Новини світу мікро- та наноелектроніки

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Due to rapidly increasing demand, particularly in the optical communications field, Tokyo-based JX Advanced Metals Corp is to make a further capital investment to increase the production of indium phosphide (InP) substrates at its Isohara Plant in Kitaibaraki City, Ibaraki Prefecture...

The IEEE International Electron Devices Meeting (IEDM) is considered the premier forum where scientists and engineers come together to disclose, discuss, and debate the best recent R&D work in electron devices, semiconductors, and microelectronic technologies. The 71st annual IEEE IEDM conference will be held December 6-10, 2025, at the Hilton San Francisco Union.

Supporting the theme “100 Years of FETs: Shaping the Future of Device Innovations,” the 2025 IEDM technical program will consist of 295 presentations, plus a host of events.

“This year’s IEDM offers a preview of the next computing paradigm. We are witnessing the convergence of atomic-scale fabrication, 3D integration, and neuromorphic design, moving us beyond yesterday’s technology and even classical computing. From monolithic CFETs that redefine transistor density to in-memory computing that can mitigate the von Neumann bottleneck, more intelligent and more efficient technology is being built here,” said Gaudenzio Meneghesso, IEDM 2025 Publicity Chair, and Head of the Department of Information Engineering at the University of Padova.

“As AI is demanding unprecedented efficiency, the device community is rising to the challenge. IEDM 2025 showcases technologies that can power the next AI decade: from GaN chiplets for power delivery and silicon photonics for data transfer to 3D DRAM and FeFETs for in-memory computing. These device technologies will make the algorithms of tomorrow possible.”

“The pursuit of Moore’s Law has evolved from a simple race to shrink transistors into engineering in multiple dimensions. IEDM 2025 showcases this new era: we are scaling up with 3D stacking like CFETs and 3D DRAM, scaling laterally with atomic-layer-deposited channel materials, and scaling past CPUs with novel architectures like in-memory computing,” said John Paul Strachan, IEDM 2025 Publicity Co-Chair, Director of Peter Grünberg Institute, Forschungszentrum Jülich, and Professor at RWTH Aachen University. “This is the culmination of a century of FET innovation, pushing the boundaries of what is physically possible to compute.”

The post IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs” appeared first on ELE Times.

DigiKey is known for comically over-packing their orders. A regular $50 order usually leaves you with a lifetime supply in ESD bags and packing material. But today they really went "hold my beer!". submitted by /u/Defiant-Appeal4340 [link] [comments]

I wanted to start a small side project to 'calm down' from my last big one. And because we need something to replace the old FM radio in our dining room, I started building this, an active smart speaker. Currently, I have what you can see on the pictures. I pulled all the parts out of an old multimedia system my mother gave to me. The donor-board can be seen on one of the pictures. It was to big to fit in the speakers I am planing to use, so I decided to split it up by transferring the components onto a self soldered PCB and throwing out unnecessary parts out in the process. The amplifier board was quite easy and done in a few hours, but the power supply took quite long as I paid careful attention while building it because you know, things plugged into the mains. The PSU originally put out multiple voltages for not only the Amp itself(24V) but also the Vacuum fluorescent display and other shenanigans I don't need. I threw out everything except the 24V for the amplifier and the 5V rail to power the RPI and micro-controller that I will put into the device for the 'smart' part. I still have to isolate the bottom of the Power supply and build a small shielding for it to eliminate noise as it will be sitting directly behind the amplifier part. Like I said, apart from these two PCBs I will also be putting a RPI1 and a STM32 with a LCD screen and rotary encoder into this thing to give it streaming capabilities. I will keep you up to date on the progress! submitted by /u/FloTec09 [link] [comments]