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Texas Instruments (TI) officially opened its new, state-of-the-art product research and development (R&D) centre in Bengaluru at an event commemorating the company’s 40-year presence in India. As the first multinational company to establish an R&D centre in India in 1985, TI has been instrumental in shaping India’s semiconductor landscape for four decades. The new 550,000-square-foot centre features a collaborative workspace dedicated to developing world-class chip designs. The centre includes an end-to-end reliability lab equipped with advanced testing capabilities for various environmental conditions, along with many other integrated circuit design labs.

Inaugurated by Shri Ashwini Vaishnaw, Union Minister for Railways, Information & Broadcasting, Electronics & Information Technology, Government of India, alongside TI leaders, the new centre highlights the company’s strategic vision to propel semiconductor innovation and nurture world-class design talent. This expansion reinforces TI’s commitment to developing breakthrough analogue and embedded processing technologies while strengthening its support for the design ecosystem and its growing customer base in India.

Shri Ashwini Vaishnaw, Union Minister for Railways, Information & Broadcasting; Electronics & Information Technology, Government of India, said, “I congratulate Texas Instruments on the inauguration of this world-class R&D centre in Bengaluru. TI has been a true pioneer in India’s semiconductor journey and stood as a testament to consistently nurturing the design talent ecosystem in India. The company’s expanded investment reinforces India’s position as a global hub for semiconductor design, development and supports our vision of building an innovation-led nation.”

Santhosh Kumar, president and managing director, TI India, said, “As we celebrate 40 years in India, this milestone reflects TI’s rich legacy and our strong commitment to the future. TI India’s product development and design teams drive research and breakthrough innovations for customers worldwide. Our world-class engineers are central to pioneering the next generation of semiconductor advancements.”

The company recently opened an additional sales office to strengthen its partnership with Indian customers, while the new R&D facility builds on its innovation capabilities in the region. With thousands of employees in India, TI continues to expand its presence in the region.

The post Union Minister Ashwini Vaishnaw inaugurates TI’s new, world-class R&D centre appeared first on ELE Times.

Designd my own PCB and got it from JLCPCB. Nice gift fir valentines. I am using NE555 to make the LEDs flash if you want to see how it works comment I'll post a video. submitted by /u/neca222 [link] [comments]

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that its stockholders have voted to approve all proposals related to its pending merger with ion implantation system maker Axcelis Technologies Inc of Beverly, MA, USA at its Special Meeting of Stockholders...

Texas governor Greg Abbott has announced that a Texas Semiconductor Innovation Fund (TSIF) grant of $14,076,031 has been extended to materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA to accelerate scaled production of indium phosphide (InP) wafers in Sherman, TX. The project represents more than $154m in capital investment...

Hareesh Ramana, Chief Experience Officer, Sasken Group & President, Borqs Technologies (a Sasken Group company)

India is making significant strides in electronics manufacturing with the aim of 38% value addition within five years. The device manufacturing ecosystem has grown to a significant scale, but it still depends heavily on designs and reference architectures developed elsewhere.

Building domestic capability in electronic device design, especially IoT/connected device design, is critical to India’s ambition of becoming a major electronics manufacturing hub. India’s ambition to reach 38% value addition in electronics manufacturing will be driven not only by scaling assembly but by strengthening device design and systems engineering, which can contribute as much as 30-35% of the total value creation.

Need for in-house design capabilities:

A growing model in India’s connected-device ecosystem is design-led, end-to-end IoT product development anchored locally, covering silicon integration, embedded software, connectivity stacks, and certification. Companies like Borqs Technologies (now part of the Sasken Group) exemplify this approach, offering full-stack IoT design capabilities from within India.  For OEMs, this can shorten development cycles, improve control over system integration, and reduce dependence on externally sourced IP and engineering capacity, especially in critical connectivity and compliance stages. Expanding these capabilities across the industry can help India move beyond contract manufacturing and toward the higher-value innovation layer where devices connect to data, analytics, and services.

Time to market gap:

Many IoT projects stall because hardware, firmware, cloud platforms, connectivity, and certification are handled by separate vendors with misaligned priorities.

Over the past decade, India’s product development ecosystem has matured to address these challenges, evolving from a cost-centric outsourcing base into a design-led innovation hub. Global OEMs and platform companies increasingly view India as a partner for rapid prototyping and co-innovation, not just low-cost assembly. Several end-to-end product engineering companies in India exemplify this shift by delivering integrated IoT solutions that shorten development cycles and align with global OEM roadmaps.

Integration as a strategic capability

Connected devices are no longer standalone products; they are endpoints of digital services. The differentiator is therefore systems integration across silicon, hardware, software, connectivity, and lifecycle management. A unified, end-to-end engineering model can enable:

• Faster debugging by tightening the feedback loop between hardware and software teams
• Fewer integration issues by reducing handoffs across multiple vendors
• Quicker prototyping and validation through coordinated design and test cycles
• More predictable certification and production ramp by planning compliance and manufacturability early
• A single accountable partner from concept through delivery and lifecycle management

This is particularly vital for industrial-grade devices where reliability, security, and compliance define adoption. Indian engineering firms with cross-layer capabilities are increasingly enabling platform-driven approaches that allow module reuse across verticals like automotive, energy management, and logistics.

AI and advanced technologies and product development:

Advanced technologies like AI, IoT, automation, digital twins, and cloud computing are transforming product development. AI-driven analytics reduce manual testing cycles, while digital twins simulate device behaviour under real-world conditions, enabling faster iteration and higher reliability.

Demand for software-defined vehicles, smart energy infrastructure, automated factories, and connected appliances is accelerating globally. Multinationals are expanding design centres and co-innovation programs in India to build products for both developed and emerging markets.

For India, the opportunity lies in moving beyond contract manufacturing to the high-value layer where devices meet data, analytics, and services. Mastery over sensors, edge intelligence, connectivity stacks, and lifecycle platforms can enable the country to capture a far greater share of the global electronics economy.

The coming decade will reward ecosystems that can bridge the design-to-deployment gap with reliability and speed. India has the talent, digital infrastructure, and entrepreneurial energy to lead this shift. The next step is an integrated approach that unites design, engineering, and manufacturing into a single innovation continuum.

The post Bridging the design-to-deployment gap: How India can lead the next wave of connected device innovation appeared first on ELE Times.

No idea what this is. Not even sure what it does. Just showing it around. submitted by /u/Depleted_Uranium_235 [link] [comments]

Hi everyone, This is my Healthtracker project. This will be my first real 6-Layer PCB I have designed using EasyEDA. I am using the nrf5340 for this low Power Bluetooth application paired with couple i2c peripherals for activitiy, heartrate, time & temp. So I don't run out of storage, I integrated infineon 8-Mbit FRAM. Power is supplied to various DC/DC Buck/Boost converters found at the top. Charging is possible via USB C. I am planning to programm the SoC using the pinheaders and my DevKit. (pinheaders will be soldered out, after programming and Debugging). Oh, don't be confused with these many throughhole vias; JLCPCB curently doesn't support blind or buried vias.... Have a great day. submitted by /u/Scared_Promise_5234 [link] [comments]

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Thumbwheel switches may evoke early digital design, yet their compact precision and tactile feedback keep them indispensable. From setting circuit-board addresses to configuring embedded parameters, they translate simple rotations into reliable numeric codes.

Whether selecting device IDs, adjusting ranges, or defining system values, thumbwheel switches deliver a straightforward interface that endures across industrial, consumer, and embedded applications.

Thumbwheel switches (often abbreviated as TWS) offer a straightforward, tactile method for setting numerical values in electronic instruments and control systems. Each wheel is marked with digits, allowing users to rotate and lock in precise entries without complex circuitry or software.

Their mechanical reliability, clear visual indication, and ease of use have made them a staple in applications ranging from laboratory test equipment to industrial control panels. By combining compact design with intuitive operation, thumbwheel switches continue to serve as a practical solution where accuracy and simplicity are paramount.

Rolling vs. clicking: Choosing your digital dial

While both convert a physical turn into a digital signal, the choice between a thumbwheel and a push-wheel switch comes down to how you prefer to drive your data. The rotary thumbwheel is the high-speed option, featuring a serrated edge that you roll with your thumb to flick through numbers in a single, fluid motion—ideal for quick adjustments across a broad range.

In contrast, the push-wheel is the precision specialist; it keeps the wheel protected behind a window and uses dedicated ‘+’ and ‘−’ buttons to advance the value one crisp click at a time. While the thumbwheel offers intuitive speed, the push-wheel provides tactile certainty and protection against accidental bumps, making it the go-to for industrial settings where every digit counts.

Figure 1 Rotary thumbwheel and push-button thumbwheel switches adjust numerical inputs by rotation or precision clicks. Source: Author

Sidenote: Although rotary thumbwheel and push‑button thumbwheel (push-wheel) switches differ in operation—one using a rotating wheel, the other plus/minus buttons—the term thumbwheel is widely applied as an umbrella designation for both types of digital input switches in industry.

Switch communication mechanisms

Beneath the surface, these switches speak a specific digital language through their pin configurations, typically utilizing binary coded decimal (BCD) or hexadecimal (Hex) outputs to communicate with your controller.

A BCD switch is the standard for human-readable interfaces, cycling strictly from 0 to 9; it’s the perfect fit for decimal-based inputs like a kitchen timer or a thermostat setpoint. However, if your project requires more density, a hexadecimal switch utilizes the same four output pins to provide 16 distinct positions (0–9 and A–F).

Figure 2 Example maps TWS positions to BCD code chart using 8421 pin logic. Source: Author

While both rely on the same 8-4-2-1 weighted logic—where internal contacts bridge a common pin to specific data lines to represent a value—BCD keeps things simple for the end-user, whereas hexadecimal is the preferred choice for technical tasks like setting device addresses or selecting complex software modes in a space-saving format.

As a quick aside, the 8-4-2-1 weighted logic is the most common form of BCD representation. Each decimal digit (0–9) is encoded into a 4-bit binary number, where the bit positions carry weights of 8, 4, 2, and 1 from left to right (MSB to LSB).

Thumbwheel switch output code variants

In practice, thumbwheel switches provide designers with multiple output code formats to match diverse digital system needs. The most common is BCD, where each decimal digit is encoded into a 4-bit binary value for straightforward interfacing with counters and microcontrollers.

Some switches offer decimal output, directly representing the digit without binary conversion. More specialized variants include BCD + Complement, which supplies both the normal BCD code and its inverted form for redundancy or error checking, and BCD Complement, which outputs only the inverted binary representation.

Certain models also support BCH hexadecimal coding, enabling representation of values 0–F in compact 4-bit hexadecimal form, useful in applications requiring extended coding beyond decimal digits. These output options give engineers flexibility to align switch signals with the encoding schemes of displays, logic circuits, or embedded systems, ensuring compatibility and efficient signal processing.

Thumbwheel switches: Key practical notes

In practice, each push-wheel/thumbwheel switch forms a single vertical segment, and multiple segments can be combined to build assemblies of varying sizes. The wheel or buttons enable digit selection from 0 through 9.

In a BCD thumbwheel switch, the common terminal (C) lies on one side, followed by weighted contacts for 8, 4, 2, and 1. Applying a small voltage, for instance 5 VDC, to the common allows the output value to be read by summing the weights of the contacts driven HIGH. For example, selecting digit 3 energizes contacts 1 and 2, both appearing at the common voltage.

Notably, diodes are incorporated into thumbwheel switches to isolate each weighted contact and prevent back-feeding between lines. This ensures that only the intended logic states contribute to the BCD output, protecting the switch and downstream logic from false readings or short circuits.

Figure 3 A practical example illustrates a BCD TWS with diodes installed. Source: Author

Equally important, pull-up and pull-down resistors establish defined default states for the contacts. A pull-up resistor ties an inactive line to logic HIGH, while a pull-down resistor ties it to logic LOW. Without these resistors, floating inputs could drift unpredictably, resulting in noisy or unstable outputs. Together, diodes and pull-up/pull-down resistors guarantee that BCD thumbwheel switches deliver clean, reliable, and unambiguous digital signals to the system.

Keep note at this point that datasheets for thumbwheel switches consistently caution against exceeding their specified voltage and current limits. These devices are usually intended for logic interfacing, with ratings of only a few volts and currents in the milliampere range. Operating them beyond these limits can lead to contact wear, unstable outputs, or permanent failure. As emphasized in manufacturer specifications, designers should strictly adhere to the stated ratings and apply recommended best practices to ensure reliable performance.

Also, it’s critical to distinguish between the Switch Rating and the Carry Rating when selecting a thumbwheel switch. The Switch Rating defines the maximum current allowed while the dial is in motion; exceeding this causes electrical arcing that can erode the gold plating on the contacts. In contrast, the Carry Rating is significantly higher because it applies only when the dial is stationary and the contacts are firmly seated, eliminating the risk of arcs.

Figure 4 Datasheet snippet highlights the key specifications of a thumbwheel switch. Source: C&K Switches

So, to maximize component life when interfacing with PLC inputs, many engineers employ cold switching. This involves adjusting the thumbwheel only when the circuit is de-energized, allowing the switch to operate within its higher carry capacity rather than its lower switching capacity. This practice eliminates the risk of electrical arcing across the contacts during transitions, thereby preventing signal noise and extending the operational life of the switch.

The click that counts

That marks the end of this quick take on thumbwheel switches. While we have covered a flake of theory and some essential practical pointers, there is always more to explore—from advanced BCD logic to creative modern retrofits. These switches may be a “classic” technology, but their reliability and tactile feedback still offer unique value in a touchscreen world.

What is your take? Are you planning to use thumbwheels in your next project, or do you have a favorite “old-school” component that still outperforms modern alternatives? Leave a comment below and share your experience; I would love to hear how you are putting these switches to work.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

The post Thumbwheel switches: Turning numbers into control appeared first on EDN.

I couldn't for the life of me understand why the multimeter was not reading correctly when using bananas to crocodile cables. Lesson learned: don't cheap out on cables. submitted by /u/love_in_technicolor [link] [comments]

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PONG has always fascinated me. A video game made entirely from logic blocks from the 74xx series. Without a processor, memory or software. After seeing an original PONG console at the Berlin Computer Game Museum, I set myself the goal of recreating one. And now it's finished. I didn't want to use the large arcade cabinet like the original as the ‘housing’, but something smaller that would focus on the circuit board. Because it is the ‘star’ of PONG. Ingeniously designed by Allen Alcorn, who went down in computer gaming history as the designer of PONG. But as I said, it's not a computer. I redesigned the circuit board from photos and templates. Conductor track by conductor track, component by component. The ICs are still relatively easy to obtain (I also recreated an Apple I, which was more difficult, or rather almost impossible nowadays). The control panel also had to be the same as the original, and of course a real coin validator had to be included. submitted by /u/GHelectronic [link] [comments]

This “Mona Lisa” was created as a technical demonstration by a by a Japanese company that provides PCB assembly (PCBA) services. Instead of using PCB traces or silkscreen artwork, this piece is built from about 10,000 1608-metric SMD components. The image is formed through the color variation of resistors, ceramic capacitors and other components, turning electronic parts into a high-resolution mosaic. submitted by /u/NEET_FACT0RY [link] [comments]

This post presents a component-level schematic overview of an ESP32-S3-based vision development board. The shared material focuses strictly on electronic circuit design and interconnection of active components, including the MCU core, power regulation, and peripheral interfaces. Primary active components shown in the schematic: - ESP32-S3-WROOM system-on-chip - DVP camera interface connected directly to the MCU - 6-axis IMU interfaced over I2C - MEMS microphone connected via I2S - SPI-based microSD card interface - Dedicated voltage regulation stages supplying RF, camera, and sensor domains The circuit design integrates vision, motion sensing, and wireless communication on a single ESP32-S3 platform. Power integrity, signal routing density, and pin multiplexing constraints are central factors influencing the schematic structure. The schematic is provided for component-level reference and electronic circuit visibility. Since it's newly created, it doesn't have a GitHub repository yet. submitted by /u/No-Army-950 [link] [comments]

submitted by /u/Vast_Image_4828 [link] [comments]

I love maps, transit, and DIY electronics- here is my recent project combining all three! I had an 8"x10" PCB manufactured with a custom map of Boston silkscreened on the front side. On this map, each station on the Red Line is marked by two LEDs- one for inbound and outbound trains. Data is streamed from the MBTA's API and displayed on the board, showing location, speed, or occupancy information. This version utilizes WS2812B-2020 LEDs and a very simple two-layer PCB. For future projects, I would be interested in using rear-mounted LEDs (such as SK6812-Es) for a more polished look. If you're interested in the project, all of the code, PCB files, and tutorials are open source: https://github.com/tomunderwood99/CharlieBoard submitted by /u/CyclingOctopuses [link] [comments]

Korea Advanced Institute of Science and Technology (KAIST) has demonstrated a high-efficiency, ultra-high-resolution red micro-LED display, paving the way for displays that can deliver visuals even sharper than reality...

MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) has promoted two senior leaders within the organization to the senior vice president level. The promotions further strengthen and expand the management team, with a focus on executing strategic corporate initiatives to grow and better serve its diverse customer base, as well developing advanced semiconductor technologies...

As AI workloads and hyperscale data centers drive unprecedented power demand, operators face mounting pressure to improve efficiency and reduce grid strain. High-voltage direct current (HVDC) distribution is emerging as a critical solution, and GlobalFoundries is enabling this transition with advanced GaN technology that enables high-density, high-efficiency power conversion. This perspective explores how GF’s semiconductor innovations will power the next generation of sustainable, large-scale data centers.

The rapid adoption of AI across consumer and commercial markets is driving unprecedented investment in high-performance computing and networking. As AI models scale and proliferate across diverse applications, demand for compute power keeps rising. To meet this need, the power consumption of heterogeneous processing units (XPUs) is projected to climb from today’s 1–1.5 kW to more than 5 kW by 2030 [1]. This surge in power requirements is driving demand for denser, more efficient power conversion solutions from the grid to the core. 

Emerging power distribution architecture

Distribution of 415-480 VAC within data centers causes a patchwork of electrical conversions. AC power needs to be converted to DC power to support battery backup, and back to AC for further distribution.  But as AI systems scale up, this energy loss is too costly to absorb. A key focus area for the industry is high-voltage direct current (HVDC) distribution, which reduces conduction losses and the number of conversion stages in large clusters.

The main proposed solutions are either ±400 V (Mt. Diablo) or 800 V (Kyber) DC power delivery.  The first phase of HVDC solutions will still rely on 415-480 VAC distribution with a sidecar power rack, thereby reducing some power conversion losses.  This step has fewer power conversion stages than existing systems and reduces conduction losses by delivering HVDC to the adjacent compute rack.  However, to further eliminate power conversion stages, data centers will distribute HVDC throughout the cluster.  Additional energy savings will be achieved by implementing the 800V DC-DC conversion within the system trays in compute racks, reducing busbar conduction losses. This deployment will require a significant step up in density and efficiency. The past few months have seen hyperscalers specifying their general needs [2] of higher rack-power capacity, power efficiency, density, and scalability, as well as vendors responding with proposed converter topologies and considerations to meet those needs [3].  

This marks real progress, and it’s already clear that the key performance goals of the solutions are within reach. The benefits of these next-generation power delivery architectures include:

1. High conversion ratio – Conversion from HVDC distribution to very low XPU core voltage with as few stages as possible requires a large step-down ratio (>1000:1).  Solutions based on wide bandgap semiconductors such as gallium nitride (GaN) achieve higher conversion ratios due to higher breakdown voltages and reduced conduction and switching losses compared to silicon-based solutions.
2. Significant density increase compared to current power supply unit (PSU) designs – The increase in XPU power consumption does not come with a corresponding increase in available volume for power electronics. Computer and network architectures impose constraints on physical distance, necessitating more compact power components. Thanks to their excellent switching characteristics, GaN power semiconductors enable higher-frequency operation, allowing smaller energy-storage components such as capacitors, inductors, and transformers.
3. Extremely high efficiency at scale – The extraordinary growth in data center power consumption means that power losses in every stage translate directly to energy costs. Thus, the conversion ratio and high density must be achieved without sacrificing efficiency. GaN devices offer the best figures of merit—including lower specific on-resistance, minimal switching charge, and better high-frequency FOM—which result in the highest efficiency for a given ratio and density.

How GaN is driving data center innovation

The data center market demands not only advanced performance but also exceptional quality and reliability. Increasingly, industry consensus points to Power GaN as the key enabling technology for HVDC solutions in data centers. 

GlobalFoundries is developing GaN platforms to support this transition, including HV (650 V) and MV (200 V and below) devices. These platforms will offer industry-leading figures of merit (FoM) with the reliability and ruggedness that hyperscalers require to deploy AI at scale.

Opportunities for scaling HVDC architectures

Looking ahead to broad solution deployment, there are several major opportunities that remain, each offering room to drive the next wave of innovation on topology selection and device optimization:

• Establishing clear safety and isolation requirements: To date, safety and isolation have been discussed only in broad terms, but HVDC architectures will require isolation. Achieving safety and isolation compliance through spacing (creepage and clearance) can come at a high cost to density, while achieving compliance mechanically via conformal coating or potting can degrade thermal performance—both of which complicate serviceability of systems in the field. Defining the right balance represents a major opportunity for innovation in materials, mechanical structures, and system architecture.
• Defining EMI/EMC requirements for scaling next-generation data centers: With data centers subject to strict electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards, the industry must determine how topologies can meet them. If bulky filter components are required to scale HVDC solutions, this may prevent density targets from being met, potentially forcing alternate topology selection. It is crucial that these requirements scale to multi-GW data centers, allowing clusters to interoperate, otherwise compatibility and performance are at risk.
• Converging on optimal step-down ratios and system-level power conversion strategy: Will the industry converge to a 16x or 64x step-down, or, as the HVDC converter moves into the system tray, will system designers optimize the power conversion stages around different voltage levels?  If solutions are customized based on system-level optimization, this will likely lead to a need for regulated HVDC converters as well as unregulated fixed-ratio converters, with the two types having distinct transient requirements. These tradeoffs will affect overall system design in the future, from rack input to XPU.

Enabling scalable, efficient, and sustainable data centers

As these solutions evolve and mature, GF will collaborate with our customers to optimize device development, integrate driver and sensor functionality with power devices, and heterogeneously integrate power devices with additional components.  

It is encouraging that, along with the activity around converter feasibility, industry participants are also extremely active in pursuing open standards, such as the Open Compute Project’s Power Distribution sub-project, which will provide a roadmap for scalable, interoperable HVDC architectures. 

Adoption of HVDC architectures allows operators and OEMs to convert efficiency gains directly into XPU and network-cluster performance—delivering more usable floating-point operations per second (FLOPs) from the same energy footprint while reducing energy losses, lowering operational costs, improving rack-level density, and advancing sustainability goals through more efficient power delivery. Meeting these stringent demands at a massive scale requires solutions that ensure interoperability and long-term ecosystem value remain top priority.

Notes:

1. Future AI processors said to consume up to 15,360 watts of power — massive power draw will demand exotic immersion and embedded cooling tech | Tom’s Hardware
2. Asset Share – NVDAM 
3. Swing Aboard the 800-V Bus: NVIDIA’s AI Power Architecture and the Chips to Drive It | Electronic Design

Related Content

• The shift to 800-VDC power architectures in AI factories
• The transition from 54-V to 800-V power in AI data centers
• Solving power challenges in AI data centers
• Data center power meets rising energy demands amid AI boom

The post Powering AI at scale: How HVDC and GaN are transforming hyperscale data centers appeared first on EDN.

❤️ БО БФ "КОЛО" і Центр крові ЗСУ у співпраці із КПІ ім. Ігоря Сікорського запрошують на донацію крові kpi пт, 02/06/2026 - 14:36