicle while maintaining performance and efficiency at a lower cost. Infineon reports that system suppliers can achieve near full-SiC efficiency with just 30% SiC and 70% silicon.

The HybridPack Drive G2 Fusion delivers up to 220 kW in the 750-V class, ensuring high reliability across a temperature range of -40°C to +175°C with enhanced thermal conductivity. Infineon’s CoolSiC MOSFET and silicon IGBT EDT3 technologies support a single or dual gate driver, facilitating the transition from full silicon or full SiC inverters to fusion inverters.

To learn more about Infineon’s HybridPack Drive power modules, click here.

Infineon Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Marketed under the Crucial brand, Micron’s DDR5 clocked unbuffered dual in-line memory modules (CUDIMMs) and clocked small-outline dual in-line memory modules (CSODIMMs) run at speeds up to 6400 MT/s. According to Micron, this is twice as fast as standard DDR4 speeds and 15% faster than conventional DDR5 without a clock driver.

These commercially available JEDEC-standard modules offer improved speed stability, faster downloads, and enhanced refresh rates for AI PCs and high-end workstations. While most systems rely on the CPU clock signal, Micron’s CUDIMMs and CSODIMMs integrate a clock driver directly into the memory module to maintain stability.

Intel has validated Micron’s DDR5 CUDIMMs and CSODIMMs for capacities up to 64 GB for use with its Intel Core Ultra desktop processors (Series 2). These modules enable system capacities up to 256 GB for workloads requiring substantial memory density and performance. The validation of these client memory modules by Intel will empower leading PC manufacturers and integrators to adopt Micron’s clock driver-based memory in their PC platforms.

Consumers can purchase the CUDIMM and CSODIMM in 16-GB capacities at Crucial.com, with 64-GB options expected to be available in the first half of 2025.

Micron Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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An RF wireless power tester prototype from Rohde & Schwarz helps to advance AirFuel Alliance RF standardization efforts. The setup, built with the company’s test and measurement equipment and available wireless charging development kits, features test automation and a user-friendly web interface.

R&S demonstrated the proof of concept for testing far-field wireless power systems at the 2024 IEEE Wireless Power Technology Conference and Expo. The R&S Wireless Power Tester (WPT) project aims to provide a comprehensive testing solution for wireless power transmitters and receivers. As an active member of the AirFuel Alliance, R&S contributes to the development of the AirFuel RF standard, a global initiative for standardized RF wireless charging technology.

The test setup includes the SMB100B RF and microwave signal generator, FSV3000 signal and spectrum analyzer, an NGU source measure unit used as a battery emulator, and two HMC8012 digital multimeters. It supports the AirFuel Alliance Conformance Test Specification for RF charging.

To learn more about RF wireless power transfer, click here.

Rohde & Schwarz  

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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