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New episodes highlight how the latest electronics are enabling sustainable design across industries

DigiKey, the global distribution leader of electronic components and automation products, announces the release of the second season of its Sustainable Futures video series, which examines how advanced electronics, from infrastructure to intelligence, are enabling cleaner energy, smarter systems, and more sustainable design across industries. DigiKey releases the second season of its Sustainable Futures video series, which explores the components and technologies behind efficient power systems. 

Sustainable Futures, sponsored by Harwin and Analog Devices, highlights the components and technologies behind efficient power systems, intelligent infrastructure, and reliable performance in demanding environments. From high-performance signal processing and energy management to rugged interconnects and advanced materials, these solutions enable engineers to design systems that are more efficient, scalable, and resilient. The series also explores how these technologies support real-time decision-making, improve system reliability, and help bring sustainable innovations from concept to deployment.

“In season two of Sustainable Futures, we examine how advanced electronics are driving cleaner energy, smarter infrastructure, and meaningful real-world impact,” said Ken Paxton, director, advanced semiconductor for DigiKey. “The team at DigiKey is encouraged by the work our partner organizations are doing to shape the technologies that will help build a sustainable future for all.” 

“Sustainability is a journey, and as expectations evolve, companies are increasingly expected to reflect the values of their customers and partners,” said Ryan Smart, vice president of product for Harwin. “Harwin is proud to provide leading-edge interconnect technology that supports more efficient, reliable, and sustainable solutions across a wide range of applications.”

“The modernization of the power grid is among the most demanding engineering challenges of our time, requiring breakthroughs in power conversion, real‑time sensing, and system‑level intelligence,” said David Andeen, senior director, business development & marketing for Analog Devices. “Analog Devices is proud to contribute to this transformation through our high‑performance power solutions.”

Episode 1: “Intelligence That Drives Efficiency” – This episode examines how renewable energy generation, smart grid infrastructure, and intelligence at the edge work together to create more efficient, resilient, and adaptive energy systems. Analog Devices’ technology enables innovation at every stage, providing system-level intelligence for measurement, control, and real-time optimization. 

Episode 2: “Building the Backbone of Electrification” – This episode looks at how EV charging infrastructure and material innovations contribute to sustainable transportation and energy systems. Harwin highlights how high-reliability interconnects and eco-friendly materials enable safe, durable, and efficient solutions that can be deployed at scale.

Episode 3: “Shaping What Comes Next” – The final episode looks ahead to the future of sustainable electronics, where AI, advanced materials, and sustainable manufacturing converge. It connects hardware, intelligence, and collaboration into a unified vision for how the industry can scale sustainable innovation over the next decade. 

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Arrow Electronics and STMicroelectronics (ST) unveil a new industrial Autonomous Mobile Robot (AMR) reference platform to shorten the path from concept to deployment for professional service robots.

Autonomous mobile robots are rapidly transforming factories, laboratories, warehouses, and logistics centers. These robots must safely navigate dynamic environments, localize accurately indoors, manage energy efficiently, and integrate advanced perception and artificial intelligence, while meeting demanding reliability and time-to-market requirements. Many robotics original equipment manufacturers (OEMs) and integrators struggle to assemble, validate, and industrialize these complex subsystems independently.

“This solution brings together the performance, flexibility, and pre-validated integration robotics customers need to move faster from development to deployment, while giving them a scalable foundation that can address a broad range of industrial and commercial robotics applications,” said Shelby Schnurrenberger, vice president of supplier management, global semiconductor, Arrow Electronics.

“ST’s broad industrial portfolio is a natural fit for autonomous mobile robot applications, where reliability, performance, and scalability are essential. By combining our technologies with Arrow’s engineering services, we are helping customers turn innovative robotic concepts into industrial-ready solutions. Together, we can accelerate the development of the next generation of AMRs for the market,” said Allan Lagasca, application director of robotics segment strategic program (SSP), smart industrials segment leader, STMicroelectronics.

To address this challenge, Arrow and eInfochips worked with ST to deliver a fully functional AMR kit built on a complete ST bill of materials, tightly integrated with an NVIDIA Jetson Orin Nano–based compute platform and NVIDIA ROS 2 software stack. Arrow and eInfochips contribute their proven Rover mechanical platform and system integration expertise, while ST provides a comprehensive portfolio of industrial-grade components and reference designs.

The new AMR reference kit combines the following features:

• Robust power and battery management for 24V operation, with a pre-validated path to 48V architectures
• STM32-based real-time controller board, acting as a powerful interface between the NVIDIA platform and the robot’s sensors and actuators
• Advanced motion control, including dual BLDC motor drives based on STSPIN32 and STDRIVE devices for precise, smooth navigation
• Rich sensing for perception and safety, using ST MEMS IMUs, magnetometers, and environmental sensors, complemented by lidar and vision inputs for SLAM-based mapping and navigation
• Industrial ROS 2 software integration, enabling mapping, localization, and autonomous navigation with standard tools such as Cartographer, NAV2, and RViz ROS 2

 The new platform offers a robust, pretested system-level design that significantly reduces development risk, integration effort, and time to market. Robot manufacturers and system integrators can start from a working, realistic AMR including chassis, electronics, and software—and then rely on engineering services from Arrow and eInfochips to customize mechanics, features, and cost-optimized designs, while ST provides a one-stop, complete bill-of-materials solution with long-term product support. This cooperation enables the AMR ecosystem to move faster from prototype to production, helping customers deliver safer, smarter, and more efficient mobile robots for industrial and commercial environments worldwide.

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Wireless technology company Baylin Technologies Inc of North York, Ontario, Canada (which provides passive and active RF and satellite communications products and services) says that its Advantech Wireless subsidiary has recently received purchase orders totalling over CDN$9m for its Genesis C-band and Ku-band solid-state power amplifiers (SSPAs) ranging from 200W to 500W...

Vishay Intertechnology, Inc. introduces a new Automotive Grade phototransistor optocoupler to deliver signal transmission with high galvanic isolation for electric vehicles (EV), including emerging 800 V battery architectures, and industrial automation systems. The Vishay Semiconductors VOLA617A combines an isolation voltage of 5000 VRMS with a VIORM of 1414 Vpeak and VIOTM of 8000 Vpeak in a 4-pin LSOP low-profile package.

The device released today is ideal for grid-connected on-board chargers (OBC), DC/DC converters, battery management systems (BMS), isolated wake-up signals, and any system control with galvanic and noise isolation. While most automotive optocouplers can not be used for battery voltages exceeding 500 V, this limits them to traditional 400 V EV platforms. VOLA617A isolates DC voltages up to 1000 V and enables its use in next-generation high-voltage EV architectures.

The VOLA617A consists of an infrared-emitting diode, optically coupled to a silicon planar phototransistor detector in a low-profile package with creepage and clearance distances of ≥ 8 mm. The device is available in four current transfer ratio (CTR) ranges and features a high 80 V collector-emitter voltage rating, allowing for more design flexibility.

The optocoupler operates over a wide -40 °C to +125 °C temperature range with a junction temperature capability up to +145 °C while providing low coupling capacitance of 0.5 pF and high common mode transient immunity. Exceeding requirements for Automotive Grade performance and reliability, the VOLA617A’s robust package provides an extra safety margin by meeting dual AEC-Q102 qualification standards. The device is RoHS-compliant, halogen-free, and Vishay Green.

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 The DSA504RT delivers high-performance timing and integration at a cost-efficient price point

Spacecraft timing systems must provide highly stable, precise signals for navigation, communications, and scientific instruments, even when GNSS signals are weak or unavailable. Designers often rely on multiple oscillators and buffers to supply precise frequencies to various subsystems, adding size, mass, and complexity. Microchip Technology announces the space-grade DSA504RT, a radiation-tolerant, six-output programmable clock generator for addressing the complex timing needs of aerospace and defense applications. 

The DSA504RT streamlines timing architecture by generating multiple clean, phase-aligned frequencies from a single master source. Additionally, this solution reduces the need for multiple discrete oscillators, lowers overall component count, and improves system failure in time (FIT) rate. It also reduces power consumption and mass, as well as simplifies distribution networks to keep all subsystems synchronized even in the harshest environments and during GNSS outages or disruptions.

Analog Phase-Locked Loop (APLL) features spread spectrum capability, two fractional and two integer dividers, and six highly configurable output buffers, each of which can be configured as a differential driver (LVPECL, LVDS, or HCSL) or as a pair of single-ended CMOS outputs. The DSA504RT delivers ultra-low jitter performance as low as  200 femtoseconds (12kHz–20MHz) and is compliant with PCIe Gen 1-7 standards. This level of integration allows engineers to replace multiple crystals, oscillators, and buffers with a single device, improving design reliability, reducing Bill of Materials cost, and design complexity.

“This Microchip clock generation device is a game-changer for space applications. It can offer a comprehensive clock tree solution, producing three different clock families and up to six different frequencies, each buffered on a variety of selectable output drive types,” said Maamoun Abou Seido, appointed vice president of Microchip’s timing communications group. “Replacing numerous oscillators, buffers, and synthesizers, the DSA504RT saves board space and reduces part count to improve the system’s Failures in Time (FIT) rate in these high-reliability applications.”

The DSA504RT, offered in QFN28 and CQFP32 packages, serves as a companion device for complex aerospace and defense systems. It enables high integration of clock architectures within a single chip, distributing precise timing references to subsystems built around radiation-tolerant or radiation-hardened FPGAs and MCUs.

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VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, a wide field of view, on-chip processing, 100 frames per second, and a sensing range from 5 centimeters to 9 meters. It meets the evolving needs of customers and partners across diverse industries, including robotics, industrial automation, smart buildings, AR/VR, and healthcare.

The global semiconductor leader serving customers across the spectrum of electronic applications announces the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.

“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.”

“3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption(1),” said Anas Chalak, Market & Technology Analyst at Yole Group.

 

ST FlightSense VL53L9 is designed for multiple industry use cases:

• Robotics: enhances small-object detection, SLAM (Simultaneous Localization and Mapping), and obstacle avoidance for autonomous navigation.
• Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management.
• Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy.
• AR/VR and consumer electronics: advanced gesture recognition, body tracking, and finger skeleton for immersive user experiences.
• Healthcare: fall detection and monitoring solutions for eldercare and patient safety.

Technical Information

Enhancing 3D sensing with precision and efficiency

The VL53L9 offers the 2,268 resolution zones (54×42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second.

All-in-one sensing data for edge AI and easy integration

The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. In contrast to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity.

Compact form factor

Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual-power-supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users.

For more information, visit the VL53L9 product page: https://www.st.com/vl53l9cx

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