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Within my year-back coverage of Google’s August 2024 multi-product launch event, I devoted multiple prose paragraphs to the $99.99 TV Streamer 4K, the company’s high-end replacement for the popular prior Chromecast with Google TV 4K and HD series:

Memory-drive evolutions

Part of the motivation for Google’s product-succession move, we belatedly learned, was a requirement unveiled three months later that all new Google TV O/S-licensed devices needed to ship with a minimum of 2 GBytes of RAM. While the original (4K) Chromecast with Google TV met that specification, the HD sibling undershot it by 25% (1.5 GBytes). The TV Streamer 4K, on the other hand, doubles the onboard RAM allotment to 4 GBytes.

Another increasingly problematic issue with prior-generation devices was their dearth of integrated nonvolatile (flash memory) storage, which adversely affected not only how many apps and other downloaded content could be held on-device but even the available capacity to house operating system updates. Both the 4K and HD variants of the Chromecast with Google TV included only 8 GBytes of storage, only around half of which were user-accessible. The TV Streamer 4K quadruples that total amount, to 32 GBytes.

Then there’s the competitive angle. A year ago, the most advanced device in licensee-slash-competitor (frenemy?) Walmart’s product arsenal was the $19.88 onn. 4K Streaming Box (which I just noticed they’re calling the “Streaming Device” again in conjunction with the recent packaging refresh) with 2 GBytes of RAM and 8 GBytes of nonvolatile storage, memory capacity-matching the Chromecast with Google TV 4K at less than half the price. That said, as any of you who saw one of my last-month teardowns already knows, Walmart subsequently unveiled a “Pro” device of its own, with 3 GBytes of RAM, 32 GBytes of nonvolatile storage, and, at $49.99, a price tag once again half that of the Google TV Streamer 4K counterpart.

And amid all this memory-related chitchat, don’t overlook equally important processing and graphics horsepower, along with connectivity and other hardware enhancements. Walmart has historically leveraged Amlogic SoCs, sometimes architecture- and/or clock speed-upgraded from one generation to another, and other times generationally essentially the same. Up to this point, at least, Google has also done the same. What’s inside the TV Streamer 4K, claimed to be “22% faster” this time? And does its feature set “adders” versus competitive alternatives, such as the ability to act as a Google Home and Matter-and-Thread hub…umm…matter? Let’s find out.

eBay once again comes through

Sorry, folks, but given my per-teardown monetary compensation, I’m not going to drop $100 on a brand new dissection “patient”, especially if I’m not confident upfront that I’ll be able to get it back together afterwards in cosmetically pristine and fully functional form. Fortunately, back in early May, I came across a “Porcelain” color (“Hazel” is also available) used-condition device with all accessories included on eBay for $52.25 plus tax, with free shipping. It was a bit beat up, but seemingly still worked fine:

Here’s how it and the accompanying accessories arrived (inside a bubble wrap-rich cardboard box, of course), as usual, in the following photo (and others to come) accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Let’s have a close-up peek at the power supply first. I was admittedly surprised to still see Google shipping devices accompanied by wall warts with legacy USB-A outputs, mated to USB-A to USB-C cables, although the combo still seemingly provides sufficient juice to power the streamer:

That’s a 5V/1.5A (7.5W) output, if you can’t discern the faint fine print:

Next, the remote control:

It’s a slightly larger version of the one bundled with the Chromecast with Google TV HD (to the right in the following photos), notably moving the volume controls to the front versus the side:

And now for the star of the show, with the following specifications:

• Length: 6.4 in
• Width: 3.0 in
• Height: 1.0 in
• Weight: 5.7 oz

Note that (optional for use, in addition to built-in Wi-Fi) wired Ethernet support is integrated this time, not necessitating the use of a separate USB-C hub. More generally, left-to-right, there’s the status LED, a “find remote” button that does double-duty for reset purposes, USB-C (software-enabled for both power and peripheral data purposes), GbE Ethernet, and HDMI 2.1:

Open sesame

Time to dive inside. That underside rubberized “foot” is usually a fruitful pathway bet:

No luck yet, but the various-shaped and -sized opening outlines barely visible below the translucent next-level layer are encouraging:

That’s better…

…save for the lingering “bubble” after I put the “foot” back in place, a familiar sight to anyone who’s ever imperfectly applied a screen protector…

Let’s pause for a moment and take in the lay of the land:

There are screw heads in all four corners, along with recessed tabs on both sides, and additional holes (with metal visible within them) at both the top and bottom edges:

Removing the screws was easy:

The tabs were more of a struggle and, ultimately, a surprise. What I thought I needed to do was to carefully bend them out of the way, thereby enabling the two halves to vertically separate. And indeed, I was able to shift one to the side, fortunately not breaking it in the process. But when I turned my attention to the other, the two halves instead separated sideways in response:

And then they vertically lifted apart. Turns out I could have saved myself some trouble (and potential tab breakage) by just sliding them apart from the beginning:

Tackling various temperature inhibitors

Next up: that sizeable heat sink. Remember the earlier-mentioned “additional holes at both the top and bottom edges”? Those were for the four additional screws that now need to be removed; the tips had been visible through the holes to the other (bottom) side:

Houston, we have liftoff:

Next, the PCB, held in place by plastic tabs (and the connectors’ inserts to the case back panel):

And yes, as you can see from the now-present smear, I got thermal paste all over myself, etc. in the process of getting the PCB out of the bottom case half:

A close-up of the LED light pipe and button mechanical bits:

Voila:

Already visible are the PCB-embedded Wi-Fi antennae on both sides; the TV Streamer 4K supports Wi-Fi 802.11ac (both 2.4 GHz and 5 GHz) along with both Bluetooth 5.1 and a Thread transceiver. Before going any further, let’s get rid of the rest of that thermal paste, properly this time (via rubbing alcohol and a tissue):

Now let’s flip the PCB over and see what the other side reveals:

Another Faraday cage! And another embedded antenna (lower left). I’m guessing that it’s for Bluetooth and, doing double-duty, Thread, both protocols being 2.4 GHz-based.

While here, let’s get this cage off. Unlike most I’ve encountered, this one has numerous discrete “dimpled” tabs holding it in place, versus longer segments each with multiple embedded “dimples”:

Tedious patience eventually won out, however:

The “fins” (which I presume are for “spring” purposes) on top of the Faraday cage are interesting:

And what’s with the three gold-color “clips” (for lack of a better word) scattered around the cage, readers? I’ve seen them in past teardowns, too; I’m not sure what purpose they serve:

A new generation, a supplier transition

A closeup reveals, at lower left, an unknown chip stamped thusly:

MG21
A020H1
B02ARA
2436

to its right, an unknown-function MediaTek MT6393GN (although this has me suspecting it’s a power management controller, and to my earlier “what SoC is in the design this time” question: hmm, MediaTek?), and at lower right, a Samsung K4FBE3D4HB-MGCL 32 Gbit LPDDR4 DRAM:

Back to the topside, and (tediously, again) off with another Faraday cage:

More thermal paste inside, unsurprisingly:

Zooming in, I’m guessing that the application processor is at far left, under the lingering lump of paste (which I’ll attempt to clean up next). Below it is the nonvolatile storage, a Kioxia (formerly Toshiba Semiconductor) THGAMVG8T13BAIL 32 GByte eMMC flash memory. To its right is the wired Ethernet transceiver, a Realtek RTL8211F. And at far right is the wireless communications nexus, MediaTek’s MT7663BSN “802.11a/b/g/n/ac Wi-Fi 2T2R + Bluetooth v5.1 Combo Chip”.

Who’ll take my bet that under that glob of thermal paste is a MediaTek-sourced SoC?

I win! It’s the MT8696, based on a quad-core Arm Cortex-A55 and capable of clocking at up to 2 GHz. I can’t read the markings on the crystal in the SoC’s upper left corner, but TechInsights’ analysis report, which I’ll revisit soon, says that the MT8696 runs at 1.8 GHz in this design.

All that was left was to apply fresh thermal paste everywhere I’d cleaned it off, set the Faraday cages back on top of their brackets, push the tabs back in place, snap some side-view shots:

and then fire it back up and see if it still works. I didn’t bother with putting the top back in place at first, in case it didn’t work, but that white LED glow in the lower left is an encouraging sign.

Huzzah!

I let it run for about 15 minutes to ensure that it was thermally stable, then unplugged it and completed the reassembly process.

Is the enemy of my enemy my friend?

In closing, I’ll share the report summary of another teardown I came across, from TechInsights, with the identities of a few other ICs. And I’ll toss out a few questions for your introspection:

• Given that Google’s conspicuous reference to this one as the “4K” model, will they follow up later with a “HD” edition as they did in the Chromecast with Google TV era?
• Given the subsequent unveiling of both Walmart’s aforementioned 4K Pro Streaming Device and even newer “little brother” (sorta…hold that thought for another teardown to come) onn. 4K Plus Streaming Device, plus other manufacturers’ Google TV O/S-based products, all significantly lower priced, just how many TV Streamer 4Ks does Google really expect to sell?
• And at the end of the day, given that Google is fundamentally a software company (with a software-licensing business model), does it matter? Is TV Streamer 4K fundamentally just a showcase product to advance the feature set of the overall market, analogous to Microsoft and its Surface computer product line? Said another way, are Amazon (with its various Fire OS-based devices), Apple (with tvOS-based Apple TV products), and Roku (Roku OS-based sticks, boxes, and TVs) Google’s real competitors?

Wrapping up, some words I previously wrote (and EDN subsequently published) last August:

Competing against a foundation-software partner who’s focused on volume at the expense of per-unit profit (even willing to sell “loss leaders” in some cases, to get customers in stores and on the website in the hopes that they’ll also buy other, more lucrative items while they’re there) is a tough business for Google to be in, I suspect. Therefore, the pivot to the high end, letting its partners handle the volume market while being content with the high-profit segment.

How well (or not) has my year-back perspective held up? Any other thoughts on what I’ve shared today? Let me (and your fellow readers) know in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• Google’s fall…err…summer launch: One-upping Apple with a sizeable product tranche
• Perusing Walmart’s onn. 4K Pro Streaming Device with Google TV: Storage aplenty
• Walmart’s onn. full HD streaming device: Still not thick, just don’t call it a stick
• Google’s Chromecast: impressively (and increasingly) up for the video streaming task
• The Google Chromecast Gen 3: Gluey and screwy
• Google’s Chromecast Ultra: More than just a Stadia consorta
• Google’s Chromecast with Google TV: Dissecting the HD edition
• The Google Chromecast Gen 2 (2015): A Form Factor Redesign with Beefier Wi-Fi, Too
• Google’s Chromecast with Google TV: Car accessory similarity, and a post-teardown resurrection opportunity?
• The Google Chromecast with Google TV: Realizing a resurrection opportunity

The post The Google TV Streamer 4K: Hardware updates on display(s) appeared first on EDN.

A variety of electromagnetic compliance (EMC) testing solutions—standalone instruments, software, and systems—will be on display at Rohde & Schwarz’s booth during IEEE EMC Europe 2025 symposium held at Sorbonne Université in Paris from 1-5 September 2025.

Start with HF1444G14, the new high-gain electromagnetic interference (EMI) microwave antenna covering 14.9 to 44 GHz. It will be paired with the company’s ESW EMI test receiver to demonstrate full compliance testing with a single measurement. The ESW EMI test receiver, boasting an FFT bandwidth of up to 970 MHz, facilitates measurements of CISPR frequency bands C and D in a single sweep.

Figure 1 The ESW EMI test receiver offers a wide measurement bandwidth and high dynamic range. Source: Rohde & Schwarz

Next, the EPL1007 EMI test receiver, supporting frequency ranges up to 7.125 GHz, can be either used for EMI pre-compliance testing or as a CISPR 16-1-1 compliant receiver. It’s a portable device that can operate on batteries, which makes it suitable for a wide range of testing environments.

Figure 2 The EPL1007 EMI test receiver is suitable for conducted and radiated measurements. Source: Rohde & Schwarz

Then there is the ELEKTRA test software, which automates EMC testing for EMI and electromagnetic susceptibility (EMS) measurements of an equipment under test (EUT). The software simplifies test configuration, speeds up test execution, and generates comprehensive test reports. Rohde & Schwarz will demonstrate new features of this test software, including the latest capabilities for immunity testing in reverberation chambers.

Figure 3 The ELEKTRA test software captures the entire system to measure EMI emissions and EMS immunity. Source: Rohde & Schwarz

Moreover, the Munich, Germany-based test and measurement company will also demonstrate EMI debugging on its oscilloscopes and probing solutions. Rohde & Schwarz’s MXO 5 oscilloscopes—featuring an update rate of more than 4.5 million wfms/s and more than 45k FFT/s for spectrum analysis—will be paired with the isolated probing system RT-ZISO to allow users to debug digital and power electronic devices quickly.

Rohde & Schwarz will also present four technical sessions at the conference.

Related Content

• EMI test considerations for power supplies
• EMC pre-compliance testing ups success rate
• Avoiding EMC Failure Through Pre-Compliance Testing
• EMC antennas for troubleshooting and pre-compliance testing
• EMI emissions testing: peak, quasi-peak, and average measurements

The post EMC compliance spanning instruments, software, and systems appeared first on EDN.

Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) is rolling out a new reference design kit tailored specifically for solar-powered race cars as 37 student teams prepare to race across the Australian Outback in the Bridgestone World Solar Challenge, starting 24 August...

Plessey Semiconductors Ltd of Plymouth, UK — which develops embedded micro-LED technology for augmented-reality and mixed-reality (AR/MR) display applications — has been acquired by London-based Haylo Labs, which has been established by Haylo Ventures (a venture operator founded in 2023 to build and scale deep-tech businesses) to focus specifically on the micro-LED, optical compute, and interconnect sectors...

Launch services and space systems company Rocket Lab Corp of Long Beach, CA, USA (the parent company of space power provider SolAero Technologies Corp) is boosting its US investments to expand semiconductor manufacturing capacity and provide supply chain security for space-grade solar cells and electro-optical sensors for national security space missions. The investments are supported by a $23.9m award through the US Department of Commerce, as part of the CHIPS and Science Act...

InnoScience (Suzhou) Technology Holding Co Ltd — which manufactures gallium nitride on silicon (GaN) power chips on 8” silicon wafers — and China’s largest tier-1 automotive supplier United Automotive Electronic Systems Co Ltd (UAES, a joint venture established in 1995 by China’s Zhonglian Automotive Electronics Co Ltd and Germany’s Robert Bosch GmbH) have established a joint laboratory to develop advanced power electronics systems for new energy vehicles using the advantages of GaN technology in size, weight, and efficiency. The two parties held an unveiling ceremony at UAES (Suzhou R&D Center)...

MeitY approved 23 chip design projects under its Design Linked Incentive (DLI) scheme, thus strengthening the semiconductor design ecosystem in India. This favors domestic start-ups and MSMEs that work on chips applicable in surveillance cameras, smart energy meters, among others.

Alongside these approvals, 72 companies now have access to industry-grade EDA tools to shorten development time and improve design capabilities in India.

One of the beneficiaries is Bengaluru-based Vervesemi Microelectronics, which is designing integrated circuits for smart energy, motor control, and aerospace. Its forthcoming designs include chips for weighing scales, energy meters, small appliances, electric vehicles, and avionics.

Vervesemi is developing ICs for strategic and consumer applications, including ASICs for weighing scales, smart energy meters, BLDC motor controllers, EVs, drones, and aerospace systems. Sampling for most designs is expected between late 2025 and 2026.

The company mentioned that these efforts display India’s growing ability to design high-performance, Made-in-India ICs for the strategic and consumer market in import substitution and raising the country’s stature at a global level in the semiconductor field.

The DLI program is at the core of India’s $10 billion semiconductor mission, which aims to reduce reliance on imports while simultaneously fostering domestic talent and creating a robust ecosystem for chip design and development.

The broader impact of the DLI scheme is already visible, as India moves toward building a robust fabless semiconductor ecosystem. By empowering startups and MSMEs with access to Electronic Design Automation (EDA) tools and financial incentives, MeitY is laying the groundwork for a self-reliant design-to-deployment pipeline. Experts believe that this momentum, combined with strategic investments and global partnerships, could help India emerge as a competitive force in the global semiconductor supply chain, reducing reliance on imports and boosting domestic innovation.

The post Govt Sanctions 23 Chip Design Ventures Under DLI Scheme appeared first on ELE Times.

InnoScience (Suzhou) Technology Holding Co Ltd — which manufactures gallium nitride on silicon (GaN) power chips on 8” silicon wafers — has launched four new 700V SolidGaN devices (ISG6123TA, ISG6123TP, ISG6124TA, and ISG6124TP) that adopt industry-standard TOLL and TOLTP high-power packages, offering compatibility with both traditional controllers and motor driver applications, and streamlining design and simplifying adoption across various applications...

India’s electronics sector, one of the major achievements under the Make in India initiative, could witness long-term benefits following China’s decision to ease export restrictions on rare earth metals and critical minerals.

Rare earth elements (REEs) comprise the very stuff in a myriad of devices-hardly just companies assembling smartphones, laptops, gaming consoles, and electric vehicles, but also advanced display technologies. Rare earth elements (REEs) were an eternal source of limited supply, coupled with China dominating the supply chains worldwide, thereby posing an impediment to global electronics manufacturers.

The relaxation in export restrictions by China could go a long way in reducing supply constraints in India thus helping the domestic industry grow faster, and in removing supply-chain bottlenecks-according to experts of the industry. This is extremely important in sectors like semiconductors, consumer electronics, and electric mobility, where India aspires to build some competitive advantage.

Industry leaders believe that stable prices for critical minerals should lower production costs and foster further investment in the electronics ecosystem in India, thus quickening the country’s path to being recognized as a-global electronics manufacturing hub.

The change in policy comes at a time when India is enhancing PLI schemes to pull in global multinationals engaged in electronics and semiconductor fabrication. With a better supply assurance for rare earths, India should now find itself better placed to enter into global value chains and curtail its dependence on expensive imports from various markets.

Despite China being India’s strategic competitor, the loosening of export controls unexpectedly highlights global supply chains’ interconnectivity. Analysts say that the way is now clear for the electronics and EV sectors of India to be among the biggest beneficiaries if India continues to develop domestic processing and value addition firms.

The post Rare Earth Export Curbs Lifted by China: India’s Semiconductor and Electronics Sectors Poised to Benefit appeared first on ELE Times.

The Ministry of Electronics and Information Technology (MeitY) has indicated that two to three small semiconductor projects may soon be announced, using leftover funds from the ₹76,000 crore India Semiconductor Mission (Semicon 1.0). Most of the outlay has already been committed to chip fabrication facilities, the Semiconductor Laboratory in Mohali, and the Design-Linked Incentive scheme.

The government is also working out the framework for Semicon 2.0 with the aim of further mainstreaming the semiconductor ecosystem in India.

The announcement comes as a precursor to SEMICON India 2025, taking place from September 2 to 4 at Yashobhoomi, Delhi, the inauguration of which shall be graced by Prime Minister Narendra Modi. This edition has almost doubled in scale and has attracted more global and state participation, with all exhibition spaces being booked to capacity.

MeitY has further said that the first commercially produced Made-in-India chips may just be out by the end of 2025, with several companies racing to reach this milestone.

Industry observers say the combination of policy support, global partnerships, and rising investor interest has positioned India as an increasingly credible player in the global semiconductor supply chain.

Global players including Applied Materials, IBM, Infineon, LAM Research, Merck, Siemens, TSMC, and Tata Electronics will join the event, underscoring rising international confidence in India’s semiconductor push.

The post MeitY May Announce 2–3 Small Semiconductor Projects Soon appeared first on ELE Times.

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❗️ Японська осінь 2025 kpi пн, 08/25/2025 - 11:14

The New High-Efficiency Audio Solution Ideal for Dashboard, eCall, and T-Box Applications

Nuvoton announced NAU83U25YG, a new automotive-grade Class-D audio amplifier. The NAU83U25YG Class-D amplifier features high-efficiency stereo, digital input, and delivers up to 3W (4 Ω load) or 1.7W (8 Ω load) output power. Featuring a two-wire gain adjustment interface, it is the ideal choice for automotive electronics applications such as dashboards, eCall, and T-Box systems.

As automotive electronics enter the era of the “smart cockpit,” vehicle intelligence has become a key industry focus. This trend is driving increasing functional requirements for audio solution providers in automotive applications. Nuvoton Technology strictly adheres to automotive industry standards, offering AEC-Q100 qualified products for automotive applications. To simplify system design, our solutions support digital I2S audio signal input from the vehicle’s main controller, reducing the need for external components and minimizing PCB size. Additionally, our digital amplifiers help prevent circuit interference and effectively solve EMI issues.

The NAU83U25YG stereo Class-D audio amplifier has advanced features like 80 dB PSRR, 90% efficiency, ultra-low quiescent current (i.e. 2.1 mA at 3.7V for 2 channels) and superior EMI performance. It offers lower distortion, reduced background noise, and a wider dynamic range. Additionally, this new amplifier supports comprehensive device protection.

NAU83U25YG Key Features

1. Gain Setting via I²C interface, 22 dB to -62 dB
2. Powerful Stereo Class-D Amplifier, 2ch x 3.0W (4Ω @ 5V, 10% THD+N)
3. Low Output Noise: 18 μVrms @ 0 dB gain
4. Comprehensive Device Protection:

• Overcurrent Protection (OCP)
• Undervoltage Lockout (UVLO)
• Overtemperature Protection (OTP)
• Clock Termination Protection (CTP)

5. Click-and-Pop Suppression
6. Package: QFN-20
7. Operating Temperature Range: -40℃ ~ +105℃
8. Automotive Grade: AEC-Q100 qualification & TS16949 compliant

Superior EMI Performance, Filter-Free
The NAU83U25YG amplifier stands out by eliminating the need for an external output filter, thanks to its spread-spectrum-oscillator technology and slew-rate control, effectively reducing electromagnetic interference (EMI). Moreover, it offers enhanced immunity and power supply rejection ratio (PSRR) of > 80 dB at 217 Hz. Making the NAU83U25YG an excellent fit for Class-D audio amplifiers in wireless and AM (Amplitude Modulation) frequency band applications.

Leap Forward in Efficiency, Power
The Class-D topology represents a significant leap forward in both power efficiency and noise minimization in audio devices. By generating a binary square wave, Class-D amplifiers efficiently amplify the signal through power device switching. Compared to Class-AB devices, Class-D amplifiers offer power efficiencies that are two-thirds better.

The NAU83U25YG Class-D audio amplifier excels in driving a 4 Ω load with an impressive output power of up to 3W and fast start-up time of just 14 msec.

NAU83U25YG Target Applications

The new Class-D audio amplifier is designed for automotive electronics applications including dashboards, eCall, ADAS (Advanced Driver Assist Systems) and T-Box.

The post Nuvoton Introduces Automotive-grade, Filter-Free 3W Class-D Audio Amplifier NAU83U25YG appeared first on ELE Times.

⏱️ Графік навчального процесу на 2024-2025 навчальний рік kpi пн, 08/25/2025 - 01:00

Just thought I’d share a little organization hack I made on the cheap. Dollar store wire dish rack and dollar store hardware boxes. Less than $10 total and makes organizing components a breeze. submitted by /u/Lonely-Issue-3508 [link] [comments]

In this article, we examine a reactance modulator design that employs the variable capacitance of a bipolar junction transistor to modulate the output of a Colpitts oscillator.

Hi electronics friends! I’ve been working on this project for a few months, and the 1.0 version of my DIY synthesizer is finally here! I documented the whole process on YouTube: 👉 https://youtu.be/B1KDbnlMJYE submitted by /u/Fearless_Theory2323 [link] [comments]

For anyone wondering what it is: It's an old Xilinx Spartan II FPGA that was cut from an old custom PCI board. It has been adapted to an prototype board. It's an 8 bit ISA prototype board, however I'm not going to make an ISA card from it. I just ran out of typical prototype boards. I am planning to use this old FPGA to help me make another homebrew computer (glue logic). I am planning this time to make homebrew on a dedicated PCB, so I want to have a playground with that FPGA with all pins reachable to experiment with it before. I could got an adapter, but I couldn't find one locally to get it quickly. This thing took me three days of work in my free time. So, yeah. It works! On last photo teh FPGA is programmed to blink the LED! The RPi Pico acts as JTAG programming cable submitted by /u/maniek-86 [link] [comments]

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