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Just a Cheap 8x8 smd led board. It will be a pain soldering all that leds on right position by hand. The IC seems to be a eeprom. The MF condenser fell of the table and I was able to find it (A miracle). submitted by /u/Don_Kozza [link] [comments]

New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.

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Artificial intelligence (AI) algorithms and supporting hardware will be critical in heralding the next stages of automated and ultimately autonomous driving, and a collaboration between Infineon and ZF as part of the EEmotion project demonstrates the viability of this ambitious technology undertaking.

EEmotion successfully integrated AI into the safety-critical functions of the vehicle control system. Source: Infineon Technologies

The EEmotion project aimed to develop an AI algorithm-based control system for automated driving that ensures more precise trajectory control in various driving situations. The project ran from September 2021 to August 2024, was co-funded by the German Federal Ministry for Economic Affairs and Climate Action and had Infineon Technologies AG as the consortium coordinator.

It began by defining the requirements for AI-based functions while aiming to develop AI in control architectures for safety-critical applications. The project also worked on aspects like the development of secure AI-monitored communication, investigation of the simulative development, and taking validation of vehicle dynamics systems into account.

As part of this project, Infineon joined hands with ZF Group to create and implement AI algorithms to develop vehicle control software. These AI algorithms—proven in a test vehicle—controlled and optimized all actuators during automated driving according to the specified driving trajectory.

ZF added AI algorithms to its two existing software solutions cubiX and Eco Control 4 ACC. The cubiX software makes it possible to control all chassis components in passenger cars and commercial vehicles. Next, Eco Control 4 ACC, a predictive cruise control system, was upended using a computationally intensive optimization algorithm and model-predictive control to achieve as much as 8% more range under real driving conditions.

These software solutions with added AI content were implemented on Infineon’s AURIX TC4x microcontroller with integrated parallel processing unit (PPU). This MCU, offering ample computing power, is capable of supporting AI modelling, virtualization, functional safety, cybersecurity and networking functions.

The outcome of loading ZF’s software solutions with added AI algorithms on AURIX TC4x MCU was a demonstration of automated lane changes much more accurately and an energy efficiency boost in adaptive cruise control. This shows how such improvements in driving performance while using lower compute power devices like MCUs could pave the way for cost-efficient Level 2+ assistance systems.

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• How Automated Driving Is Transforming the Sensor and Computing Market

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✨Програма Microsoft Imagine Academy для КПІ ім. Ігоря Сікорського kpi пт, 09/13/2024 - 17:26

Засідання Спілки ректорів закладів вищої освіти України в КПІ kpi пт, 09/13/2024 - 17:25

Доповідь ректора КПІ ім. Ігоря Сікорського Анатолія Мельниченка на сесії професорсько-викладацького складу 2024 kpi пт, 09/13/2024 - 17:22

65 років разом із КПІ! 10 фактів з життя академіка М.Ю. Ільченка kpi пт, 09/13/2024 - 16:13

As part of the ‘Spark their imagination; power their future’ project funded by Innovate UK and run by Compound Semiconductor Applications (CSA) Catapult and the UK Electronics Skills Foundation (UKESF), a total of 24 Year 13 students from across Wales have been awarded bursaries to provide support while they complete electronics-related degrees and help them start careers in technology...

As part of the ‘Spark their imagination; power their future’ project funded by Innovate UK and run by Compound Semiconductor Applications (CSA) Catapult and the UK Electronics Skills Foundation (UKESF), a total of 24 Year 13 students from across Wales have been awarded bursaries to provide support while they complete electronics-related degrees and help them start careers in technology...

In cooperation with Dr Hermann Oppermann of the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Dr Norwin von Malm (senior director New Technologies) and Stefan Groetsch (who leads the corresponding team within System Solution Engineering) at ams OSRAM GmbH in Premstätten, Austria and Munich, Germany comprise one of three teams nominated as a finalist for the Deutscher Zukunftspreis 2024 (German Future Award), the Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), China-based Chengdu InSiGa Semiconductor Technologies Co Ltd and POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — have developed and are showcasing in a live demonstration the combination of POET’s 200Gx4 transmit optical engine using InSiGa’s 200G/lane EML driver ISG-D9616 for 800G and 1.6T modules...

The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet sources. The platform offers three core services—design, packaging, and production—to improve the efficiency of assembling complex semiconductor designs.

In the chiplet era, advanced packaging capacity is increasingly constrained. Faraday’s platform tackles this issue by coordinating vendors for chiplets, high bandwidth memory (HBM), interposers, and 2.5D/3D packaging. It provides a one-stop solution with services including chiplet design, testing, production planning, procurement, inventory management, and advanced packaging. Tailored to diverse client needs, the platform ensures a reliable supply of critical components.

In addition, Faraday specializes in designing and implementing key chiplets, such as I/O dies, SoC/compute dies, and interposers. The company partners with UMC, Samsung, Intel, and OSAT providers to deliver advanced packaging solutions. These include system-level design, power and signal integrity analysis, and thermal dissipation optimization for technologies like Intel’s EMIB, Samsung’s I-Cube, and 2.5D packaging.

Faraday Technology is an ASIC design service and IP provider, certified to ISO 9001 for quality management and ISO 26262 for functional safety in automotive systems. Its silicon IP portfolio includes I/O, memory, ARM-compliant CPUs, and high-speed interfaces like USB, Ethernet, SATA, PCIe, and SerDes.

Faraday Technology 

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Thine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition in Frankfurt, Germany. By eliminating DSPs from optical communication systems in data centers, the chipset reduces power consumption by 60% and lowers latency by 90%.

Current advanced optical communication systems for PCIe often face challenges with high power consumption and signal processing delays, particularly with silicon-photonics lasers and DSP-equipped VCSEL drivers. To address these issues, THine’s chipset for PCIe 6.0 integrates a VCSEL driver and transimpedance amplifier into a DSP-free active optical cable (AOC) solution.

This optical PAM4 64-Gbps chipset leverages THine’s analog technology to eliminate DSPs from optical modules and end-point ASICs, achieving accurate signal recovery and improvements in power efficiency. The complany also plans to develop an advanced optical chipset for PCIe 7.0.

A datasheet for the PAM4 PCIe 6.0 chipset was not available at the time of this announcement.

THine Electronics

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Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and MEO satellites. Using the Compact Antenna Test Range (CATR) method, the chamber simulates long-distance communication conditions, such as those encountered in satellite communication, over a short physical distance. It is also capable of accommodating one of Japan’s largest antennas, with an aperture of up to 80 cm.

Designed with high-quality radio wave-absorbing materials on the ceiling, walls, and floor, and equipped with parabolic reflectors, the chamber suppresses unwanted reflections and measures performance over a short distance. While typical chambers require over 60 meters to test an 80-cm aperture antenna, Sharp’s CATR-based setup achieves accurate measurements over approximately 7 meters across a frequency range of 10 GHz to 40 GHz.

In addition to supporting Ku/Ka bands used for satellite communications, the anechoic chamber also accommodates measurements in the upper mid-band (FR3 6 GHz to 24 GHz), a potential frequency range for 6G deployment. The new chamber facility, launching this month, will enable testing and technical verification of various products, including next-generation smartphones.

Sharp

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Two Hall-effect switch families, the unipolar AH332xQ and omnipolar AH352xQ from Diodes, offer a range of operating sensitivity options. The automotive-compliant ICs are suitable for a wide range of contactless position and proximity detection applications, including seatbelt fastening, door and trunk latching, windshield wipers, and steering wheel locks.

The unipolar AH332xQ switches provide 10 sensitivity options, ranging from a highly sensitive 30 G BOP to a low-sensitivity 275 G BOP. The omnipolar AH352xQ series includes three high-sensitivity options from ±20 G BOP to ±40 G BOP. Both series feature tight operating and release thresholds with sufficient hysteresis for reliable operation, while a low temperature coefficient ensures stable switching points.

These devices support a wide input voltage range of 3 V to 28 V and are AEC-Q100 Grade 0 qualified, with an extended temperature range of -40°C to +150°C. They deliver ESD protection exceeding 8 kV HBM and 1 kV CDM, along with 40-V load-dump capability. Packaging options include SIP-3, SOT23 (Type S), and SC59.

The AH332xQ and AH352xQ Hall-effect switches cost $0.30 each in lots of 3000 units.

AH332xQ series product page

AH352xQ series product page

Diodes

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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