Збирач потоків

ST’s web-based tool, AIoT Craft, simplifies the development and provisioning of node-to-cloud AIoT projects that use the machine-learning core (MLC) of ST’s smart MEMS sensors. Intended for both beginners and seasoned developers, AIoT Caft helps program these sensors to run inference operations.

The MLC enables decision-tree learning models to run directly in the sensor. Operating autonomously without host system involvement, the MLC handles tasks that require AI skills, such as classification and pattern detection.

To ease the creation of decision-tree models, AIoT Craft includes AutoML, which automatically selects optimal attributes, filters, and window size for sensor datasets. This framework also trains the decision tree to run on the MLC and generates the configuration file to deploy the trained model. To provision the IoT project, the gateway can be programmed with the Data Sufficiency Module, intelligently filtering data points for transmission to the cloud.

As part of the ST Edge AI Suite, AIoT Craft offers customizable example code for in-sensor AI and sensor-to-cloud solutions. Decision tree algorithms can be tested on a ready-to-use evaluation board connected to the gateway and cloud.

AIoT Craft product page

STMicroelectronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Renesas has added new devices to its RA8 series of MCUs, combining the same Arm Cortex-M85 core with a streamlined feature set to reduce costs. The RA8E1 and RA8E2 MCU groups are well suited for high-volume applications, including industrial and home automation, mid-end graphics, and consumer products. Both groups employ Arm’s Helium vector extension to boost ML and AI workloads, as well as Trust Zone for enhanced security.

The RA8E1 group’s Cortex-M85 core runs at 360 MHz. These microcontrollers provide 1 Mbyte of flash, 544 kbytes of SRAM, and 1 kbyte of standby SRAM. Peripherals include Ethernet, octal SPI, I2C, USB FS, CAN FD, 12-bit ADC, and 12-bit DAC. RA8E1 MCUs come in 100-pin and 144-pin LQFPs.

MCUs in the RA8E2 group boost clock speed to 480 MHz and increase SRAM to 672 kbytes. They also add a 16-bit external memory interface. RA8E2 MCUs are offered in BGA-224 packages.

The RA8E1 and RA8E2 MCUs are available now. Samples can be ordered on the Renesas website or through its distributor network.

RA8E1 product page

RA8E2 product page

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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With a breakdown voltage of 1700 V, Power Integrations’ IMX2353F GaN switcher easily supports a nominal input voltage of 1000 VDC in a flyback configuration. It also achieves over 90% efficiency, while supplying up to 70 W from three independently regulated outputs.

The IMX2353F, part of the InnoMux-2 family of power supply ICs, is fabricated using the company’s PowiGaN technology. Its high voltage rating makes it possible for GaN devices to replace costly SiC transistors in applications like automotive chargers, solar inverters, three-phase meters, and other industrial power systems.

Like other InnoMux-2 devices, the IMX2353F provides both primary and secondary-side controllers, zero voltage switching without an active clamp, and FluxLink, a safety-rated feedback mechanism. Each of the switcher IC’s three regulated outputs is accurate to within 1%. By independently regulating and protecting each output, the IMX2353F eliminates multiple downstream conversion stages. The device has a switching frequency of 100 kHz and operates over a temperature range of -40°C to +150°C.

Prices for the IMX2353F start at $4.90 each in lots of 10,000 units. Samples and evaluation boards are available from Power Integrations and its authorized distributors.

IMX2353F product page

Power Integrations 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Navitas has developed a power supply unit (PSU) that is capable of producing 8.5 kW of output power with 98% efficiency. Aimed at AI and hyperscale data centers, the PSU achieves a power density of 84.6 W/in.3 through the use of both GaN and SiC MOSFETs.

The PSU provides a 54-V output and complies with Open Compute Project (OCP) and Open Rack v3 (ORV3) specifications. It employs the company’s 650-V GaNSafe and 650-V Gen-3 Fast SiC MOSFETs configured in 3-phase interleaved PFC and LLC topologies.

According to Navitas, the shift to a 3-phase topology for both PFC and LLC enables the industry’s lowest ripple current and EMI. The power supply also reduces the number of GaN and SiC devices by 25% compared to the nearest competing system, reducing overall cost.

Specifications for the PSU include an input voltage range of 180 V to 264 V, a standby output voltage of 12 V, and an operating temperature range of -5°C to +45°C. Its hold-up time at 8.5 kW is 10 ms, with 20 ms possible through an extender.

Navitas will debut the 8.5-kW power supply design at electronica 2024.

Navitas Semiconductor 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The OV0TA1B CMOS image sensor from Omnivision fits 3-mm-high modules, ultrathin-bezel notebooks, webcams, and IoT devices. This low-power sensor is well-suited for AI-based human presence detection, facial authentication, and always-on devices. Additionally, it comes in monochrome and infrared versions to complement designs that include a separate RGB camera.

Featuring 2-µm pixels based on the company’s PureCel technology, the OV0TA1B sensor offers high sensitivity and modulation transfer function (MTF) for reliable detection and authentication. It delivers 30 frames/s at a resolution of 440×360 pixels in a compact 1/15.8-in. optical format.

In addition to the higher resolution, the sensor can also operate at a lower resolution of 220×180 pixels, consuming just 2.58 mW at 3 frames/s. The lower resolution and frame rate reduce power consumption, allowing it to meet the needs of energy-sensitive applications.

The OV0TA1B provides programmable controls for frame rate, mirroring, flipping, cropping, and windowing. It supports 10-bit RAW output in normal mode and 8-bit RAW output in always-on mode, along with static defect pixel correction and automatic black level calibration. 

Samples of the OV0TA1B image sensor are available now, with mass production to begin in Q1 2025.

OV0TA1B product page 

Omnivision

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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This is about a festive event accessory for lots of happy people with good cheer all around and in my opinion, a public safety hazard.

We were at a gala party one day where there were several hundred people. There were all kinds of food, there was music and there was this rotating orb in the center of the room which emitted decorative beams of light in constantly changing directions (Figure 1).

Figure 1 Party light at several different moments that emitted beams in several different directions.

Those beams of light were generated by moving lasers. They produced tightly confined light in whatever direction they were being aimed, just like the laser pointers you’ve undoubtedly seen being used in lecture settings.

I was not at ease with that (Figure 2).

Figure 2 A google search of the potential dangers of a laser pointer.

I kept wondering if when the decorative light beams would shine directly into someone’s eye, would that someone be in danger of visual injury? Might the same question be raised with respect to laser-based price checking kiosks in the stores (Macy’s or King Kullen for example) or for cashiers at their price scanning check out stations?

Everyone at the party went home happy.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post Laser party lights appeared first on EDN.

Taking place from December 10–13, MASTERs offers over 50 technical sessions for embedded control engineers

Microchip Technology has announced that registration is now open for its signature MASTERs Conference, the premier technical training event for embedded control engineers. The 17th Annual India MASTERs Conference returns to an in-person format and will take place at the Sheraton Grand Bangalore Hotel at Brigade Gateway from December 10–13, 2024.

Commonplace in the semiconductor industry is the use of acronyms and “MASTERs” is no exception. It stands for Microchip Annual Strategic Technical Exchange and Review. The conference strives to deliver advanced technical learning sessions that are taught by application and design engineers to foster a synergistic engineer-to-engineer experience.

The sessions at MASTERs are curated for engineers at all levels of experience and specialties and cover an array of embedded control topics including analog, functional safety, IoT, clock and timing, FPGA solutions and much more. The conference will feature 51 technical sessions of which 22 are hands-on workshops as well as technology showcase sessions for attendees to explore Microchip’s development tools. A highlight of this year’s MASTERs Conference is the networking dinner on December 11, which will feature a keynote by Joe Krawczyk, Microchip’s senior corporate vice president of global sales.

“We are delighted for the long-awaited return of MASTERs and look forward to reconnecting with existing clients and meeting new attendees,” said Edward Han, Microchip’s vice president of Asia Pacific sales. “This year marks the 17th annual India conference and we are proud of the legacy we have built over the years. Microchip strives to inspire and shape the engineers of tomorrow and we hope attendees will leave the conference with a rich and rewarding learning experience.”

Throughout the MASTERs Conference, networking sessions will be available with Microchip engineers at the Ask the Experts booths. These networking sessions provide attendees with the opportunity to meet with Microchip experts to learn about available tools and are given mini lessons on how to use them to fast-track the development of their applications.

MASTERs Registration and Pricing Information

Registration pricing is all inclusive at Rs. 12,000 and includes entry to the conference courses, meals and access to all class materials. Deadline to register is November 26, 2024.

For more information and to register, visit the conference web page.

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Contributes to higher efficiency in automotive electric compressors and inverters for industrial equipment

ROHM has developed automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading* low loss characteristics with high short-circuit resistance. This makes the devices ideal for vehicle electric compressors and HV heaters as well as industrial inverters. The current lineup includes four models – RGA80TRX2HR / RGA80TRX2EHR / RGA80TSX2HR / RGA80TSX2EHR – in two discrete package types (TO-247-4L and TO-247N), along with 11 bare chip variants – SG84xxWN – with plans to further expand the lineup in the future.

The increasing use of higher voltages in automotive systems and industrial equipment has led to a growing demand for power devices capable of handling high voltages in applications such as vehicle electric compressors, HV heaters, and inverters for industrial equipment. At the same time, there is a strong push for high efficiency power devices to improve energy conservation, simplified cooling mechanisms, and smaller form factors for a decarbonized society. Automotive electrical components must also comply with automotive reliability standards, while power devices for inverter and heater circuits are required to provide current interruption capabilities during short circuits, necessitating high short-circuit tolerance.

In response, ROHM redesigned the device structure and adopted an appropriate package to develop new 4th Generation IGBTs suitable for high voltage by delivering industry-low loss characteristics with superior short-circuit tolerance. These devices achieve an industry-leading* short-circuit withstand time of 10µs (Tj=25°C) together with low switching and conduction losses while maintaining a high withstand voltage of 1200V and meeting automotive standards by reviewing the device structure, including the peripheral design. At the same time, the new TO-247-4L package products, which feature 4 terminals, can accommodate an effective voltage of 1100V in a ‘Pollution Degree 2 environment’ by ensuring adequate creepage distance between pins. This enables support for higher voltage applications than conventional products.

Implementing creepage distance measures on the device side alleviates the design burden for manufacturers. On top, the TO-247-4L package achieves high-speed switching by including a Kelvin emitter terminal, resulting in even lower losses. In fact, when comparing the efficiency of the new TO-247-4L packages with conventional and standard products in a 3-phase inverter, loss is reduced by about 24% compared to standard products and by 35% over conventional products – contributing to higher efficiency in drive applications.

ROHM will continue to expand its lineup of high-performance IGBTs that contribute to greater miniaturization and high efficiency drive in automotive and industrial equipment applications.

Terminology

AEC-Q101 Automotive Reliability Standard

AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. AEC-Q101 is a standard that specifically applies to discrete semiconductor products (i.e. transistors, diodes).

Short-Circuit Tolerance

The time that a power device can withstand a short-circuit without being destroyed.

IGBT (Insulated Gate Bipolar Transistor)

A power transistor that combines the high-speed switching characteristics of a MOSFET with the low conduction loss of a bipolar transistor.

Creepage Distance

The shortest distance along the surface of an insulator between two conductors. In semiconductor design, insulation measures with such creepage and space distances must be taken to prevent electric shocks, leakage currents, and short-circuits in semiconductor products.

Pollution Degree 2 Environment

Pollution Degree 2 corresponds to typical environments such as homes and offices where only dry, non-conductive contaminants are present. Pollution Degree is the grade of the environment that influences the determination of the spatial and creepage distances of components, classified from 1 to 4 according to the presence, amount, and condition of pollutants.

Kelvin Emitter Terminal

An emitter terminal dedicated to voltage measurement. By separating this from the emitter through which current flows, the effects of voltage drop during current flow can be minimized, allowing for fast, stable switching.

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• Collaboration aims to significantly enhance cost, energy efficiency, driver experience and vehicle range
• Companies signed supply and capacity reservations for PROFET power switches and silicon carbide (SiC) CoolSiC semiconductors

• Infineon’s scalable production capacity is ready to meet the market demand for automotive semiconductor solutions

Stellantis N.V. and Infineon Technologies AG announced that they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.

To support this, the companies have signed major supply and capacity agreements that will serve as the foundation for the planned collaboration to develop the next generation of power architecture, including:

• Infineon’s PROFET smart power switches, which will replace traditional fuses, reduce wiring and enable Stellantis to become one of the first automakers to implement intelligent power network management.
• Silicon carbide (SiC) semiconductors, which will support Stellantis in its efforts to standardize its power modules, improve the performance and efficiency of EVs while also reducing costs.
• AURIX microcontrollers, which target the first generation of the STLA Brain zonal architecture.

Stellantis and Infineon are also in the process of extending their cooperation with the implementation of a Joint Power Lab to define the next-generation scalable and intelligent power architecture enabling Stellantis’ software-defined vehicle.

“As outlined in our strategic plan, Dare Forward 2030, we are securing the supply of crucial semiconductor solutions required to continue our transition to an electrified future leveraging innovative E/E architectures for our next-generation platforms,” said Maxime Picat, Stellantis Chief Purchasing and Supplier Quality Officer.

“Infineon is now entering a collaboration and innovation partnership with Stellantis,” said Peter Schiefer, President of Infineon’s Automotive Division. “As the world’s leading automotive semiconductor vendor, we bring our product-to-system expertise and dependable electronics to the table. Our semiconductors drive the decarbonization and digitalization of mobility. They increase the efficiency of cars and enable software-defined architectures that will significantly improve the user experience.”

With the world`s most cost-competitive SiC fab in Kulim, Malaysia, the upcoming 300-millimeter ”Smart Power Fab” in Dresden, Germany, and the joint venture with TSMC and partners (ESMC) as well as accompanying supply agreements with foundry partners, Infineon is ready to fully meet market demand for automotive semiconductor solutions. According to the market research company TechInsights, Infineon is the global number one supplier of automotive microcontrollers with a market share of about 29 percent of the global automotive microcontroller market.

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• 21-year contract for energy produced by a new solar farm in Malaysia, where ST operates a large-volume test & assembly site.
• PPA will support the 2027 carbon neutrality and 100% renewable energy sourcing targets of ST.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced a 21-year Power Purchase Agreement (PPA) with BKH Solar Sdn Bhd, an entity jointly established by ENGIE Renewable SEA Pte Ltd (ENGIE), a renowned global leader in low-carbon energy and services, and Conextone Energy Sdn Bhd, a rapidly emerging solar energy developer in Malaysia. The agreement will facilitate the supply of approximately 50 GWh of renewable energy annually from a new solar farm in Bukit Kayu Hitam, Kedah, Malaysia. This long-term agreement is undertaken under the Corporate Green Power Program introduced by the Malaysian Single Buyer in 2023.

Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented: “This long-term power purchasing agreement in Malaysia, ST’s first one in Asia, marks yet another important step towards ST’s goal of becoming carbon neutral in its operations (Scope 1 and 2 emissions, and partially scope 3) by 2027, including the sourcing of 100% renewable energy by 2027. PPAs will play a major role in our transition. Starting in 2025, this PPA with ENGIE will provide a significant level of renewable energy for ST’s operations in our high-volume test and assembly site in Muar, Johor, Malaysia.”

Amit Jain, Managing Director India & Southeast Asia, ENGIE, commented: “ENGIE is delighted to join forces with STMicroelectronics in the global transition towards sustainable energy solutions. By supplying approximately 50 GWh of renewable energy annually from our new solar PV 30 MW project in Malaysia, we are proudly contributing to ST’s transition towards 100% renewable sourcing. This partnership with ST demonstrates our commitment to providing green, clean and reliable energy to our clients.”

ST’s high-volume test and assembly site located in Muar, Johor, has over 4,700 employees supporting multiple technologies and products, including high reliability applications for automotive customers. ST also operates support functions out of Penang and Kuala Lumpur.

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The post Renesas Brings the High Performance of Arm Cortex-M85 Processor to Cost-Sensitive Applications with New RA8 Entry-Line MCU Groups appeared first on ELE Times.

The ever-increasing prevalence of lithium-based batteries in various shapes, sizes and capacities is creating a so-called “virtuous circle”, leading to lower unit costs and higher unit volumes which encourage increasing usage (both in brand new applications and existing ones, the latter as a replacement for precursor battery technologies), translating into even lower unit costs and higher unit volumes that…round and round it goes. Conceptually similarly, usage of e-cigarettes, aka so-called “vape” devices, is rapidly growing, both by new  and existing users of cigarettes, cigars, pipes and chewing tobacco. The latter are often striving to wean themselves off these conventional “nicotine delivery platforms” and away from their well-documented health risks but aren’t yet able or ready to completely “kick the habit” due to nicotine’s potent addictive characteristics (“vaping” risks aren’t necessarily nonexistent, of course; being newer, however, they’re to date less thoroughly studied and documented).

What’s this all got to do with electronics? “Vapes” are powered by batteries, predominantly lithium-based ones nowadays. Originally, the devices were disposable, with discard-and-replacement tied to when they ran out of oft (but not always) nicotine-laced, oft-flavored “juice” (which is heated, converting it into an inhalable aerosol) and translating into lots of perfectly good lithium batteries ending up in landfills (unless, that is, the hardware hacker community succeeds in intercepting and resurrecting them for reuse elsewhere first). Plus, the non-replaceable and inherently charge-“leaky” batteries were a retail shelf life issue, too.

More recent higher-end “vape” devices’ batteries are capable of being user-recharged, at least. This characteristic, in combination with higher capacity “juice” tanks, allows each device to be used longer than was possible previously. But ultimately, specifically in the absence of a different sort of hardware hacking which I’ll further explore in the coming paragraphs, they’re destined for discard too…which is how I obtained today’s teardown victim (a conventional non-rechargeable “vape” device is also on my teardown pile, if I can figure out how to safely crack it open). Behold the Geek Bar Pulse, as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

One side is bland:

The other is also seemingly so:

at least until you flip the “on” switch at the bottom, at which time it turns into something reminiscent of an arcade video game (thankfully not accompanied by sounds):

The two-digit number at the top indicates that the battery is still a bit more than halfway charged. Its two-digit counterpart at the bottom however, reports that its “juice” tank is empty, therefore explaining why it was discarded and how it subsequently ended up in my hands (not exactly the result of “dumpster diving” on my part, but I did intercept it en route to the trash). To that latter point, and in one of those “in retrospect I shouldn’t have been surprised” moments, when researching the product prior to beginning my dissection, I came across numerous web pages, discussion group threads and videos about both it and alternatives:

with instructions on how to partially disassemble rechargeable “vape” devices, specifically to refill their “juice” tanks with comparatively inexpensive fluid and extend their usable life. Turns out, in fact, that this device’s manufacturer has even implemented a software “kill switch” to prevent such shenanigans, which the community has figured out how to circumvent by activating a hidden hardware switch.

Anyhoo, let’s conclude our series of overview shots with the top, containing the mouthpiece nozzle from which the “vape” aerosol emits:

and the bottom, encompassing the aforementioned power switch, along with the USB-C recharging connector:

That switch, you may have already noticed, is three-position. At one end is “off”. In the middle is normal “on” mode, indicated in part by a briefly visible green ring around the display:

And at the other end is “pulse” mode, which emits more aerosol at the tradeoffs of more quickly draining the battery and “juice” tank, and is differentiated by both a “rocket” symbol in the middle of the display and a briefly illuminated red ring around it:

By the way, the power-off display sequence is entertaining, too:

And now, let’s get inside this thing. No exposed screws, of course, but that transparent side panel seems to be a likely access candidate:

It wasn’t as easy as I thought, but thanks to a suggestion within the first video shown earlier, to pop off the switch cover so that the entire internal assembly could then move forward:

I finally got it off, complete with case scratches (and yes, a few minor curses) along the way:

Quick check: yep, still works!

Now to get those insides out. Again, my progress was initially stymied:

until I got the bright (?) idea of popping the mouthpiece off (again, kudos to the creator of that first video shown earlier for the to-do guidance):

That’s better (the tank is starting to come into view)…

Success!

Front view of the insides, which you’ve basically already seen:

Left side, with our first unobstructed view of the tank:

Back (and no, it wasn’t me who did that symbol scribble):

Right side:

Top, showing the aerosol exit port:

And bottom, again reminiscent of a prior perspective photo:

Next, let’s get that tank off:

One of those contacts is obviously, from the color, ground. I’m guessing that one of the others feeds the heating element (although it’s referred to on the manufacturer’s website as being a “dual mesh coil” design, I suspect that “pulse” mode just amps—pun intended—up the output versus actually switching on a second element) and the third routes to a moisture or other sensor to assess how “full” the “tank” is.

To clarify (or maybe not), let’s take the “tank” apart a bit more:

More (left, then right) side views of the remainder of the device, absent the tank:

And now let’s take a closer look at that rubber “foot”, complete with a sponge similar to the one earlier seen with the mouthpiece, that the tank formerly mated with:

Partway through, another check…does it still work?

Yep! Now continuing…

Next, let’s again use the metal “spudger”, this time to unclip the display cover from the chassis:

Note the ring of multicolor LEDs around the circumference of the display (which I’m guessing is OLED-fabricated: thoughts, readers?):

And now let’s strive to get the “guts” completely out of the chassis:

Still working?

Amazing! Let’s next remove the rest of the plastic covering for the three-position switch:

Bending back the little plastic tab at the bottom of each side was essential for further progress:

Mission accomplished!

A few perspectives on the no-longer-captive standalone “guts”:

It couldn’t still be working, after all this abuse, could it?

It could! Last, but not least, let’s get that taped-down battery out the way and see if there’s anything interesting behind it:

That IC at the top of the PCB that does double-duty as the back of the display is the Arm Cortex-M0+- and flash memory-based Puya F030K28. I found a great writeup on the chip, which I commend to your attention, with the following title and subtitle:

The cheapest flash microcontroller you can buy is actually an Arm Cortex-M0+

Puya’s 10-cent PY32 series is complicating the RISC-V narrative and has me doubting I’ll ever reach for an 8-bit part again.

“Clickbait” headlines are often annoying. This one, conversely, is both spot-on and entertaining. And given the ~$20 retail price point and ultimately disposable fate for the device that the SoC powers, $0.10 in volume is a profitability necessity! That said, one nitpick: I’m not sure where Geek Bar came up with the “dual core” claim on its website (not to mention I’m amazed that a “vape” device supplier even promotes its product’s semiconductor attributes at all!).

And with that, one final check; does it still work?

This is one rugged design! Over to you for your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Investigating a vape device appeared first on EDN.

While semiconductor design engineers become more aware of silent data corruption (SDC) or silent data errors (SDE) caused by aging, environmental factors, and other issues, embedded test solutions are emerging to address this subtle but critical challenge. One such solution applies embedded deterministic test patterns in-system via industry-standard APB or AXI bus interfaces.

Siemens EDA’s in-system test controller—designed specifically to work with the company’s Tessent Streaming Scan Network (SSN) software—performs deterministic testing throughout the silicon lifecycle. Tessent In-System Test is built on the success of Siemens’ Tessent MissionMode technology and Tessent SSN software.

Figure 1 The Tessent In-System Test software with embedded on-chip in-system test controller (ISTC) enables the test and diagnosis of semiconductor chips throughout the silicon lifecycle. Source: Siemens EDA

Tessent In-System Test enables seamless integration of deterministic test patterns generated with Siemens’ Tessent TestKompress software. That allows chip designers to apply embedded deterministic test patterns generated using Tessent TestKompress with Tessent SSN directly to the in-system test controller.

The resulting deterministic test patterns are applied in-system to provide the highest test quality level within a pre-defined test window. They also offer the ability to change test content as devices mature or age through the silicon lifecycle.

Figure 2 Tessent In-System Test applies high-quality deterministic test patterns for in-system/in-field testing during the lifecycle of a chip. Source: Siemens EDA

These in-system tests with embedded deterministic patterns also support the reuse of existing test infrastructure. They allow IC designers to reuse existing IJTAG- and SSN-based patterns for in-system applications while improving overall chip planning and reducing test time.

“Tessent In-System Test technology allows us to reuse our extensive test infrastructure and patterns already utilized in our manufacturing tests for our data center fleet,” said Dan Trock, senior DFT manager at Amazon Web Services (AWS). “This enables high-quality in-field testing of our data centers. Continuous monitoring of silicon devices throughout their lifecycle helps to ensure AWS customers benefit from infrastructure and services of the highest quality and reliability.”

The availability of solutions like the Tessent In-System Test shows that silent data corruption in ICs is now on designers’ radar and that more solutions are likely to emerge to counter this issue caused by aging and environmental factors.

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