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Diodes Incorporated has announced two new ideal diode controllers with a wide input voltage range, low quiescent current, and overvoltage lockout protection.

Ok I'm not a noob but I haven't built anything for a long long time, this PCB circuit was a complete fail haha I didn't expect to have issues with it but it's on me for not thinking properly. Simple OpAmp driving a class B output stage (unbiased, the opamp is fast enough to prevent crossover distortion) I was using TO-3 transistors with 30 volts power supply input. This circuit worked great on a breadboard. I thought I could hack together a PCB and instead of taking time to do proper design I just hack and slashed the PCB "pads" with a dremel bit. Probably not the best idea... The amplifier simply refused to amplify symmetrically - almost all the signal was in the upper NPN transistor, and in fact I could hear the output capacitor vibrating at the 1Khz tone I was feeding into the circuit. See that potentiometer? It was meant to adjust the OpAmp's voltage on the positive input so I could fine tune the symmetry of the amplifier, but it wouldn't affect anything. The upper NPN would get super hot and the PNP wasn't do much at all. Also the circuit was drawing like 250ma without any input signal (whereas when it was on the breadboard it would only draw 5ma, because the OPAMP was keeping the transistors off when there was no signal) At first I thought I possibly had a bad connection somewhere, like wired wrong I looked at this thing for a few hours, all the parts were in the right place. I could not find any weird shorts either. Tested different sections with a multimeter to see. The main thing that would always come back wrong was the voltage on the OPamp + input, it was like in millivolt range, I even replaced the POT and still nothing. I think it was probably oscillating, you can see my thicker output wires? They *twice* cross over the wires that are inputs to the transistor base. Ya, that's probably a really stupid thing to do. Power transistors with a gain of around 70 (beta). Anyway, I don't know how I though this was ever going to work LOL. I guess I should have more patience next time and design a proper layout. Probably use perfboard instead I was using big TO-3 transistors and attaching them to a heatsink . I cut the transistors off of this board . I put them back into my circuit on a breadboard and everything works perfectly again haha. So ya, layout is important DERP. One thing I didn't think to try was lowering the gain of the OpAmp to see if it was oscillating. Right now the gain is at 33 (AC gain) I could have tried dropping that to like 5 to see if it changed anything. Anyway, time to start over and build a proper board that keeps the input lines well away from the higher current output lines. submitted by /u/Perfect-Campaign9551 [link] [comments]

submitted by /u/1Davide [link] [comments]

❤️ Державні гранти на навчання у КПІ ім.Ігоря Сікорського kpi чт, 07/31/2025 - 23:14

submitted by /u/1Davide [link] [comments]

This isn't a gender changer. It's a gender conformer. Plug one gender DE-9 into one end, get that same gender on the other. At best, it's a ⅞" extension "cord". And before anyone suggests it can turn a straight-through cable into a cross-over cable, or vice-versa, I've already signal-traced the pins. It's 1:1. So, what's the most useless bit of kit you have? submitted by /u/EmbeddedSoftEng [link] [comments]

The Renesas 64-bit RZ/G3E microprocessor powers HMI applications with a quad-core Arm Cortex-A55 CPU and Ethos-U55 neural processing unit (NPU) for AI tasks. Running at up to 1.8 GHz, the Cortex-A55 handles both HMI and edge computing functions, while an integrated Cortex-M33 core performs real-time tasks independently of the main CPU to enable low-power operation.

With Full HD graphics and high-speed connectivity, the RZ/G3E is well-suited for industrial and consumer HMI systems, including factory equipment, medical monitors, retail terminals, and building automation. It outputs 1920×1080 video at 60 fps on two independent displays via an LVDS (dual-link) interface. MIPI-DSI and parallel RGB outputs are also available, along with a MIPI-CSI interface for video input and sensing tasks.

The microprocessor’s 1-GHz NPU delivers 512 GOPS for AI workloads such as image classification, object and voice recognition, and anomaly detection—while offloading the CPU. Power management features in the RZ/G3S reduce standby consumption by maintaining sub-CPU operation and peripheral functions at approximately 50 mW, dropping to about 1 mW in deep standby mode.

The RZ/G3E microprocessor is available now. Visit the product page below to check distributor availability.

RZ/G3E product page 

Renesas Electronics 

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TI’s single-chip battery fuel gauges, the BQ41Z90 and BQ41Z50, extend battery runtime by up to 30% using a predictive modeling algorithm. Their adaptive Dynamic Z-Track algorithm delivers state-of-charge and state-of-health accuracy within 1%, enabling precise monitoring in battery-powered devices such as laptops and e-bikes.

The fuel gauges provide accurate battery capacity readings under varying load conditions, allowing designers to right-size batteries without overprovisioning. The BQ41Z90 integrates a fuel gauge, monitor, and protector for 3- to 16-cell Li-ion battery packs, while the BQ41Z50 supports 2 to 4 cells. Integration reduces board complexity and can shrink footprint by up to 25% compared to discrete implementations.

Each battery pack manager monitors voltage, current, temperature, available capacity, and other key parameters using integrated analog peripherals and an ultra-low-power 32-bit RISC processor. Both devices report data to the host system over an SMBus v3.2-compatible interface, while the BQ41Z90 also supports I²C. It additionally enables simultaneous current and voltage conversion for real-time power calculations and supports sense resistors as low as 0.25 mΩ.

Pre-production quantities of the BQ41Z90 and production quantities of the BQ41Z50 are available now on TI.com. Evaluation modules, reference designs, and simulation models are also available.

BQ41Z90 product page 

BQ41Z50 product page 

Texas Instruments 

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Teledyne’s 16-Gbyte DDR4 memory module, designated TDD416Y12NEPBM01, is screened and qualified as an Enhanced Product (EP) for high-reliability aerospace and defense systems. The solder-down device is smaller than a postage stamp, making it well-suited for space-constrained systems where performance is critical.

Rated for -40°C to +105°C operation, the module delivers 3200 MT/s (3200 MHz) and integrates memory, termination, and passives in a compact 22×22- mm, 216-ball BGA package. It replaces multiple discrete components, helping to simplify board layout. An optional companion ECC chip is available for applications requiring error correction.

The TDD416Y12NEPBM01 interfaces with x64 and x72 memory buses and supports a range of processors and FPGAs, including those from Xilinx, Microchip, NXP, and Intel, as well as Teledyne’s LS1046-Space. According to Teledyne, the DDR4 module achieves 42% lower power, 42% less jitter, and 39% PK/PK reduction compared to conventional SODIMMs.

To request further information on the TDD416Y12NEPBM01, click here.

Teledyne HiRel Semiconductors 

The post DDR4 memory streamlines rugged system design appeared first on EDN.

With over twice the throughput of its predecessor, MaxLinear’s Panther V storage accelerator achieves 450 Gbps, scalable to 3.2 Tbps. It enables low-latency data processing across file, block, and object storage in HPC, hyperscale, hyperconverged, and AI/ML environments.

Panther V offloads the CPU from compute-intensive data transformation tasks—including compression, deduplication, encryption, and real-time verification. According to MaxLinear, the hardware-based approach offers higher performance, lower storage costs, and improved energy efficiency compared to conventional software-only, FPGA-based, and other competing solutions.

Panther V features a PCIe Gen5 x16 interface to fully leverage the bandwidth of next-generation server platforms. Its MaxHash-based deduplication, combined with deep compression algorithms, achieves data reduction ratios of up to 15:1 for structured data. By reducing CPU and memory bandwidth demands, as well as storage device usage, Panther V helps lower both capital and operating costs. Built-in reliability features ensure high data integrity and six-nines availability.

MaxLinear will unveil Panther V at the upcoming Flash Memory Summit (FMS25).

Panther V product page

MaxLinear

The post Accelerator speeds data, cuts latency appeared first on EDN.

Designed for 400G and 800G optical networks, Coherent’s CHR1065 100G transimpedance amplifier (TIA) operates at 56 Gbaud using PAM4 modulation. It joins the company’s open-market ASIC portfolio, offering four channels with a 750-µm optical pitch suited for compact DR, FR, and LR module configurations.

The CHR1065 minimizes input-referred noise to 2.3 µA RMS, enhancing receiver sensitivity for longer reach. High linearity up to 2.5 mA ensures reliable performance across varying link budgets. Consuming just 227 mW per channel at 25°C, the TIA supports dense deployments in power-constrained data centers. An I²C interface enables integration with system-level monitoring and control functions.

Tested to JEDEC standards for lifetime reliability, the CHR1065 is now available as a wire-bondable bare die and in full volume production. Engineering samples ship in 25-piece waffle packs. For more information or to request samples, click here.

Coherent

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submitted by /u/Grid_Rider [link] [comments]

Professional bodge wires, with silkscreen and everything. 2oz copper left the chat. submitted by /u/Purple_Ice_6029 [link] [comments]

For second-quarter 2025, deposition equipment maker Aixtron SE in Herzogenrath, near Aachen, Germany has reported revenue of €137.4m, up 4.2% on €131.8m a year ago and 22% on €112.5m in Q1.2025. This is near the upper end of the guidance range of €120–140m, reflecting a strong performance in a generally soft market environment...

The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.

This project is a compact evaluation PCB designed for the nPM1100 Power Management IC by Nordic Semiconductor. The board provides the essential circuitry to evaluate the core features of the PMIC in a minimal footprint while exposing all IO pins for external interfacing. PCB dimensions: 22 mm × 16 mm PCB layers: 2 All components: Surface-mounted on the top layer Header pitch: Standard 2.54 mm (0.1") More info on GitHub https://github.com/P-rth/LIPL-Assessment/blob/main/ProblemStatemet2%2Freadme.md submitted by /u/antihumanracerobot [link] [comments]

It's not finished yet, but it will be soon. Only one PCB is left once I finish that and do the wiring, it'll be done. submitted by /u/Careful-Rich9823 [link] [comments]

Today’s car buyers, whether purchasing premium or economy models, expect to charge multiple devices simultaneously through in-vehicle USB ports. To meet this demand, automakers are replacing legacy USB Type-A ports with multiple USB Type-C ports that support the latest USB power delivery (PD) standards. These standards enable significantly higher power levels—up to 48 V and 240 W—suitable for fast-charging laptops, tablets, and phones.

USB PD controllers operate alongside internal or external DC/DC converters, which add their own thermal stress to the system. This challenge becomes even more critical in automotive, industrial, and other space-constrained designs where airflow is minimal and ambient temperatures are high. If left unmanaged, excessive heat can damage or degrade system reliability. Elevated temperatures accelerate the aging of semiconductors and passive components, cause solder joint fatigue, and, in the worst cases, can lead to printed circuit board (PCB) delamination or thermal runaway. These risks make thermal management a priority in system-level USB PD designs, especially when long-term reliability or safety are requirements. In this power tip, I’ll explore different methods to manage heat and improve system reliability when implementing automotive USB PD solutions.

A typical 12-V battery automotive system needs these components to implement a USB PD charging port:

• A DC/DC converter. The converter steps the 12-V battery voltage up to the desired USB output (commonly 5 V to 20 V, up to 60 W, or even 48 V and 240 W with the latest USB PD specifications).
• A controller that supports USB PD. This controller is at the heart of modern high-power charging systems, negotiating power roles and voltage levels with connected devices. The TPS26744E-Q1 from Texas Instruments (TI) is an example of a dual-port automotive controller that manages USB PD profiles and controls the associated DC/DC converter.

Challenges when designing high-power USB PD from a 12-V rail include:

• Wide voltage variations: Both input (car battery) and output (USB Type-C port and connected load) voltages vary significantly, requiring a reliable and flexible power architecture.
• High current requirements: Delivering 100 W from a 12-V input can require more than 10 A of input current, necessitating large inductors, low drain-to-source on-resistance MOSFETs, and careful PCB layout to manage losses on the power components.
• Thermal bottlenecks: Most designs use buck-boost converters with four external MOSFETs, which can introduce substantial thermal stress under high load conditions, especially at low input voltages and high output power.

The shift to 48-V systems

The automotive industry is transitioning toward 48-V power architectures, which simplifies USB PD designs and improves thermal efficiency. With a higher input voltage, a buck-only topology is sufficient, replacing the more complex buck-boost design. You’ll need fewer external components (no four-FET bridge, and with significantly reduced inductor size and current rating requirements).

For example, TI’s LM72880-Q1 is an integrated automotive-grade buck converter suitable for 48-V input USB PD applications. Figure 1 shows two USB PD DC/DC converters: a buck-boost converter off a 12-V battery to the left and a buck converter only off a 48-V battery to the right. You can see that the total solution size and components are much lower for the 48-V based system. The 48V-based solution achieves a 58% reduction in PCB area, from 1.75 in² to 0.74 in².

Figure 1 Buck-boost topology for 12-V architecture versus a buck-only topology for the 48-V architecture. Source: Texas Instruments

Lower switching frequencies can help

Switching frequency has a direct impact on power loss. Higher frequencies reduce the size of passive components but increase switching losses in MOSFETs; lower frequencies reduce switching losses but increase inductor ripple, and may require larger output filters.

Figure 2 compares the same board working at different switching frequencies, with 400 kHz to the left and 200 kHz to the right.

Figure 2 Thermal images of the same board working at a switching frequency of 400 kHz (left) versus 200kHz (right). Source: Texas Instruments

The thermal test comparing a 400 kHz versus 200 kHz switching frequency (both at a 54-V input, 5-A output, and with fan cooling) shows that lowering the frequency reduces converter temperature by 18°C. The inductor temperature does rise slightly from 60°C to 63°C, indicating the need for output filtering to balance the heat distribution.

Thicker copper, more PCB layers

PCB design plays a crucial role in thermal management. Increasing copper thickness and adding more layers can significantly reduce temperature rise, especially when fan cooling is not available.

Figure 3 shows thermal images from two similarly sized boards. The board on the left is four layers, each with 1 oz of copper. The board on the right is six layers, with 2 oz of copper for the top and bottom layers and 1 oz of copper for the inner layers.

Figure 3 Thermal images of two PCBs: one with four layers with 1 oz of copper each (left) and one with six layers with 2 oz outer layers and 1 oz inner layers (right). Source: Texas Instruments

Both boards operate at a 48-V input and a 20-V output with 400 kHz switching. The board on the right carries 5 A versus 4.25 A for the board on the left, yet experiences 50% less temperature rise from improved heat dissipation. This underscores the importance of investing in copper-heavy PCB stacks for thermally demanding automotive applications.

Thermal foldback

Traditional protection methods often rely on thermal shutdown, completely disabling the system when a temperature threshold is crossed. While thermal shutdown protects hardware, this approach is abrupt and disruptive. In applications where continuous operation is preferable to complete shutdown—such as in automotive infotainment, industrial USB charging, or consumer docking stations—thermal shutdown simply doesn’t provide a good user experience.

USB PD controllers today, including those from TI, support firmware-configurable thermal foldback, a more sophisticated, dynamic thermal response system that reduces power delivery as temperature rises. Instead of cutting power entirely, the controller steps down the VBUS output power, allowing the system to cool while still maintaining basic functionality. It’s a “fail-soft” approach that maintains safety and system uptime.

TI’s USB PD controllers monitor system temperature through an external negative temperature coefficient thermistor connected to an analog-to-digital converter input. The firmware evaluates this voltage to assess temperature conditions. As the temperature rises, the system progresses through configurable thermal phases, each with increasing levels of power reduction.

In Figure 4, thermal foldback is divided into three thermal phases, each representing a higher level of thermal severity:

• Phase 1: Mild temperature rise. Power is reduced slightly to reduce thermal buildup.
• Phase 2: Intermediate temperature. Power delivery is throttled further to stabilize the system.
• Phase 3: High-temperature alert. Power is significantly reduced or disabled to avoid dangerous overheating.

Figure 4 Thermal thresholds rising and falling with three main phases of thermal foldback. Source: Texas Instruments

Each phase is defined by two voltage thresholds: a rising (Vth_R) and falling (Vth_F) threshold, creating hysteresis to prevent rapid toggling between phases when temperatures hover around a transition point.

In response to phase transitions, the USB PD controller will renegotiate the USB PD contract with the connected sink device. The maximum power allowed in each phase is configurable, offering precise control. For example, if the maximum port power is 100 W, thermal foldback could reduce the power to 60 W when entering phase 1, 27 W in phase 2, and 7.5 W in phase 3.

Thermal foldback is no longer a luxury feature; it’s a necessity in high-power USB PD designs. With firmware-configurable behavior, TI’s USB PD controllers give engineers the flexibility to maintain safe, efficient operation under thermal stress without sacrificing usability or system availability. By stepping power down intelligently instead of shutting off entirely, thermal foldback improves product reliability, extends component life, and delivers a better end-user experience in demanding environments.

USB PD thermal management

Thermal management is an important design consideration in automotive USB PD applications. By leveraging higher-voltage systems, optimizing switching frequency, and investing in PCB design, you can significantly reduce heat-related stress and improve overall reliability. TI offers a range of automotive-grade USB PD controllers and DC/DC converters, such as the TPS26744E-Q1 and LM72880-Q1, to help you design compact, efficient, and thermally reliable USB Type-C charging solutions.

Josh Mandelcorn has been at Texas Instrument’s Power Design Services team for two decades focused on designing power solutions for automotive and communications / enterprise applications. He has designed high-current multiphase converters to power core and memory rails of processors handling large rapid load changes with stringent voltage under / overshoot requirements. He previously designed off-line AC to DC converters in the 250W to 2 kW range with a focus on emissions compliance. He is listed as either an author or co-author on 17 US patents related to power conversion. He received a BSEE degree from the Carnegie-Mellon University, Pittsburgh, Pennsylvania.

Seong Kim is an Applications Engineer at Texas Instruments, where he focuses on automotive USB Power Delivery and DC/DC converter solutions. With over a decade of experience at TI, Seong has supported a wide range of embedded and power designs – from Wi-Fi/Bluetooth MCUs for IoT to high-speed USB-C and PD systems in automotive environments. He works closely with automotive OEMs and Tier-1s to enable reliable fast-charging systems, and is regarded as a go-to expert on PD integration challenges. Seong has authored technical collateral and training materials used across TI’s global customer base, and is listed as an inventor on a pending U.S. patent related to USB Power Delivery. He holds a BSEE from the University of Texas at Dallas and is based in Dallas, Texas.

Stefano Panaro is a Systems Engineer in Texas Instrument’s Power Design Services team focused on designing power solution for Automotive and Communications applications. His main focus is on the design of DCDC converters, with a power level ranging from mW to kW. He received his BS in ECE and his MS in Electronic Engineering from Politecnico di Torino, Italy.

Related Content

• A quick and practical view of USB Power Delivery (USB-PD) design
• USB Power Delivery: incompatibility-derived foibles and failures
• Power Tips #130: Migrating from a barrel jack to USB Type-C PD
• Power Tips #75: USB Power Delivery for automotive systems
• Power Tips #142: A comparison study on a floating voltage tracking power supply for ATE

Additional resources

• For more information, see the reference design from TI, “Automotive, 24V to 60V input, two-port USB Power Delivery 60W maximum per port reference design.”

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5V, Up to 64KB Flash Memory, Rich Peripherals, and High Noise Immunity Empowering Industrial and Home Appliance Applications

Nuvoton Technology released the enhanced 1T-8051 microcontroller series – NuMicro MG51, tailored for applications such as home appliances, LED dimming, motor control, and industrial automation.

Key Features of the NuMicro MG51 Series:

• High-Speed Core: 1T-8051 core running up to 24 MHz.
• Rich Memory: Up to 64 KB of Flash memory, 4 KB of SRAM, and 4 KB of LDROM.
• Robust Operation: Wide voltage (2.4V-5.5V) and industrial temperature (-40°C to +105°C) support.
• High Noise Immunity: 7 kV ESD (HBM) and 4.4 kV EFT protection.
• Advanced Control: Up to 12-channel PWM for precise motor control.
• Flexible Communication: Up to 5 UARTs, SPI, and I²C interfaces.
• High-Precision Sensing: 15-channel, 12-bit ADC with 500 kSPS sampling rate.
• Ample I/O: Up to 46 GPIOs with flexible interrupt configuration.

Running at speeds of up to 24 MHz, the MG51 series features up to 64 KB of Flash memory, 4 KB of SRAM, and 4 KB of LDROM. It integrates rich communication and control peripherals, supports 5V operation, industrial-grade temperature range, and robust noise immunity. Multiple package options are available, including the 48-pin version that supports up to 46 external interrupt-capable I/Os, offering developers excellent design flexibility and application scalability.

The MG51 is equipped with four 16-bit timers and up to five independent UARTs. These include two UARTs with built-in error detection and automatic address recognition, and three ISO 7816-3 compliant interfaces (which can also function as UARTs with automatic parity check support). One SPI and one I²C interface are also provided to support various communication and data transfer needs.

The series supports up to 12-channel PWM outputs, making it ideal for small motor applications such as fans and pumps. It also integrates up to 15-channel 12-bit ADCs with 500 kSPS continuous conversion, capable of real-time sensing of temperature, current, and light, making it highly suitable for smart appliances, energy control modules, and automation systems.

MG51 provides 24 interrupt sources and four levels of interrupt priority. Combined with flexible I/O configuration, it is ideal for systems requiring multi-point input control and event triggering, such as LED dimming, keypad control, audio, and alarm modules. The series operates reliably across a wide industrial temperature range, from -40°C to +105°C, and features high noise immunity with ESD protection of up to 7 kV and EFT protection of up to 4.4 kV. It supports a wide operating voltage range from 2.4V to 5.5V, ensuring stable performance across diverse power environments.

In terms of chip security, this series offers three protection mechanisms.

• Prevents program readout via ICP pins through Flash lock bits.
• Built-in 128-byte Security Protection ROM (SPROM). In security mode, the SPROM region is executable-only and inaccessible for code or data read. In non-security mode, it can also be used as Data Flash.
• Provides a 96-bit Unique Identification (UID) and a customizable 128-bit Unique Customer Identification (UCID).

Package options include TSSOP20/28, QFN20/33, and LQFP32/48—six types in total—addressing the needs of space-constrained applications. The entire MG51 series is now in mass production and fully available.

Comprehensive development resources are also offered, including the NuMaker development boards and Nu-Link debuggers. MG51 is compatible with Keil C51, IAR EW8051, and NuEclipse SDCC development toolchains. Notably, NuEclipse is Nuvoton’s in-house cross-platform embedded development suite for 8051 and Arm cores, designed specifically for the NuMicro MCU series. It integrates multiple Eclipse plug-ins and tools, enabling developers to efficiently build, compile, and debug projects within the familiar Eclipse framework across both Linux and Windows platforms, thereby accelerating development and reducing time-to-market.

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The USA smartphone market continues to be in its 2025 dimension, along the lines of innovation, competition, and consumer loyalty. With a global battle for supremacy, users look towards what they consider best: AI-powered photography, 5G capabilities, foldable designs, and extended software support. Here is a more detailed breakdown of the top 10 smartphone brands in the USA, based upon innovation, customer faith, and general performance.

1. Apple

Apple, based in Cupertino, California, is by far the most recognized name in U.S. smartphones. The iPhones hold nearly 55% of the market share, with the iPhone 15 generation leading both premium and mainstream smartphone markets. Most choose Apple basically because of the iOS ecosystem, longevity of software support, and proprietary chips. Satellite connectivity, Dynamic Island, and cutting-edge camera systems continue to set the standards for user expectations.

2. Samsung

Samsung from Seoul holds the second-biggest share of the U.S. smartphone market. With a couple of good Galaxy S and Z Fold/Flip series models, Samsung continues to claim the top place in Android innovation. The Galaxy S24 Ultra and Z Fold5 have set benchmarks with AMOLED displays, S Pen functionality, and foldable designs. With powerful specs and One UI, Samsung offers options across all price points.

3. Google Pixel

The Google Smartphone Division is located in Mountain View, California, steadily increasing market presence in the U.S. Pixel 8 Pro glorifies Google’s expertise in computational photography, pure Android experience, and AI-based features such as Magic Eraser and real-time call screening. 7 years of software support beginning with the Pixel 8 series-however, Google has set a new bar for Android longevity.

4. OnePlus

OnePlus, a subsidiary of BBK Electronics, and headquartered in Shenzhen in China, has made a big market among tech-savvy users in the U.S. OnePlus 12 flaunts a set of flagship-level specifications with Snapdragon 8 Gen 3, an awe-inspiring AMOLED display, and Hasselblad-powered cameras. Known for its fast charging and smooth OxygenOS, OnePlus offers performance-oriented devices at competitive prices.

5. Motorola

Founded in the US and now owned by Lenovo, Motorola is now based in Chicago, Illinois. It has staged quite a good comeback with the Moto G and Edge series, which promise great performance and near stock Android. Its iconic Razr foldables are the epitome of nostalgia meeting modern-day tech. Motorola targets those looking for affordable phones with long battery.

6. TCL

TCL, the highest-rated company for televisions and displays, ventures into the smartphone field with its operating headquarters in Huizhou, China. Although still minor on volume basis, TCL has been garnering attention for its budget smartphones that never compromise on display or build quality. The customers are attracted by phones like the TCL 50 XL 5G for the affordable 5G-ready phone.

7. ASUS

ASUS, with headquarters in Taipei, Taiwan, caters to the niche gaming phone market in the U.S. ROG Phone 8 Pro, with a 165Hz refresh rate and huge battery, along with cooling accessories for hours of intense gaming, is the ultimate power phone. While not exactly mainstream, ASUS appeals greatly to gamers and power users.

8. Sony Xperia

Sony Mobile, based out of Tokyo, aims at some niche professional users and content creators in the U.S. Its Xperia 1 V has a 4K OLED screen and Zeiss-tuned cameras, perfect for videography and media consumption. Though it sells in smaller numbers, Sony phones are well-regarded for their abilities as multimedia devices and for their stylish looks.

9. Honor

Honor, a quickly scaling brand situated in Shenzhen, China, has been making waves in the global markets and slowly making entry into the U.S. scenario, predominantly through online platforms and unlocked devices. Formerly a sub-brand of Huawei, Honor is now an independent entity, known for its stylish design, robust hardware, and relative value offerings. Its newest flagship, Honor Magic6 Pro, is the powerful contender that comes with Snapdragon 8 Gen 3, 120Hz OLED display, and Elite AI photography.

10. BLU

BLU Products is a smartphone company located in Miami, Florida, offering ultra-affordable unlocked Indian handsets. Blu targets entry-level users with simplistic smartphones that go for sale on the web or prepaid carrier plans. Up-to-date spec-wise, G91s provides a set of features under $150: an ideal purchase for buyers watchful of their budget or just a second phone for a user.

Tech Table: Specifications Comparison

Brand	Flagship Model	Display	Processor	RAM / Storage
Apple	iPhone 15 Pro Max	6.7″ Super Retina XDR OLED 120Hz	Apple A17 Pro	8GB / up to 1TB
Samsung	Galaxy S24 Ultra	6.8″ QHD+ AMOLED 2X, 120Hz	Snapdragon 8 Gen 3	16GB / up to 512GB
Google	Pixel 8 Pro	6.7″ LTPO OLED, 120Hz	Google Tensor G3	12GB / 128GB–1TB
OnePlus	OnePlus 12	6.8″ AMOLED ProXDR, 120Hz	Snapdragon 8 Gen 3	16GB / up to 512GB
Motorola	Moto Edge+ (2024)	6.7″ OLED, 165Hz	Snapdragon 8 Gen 2	8GB / 512GB
TCL	TCL 50 XL 5G	6.8″ FHD+ LCD, 120Hz	MediaTek Dimensity 6100	6GB / 128GB
ASUS	ROG Phone 8 Pro	6.78″ AMOLED, 165Hz	Snapdragon 8 Gen 3	16GB / up to 1TB
Sony	Xperia 1 V	6.5″ 4K OLED, 120Hz	Snapdragon 8 Gen 2	12GB / 256GB
Honor	Honor Magic6 Pro	6.8″ LTPO OLED, 120Hz	Snapdragon 8 Gen 3	12GB / up to 1TB
Blu	BLU G91s	6.5″ HD+ LCD, 60Hz	MediaTek Helio G80	4GB / 128GB

 

Flagship Model & Price Range Comparison:

Brand	Flagship Model	Approx. Price (In USD)
Apple	iPhone 15 Pro Max	$1,199
Samsung	Galaxy S24 Ultra	$1,299
Google	Pixel 8 Pro	$999
OnePlus	OnePlus 12	$799
Motorola	Moto Edge+	$699
TCL	TCL 50 XL 5G	$299
ASUS	ROG Phone 8 Pro	$1,099
Sony	Xperia 1 V	$1,299
Honor	Honor Magic6 Pro	$899
Blu	BLU G91s	$149

Conclusion:

In 2025, the U.S. smartphone market remains dynamic yet is dominated by a select few powerhouses, with Apple holding the throne with unparalleled brand loyalty and ecosystem strength; Samsung, the Android flagbearer, maintains its position by innovation-first approach; while the Pixel lineup from Google is changing the way AI is integrated with mobile tech.

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