Новини світу мікро- та наноелектроніки

A 50-Ω SPDT RF switch from pSemi, the automotive-grade PE423211, covers bandwidths ranging from 300 MHz to 10.6 GHz. The part can be used in Bluetooth LE, ultra-wideband (UWB), ISM, and WLAN 802.11 a/b/g/n/ac/ax applications. Its suitability for BLE and UWB make the switch particularly useful for secure car access, telematics, sensing, infotainment, in-cabin monitoring systems, and general-purpose switching.

Qualified to AEC-Q100 Grade 2 requirements, the PE423211 operates over a temperature range of -40° to +105°C. The device combines low power, high isolation, and wide broadband frequency support in a compact 6-lead, 1.6×1.6-mm DFN package. It consumes less than 90 nA and provides ESD performance of 2000 V at HBM levels and 500 V at CDM levels.

The RF switch is manufactured on the company’s UltraCMOS process, a silicon-on-insulator technology. It also leverages HaRP technology enhancement, which reduces gate lag and insertion loss drift.

The PE423211 RF switch is sampling now, with production devices expected in late 2024. A datasheet for the switch was not available at the time of this announcement.

PE423211 product page

pSemi

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The first entries in Quectel’s Wi-Fi 7 module family, the FGE576Q and FGE573Q, deliver fast data rates and low latency for real-time response. Both modules offer Wi-Fi 7 and Bluetooth 5.3 connectivity for use in a diverse range of applications, including smart homes, industrial automation, healthcare, and transportation.

The FGE576Q provides a data rate of up to 3.6 Gbps and operates on dual Wi-Fi bands simultaneously: 2.4 GHz and 5 GHz or 2.4 GHz and 6 GHz. The FGE573Q operates at a maximum data rate of 2.9 Gbps. Devices feature 4K QAM and multi-link operation (MLO), which enables routers to use multiple wireless bands and channels concurrently when connected to a Wi-Fi 7 client. With Bluetooth 5.3 integration, each module supports LE audio and a maximum data rate of 2 Mbps, as well as BLE long-range capabilities.

Housed in 16×20×1.8-mm LGA packages, the FGE576Q and FGE573Q operate over a temperature range of -20°C to +70°C. Quectel also offers Wi-Fi/Bluetooth antennas in various formats for use with these modules.

FGE576Q product page

FGE573Q product page

Quectel Wireless Solutions

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Quectel unveils low-latency Wi-Fi 7 modules appeared first on EDN.

MaxLinear’s Wi-Fi 7 SoC with integrated triband access point has been certified by the Wi-Fi Alliance and selected as a Wi-Fi Certified 7 test bed device. Certification ensures that devices interoperate seamlessly and deliver the high-performance features of the Wi-Fi 7 standard.

The test bed employs the MxL31712 SoC, with the triband access point capable of operating at 2.4 GHz, 5 GHz, and 6 GHz. Well-suited for high-density environments, the access point includes the advanced features of 4K QAM, multi-link operation (MLO), multiple resource units (MRU) and puncturing, MU-MIMO, OFDMA, advanced beamforming, and power-saving enhancements.

MaxLinear’s Wi-Fi Certified 7 SoC family, comprising the triband MxL31712 and dual-band MxL31708, is based on the upcoming IEEE 802.11be standard and delivers peak throughput of 11.5 Gbps on 6-GHz (6E) spectrum. The MxL31712 accommodates up to 12 spatial streams, while the MxL31708 handles up to 8 spatial streams.

To learn more about the Wi-Fi 7 SoCs, click here.

MaxLinear

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The SCH16T-K01 inertial sensor from Murata combines an XYZ-axis gyroscope and XYZ-axis accelerometer in a robust SOIC package. Based on the company’s capacitive 3D-MEMS process, the device achieves centimeter-level accuracy in machine dynamics and position sensing, even in harsh environments.

The SCH16T-K01 provides an angular rate measurement range of ±300°/s and an acceleration measurement range of ±8 g. A redundant digital accelerometer channel offers a dynamic range of up to ±26 g, which offers resistance against saturation and vibration. Gyro bias instability is typically 0.5°/h. According to the company, the component overall exhibits excellent linearity and offset stability over the entire operating temperature range of -40°C to +110°C.

Other features of the industrial sensor include a SafeSPI V2.0 digital interface, self-diagnostics, and options for output interpolation and decimation. Housed in a 12×14×3-mm, 24-pin SOIC plastic package, the SCH16T-K01 is suitable for lead-free soldering and SMD mounting.

SCH16T-K01 product page

Murata

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post 6-DoF inertial sensor improves machine control appeared first on EDN.

Built this to test some pcbs I made submitted by /u/Anyhting_But_Stock [link] [comments]

submitted by /u/1Davide [link] [comments]

Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA says that its new facility in Tamil Nadu, India, the country’s first fully vertically integrated solar manufacturing plant, has been inaugurated by Dr T R B Rajaa (Minister for Industries, Promotions and Commerce of the Government of Tamil Nadu) in a ceremony attended by Eric Garcetti (the US Ambassador to India) and Scott Nathan, CEO of the US International Development Finance Corporation (DFC)...

This year’s CES officially runs from today (as I write these words), Tuesday, January 9 through Friday, January 12. So why, you might ask, am I committing my coverage to cyber-paper on Day 1, only halfway through it, in fact? That’s because CES didn’t really start just today. The true official kickoff, at least for media purposes, was Sunday evening’s CES Unveiled event, which is traditionally reminiscent of a Japanese subway car, or if you prefer, a Las Vegas Monorail:

Yesterday was Media Day, where the bulk of the press releases and other announcement paraphernalia was freed from its prior corporate captivity for public perusal:

And some companies “jumped the gun”, announcing last week or even prior to the holidays, in attempting to get ahead of the CES “noise”. So, the bulk of the news is already “in the wild”; all that’s left is for the huddled masses at the various Convention Centers and other CES-allotted facilities to peruse it as they aimlessly wander zombie-like from booth to booth in search of free tchotchkes (can you tell how sad I am to not be there in person this year? Have I mentioned the always-rancid restrooms yet? Or, speaking of which, the wastewater-suggestive COVID super-spreader potential? Or…). Plus, it enables EDN to get my writeup up on the website and in the newsletters earlier than would otherwise be the case. I’ll augment this piece with comments and/or do follow-on standalone posts if anything else notable arrives before end-of-week.

AI (nearly) everywhere

The pervasiveness of AI wasn’t a surprise to me, and likely wasn’t to you, either. Two years ago, after all, I put to prose something that I’d much earlier believed was inevitable, ever since I saw an elementary live demo of deep learning-based object recognition (accelerated by the NVIDIA GPU in his laptop) from Yann LeCun, Director of AI Research at Facebook and a professor at New York University, at the May 2014 Embedded Vision Summit:

One year later (and one year ago), I amped up my enthusiasm in discussing generative AI in its myriad implementation forms, a topic which I revisited just a few months ago. And just about a week ago, I pontificated on the exploding popularity of AI-based large language models. It takes a while for implementation ideas to turn into prototypes, not to mention for them to further transition to volume production (if they make it to that far at all, that is), so this year’s CES promised to be the “fish or cut bait” moment for companies run by executives who’d previously only been able to shoehorn the “AI” catchphrase into every earnings briefing and elevator pitch.

So this week we got, among other things, AI-augmented telescopes (a pretty cool idea, actually, says this owner of a conventional Schmidt-Cassegrain scope with an 8” primary mirror). We got (I’m resisting inserting a fecal-themed adjective here, but only barely) voice-controllable bidet seats, although as I was reminded of in doing the research for this piece, the concept isn’t new, just the price point (originally ~$10,000, now “only” ~$2,000, although the concept still only makes me shudder). And speaking of fecund subjects, AI brings us “smart” cat doors that won’t allow Fluffy to enter your abode if it’s carrying a recently killed “present” in its mouth. Meow.

Snark aside, I have no doubt that AI will also sooner-or-later deliver a critical mass of tangibly beneficial products. I’ll save further discussion of the chips, IP cores, and software that fundamentally enable these breakthroughs for a later section. For now, I’ll just highlight one technology implementation that I find particularly nifty: AI-powered upscaling. Graphics chips have leveraged conventional upscaling techniques for a while now, for understandably beneficial reasons: they can harness a lower-performance polygons-to-pixels “engine” (along with employing less dedicated graphics memory) than would otherwise be needed to render a given resolution frame, then upscale the pixels before sending them to the screen. Dedicated-function upscaling devices (first) and integrated upscaling ICs in TVs (later) have done the same thing for TVs, as long-time readers may recall, again using conventional “averaging” and other approaches to create the added intermediary pixels between “real” ones.

But over the past several years, thanks to the massive, function-flexible parallelism now available in GPUs, this upscaling is increasingly now being accomplished using more intelligent deep learning-based algorithms, instead. And now, so too with TVs. This transition is, I (perhaps simplistically) believe, fundamentally being driven by necessity. TV suppliers want to sell us ever-larger displays. But regardless of how many pixels they also squeeze into each panel, the source material’s resolution isn’t increasing at the same pace…4K content is still the exception, not the norm, and especially if you sit close and/or if the display is enormous, you’re going to see the individual pixels if they’re not upscaled and otherwise robustly processed.

See-through displays: pricey gimmick or effective differentiator?

Speaking of TVs…bigger (case study: TCL’s 115” monstrosity), thinner, faster-refreshing (case study: LG’s 480 Hz refresh-rate OLED…I’ll remind readers of my longstanding skepticism regarding this particular specification, recently validated by Vizio’s class action settlement) and otherwise “better” displays were as usual rife around CES. But I admittedly was surprised by another innovation, which LG’s suite reportedly most pervasively exemplified, with Samsung apparently a secondary participant: transparent displays. I’m a bit embarrassed to admit this, but so-called “See-through Displays” (to quote Wikipedia vernacular) have apparently been around for a few years now; this is the first time they’ve hit my radar screen.

Admittedly, they neatly solve (at least somewhat) a problem I identified a while back; ever-larger displays increasingly dominate the “footprint” of the room they’re installed in, to the detriment of…oh…furniture, or anything else that the room might otherwise also contain. A panel that can be made transparent (with consequent degradation of contrast ratio, dynamic range, and other image quality metrics, but you can always re-enable the solid background when those are important) at least creates the illusion of more empty room space. LG’s prototypes are OLED-based and don’t have firm prices (unless “very expensive” is enough to satisfy you) or production schedules yet. Samsung claims its MicroLED-based alternative approach is superior but isn’t bothering to even pretend that what it’s showing are anything but proof-of-concepts.

High-end TV supplier options expand and abound

Speaking of LG and Samsung…something caught my eye amidst the flurry of news coming through my various Mozilla Thunderbird-enabled RSS feeds this week. Roku announced a new high-end TV family, implementing (among other things) the aforementioned upscaling and other image enhancement capabilities. What’s the big deal, and what’s this got to do with LG and Samsung? Well, those two were traditionally the world’s largest LCD TV panel suppliers, by a long shot. But nowadays, China’s suppliers are rapidly expanding in market share, in part because LG and Samsung are instead striving to move consumers to more advanced display technologies, such as the aforementioned OLED and microLED, along with QLED (see my post-2019 CES coverage for more details on these potential successors).

LG and Samsung manufacture not only display panels but also TVs based on them, of course, and historically they’d likely be inclined to save the best panels for themselves. But now, Roku is (presumably) being supplied by Chinese panel manufacturers who don’t (yet, at least) have the brand name recognition to be able to sell their own TVs to the US and other Western markets. And Roku apparently isn’t afraid (or maybe it’s desperation?) to directly challenge other TV suppliers such as LG and Samsung, who it’d previously aspired to have as partners, integrate support for its streaming platform. Interesting.

Premium smartphones swim upstream

Speaking of aspiring for the high end…a couple of weeks ago, I shared my skepticism regarding any near-term reignition of new smartphone sales. While I’m standing by that premise in a broad sense, there is one segment of the market that seemingly remains healthy, at least comparatively: premium brands and models. Thereby explaining, for example, Qualcomm’s latest high-end Qualcomm Snapdragon 8 Gen 3 SoC platform, unveiled last October. And similarly explaining the CES-launched initial round of premium smartphones based on the Snapdragon 8 Gen 3 and competitive chipsets from companies like Apple and MediaTek.

Take, for example, the OPPO Find X7 Ultra. Apple’s iPhone 15 Pro Max might have one periscope lens, but OPPO’s new premium smartphone has two! Any sarcasm you might be sensing is intentional, by the way…that said, keep in mind that I’m one of an apparently dying breed of folks who’s still fond of standalone cameras, and that I also take great pride in not acquiring the latest-and-greatest smartphones (or brand-new ones at all, for that matter).

Wi-Fi gets faster and more robust…and slower but longer distance

Speaking of wireless communications…Wi-Fi 7 (aka IEEE 802.11be), the latest version of the specification from the Wi-Fi Alliance, was officially certified this week. Predictably, as with past versions of the standard, manufacturers had jumped the gun and began developing and sampling chipsets (and systems based on them) well ahead of this time; hopefully all the equipment already out there based on “draft” specs will be firmware-upgradeable to the final version. In brief, Wi-Fi 7 builds on Wi-Fi 6 (aka IEEE 802.11ax), which had added support for both MU-MIMO and OFDMA, and Wi-Fi 6e, which added support for the 6 GHz license-exempt band, with several key potential enhancements:

• Wider channels: up to 80 MHz in the 5 GHz band (vs 20 MHz initially) and up to 320 MHz in the 6 GHz band (vs 160 MHz previously)
• Multi-link operation: the transmitter-to-receiver connection can employ multiple channels in multiple bands simultaneously, for higher performance and/or reliability
• Higher QAM levels for denser data packing: 4K-QAM, versus 1,024-QAM with Wi-Fi 6 and 256-QAM in Wi-Fi 5.

The key word in all of this, of course, is “potential”. The devices on both ends of the connection must both support Wi-Fi 7, first and foremost, otherwise it’ll down-throttle to a lower version of the standard. Wide channel usage is dependent on spectrum availability, and the flip side of the coin is also relevant: its usage may also adversely affect other ISM-based devices. And QAM level relevance is fundamentally defined by signal strength and contending interference sources…i.e., 4K-QAM is only relevant at close range, among other factors.

That said, Wi-Fi’s slower but longer range sibling, Wi-Fi HaLow (aka IEEE 802.11ah), which also had its coming-out party at CES this year, is to me actually the more interesting wireless communication standard. The key word here is “standard”. Long-time readers may remember my earlier discussions of my Blink outdoor security camera setup. Here’s a relevant excerpt from the premier post in the series:

A Blink system consists of one or multiple tiny cameras, each connected both directly to a common router or to an access point intermediary (and from there to the Internet) via Wi-Fi, and to a common (and equally diminutive) Sync Module control point (which itself then connects to that same router or access point intermediary via Wi-Fi) via a proprietary “LFR” long-range 900 MHz channel.

The purpose of the Sync Module may be non-intuitive to those of you who (like me) have used standalone cameras before…until you realize that each camera is claimed to be capable of running for up to two years on a single set of two AA lithium cells. Perhaps obviously, this power stinginess precludes continuous video broadcast from each camera, a “constraint” which also neatly preserves both available LAN and WAN bandwidth. Instead, the Android or iOS smartphone or tablet app first communicates with the Sync Module and uses it to initiate subsequent transmission from a network-connected camera (generic web browser access to the cameras is unfortunately not available, although you can also view the cameras’ outputs from either a standalone Echo Show or Spot, or a Kindle Fire tablet in Echo Show mode).

In summary, WiFi HaLow takes that “proprietary “LFR” long-range 900 MHz channel” and makes it industry-standard. One of the first Wi-Fi HaLow products to debut this week was Abode Systems’ Edge Camera, developed in conjunction with silicon partner Morse Micro and software partner Xailent, which will enter production later this quarter at $199.99 and touts a 1.5 mile broadcast range and one year of operating life from its integrated 6,000 mAh rechargeable Li-ion battery. The broader implications of the technology for IoT and other apps are intriguing.

Does Matter (along with Thread, for that matter) matter?

Speaking of networking…the Matter smart home communication standard, built on the foundation of the Thread (based on Zigbee) wireless protocol, had no shortage of associated press releases and product demos in Las Vegas this week. But to date, its implementation has been underwhelming (leading to a scathing but spot-on recent diatribe from The Verge, among other pieces), both in comparison to its backers’ rosy projections and its true potential.

Not that any of this was a surprise to me, alas. Consider that the fundamental premise of Matter and Thread was to unite the now-fragmented smart home device ecosystem exemplified by, for example, the various Belkin WeMo devices currently residing in my abode. If you’re an up-and-coming startup in the space, you love industry standards, because they lower your market-entry barriers versus larger, more established competitors. Conversely, if you’re one of those larger, more established suppliers, you love barriers to entry for your competitors. Therefore the lukewarm-at-best (and more frequently, nonexistent or flat-out broken) embrace of Matter and Thread by legacy smart home technology and product suppliers (for which, to be precise, and as my earlier Blink example exemplifies, conventional web browser access, vs a proprietary app, is even a bridge too far).

I’ll have more to say on Matter and Thread in a dedicated-topic post to come. But suffice it to say that I’m skeptical about their long-term prospects, albeit only cautiously so. I just don’t know what it might take to break the logjam that understandably prevents competitors from working together, in spite of the reality that a rising tide often does end up lifting all boats…or if you prefer, it’s often better to get a slice of a large pie versus the entirety of a much smaller pie. I’d promise to turn metaphors off at this point, but then there’s the title of the next section…

The Apple-ephant in the room

Speaking of standards…Apple, as far as I know, has never had a show floor, hospitality suite or other formal presence at CES, although I’m sure plenty of company employees attend, scope out competitors’ wares and meet with suppliers (and of course, there are plenty of third-party iPhone case suppliers and the like showing off their latest-and-greatest). That said, Apple still regularly casts a heavy pall over the event proceedings by virtue of its recently announced, already-public upcoming and rumored planned product and service offerings. Back in 2007, for example, the first-generation iPhone was all that anyone to talk about. And this year, it was the Vision Pro headset, which Apple announced on Monday (nothing like pre-empting CES, eh?) would be open for pre-sale beginning next week, with shipments starting on February 2:

The thematic commonality with the first iPhone commercial was, I suspect, not by accident:

What’s the competitive landscape look like? Well, in addition to Qualcomm’s earlier mentioned Snapdragon 8 Gen 3 SoC for premium smartphones, the company more recently (a few days ago, to be precise) unveiled a spec-bumped “+” variant of its XR2 Gen 2 SoC for mixed-reality devices, several of which were on display at the show. There was, for example, the latest-generation XREAL augmented reality (AR) glasses, along with an upcoming (and currently unnamed) standalone head-mounted display (HMD) from Sony. The latter is particularly interesting to me…it was seemingly (and likely obviously) rushed to the stage to respond to Apple’s unveil, for one thing. Sony’s also in an interesting situation, because it first and foremost wants to preserve its lucrative game console business, for which it already offers several generations of VR headsets as peripherals (thereby explaining why I earlier italicized “standalone”). Maybe that’s why development partner Siemens is, at least for now, positioning it as intended solely for the “industrial metaverse”?

The march of the semiconductors

Speaking of ICs…in addition to the announcements I’ve already mentioned, the following vendors (and others as well; these are what caught my eye) released chips and/or software packages:

• Ambarella: A new IoT processor family, two new ADAS processors in an existing family, and a software development toolkit platform
• AMD: New chips for automotive applications, a next-generation mainstream graphics chip, and both new APUs (integrated CPUs-plus-GPUs) for socket AM5 and additional CPUs for legacy socket AM4 (the ongoing cost-per-bit benefit of DDR4 SDRAM versus the sooner-or-later DDR5 successor has made Intel’s life easier and complicated AMD’s, hasn’t it?)
• Speaking of Intel…new variants (including automotive-tailored spins…what happened to Mobileye, Intel?) of the Meteor Lake chiplet-based CPUs that I wrote about last September, plus plenty of “AI PCs” from the company’s system partners (and a mobile gaming system from MSI), along with both mobile and mainstream desktop proliferations of the 14th generation “Raptor Lake Refresh” architecture that I also mentioned in last September’s writeup’s comments.
• And “SUPER” high-end versions of NVIDIA’s RTX 4080, RTX 4070 Ti and RTX 4070, in the process obsoleting their (non-super?) TI predecessors but effectively doing little to nothing to alleviate the big-picture GPU constraints I grumbled about a few weeks back.

The rest of the story

I’m a few words shy of 3,000 at this point, and I’m not up for incurring Aalyia’s wrath, so I’ll only briefly mention other CES 2024 announcements and trends that particularly caught my eye:

• The first public mention of a Thunderbolt 5-based product via a dock from Hyper
• A cute but dubious-at-best (IMHO) meaningful reintroduced robot from Samsung called Ballie (analogies to Sony’s aibo and Amazon’s Astro are perhaps apt)
• Numerous products, some brand new and others seemingly just firmware-updated repackages of MagSafe predecessors, based on Qi2, the latest version of the Wireless Power Consortium’s wireless charging specification (stay tuned for already-queued coverage to come soon on both MagSafe and Qi2)
• And PCIe 5-based SSDs from companies such as Sabrent and Samsung (Samsung’s dual-mode approach is particularly interesting to me for its bandwidth-vs-power consumption tradeoff potential)

And with that, pushing beyond 3,100 words (and pushing my luck with Aalyia in the process) I’ll sign off. Sound off with your thoughts in the comments, please!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post The 2024 CES: It’s “AI everywhere”, if you hadn’t already guessed appeared first on EDN.

Transphorm Inc of Goleta, CA, USA is to be acquired by a subsidiary of Renesas Electronics Corp of Tokyo, Japan for $5.10 per share in cash (a premium of about 35% to Transphorm’s closing stock price on 10 January, and about 56% to the volume-weighted average price over the last 12 months and 78% to that over the last six months). The transaction values Transphorm at about $339m...

Wireless Connectivity Test Set MT8862A Enables Flexible and Fast Advanced RF Measurement for Wi-Fi 7 320 MHz

Anritsu and ASUS have announced a partnership to validate the latest wireless communications standard, IEEE 802.11be (Wi-Fi 7) 320 MHz performance testing. This series of tests utilized the Anritsu Wireless Connectivity Test Set (WLAN Tester) MT8862A in Network Mode and in the ASUS ROG Phone 8 series smartphones.

The IEEE 802.11be standard incorporates innovative technologies, including a 320 MHz bandwidth, 4096 QAM modulation and Multiple RUs, which require comprehensive evaluation of RF performance. Anritsu’s Wireless Connectivity Test Set (WLAN Tester) MT8862A is designed to measure the TRx RF performance of IEEE 802.11a/b/g/n/ac/ax/be (across 2.4 GHz, 5 GHz and 6 GHz bands) WLAN devices. It supports performance evaluation as defined by the IEEE 802.11 standard and Over-The-Air (OTA) performance tests according to specifications defined by the Cellular Telecommunications and Internet Association (CTIA). With its Network Mode and Direct Mode, it offers flexible testing for the RF TRx characteristics (such as Tx power, modulation accuracy, Rx sensitivity, etc.) of WLAN devices that tailored to match the measurement environment.

“The ASUS ROG Phone series is dedicated to delivering exceptional performance, making the achievement of ultra-high-speed wireless connectivity technology crucial,” said Alvin Liao, Director of ASUS Wireless Communications R&D. “Anritsu has been an indispensable partner to us, consistently providing superior test solutions in the realm of IEEE 802.11be, which has been guiding our Wi-Fi 7 technology evolution and injecting significant momentum into our technological advancements.”

“The MT8862A network mode is equipped with a unique data rate control algorithm that allows users to specify data rates for transmission measurements,” said Ivan Chen, General Manager of Anritsu Taiwan. “We are proud of the continuous trust ASUS places in Anritsu’s verification of its devices’ advanced features. This collaboration once again demonstrates Anritsu’s capability to provide leading-edge technology, enabling Wi-Fi 7 product manufacturers to shorten their product development time and continue to play a pivotal role in developing next-generation communication devices.”

The post Anritsu Collaborates with ASUS to Validate IEEE 802.11be (Wi-Fi 7) 320 MHz RF Performance Testing appeared first on ELE Times.

According to the latest report ‘TrendForce 2024 Infrared Sensing Application Market and Branding Strategies’, the market for consumer electronics 3D sensing vertical-cavity surface-emitting lasers (VCSELs) fell to US$847m in 2023 due to weak consumer demand and pricing pressure...