Новини світу мікро- та наноелектроніки

Balun Basics and Practical Performance Parameters

AAC - Ндл, 01/21/2024 - 20:00
Learn about the balun, a special type of transformer used in mixers, amplifiers, and signaling.

Ways to Connect Your TV to the Internet

Electronic lovers - Сбт, 01/20/2024 - 20:25

These days, smart TVs are very popular, allowing users to connect to the internet and access the latest media on streaming services. Platforms like Netflix, Disney and Amazon Prime are used by millions of people, offering on-demand content which can be enjoyed in high definition. Streaming has changed the game for media companies, offering new ways to release films and TV shows and giving consumers more choice over what they watch and when.

You can easily connect your TV to the internet if it’s a smart TV. However, if you have an older model, it can be more difficult. You’ll need the right devices, cables and know-how to set it up. In this guide, we’ll explain everything that’s required to connect your TV so you can enjoy your favourite media through streaming.

Connecting to a Laptop

If you have a smart TV, connecting to the internet is as simple as connecting to your home WiFi network or inserting an ethernet cable. For older TVs, you’ll need to connect to a device that has internet access. The simplest way is using a streaming device, but you can also connect to your laptop or desktop computer if you prefer.

This is a good option if you don’t have a streaming device available or if you prefer to do things from your computer. Check whether or not your TV and laptop have HDMI ports first. If not, you’ll have to use a VGA cable, which stands for Video Graphics Array. These were one of the standard ways to connect audio visual equipment, although they’ve since been phased out by HDMI for higher resolution images.

Once you’ve connected the cables to both ends, change the video source on your TV. You can then select the TV as an external monitor from your laptop or desktop computer. It’s possible to show the image on both screens at once, or just use the TV if you prefer. Then, all you have to do is visit your favourite streaming platform on your device and choose something to play. As long as your device is connected to the internet, you can access any site you like.

Streaming Device

Streaming devices have fast become one of the most popular ways to connect a TV to the internet. You can find a wide range of different products available, including firesticks, roku, apple TV and more. There are also cheaper, android devices, which serve the exact same purpose. These devices can all be connected easily to your TV, using either an HDMI or VGA cable.

To connect your device, simply plug it in to the power using the supplied adapter. Then, you need to connect to your TV using the appropriate cable. Most devices will only support HDMI, so make sure your TV is compatible before purchasing. In some cases, you may be able to use a specific adapter, though this will only be needed for much older TVs.

As with connecting to a laptop, you’ll need to select the source in order to connect to the streaming device. Most streaming devices will support a wide range of different streaming platforms and applications, though you’ll have to check this before you buy. Make sure you have access to your favourite platform, and then connect to the WiFi and log into your account to set it up on your TV.

Casting From a Smartphone

Even if you don’t have a laptop or streaming device, you should still be able to connect to your TV using just your phone. Smartphone casting lets you share your smartphone screen with the TV, allowing you to play videos and display pictures. If your TV has Bluetooth, you can do this very easily. However you can use a USB connection if not.

The post Ways to Connect Your TV to the Internet appeared first on Electronics Lovers ~ Technology We Love.

These 3 Hardware Startups Brought Engineering Ingenuity to the CES Stage

AAC - Сбт, 01/20/2024 - 20:00
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.

Weekly discussion, complaint, and rant thread

Reddit:Electronics - Сбт, 01/20/2024 - 18:00

Open to anything, including discussions, complaints, and rants.

Sub rules do not apply, so don't bother reporting incivility, off-topic, or spam.

Reddit-wide rules do apply.

To see the newest posts, sort the comments by "new" (instead of "best" or "top").

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Budget FY 2024-25 Expectations

ELE Times - Сбт, 01/20/2024 - 13:34

By the time you’re reading this piece, there is a possibility that we’d be in the middle of the interim budget announcement for the fiscal year 2024-25, by Finance Minister Nirmala Sitharaman, scheduled on February 1, 2024. 

While many of us expect some indispensable leaps in several areas including technology, innovation, manufacturing, and R&D, FM Sitharaman while speaking at an event by the Confederation of Indian Industry (CII) ruled out the possibility of any “spectacular” announcements. This cements the fact that fiscal discipline will take precedence over populist spending, thus following the premise of a conventional interim budget model. 

It will be interesting to see the stance that this budget will adopt, especially in expediting growth in the Power and Energy sector with lead incentivization for green hydrogen. The oil and gas sector has expectations of steady reforms for City Gas Distribution players that will boost natural gas consumption in the country, while the power sector is keen on noticing some bold initiatives to encourage the adoption of renewable energy. As per EY’s 2024 Budget expectations report, the government may extend the concessional 15 per cent income tax rate for corporations, to set up manufacturing units by one year till March 31, 2025, to attract foreign investments. Experts also predict that the government could unveil an expanded third phase of the incentive scheme for electric vehicles and that the budget will cater to further strengthening of the startup ecosystem in the country.  

Overall, India is expected to maintain the growth momentum into FY25, and the upcoming union budget can be a solid step toward realizing the country’s ambition of becoming the third-largest economy. 

Let us take a look at what some of the prominent industry experts’ expectations are from this year’s interim budget, as shared with ELE Times. 

Saurabh Marda, Managing Director and Co-Founder at Freyr Energy –

“The rooftop solar sector in India is rapidly expanding, with an impressive CAGR of 15%. To further accelerate the adoption of solar, the Ministry of New and Renewable Energy (MNRE) has decided to increase the Central Financial Assistance (CFA) by 23%.  One major challenge that many customers face, however, is the high upfront investment. To promote the wider adoption of solar energy, we hope that the 2024 union budget will encourage banks to offer affordable financing options for solar solutions. By providing low-interest loans, these financial institutions can significantly contribute to India’s progress towards sustainable energy”.  

Prem Kumar Vislawath, CEO and Founder at Marut Drones –

“The Central government has been on the right path in paving the way for large-scale embrace of drones in India with its decision to provide 15,000 agricultural drones free of cost to rural women under the Drone Didi initiative.  The aviation sector is bound to see incredible changes in the coming years. In budget 2024, we are hoping to see ease of regulations for start-ups as well as consumers, along with easy financing for drones for commercial purposes. A 100 per cent subsidy to farmers on drone training certification programs through Skill India would support the drone ecosystem of the country. GST waiver on drones, allied products, software, training, and licenses could be an excellent step towards that future. We are hoping to see ease of regulations for start-ups as well as consumers. For instance, a PLI scheme extension for components and manufacturers would be a great incentive for start-ups. Easy financing for drones for commercial purposes can go a long way in making them affordable to all sections of society. Fine-tuning policies and quicker clearances will help the drone industry achieve its true potential of making India a drone hub by 2030”.

Mr Kumar Gaurav, Co-Founder of Cashaa-

“As we eagerly anticipate the Union Budget of 2024, Cashaa is hopeful for transformative measures that will shape the future of the Indian crypto sector. Our primary expectation is a reduction in the flat tax rate from 30%, aligning crypto gains with other asset classes like debt and equity. We also advocate for a significant drop in the high TDS rate from 1% to approximately 0.01%, aiming to rekindle trading volumes crucial for a vibrant market. A decisive and supportive regulatory framework is pivotal, as it will not only encourage innovation but also attract vital investments to fuel the growth of the crypto sector in India. While our optimism runs high, we remain mindful of the interim nature of this budget, preceding the 2024 general elections”.

Pankaj Jha, Country Head & Director of Sales, MAXHUB India-  

“As the country continues to evolve, it is imperative for the government to channel its efforts towards the digitalization of education, aligning with the visionary National Education Policy 2020. In addition, expanding the scope of smart city projects to include more cities will undoubtedly contribute to our nation’s growth. I strongly advocate for the simplification of custom duties and incentives for ‘Make in India’ initiatives, with a special focus on facilitating contract manufacturing. Furthermore, providing tax exemptions on smart classrooms for private education players is an essential step in fostering innovation and accessibility. These measures collectively pave the way for a technologically advanced and educationally empowered India”.

Mr. Manideep Katepalli, Co-Founder at BikeWo –

“Despite last year’s commendable 33% surge in EV registrations, our industry encounters persistent challenges. Chief among these hurdles is the imperative need for robust charging infrastructure, pivotal in inspiring confidence among potential buyers and propelling the widespread adoption of electric vehicles (EVs) as a sustainable mode of transportation.
Another barrier remains the relatively higher initial cost of EVs, often deterring consumers. However, the promise of life tax subsidies for electric vehicles and the availability of accessible EV financing options hold immense potential to mitigate this challenge.


The integration of EV infrastructure into Priority Sector Lending (PSL) is poised to bolster credit flow into the sector by mandating financial institutions to provide support, thus promising a significant boon.

A supportive regulatory framework coupled with financial incentives aimed at fostering research and development within the EV sector stands as an indispensable pillar. These measures not only drive innovation but also attract investments, creating an environment conducive to widespread EV adoption.


Ultimately, these strategic initiatives play a pivotal role in establishing an enduringly sustainable and eco-friendly transportation ecosystem”.

Dinesh Arjun, CEO & Co-Founder at Raptee-

“As the electric vehicle (EV) industry gears up for substantial growth in the coming years, it is imperative for the government to foster a supportive ecosystem. To stimulate investment opportunities, there should be encouragement for potential investors, coupled with essential reductions in GST rates for electric vehicles and charging stations. Additionally, easing the burden on the industry can be achieved through a decrease in import duties on electronic components. Given their pivotal role in the EV sector, the industry is particularly hopeful for a significant GST reduction, aiming to bring it down from 18% to 5% specifically for lithium-ion battery packs and cells. A concerted effort in the budget towards enhancing the ease of doing business and facilitating the entry of local players into the market is crucial. Addressing aspects like component localization and ensuring easy access to necessary components will empower Indian companies, both large and small, to develop competitive products at competitive prices, further solidifying the sector’s growth potential”.

Ritesh Kumar, Founder at Cyfirma-

“We would like to see the upcoming budget carry a strong focus on helping businesses overcome the threats of cyberattacks and other digital risks. Indian businesses are adopting digital solutions at an accelerated pace yet their cybersecurity maturity remains low. A budget that supports SMEs and start-up’s growth while ensuring their cybersecurity needs are taken care of is much needed in the current AI and digital age. The government’s approach needs to move beyond building compliance frameworks to providing tangible subsidies for cybersecurity protection solutions”.

The post Budget FY 2024-25 Expectations appeared first on ELE Times.

Uttar Pradesh Takes a Leap in Technology with the Signing of Semiconductor Policy 2024

ELE Times - Сбт, 01/20/2024 - 09:48

In a significant development, Uttar Pradesh Chief Minister Yogi Adityanath has officially signed the long-awaited Semiconductor Policy 2024, making Uttar Pradesh the fourth Indian state, following Gujarat, Odisha, and Tamil Nadu, to establish its dedicated semiconductor policy. The policy, spanning a five-year term, aims to attract investments and propel the state into a prominent hub for the semiconductor industry.

According to statements from the state cabinet, the policy offers a range of incentives to investors, positioning Uttar Pradesh as an attractive destination for semiconductor manufacturing. Higher Education Minister Yogendra Upadhyay emphasized during a media conference that the semiconductor policy is designed to provide capital, non-financial, and financial incentives to all stakeholders in the semiconductor manufacturing ecosystem.

Under the policy, the state government plans to subsidize 50 per cent of the capital subsidy provided by the central government. Additionally, units investing up to Rs 200 crore will benefit from interest subsidies up to a maximum of Rs 1 crore. The state will also provide a 75 per cent discount on the first 200 acres of land and a 30 per cent discount on additional land. Furthermore, there will be a 100 per cent exemption on registration and stamp duty for land acquisitions.

The official press release from the Uttar Pradesh government highlights the anticipated surge in demand for semiconductors, projecting a market exceeding USD 100 billion by 2025. Acknowledging the country’s current dependency on semiconductor imports, the government aims to leverage the policy to lead the charge towards becoming a trillion-dollar economy.

The IT and Electronics Department will serve as the nodal agency for policy implementation, with the establishment of a dedicated policy implementation unit chaired by the additional chief secretary/principal secretary of the IT and Electronics Department. This move signifies Uttar Pradesh’s commitment to fostering technological growth and self-reliance in the semiconductor sector.

The post Uttar Pradesh Takes a Leap in Technology with the Signing of Semiconductor Policy 2024 appeared first on ELE Times.

Introduction to the Directional Coupler for RF Applications

AAC - Сбт, 01/20/2024 - 02:00
As part of a vector network analyzer (VNA), a directional coupler enables us to characterize a device’s performance by its S-parameters. Read this article to learn more about this important piece of equipment.

Infineon Rolls Out Magnetic Position Sensor Using TMR Technology

AAC - Птн, 01/19/2024 - 20:00
By measuring position with magnetics, the new position sensor frees up system real estate for designers.

Using an inductor to improve an existing design

EDN Network - Птн, 01/19/2024 - 18:38

Here is the circuit in Figure 1 from a previous DI:

Figure 1 Simple local low-noise voltage converter that can be used when a simple negative supply of low voltage is required.

Wow the engineering world with your unique design: Design Ideas Submission Guide

It is simple, and its efficiency can be improved by a very quick change. If you fix both values of R1 and R1′ (making the input power fixed also), the output voltage will have an extremum on the graph Eo=Eo(R2). To facilitate the achievement of this extremum the circuit Figure 1 can be modified as shown in Figure 2; here you can change the value of both R2/R2’ with a single potentiometer (R2).

Figure 2 Added inductance to the output of Figure 1 to improve converter efficiency.

But the main alteration is in adding inductance L to the output. A rather low value of inductance (0.1…1.0 mH) is sufficient. (This low value may be counter-intuitive to the low frequency of the multivibrator, which is less than 1 KHz.)

The negative output voltage slowly increases with an increasing inductance: from -0.36 V @ L=0.1 mH to -0.4 V @ L=1 mH.

The main advantage is in this ~25% increase of the output current (voltage). While the circuit in Figure 1 has its maximum output voltage at -0.31 V, the circuit Figure 2 can provide more than -0.39V with the same load (910 Ω).

This increasing is due to… hmmm…we’ll see the explanation in comments…

The second improvement is in output noise: the same inductance L significantly decreases it—the output capacitor in Figure 2 has half the capacity, nevertheless the amplitude of the output noise here is halved.

The values of components are:  L=0.1…1.0 mH, R1=R1’=5.6 k, R2 =~22 k, C1=C1’=0.1 µF. The output capacitors should be of low impedance.

The circuit consumes less than 1.5 mA from +5 V and produces more than -0.39 V on 910 Ω load. The very first circuit (“Photocell makes true-zero output of the op-amp“) with the same output current consumes about 10 times more power, but its output noise is about 100 times less.

With all these circuits there may be one problem though: they produce a low voltage which is not critical for the host system, but if it somehow drops, the results will be distorted and this can be unnoticed.

To make sure any drop of this voltage will be detected, a circuit in Figure 3 can be used. It can be useful to monitor the coherence of the power in any system with dual power.

Figure 3 Circuit that ensures any drop is voltage is detected that may result in distorted results for converters in Figure 1 and Figure 2.

The green LED indicates “Power Good” and can be used as “Power On” indicator for the whole host system. The resistors R1, R2 should be stable 1% at least. The LED should go on when the output voltage grows to e= -20…-100 mV, depending on your buffer parameters.

For values R1, R2 let:

v1 = Vref + |e|,
v2 = 2.5 + |e|, then
R1 = R2 * ((v1 / v2) – 1)

For the given reference and e = 50 mV:

R1 = 0.63 * R2,

For example, R1=38.8 k, R2=62 k. These values may call for some trim because their total value cannot be too low—the output current should be used sparingly. And the input current of TL431 has far more influence when the current through the voltage divider is very low, so some trim is recommended in this case. Finally, any other reference with output voltage more than 2.5 V can be used, but the values of R1, R2 should be recalculated.

Peter Demchenko studied math at the University of Vilnius and has worked in software development.

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Guerrilla RF’s Q4 revenue almost doubles year-on-year to record $4.7m

Semiconductor today - Птн, 01/19/2024 - 17:46
For fourth-quarter 2023, Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has reported revenue of $4.7m, up 38% on $3.4m in Q32023 and up 95.8% on $2.4m a year ago...

Nichia’s blue and green laser diodes receive Scientific and Technical Award from Academy of Motion Picture

Semiconductor today - Птн, 01/19/2024 - 15:45
Nichia Corp of Tokushima, Japan — the world’s largest gallium nitride (GaN)-based light-emitting diode/laser diode (LED/LD) manufacturer and inventor of high-brightness blue and white LEDs — says that its laser diode technology has been recognized for its contribution to the advancement of the motion picture industry by receiving a Scientific and Technical Awards from the Academy of Motion Picture Arts and Sciences (AMPAS)...

Making the case for a new MEMS fab model

EDN Network - Птн, 01/19/2024 - 12:51

A new Japanese fab service MEMS Infinity, offering 150-mm and 200-mm wafers, aims to facilitate concept design and evaluation all the way through prototyping and mass production. It has joined hands with MEMS development services provider AMFitzgerald to offer a full-service MEMS silicon wafer foundry and expedite the commercialization of thin-film lead zirconate titanate (PZT) MEMS chip technologies.

Sumitomo Precision Products Co. Ltd (SPP)—a manufacturer of high-precision industrial products with three decades of experience in the MEMS industry—has set up MEMS Infinity with a 20,000 square-foot cleanroom in the industrial and technology hub of Amagasaki, Japan.

Figure 1 MEMS Infinity foundry service features PZT-specific patterning equipment and proprietary high-figure-of-merit epitaxial-PZT (epi-PZT) thin film deposition. Source: Sumitomo Precision Products

Sumitomo Precision Products has already been offering MEMS accelerometers and high-precision MEMS gyros under the name of an affiliated company. Now MEMS Infinity is one of the industry’s few foundries providing a portfolio of PZT thin films, piezoelectric materials that transduce electrical energy to mechanical energy and vice-versa.

These thin-film piezoelectric materials enable new architectures for challenging applications such as high-fidelity and low-power audio, low-cost handheld ultrasound imaging, and instant all-in-focus video. PZT is a versatile piezoelectric material that is sought after for MEMS sensors or actuators. It serves high-growth applications—such as true wireless stereo (TWS), automotive LiDAR, medical ultrasound imaging, AR/VR, and haptics—which require precise performance in a robust, ultra-miniaturized form factor.

“As a material that enables many types of emerging, performance-intensive MEMS devices, thin-film PZT is much in demand,” said Alissa Fitzgerald, founder and CEO of AMFitzgerald. “However, PZT requires specific process tools and expertise that are not widespread.” As a result, it’s been difficult to access commercial-quality material during development stages, especially when wafer volumes are low.

Moreover, using poorly controlled research-grade materials during prototyping slows down product development. The strategic alliance between MEMS Infinity and AMFitzgerald aims to address these challenges by integrating design-to-manufacture solutions while using high-quality PZT from day one.

EDN recently spoke with Fitzgerald to find out more details about thin-film piezoelectric materials and how they meet the needs of next-generation MEMS products.

A new generation of commercial MEMS technology

Sensorization is a mega trend continuing across all markets, and it began with our phones being loaded with sensors. At this technological crossroads, we see a new generation of commercial MEMS devices arising amid the manufacturability of thin-film piezoelectric materials, which have been around for decades in bulk format.

“They were used in many industrial and medical applications in solid bulk format, but now we have tools to deposit them on 1-micron or 2-micron thin films on 200 mm wafers,” Fitzgerald said. “These manufacturing tools are available now, so we are finally seeing piezoelectric MEMS products emerge in the market after more than 10 years of development in academia and elsewhere.”

Piezoelectric MEMS now offer performance and manufacturing gains over traditional capacitive MEMS. Some of the early products include speakers inside the earbuds to provide TWS experience and low-cost ultrasound transducers. “While products like ultrasound transducers have been made from bulk PZT for 40 to 50 years, now we can produce them with thin-film materials, enabling much lower cost transducers, leading to lower cost ultrasound diagnostic systems,” she added.

Figure 2 MEMS applications using PZT thin films include inkjets, autofocus, ultrasound, microphones/speakers, micromirrors, pumps, fluidics, and gyroscopes. Source: AMFitzgerald

It’s important to note that all the high-volume MEMS we see today are based on capacitive deep silicon etch architecture. However, with the advent and maturation of thin film piezoelectric, we see many devices redesigned in piezoelectric architecture. “Many companies are now seeking performance and manufacturing gains compared to the 1990s era traditional capacitive MEMS devices,” Fitzgerald said.

It’s also worth mentioning that while PZT is emerging as the most versatile material, aluminum nitride (AlN) was the first piezoelectric thin film to be commercialized in high volume for RF filters. Companies like Broadcom chose AlN because it’s best for MEMS-CMOS monolithic integration. “It enabled CMOS-MEMS integration on the same piece of silicon and the circuitry surrounding it, and that’s essential for RF filters,” she added.

“We are focused on PZT because it’s a more versatile material that can address many more applications and MEMS device types,” Fitzgerald said. “It spans both sensing and actuating functions and also enables wafer-level or chip-level system electronics integration.”

PZT’s technical merits aside, however, the critical issue is where fabless MEMS companies can access thin film PZT production, especially when the large MEMS fabs are very selective of their customers.

A new MEMS fab model

During the 1980s, the CMOS industry created the fabless business model by forming alliances with design partners to bridge the gap between fabless companies and foundries. However, MEMS foundries have yet to embrace the design partner model. Here, Fitzgerald pointed out that North America currently doesn’t have a MEMS fab for thin film PZT.

“We have been seeking PZT source for quite a while as our clients have been approaching us for this material,” she told EDN. “Large MEMS fabs don’t want to participate in the early-stage development because wafer volumes are small.” As a result, access to PZT has been limited, and there has been an unmet need for small- to medium-level production of high-quality thin films.

Efficient PZT MEMS development requires access to stable, high-performing PZT films, and R&D fabs don’t satisfy this need. The alliance will provide AMFitzgerald access to MEMS Infinity’s thin-film PZT. Furthermore, access to proprietary data on thin-film PZT will improve the accuracy of MEMS design and modeling, minimizing the need for design-build-test cycles.

“When you are developing a new MEMS device, you want to work with the exact material you are using in production,” said Fitzgerald. “So, we aim to lower the barrier for access to this material as well as have foundry-specific MEMS design.” That will inevitably speed up time to market and shrink development costs.

AMFitzgerald will get access to MEMS Infinity’s proprietary data, which will significantly enhance the design and modeling phases of MEMS development. “We can engineer the design specifically for their material, and that helps to reduce design and build test cycles,” she added. “MEMS devices take longer to develop because there are a lot of iterations between the design and foundry stages, and we can reduce that now to help unlock the potential of MEMS devices.”

Figure 3 The alliance will lower the barrier to PZT materials while facilitating design-to-production MEMS service. Source: AMFitzgerald

The alliance between AMFitzgerald and MEMS Infinity is based on a tried-and-tested business model that has been very successful in the CMOS industry, where TSMC is most notable for its design partners’ alliance. “CMOS foundries understood a long time ago that you need design partners to bridge the gap between a fabless company and foundry, but for some reason, this hasn’t taken hold in the MEMS industry yet,” Fitzgerald said. “We think we are going to be the first to have this kind of close collaboration with a foundry.”

Collaboration modus operandi

In MEMS design, prototyping is the third vital step after design and feasibility, and it tends to occur at a research facility. Custom chip designs are validated by prototypes built in-house before transfer to the foundry for production. That’s followed by foundry selection, and then the design must be adjusted for the foundry toolsets. Next, you must move on to ramping up production.

This alliance between AMFitzgerald and MEMS Infinity seeks to provide a shortcut for PZT to facilitate design on the foundry’s material properties and qualities. Moreover, prototyping will occur on the production-ready material from day one at the foundry. In other words, the tie-up aims to shorten the commercialization timeline of MEMS devices.

The two MEMS partners aim to provide the complete PZT development solution. AMFitzgerald will offer MEMS design, modeling and product development services, while MEMS Infinity will provide production for thin films and versatile foundry services. MEMS Infinity will provide production proven PZT processes at its fab.

AMFitzgerald will facilitate global access to MEMS Infinity’s thin-film PZT while using its proprietary thin-film PZT data to improve the accuracy of MEMS design and modelling. That, in turn, will minimize the need for design-build-test cycles and accelerate product development. Consequently, it will unlock the commercial potential of performance-intensive piezoelectric MEMS devices such as ultrasound transceivers, micro-speakers, micromirrors, and microfluidics.

“We aim to provide integrated product development experience, which has been missing in the MEMS industry,” Fitzgerald concluded. “We want to facilitate MEMS Infinity’s high-quality material, which we used for 20 years to produce piezoelectric gyroscopes.”

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Groundbreaking AI Innovation Simplifies Robot Integration in Manufacturing

ELE Times - Птн, 01/19/2024 - 11:49

In a pioneering development, researchers at the Department of AI Machinery, part of the Korea Institute of Machinery and Materials (KIMM), have unveiled an artificial intelligence (AI) technology designed to streamline the integration of robots into manufacturing processes. Currently undergoing testing by EV parts manufacturers, this versatile AI solution is poised to revolutionize various sectors, including automobile manufacturing, machine part production, assembly, and other production processes.

The innovative technology, developed for the first time globally, promises to simplify the complex task of integrating robots into manufacturing. Researchers at KIMM have specifically tailored this AI technology for easy integration into various manufacturing processes. Currently, it is in the testing phase with electronic component producers, with plans to expand its application to a broader range of manufacturers in the future.
The AI-driven robot employs the “Large Language Model (LLM)” and operates within a virtual environment. This technology is adept at understanding user commands and automatically generating and executing tasks for the robot. It facilitates the creation of task sequences and movements through voice or text commands. By leveraging pre-learning in a virtual space, the technology selects optimal work points for the site, streamlining the work process with automatic object detection and collision avoidance capabilities.

Traditionally, the integration of robots into manufacturing sites often necessitated modifying the site to accommodate the robot, limiting the range of tasks robots could perform. The newly developed technology addresses this challenge by enabling robots to efficiently handle specific task assignments with minimal on-site modification, thanks to pre-learning in a virtual space. Ongoing on-site demonstration tests indicate that this groundbreaking AI solution is well-equipped to handle various future scenarios at manufacturing sites.

The post Groundbreaking AI Innovation Simplifies Robot Integration in Manufacturing appeared first on ELE Times.

AI Leading the Path to the Future of Communication Technology

ELE Times - Птн, 01/19/2024 - 09:53

In an exciting leap toward the next generation of wireless technology, researchers at UBC Okanagan, led by Dr. Anas Chaaban from the UBCO Communication Theory Lab, are tapping into the power of artificial intelligence (AI) to revolutionize communication architectures. The goal is to achieve faster data transmission, energy efficiency, and more in the evolving landscape of mobile networks beyond 5G.

Dr. Chaaban, an Assistant Professor at UBCO’s School of Engineering, emphasizes that the upcoming wave of communication technology goes beyond mere speed. The research aims to create a theoretical wireless communication architecture that can handle increased data loads and enable instantaneous communication among devices, consumers, and the environment.

The researchers advocate for intelligent architectures to address the demands of massive connectivity, ultra-low latency, high reliability, quality experience, energy efficiency, and reduced deployment costs. Dr Chaaban proposes a departure from traditional communication techniques and advocates for leveraging recent advances in AI to adapt to emerging technology challenges.

Using transformer-masked autoencoders, the team is developing techniques to enhance efficiency, adaptability, and robustness. Dr. Chaaban elaborates on their innovative approach of breaking down content, such as images or videos, into smaller packets for transport. AI is then employed to recover lost packets at the recipient, effectively reconstructing the content.

Integrating virtual reality into everyday communications is a key focus of next-generation technology. Dr Chaaban envisions AI’s role in creating complex architectures that propel communication technologies forward, particularly in adapting to emerging technologies like virtual reality. The collective efforts to address these intricacies are expected to usher in an era of adaptive, efficient, and secure communication networks.

The post AI Leading the Path to the Future of Communication Technology appeared first on ELE Times.

Researchers Create World’s First Graphene Semiconductor

AAC - Птн, 01/19/2024 - 02:00
Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.

Multichannel digital isolators withstand 8 kV

EDN Network - Чтв, 01/18/2024 - 23:03

Novosense has expanded its NSI824x series of digital isolators with quad-channel devices that provide an isolation rating of 8 kV and a creepage distance of 15 mm. The new NSI824xWx ICs perform signal isolation and level shifting in applications ranging from solar inverters and energy storage to industrial automation and electric vehicles.

Qualified to UL 1577 safety standards, the NSI824xWx isolators deliver robust EMC performance with high levels of protection against system-level ESD, EFTs, and voltage surges. In addition to an insulation voltage of up to 8 kVRMS, the parts furnish chip-level ESD HBM protection to ±8 kV and common-mode transient immunity of up to 200 kV/µs.

The digital isolators handle channel speeds of up to 150 Mbps. Configuration options for channel direction include four forward channels, three forward channels and one reverse channel, or two forward and two reverse channels. An input voltage range of 2.5 V to 5.5 V accommodates a wide variety of digital interfaces. Power consumption is 1.5 mA/channel at speeds of 1 Mbps.

Housed in ultra-wide-body SOWW-16 packages, the NSI824xWx digital isolators operate over a temperature range of -55°C to +125°C. A request form for samples can be found on the product page linked below.

NSI824x product page

Novosense Microelectronics

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