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• The expansion opens new opportunities for end customers in industries such as manufacturing (automobile/electronics), ports, pharma, retail, e-commerce, q-commerce, logistics and healthcare
• Its AIDC portfolio includes an array of products such as Mobile Computers (HHDs), High-Definition Scanners, Industrial Grade Label Printers, and more

TVS Electronics, a leading player in offering integrated end-to-end electronic solutions, has announced the launch of its Enterprise Automatic Identification and Data Capture (AIDC) with an aim to make it simple and accessible to everyone. Leveraging its comprehensive range of enterprise-grade product solutions, TVS Electronics is set to expand beyond its retail offerings and compete strongly in the enterprise AIDC segment, moving beyond its trusted retail offerings.

This move will help Indian businesses digitize operations with affordable, locally supported technology. TVSE’s strong service network ensures quick maintenance, while its end-to-end solutions—from sales to refurbished equipment auction reducing long-term costs. TVS Electronics focus is to introduce practical, scalable tech that improves accuracy and efficiency in inventory, tracking, and data management. By combining global-grade AIDC tech with India-specific needs, TVS Electronics aims to be a one-stop partner for companies embracing automation. Their approach simplifies digital transformation, making advanced tools accessible to enterprises of all sizes.

India’s track and trace sector is accelerating fast, projected to grow at a strong CAGR of 21.3% by 2030. This surge is powered by the integration of AIDC technology with smart tracking software, delivering real-time visibility and seamless automation across the supply chain. Logistics operations are becoming more agile, manufacturers gain better control and efficiency, e-commerce fulfillment is faster and more accurate, and warehousing is undergoing a high-tech makeover. Together, these innovations are driving a smarter, connected, and more responsive supply chain ecosystem across India.

TVS Electronics’ AIDC portfolio includes a broad range of solutions designed to meet the demanding requirements of enterprise operations, such as:

• Mobile Computers (HHDs):Handheld devices for seamless mobility and real time data capture.
• Rugged Scanners:Industrial grade wired, and Bluetooth enabled wireless scanners that provide reliability in harsh environments.
• High-Definition Scanners:Precision scanners (HD, HHD, XHD, UHD) for electronics industries requiring barcode scanning below 3 mil size.
• Industrial-Grade Label Printers:Label printers designed for durability, offering 203 dpi/300 dpi resolutions.
• Mobile Printers:Compact, Bluetooth-enabled printers designed for mobile workforces.
• Rugged Tablets:Tablets built to withstand tough industrial environments, enabling better data management and communication in the field.

TVS Electronics delivers more than just hardware—it’s building a full-fledged automation ecosystem. By integrating with ERP platforms like SAP and Oracle, and leveraging tools such as SOTI for WMS and MDM, TVSE offers seamless end-to-end solutions that elevate operational efficiency and supply chain visibility. Its approach goes far beyond product delivery, prioritizing strategic alliances with software providers, IoT platform innovators, and system integrators. From consultation to training and ongoing support, the company ensures each solution is tailored, enterprise-ready, and optimized across every layer of the tech stack.

Mr. C. Balaji, Vice President, PSG Business, TVS Electronics, said, “TVS Electronics aims to not only provide superior AIDC devices but to also bring tailored, customizable solutions to enterprises across industries. This launch marks a significant milestone for TVS Electronics as we reposition ourselves as a key player in the enterprise AIDC segment, breaking the stereotype of being a retail-focused brand. By building a robust partner ecosystem, we aim to foster customer trust and drive enterprise growth. Our shift towards value-based selling drives sustainable growth while addressing niche industry needs with tailored solutions. With this move, TVS Electronics solidifies its position as a full-spectrum solutions provider in enterprise technology, leveraging the ‘Make in India’ initiative and digital transformation trends to drive growth and innovation.”

TVS Electronics showcases its competitive advantage through highly customizable Enterprise AIDC solutions that integrate seamlessly with leading ERP (Enterprise Resource Planning) platforms, enabling AI-powered insights and real-time analytics for enhanced operational efficiency. Its advanced Tumakuru facility ensures top-tier quality, reduced lead times, and cost-effective production—fueling innovation and strengthening global competitiveness. With tailored end-to-end offerings like Warehouse Management Systems (WMS) and Real-Time Locating Systems (RTLS), and strategic collaborations with Independent Software Vendors (ISVs) and system integrators, TVSE empowers businesses across sectors with scalable automation and intelligent tracking solutions.

With this, TVS Electronics continues to be a reliable OEM supplier in the enterprise AIDC market, expanding its focus beyond retail to serve large enterprises. Committed to staying ahead of trends like automation and IoT, TVS Electronics will deliver enterprise-grade AIDC solutions to empower businesses.

TVS Electronics strengthens its market position and drives enterprise growth by offering tailored solutions backed by a shift to value-based selling, boosting profitability. The company’s focus on digital transformation reinforces its role as a full-spectrum enterprise technology provider. With one of the largest service networks in India, TVS Electronics delivers industry-best turnaround times and exceptional customer support. Its end-to-end IT lifecycle offerings—from after-sales service to second-hand product auctions—ensure optimal efficiency and cost-effectiveness, making it a reliable one-stop solution for businesses.

The post TVS Electronics Expands Its Footprint in the Enterprise AIDC Market with a Comprehensive Portfolio of Mobility, Products & Solutions Across India appeared first on ELE Times.

Does’t get much cooler than this. submitted by /u/DrZZed [link] [comments]

Diodes Incorporated has announced two new ideal diode controllers with a wide input voltage range, low quiescent current, and overvoltage lockout protection.

Ok I'm not a noob but I haven't built anything for a long long time, this PCB circuit was a complete fail haha I didn't expect to have issues with it but it's on me for not thinking properly. Simple OpAmp driving a class B output stage (unbiased, the opamp is fast enough to prevent crossover distortion) I was using TO-3 transistors with 30 volts power supply input. This circuit worked great on a breadboard. I thought I could hack together a PCB and instead of taking time to do proper design I just hack and slashed the PCB "pads" with a dremel bit. Probably not the best idea... The amplifier simply refused to amplify symmetrically - almost all the signal was in the upper NPN transistor, and in fact I could hear the output capacitor vibrating at the 1Khz tone I was feeding into the circuit. See that potentiometer? It was meant to adjust the OpAmp's voltage on the positive input so I could fine tune the symmetry of the amplifier, but it wouldn't affect anything. The upper NPN would get super hot and the PNP wasn't do much at all. Also the circuit was drawing like 250ma without any input signal (whereas when it was on the breadboard it would only draw 5ma, because the OPAMP was keeping the transistors off when there was no signal) At first I thought I possibly had a bad connection somewhere, like wired wrong I looked at this thing for a few hours, all the parts were in the right place. I could not find any weird shorts either. Tested different sections with a multimeter to see. The main thing that would always come back wrong was the voltage on the OPamp + input, it was like in millivolt range, I even replaced the POT and still nothing. I think it was probably oscillating, you can see my thicker output wires? They *twice* cross over the wires that are inputs to the transistor base. Ya, that's probably a really stupid thing to do. Power transistors with a gain of around 70 (beta). Anyway, I don't know how I though this was ever going to work LOL. I guess I should have more patience next time and design a proper layout. Probably use perfboard instead I was using big TO-3 transistors and attaching them to a heatsink . I cut the transistors off of this board . I put them back into my circuit on a breadboard and everything works perfectly again haha. So ya, layout is important DERP. One thing I didn't think to try was lowering the gain of the OpAmp to see if it was oscillating. Right now the gain is at 33 (AC gain) I could have tried dropping that to like 5 to see if it changed anything. Anyway, time to start over and build a proper board that keeps the input lines well away from the higher current output lines. submitted by /u/Perfect-Campaign9551 [link] [comments]

submitted by /u/1Davide [link] [comments]

❤️ Державні гранти на навчання у КПІ ім.Ігоря Сікорського kpi чт, 07/31/2025 - 23:14

submitted by /u/1Davide [link] [comments]

This isn't a gender changer. It's a gender conformer. Plug one gender DE-9 into one end, get that same gender on the other. At best, it's a ⅞" extension "cord". And before anyone suggests it can turn a straight-through cable into a cross-over cable, or vice-versa, I've already signal-traced the pins. It's 1:1. So, what's the most useless bit of kit you have? submitted by /u/EmbeddedSoftEng [link] [comments]

The Renesas 64-bit RZ/G3E microprocessor powers HMI applications with a quad-core Arm Cortex-A55 CPU and Ethos-U55 neural processing unit (NPU) for AI tasks. Running at up to 1.8 GHz, the Cortex-A55 handles both HMI and edge computing functions, while an integrated Cortex-M33 core performs real-time tasks independently of the main CPU to enable low-power operation.

With Full HD graphics and high-speed connectivity, the RZ/G3E is well-suited for industrial and consumer HMI systems, including factory equipment, medical monitors, retail terminals, and building automation. It outputs 1920×1080 video at 60 fps on two independent displays via an LVDS (dual-link) interface. MIPI-DSI and parallel RGB outputs are also available, along with a MIPI-CSI interface for video input and sensing tasks.

The microprocessor’s 1-GHz NPU delivers 512 GOPS for AI workloads such as image classification, object and voice recognition, and anomaly detection—while offloading the CPU. Power management features in the RZ/G3S reduce standby consumption by maintaining sub-CPU operation and peripheral functions at approximately 50 mW, dropping to about 1 mW in deep standby mode.

The RZ/G3E microprocessor is available now. Visit the product page below to check distributor availability.

RZ/G3E product page 

Renesas Electronics 

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TI’s single-chip battery fuel gauges, the BQ41Z90 and BQ41Z50, extend battery runtime by up to 30% using a predictive modeling algorithm. Their adaptive Dynamic Z-Track algorithm delivers state-of-charge and state-of-health accuracy within 1%, enabling precise monitoring in battery-powered devices such as laptops and e-bikes.

The fuel gauges provide accurate battery capacity readings under varying load conditions, allowing designers to right-size batteries without overprovisioning. The BQ41Z90 integrates a fuel gauge, monitor, and protector for 3- to 16-cell Li-ion battery packs, while the BQ41Z50 supports 2 to 4 cells. Integration reduces board complexity and can shrink footprint by up to 25% compared to discrete implementations.

Each battery pack manager monitors voltage, current, temperature, available capacity, and other key parameters using integrated analog peripherals and an ultra-low-power 32-bit RISC processor. Both devices report data to the host system over an SMBus v3.2-compatible interface, while the BQ41Z90 also supports I²C. It additionally enables simultaneous current and voltage conversion for real-time power calculations and supports sense resistors as low as 0.25 mΩ.

Pre-production quantities of the BQ41Z90 and production quantities of the BQ41Z50 are available now on TI.com. Evaluation modules, reference designs, and simulation models are also available.

BQ41Z90 product page 

BQ41Z50 product page 

Texas Instruments 

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Teledyne’s 16-Gbyte DDR4 memory module, designated TDD416Y12NEPBM01, is screened and qualified as an Enhanced Product (EP) for high-reliability aerospace and defense systems. The solder-down device is smaller than a postage stamp, making it well-suited for space-constrained systems where performance is critical.

Rated for -40°C to +105°C operation, the module delivers 3200 MT/s (3200 MHz) and integrates memory, termination, and passives in a compact 22×22- mm, 216-ball BGA package. It replaces multiple discrete components, helping to simplify board layout. An optional companion ECC chip is available for applications requiring error correction.

The TDD416Y12NEPBM01 interfaces with x64 and x72 memory buses and supports a range of processors and FPGAs, including those from Xilinx, Microchip, NXP, and Intel, as well as Teledyne’s LS1046-Space. According to Teledyne, the DDR4 module achieves 42% lower power, 42% less jitter, and 39% PK/PK reduction compared to conventional SODIMMs.

To request further information on the TDD416Y12NEPBM01, click here.

Teledyne HiRel Semiconductors 

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With over twice the throughput of its predecessor, MaxLinear’s Panther V storage accelerator achieves 450 Gbps, scalable to 3.2 Tbps. It enables low-latency data processing across file, block, and object storage in HPC, hyperscale, hyperconverged, and AI/ML environments.

Panther V offloads the CPU from compute-intensive data transformation tasks—including compression, deduplication, encryption, and real-time verification. According to MaxLinear, the hardware-based approach offers higher performance, lower storage costs, and improved energy efficiency compared to conventional software-only, FPGA-based, and other competing solutions.

Panther V features a PCIe Gen5 x16 interface to fully leverage the bandwidth of next-generation server platforms. Its MaxHash-based deduplication, combined with deep compression algorithms, achieves data reduction ratios of up to 15:1 for structured data. By reducing CPU and memory bandwidth demands, as well as storage device usage, Panther V helps lower both capital and operating costs. Built-in reliability features ensure high data integrity and six-nines availability.

MaxLinear will unveil Panther V at the upcoming Flash Memory Summit (FMS25).

Panther V product page

MaxLinear

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Designed for 400G and 800G optical networks, Coherent’s CHR1065 100G transimpedance amplifier (TIA) operates at 56 Gbaud using PAM4 modulation. It joins the company’s open-market ASIC portfolio, offering four channels with a 750-µm optical pitch suited for compact DR, FR, and LR module configurations.

The CHR1065 minimizes input-referred noise to 2.3 µA RMS, enhancing receiver sensitivity for longer reach. High linearity up to 2.5 mA ensures reliable performance across varying link budgets. Consuming just 227 mW per channel at 25°C, the TIA supports dense deployments in power-constrained data centers. An I²C interface enables integration with system-level monitoring and control functions.

Tested to JEDEC standards for lifetime reliability, the CHR1065 is now available as a wire-bondable bare die and in full volume production. Engineering samples ship in 25-piece waffle packs. For more information or to request samples, click here.

Coherent

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submitted by /u/Grid_Rider [link] [comments]

Professional bodge wires, with silkscreen and everything. 2oz copper left the chat. submitted by /u/Purple_Ice_6029 [link] [comments]

For second-quarter 2025, deposition equipment maker Aixtron SE in Herzogenrath, near Aachen, Germany has reported revenue of €137.4m, up 4.2% on €131.8m a year ago and 22% on €112.5m in Q1.2025. This is near the upper end of the guidance range of €120–140m, reflecting a strong performance in a generally soft market environment...

The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.

This project is a compact evaluation PCB designed for the nPM1100 Power Management IC by Nordic Semiconductor. The board provides the essential circuitry to evaluate the core features of the PMIC in a minimal footprint while exposing all IO pins for external interfacing. PCB dimensions: 22 mm × 16 mm PCB layers: 2 All components: Surface-mounted on the top layer Header pitch: Standard 2.54 mm (0.1") More info on GitHub https://github.com/P-rth/LIPL-Assessment/blob/main/ProblemStatemet2%2Freadme.md submitted by /u/antihumanracerobot [link] [comments]

It's not finished yet, but it will be soon. Only one PCB is left once I finish that and do the wiring, it'll be done. submitted by /u/Careful-Rich9823 [link] [comments]

Today’s car buyers, whether purchasing premium or economy models, expect to charge multiple devices simultaneously through in-vehicle USB ports. To meet this demand, automakers are replacing legacy USB Type-A ports with multiple USB Type-C ports that support the latest USB power delivery (PD) standards. These standards enable significantly higher power levels—up to 48 V and 240 W—suitable for fast-charging laptops, tablets, and phones.

USB PD controllers operate alongside internal or external DC/DC converters, which add their own thermal stress to the system. This challenge becomes even more critical in automotive, industrial, and other space-constrained designs where airflow is minimal and ambient temperatures are high. If left unmanaged, excessive heat can damage or degrade system reliability. Elevated temperatures accelerate the aging of semiconductors and passive components, cause solder joint fatigue, and, in the worst cases, can lead to printed circuit board (PCB) delamination or thermal runaway. These risks make thermal management a priority in system-level USB PD designs, especially when long-term reliability or safety are requirements. In this power tip, I’ll explore different methods to manage heat and improve system reliability when implementing automotive USB PD solutions.

A typical 12-V battery automotive system needs these components to implement a USB PD charging port:

• A DC/DC converter. The converter steps the 12-V battery voltage up to the desired USB output (commonly 5 V to 20 V, up to 60 W, or even 48 V and 240 W with the latest USB PD specifications).
• A controller that supports USB PD. This controller is at the heart of modern high-power charging systems, negotiating power roles and voltage levels with connected devices. The TPS26744E-Q1 from Texas Instruments (TI) is an example of a dual-port automotive controller that manages USB PD profiles and controls the associated DC/DC converter.

Challenges when designing high-power USB PD from a 12-V rail include:

• Wide voltage variations: Both input (car battery) and output (USB Type-C port and connected load) voltages vary significantly, requiring a reliable and flexible power architecture.
• High current requirements: Delivering 100 W from a 12-V input can require more than 10 A of input current, necessitating large inductors, low drain-to-source on-resistance MOSFETs, and careful PCB layout to manage losses on the power components.
• Thermal bottlenecks: Most designs use buck-boost converters with four external MOSFETs, which can introduce substantial thermal stress under high load conditions, especially at low input voltages and high output power.

The shift to 48-V systems

The automotive industry is transitioning toward 48-V power architectures, which simplifies USB PD designs and improves thermal efficiency. With a higher input voltage, a buck-only topology is sufficient, replacing the more complex buck-boost design. You’ll need fewer external components (no four-FET bridge, and with significantly reduced inductor size and current rating requirements).

For example, TI’s LM72880-Q1 is an integrated automotive-grade buck converter suitable for 48-V input USB PD applications. Figure 1 shows two USB PD DC/DC converters: a buck-boost converter off a 12-V battery to the left and a buck converter only off a 48-V battery to the right. You can see that the total solution size and components are much lower for the 48-V based system. The 48V-based solution achieves a 58% reduction in PCB area, from 1.75 in² to 0.74 in².

Figure 1 Buck-boost topology for 12-V architecture versus a buck-only topology for the 48-V architecture. Source: Texas Instruments

Lower switching frequencies can help

Switching frequency has a direct impact on power loss. Higher frequencies reduce the size of passive components but increase switching losses in MOSFETs; lower frequencies reduce switching losses but increase inductor ripple, and may require larger output filters.

Figure 2 compares the same board working at different switching frequencies, with 400 kHz to the left and 200 kHz to the right.

Figure 2 Thermal images of the same board working at a switching frequency of 400 kHz (left) versus 200kHz (right). Source: Texas Instruments

The thermal test comparing a 400 kHz versus 200 kHz switching frequency (both at a 54-V input, 5-A output, and with fan cooling) shows that lowering the frequency reduces converter temperature by 18°C. The inductor temperature does rise slightly from 60°C to 63°C, indicating the need for output filtering to balance the heat distribution.

Thicker copper, more PCB layers

PCB design plays a crucial role in thermal management. Increasing copper thickness and adding more layers can significantly reduce temperature rise, especially when fan cooling is not available.

Figure 3 shows thermal images from two similarly sized boards. The board on the left is four layers, each with 1 oz of copper. The board on the right is six layers, with 2 oz of copper for the top and bottom layers and 1 oz of copper for the inner layers.

Figure 3 Thermal images of two PCBs: one with four layers with 1 oz of copper each (left) and one with six layers with 2 oz outer layers and 1 oz inner layers (right). Source: Texas Instruments

Both boards operate at a 48-V input and a 20-V output with 400 kHz switching. The board on the right carries 5 A versus 4.25 A for the board on the left, yet experiences 50% less temperature rise from improved heat dissipation. This underscores the importance of investing in copper-heavy PCB stacks for thermally demanding automotive applications.

Thermal foldback

Traditional protection methods often rely on thermal shutdown, completely disabling the system when a temperature threshold is crossed. While thermal shutdown protects hardware, this approach is abrupt and disruptive. In applications where continuous operation is preferable to complete shutdown—such as in automotive infotainment, industrial USB charging, or consumer docking stations—thermal shutdown simply doesn’t provide a good user experience.

USB PD controllers today, including those from TI, support firmware-configurable thermal foldback, a more sophisticated, dynamic thermal response system that reduces power delivery as temperature rises. Instead of cutting power entirely, the controller steps down the VBUS output power, allowing the system to cool while still maintaining basic functionality. It’s a “fail-soft” approach that maintains safety and system uptime.

TI’s USB PD controllers monitor system temperature through an external negative temperature coefficient thermistor connected to an analog-to-digital converter input. The firmware evaluates this voltage to assess temperature conditions. As the temperature rises, the system progresses through configurable thermal phases, each with increasing levels of power reduction.

In Figure 4, thermal foldback is divided into three thermal phases, each representing a higher level of thermal severity:

• Phase 1: Mild temperature rise. Power is reduced slightly to reduce thermal buildup.
• Phase 2: Intermediate temperature. Power delivery is throttled further to stabilize the system.
• Phase 3: High-temperature alert. Power is significantly reduced or disabled to avoid dangerous overheating.

Figure 4 Thermal thresholds rising and falling with three main phases of thermal foldback. Source: Texas Instruments

Each phase is defined by two voltage thresholds: a rising (Vth_R) and falling (Vth_F) threshold, creating hysteresis to prevent rapid toggling between phases when temperatures hover around a transition point.

In response to phase transitions, the USB PD controller will renegotiate the USB PD contract with the connected sink device. The maximum power allowed in each phase is configurable, offering precise control. For example, if the maximum port power is 100 W, thermal foldback could reduce the power to 60 W when entering phase 1, 27 W in phase 2, and 7.5 W in phase 3.

Thermal foldback is no longer a luxury feature; it’s a necessity in high-power USB PD designs. With firmware-configurable behavior, TI’s USB PD controllers give engineers the flexibility to maintain safe, efficient operation under thermal stress without sacrificing usability or system availability. By stepping power down intelligently instead of shutting off entirely, thermal foldback improves product reliability, extends component life, and delivers a better end-user experience in demanding environments.

USB PD thermal management

Thermal management is an important design consideration in automotive USB PD applications. By leveraging higher-voltage systems, optimizing switching frequency, and investing in PCB design, you can significantly reduce heat-related stress and improve overall reliability. TI offers a range of automotive-grade USB PD controllers and DC/DC converters, such as the TPS26744E-Q1 and LM72880-Q1, to help you design compact, efficient, and thermally reliable USB Type-C charging solutions.

Josh Mandelcorn has been at Texas Instrument’s Power Design Services team for two decades focused on designing power solutions for automotive and communications / enterprise applications. He has designed high-current multiphase converters to power core and memory rails of processors handling large rapid load changes with stringent voltage under / overshoot requirements. He previously designed off-line AC to DC converters in the 250W to 2 kW range with a focus on emissions compliance. He is listed as either an author or co-author on 17 US patents related to power conversion. He received a BSEE degree from the Carnegie-Mellon University, Pittsburgh, Pennsylvania.

Seong Kim is an Applications Engineer at Texas Instruments, where he focuses on automotive USB Power Delivery and DC/DC converter solutions. With over a decade of experience at TI, Seong has supported a wide range of embedded and power designs – from Wi-Fi/Bluetooth MCUs for IoT to high-speed USB-C and PD systems in automotive environments. He works closely with automotive OEMs and Tier-1s to enable reliable fast-charging systems, and is regarded as a go-to expert on PD integration challenges. Seong has authored technical collateral and training materials used across TI’s global customer base, and is listed as an inventor on a pending U.S. patent related to USB Power Delivery. He holds a BSEE from the University of Texas at Dallas and is based in Dallas, Texas.

Stefano Panaro is a Systems Engineer in Texas Instrument’s Power Design Services team focused on designing power solution for Automotive and Communications applications. His main focus is on the design of DCDC converters, with a power level ranging from mW to kW. He received his BS in ECE and his MS in Electronic Engineering from Politecnico di Torino, Italy.

Related Content

• A quick and practical view of USB Power Delivery (USB-PD) design
• USB Power Delivery: incompatibility-derived foibles and failures
• Power Tips #130: Migrating from a barrel jack to USB Type-C PD
• Power Tips #75: USB Power Delivery for automotive systems
• Power Tips #142: A comparison study on a floating voltage tracking power supply for ATE

Additional resources

• For more information, see the reference design from TI, “Automotive, 24V to 60V input, two-port USB Power Delivery 60W maximum per port reference design.”

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