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Integrated Motor Drivers For Efficient Real-Time Embedded Motor Control

ELE Times - Wed, 02/28/2024 - 11:19

Microchip Technology Inc. launches a new family of integrated motor drivers, leveraging its dsPIC Digital Signal Controllers (DSC). This innovative solution integrates a dsPIC33 DSC, a three-phase MOSFET gate driver, and an optional LIN or CAN FD transceiver into a single package. It provides a comprehensive solution for efficient, real-time embedded motor control in space-constrained applications.

This integration reduces the components needed for motor control system designs, leading to smaller PCB sizes and simplified design complexity. Particularly beneficial for automotive, consumer, and industrial applications where high performance and compact form factors are crucial.

Key Features Include:

  • Single power supply operation up to 29V (operation) and 40V (transient).
  • Internal 3.3V low dropout (LDO) voltage regulator for the dsPIC DSC.
  • Operating frequencies between 70—100 MHz, enabling high CPU performance for advanced motor control algorithms like field-oriented control (FOC).

Microchip supports the development and deployment of these integrated motor drivers with a comprehensive ecosystem of software and hardware tools. This includes development boards, reference designs, application notes, and the motorBench Development Suite V2.45, a free GUI-based software tool for FOC. Additionally, the dsPIC33CK Motor Control Starter Kit (MCSK) and the MCLV-48V-300W development board offer rapid prototyping solutions with flexible control options for various motor control applications.

Joe Thomsen, Vice President of Microchip’s Digital Signal Controllers Business Unit, highlighted the advantages of the new integrated motor drivers, stating, “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space, meeting the evolving demands for higher performance and reduced footprints in various designs.”

The post Integrated Motor Drivers For Efficient Real-Time Embedded Motor Control appeared first on ELE Times.

Infineon unveils high-density power modules to enable benchmark performance and TCO for AI data centers

ELE Times - Wed, 02/28/2024 - 09:15

Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Today, Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centres. The TDM2254xD series products blend innovation in robust OptiMOSTM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centres operate at a higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO. 

Given that AI servers require 3 times more energy than traditional servers and data centres already consume more than 2 per cent of the global energy supply, it is essential to find innovative power solutions and architecture designs that further drive decarbonization. Paving the way for the green AI factory, Infineon’s TDM2254xD dual-phase power modules combine with XDPTM Controller technology to enable efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.

Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). The modules’ unique design allows for efficient heat transfer from the power stage onto the heat sink through a novel inductor design that is optimized to transfer current and heat, thereby allowing for a 2 per cent higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields significant energy savings at scale. This translates into megawatts saved for data centres computing generative AI and in turn leads to reduced CO2 emissions and millions of dollars in operating cost savings over the system’s lifetime. 

“This unique Product-to-System solution combined with our cutting-edge manufacturing lets Infineon deliver solutions with differentiated performance and quality at scale, thereby significantly reducing total cost of ownership for our customers,” said Athar Zaidi, Senior Vice President of Power & Sensor Systems at Infineon Technologies. “We are excited to bring this solution to market; it will accelerate computing performance and will further drive our mission of digitalization and decarbonization.”

The post Infineon unveils high-density power modules to enable benchmark performance and TCO for AI data centers appeared first on ELE Times.


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