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🎥 Майбутні інженери опановуватимуть реверс-інжиніринг у новій лабораторії на ФРП KPI4U-2 ср, 09/02/2026 - 12:58

US-based aerospace & defense technology company Northrop Grumman Corp has won a $7m contract to create diamond-cooled chips that deliver higher power, faster speeds and enhanced performance for military radar and communications...

To accelerate technical innovation and expand domestic manufacturing capabilities for solar panels in space applications, the US Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation has announced a $12m funding opportunity to help to ensure that the next generation of space photovoltaics (PV) is developed in the USA...

🍁 Три дні Японії в самому серці Києва — у КПІ ім. Ігоря Сікорського kpi ср, 09/02/2026 - 10:43

Vishay Intertechnology, today introduced two new low profile common mode chokes for high current automotive, energy, and industrial applications. Available in both surface-mount and through-hole packages, the Vishay Dale commercial ICMS2321 10 and Automotive Grade ICMS2321-1A combine a heat rating current to 30 A with a 1500 VDC dielectric withstand voltage between coils.

With their low profile, the devices released today offer a reduced size and volume, making them more resistant to shock and vibration, while their enhanced core design increases performance and saturation current at high temperatures up to +150 °C. Offering a self-shielded, rugged construction, the common mode chokes are ideal for DC/DC converters, high voltage inverters, EMI filters, and high current filters for noise suppression in motor control and other circuitry. The AEC-Q200 qualified ICMS2321-1A is well suited for use in automotive on-board chargers.

In addition to their surface-mount and through-hole mounting options, the ICMS2321-10 and ICMS2321-1A offer customizable inductance, impedance, DCR, and current ratings. Devices with surface-mount terminations are available in tape and reel packaging and are compatible with automated pick and place assembly for increased flexibility in board layouts. The common mode chokes are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

Part number		ICMS2321-10	ICMS2321-1A
Inductance		70 µH to 480 µH
DCR typ.		1.2 mΩ to 13.4 mΩ
DCR max.		1.3 mΩ to 15.0 mΩ
Common mode impedance	@ 1 MHz	540 Ω to 3790 Ω
	@ 10 MHz	345 Ω to 1920 Ω
	@ 100 MHz	220 Ω to 410 Ω
Heat rating current typ.(1)		7 A to 20 A
Heat rating current typ.(2)		10 A to 30 A
Leakage max.		1.7 µH to 11.5 µH
AEC-Q200		No	Yes

 

(1) DC current (A) that will cause an approximate ΔT of 40 °C

(2) DC current (A) that will cause an approximate ΔT of 100 °C

The post Vishay Intertechnology Commercial and Automotive Grade Low Profile Common Mode Chokes Offer High Shock and Vibration Resistance appeared first on ELE Times.

The IOX-77 is an ESP32-C3-based development board that packs 75 GPIO pins into a compact 71 × 42 mm PCB, using five RISC-V CH32V003 microcontrollers on an I²C bus for parallel execution and expandability.

In electronics manufacturing, material and quality testing using X-ray inspection is considered the gold standard for reliability and the highest standards. For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels. With a completely newly developed system platform, the manufacturer now presents next-generation X-ray inspection: The Multi Line AXI combines outstanding technological innovations with highly versatile application options and multifunctionality, while offering simple operation and rapid adaptability to inspection tasks. The result is an innovative AXI system that sets new standards in X-ray inspection—offering a secure investment and high performance.

Technically, the Multi Line AXI stands out as a state-of-the-art planar 3D-CT X-ray system, offering the highest possible resolution and razor-sharp cross-sectional images. Based on the company’s proprietary aspeCT technology, the system achieves new levels of precision and image quality in X-ray inspection. Using a high-resolution, high-speed flat-panel detector, the detailed images are transformed into intelligent 3D reconstructions and volumetric 3D images and models of the highest quality. An innovative 7-axis system with synchronized control ensures high-speed, on-the-fly CT imaging in the shortest possible time: In less than 2 seconds, and with 8 µm voxel resolution, the Multi Line AXI offers flexible 2D, 2.5D, and 3D X-ray imaging as needed, using microfocus X-ray tubes and in sub-micrometer increments. This makes the system a highly secure investment and versatile in its application, manufactured entirely in Jena.

In addition to its outstanding technology, the Multi Line AXI has been consistently designed for broad applicability, reliability, and low-maintenance operation. With an 810×535 mm inspection area, a maximum PCBA clearance of 105 mm, and a transport capacity of up to 25 kg in its flexible transport system, both the smallest PCBAs and large power electronics can be inspected quickly and with consistently high quality. Thanks to the use of parts from exclusively European suppliers and German-brand mechanical components, the system is extremely durable and reliable. The Multi Line AXI’s platform concept makes upgrades, expansions, and repairs quick and easy. Furthermore, the system can be integrated into any manufacturing or inspection environment—whether inline, at-line, or stand-alone. It interfaces seamlessly with the manufacturer’s MES and can be integrated into traceability systems. High repeatability, variable X-ray performance as needed, and adaptability to high mix, low-volume production are hallmarks of the Multi Line AXI.

However, a system’s performance and quality are only the foundation—in everyday use, an AXI system must be quickly adaptable to specific inspection tasks and easy to operate. The Multi Line AXI guarantees this through its seamless integration into the PILOT software platform’s user interface, which has also proven itself in GÖPEL AOI systems. Inspection programs are automatically generated using “Magic Click” based on Gerber and assembly data or other CAD formats (ODB++, Process, etc.). For reliable verification, the PASS/FAIL evaluation is supported by intelligent AI assistants. This transforms detailed X-ray images into actionable inspection results—ensuring the quality and security of the PCBA. Short programming times and comprehensive evaluation of results—including precise void calculation and THT fill rate measurement in percent—combined with GÖPEL electronic’s software and inspection intelligence make the Multi Line AXI practical and suitable for everyday use, intuitive to operate, and customizable.

In developing the new X-ray inspection system, GÖPEL electronic also addressed questions about the future: How do we want to manage our resources? As a result, the Multi Line AXI is designed as a “Lean & Green Machine” focused on resource conservation, energy efficiency, and sustainability. The manufacturer has deliberately omitted pneumatic components and compressed air, which not only simplifies installation and operation but also reduces maintenance and operating costs. With its lightweight design—weighing just 2.7 metric tons and featuring a compact footprint of 1600×1660—this X-ray system requires no special structural preparations and can be installed quickly and easily in virtually any environment. Based on GÖPEL electronic’s many years of experience, the system is designed from the outset to be durable, upgradeable, and reusable, with easy access for service and maintenance.

The post GÖPEL electronic Introduces the New Multi Line AXI 3D-CT X-Ray Inspection System appeared first on ELE Times.

Murata Manufacturing Co., Ltd., a global leader in electronic components and innovative electronic solutions, will participate in electronica India 2026, taking place from 16–18 September 2026 at the Bangalore International Exhibition Centre (BIEC), Bengaluru.

Located at Hall 3, Booth H3.E11, Murata will present its exhibition theme, ‘Scaling the Future from India with Murata,’ showcasing how its technologies are helping shape the next generation of intelligent, connected, and energy-efficient electronic systems. As India’s industries accelerates toward an AI-powered, electrified, and digitally connected future, Murata is helping enable the technologies that make it possible. Backed by global reliability, local commitment, and scalable innovation, Murata delivers advanced electronic components, sensing technologies, power solutions, RF technologies, and system innovations that support next-generation industrial systems.

At electronica India 2026, visitors will experience application-focused demonstrations, engage with Murata’s technical experts, and discover how the company’s technologies help accelerate innovation across rapidly evolving industries.

Scaling the Future from India with Murata

The electronics industry is entering a new era driven by artificial intelligence, semiconductor innovation, intelligent mobility, industrial automation, robotics, and digital infrastructure. As these technologies continue to converge, the need for highly reliable, energy-efficient, and integrated electronic solutions continues to grow.

At electronica India 2026, visitors will experience how Murata’s technologies address these evolving industry needs through interactive demonstrations and application-focused showcases.

Explore Murata’s Application Zones

Murata’s booth will feature five application zones highlighting technologies that enable future-ready electronic
systems across diverse industries:

• IC Zone – Accelerating Semiconductor Innovation from Device to System
  High performance AI computing requires increasingly integrated semiconductor systems. Explore how Murata’s components, reference design, and EMI expertise support power delivery, noise control, and reliable system design for advanced semiconductor applications.
• Data Center Zone – Powering AI Servers and Modern Data Center Infrastructure
  Data centers supporting AI and other high-performance computing workloads require efficient, reliable, and scalable power solutions. Discover Murata’s power technologies and electronic components for AI servers, networking, and modern data center infrastructure.
• Mobility Zone – Driving the Future of Connected and Electrified Mobility
  Enabling connected, electrified vehicles through advanced communication, sensing, and battery technologies. Explore Murata solutions for V2X (Vehicle to Everything), connectivity, positioning, and system reliability.
• Industrial Zone – Accelerating Smart Factory Transformation
  Manufacturers are adopting smarter, more connected operations. Explore Murata solutions for automation, machine monitoring, asset tracking, and operational efficiency.
• Humanoid Zone – Enabling Responsive Interaction and Synchronized Action
  Humanoid robots need accurate sensing, reliable connectivity, and coordinated control. Discover how Murata technologies support responsive interaction, synchronized movement, and dependable operation.

Complementing these featured showcases, visitors will also have the opportunity to explore additional product showcases and technology displays across each application zone, together with Murata’s broader product portfolio, demonstrating Murata’s expanding role in delivering comprehensive electronic solutions across diverse applications.

Global Expertise. Growing Local Readiness

Murata combines decades of global technology leadership with an expanding local presence to support India’s rapidly evolving electronics ecosystem. By integrating global manufacturing standards with local engineering expertise and dedicated customer support, Murata continues to deliver the quality, reliability, and innovation trusted by customers worldwide.

As part of its long-term commitment to India, Murata continues to strengthen its local capabilities through its sales offices in Chennai, Delhi (Noida), and Bengaluru, together with its manufacturing facility in Chennai. This growing footprint enables closer customer collaboration, faster technical support, and stronger partnerships, reinforcing Murata’s commitment to supporting India’s ambition to become a global hub for electronics manufacturing and technological innovation.

Join us at electronica India 2026

Murata invites customers, partners, design engineers, and industry professionals to visit Hall 3, Booth H3.E11 at electronica India 2026 to experience application-focused demonstrations, engage with technical experts, and discover how ’Scaling the Future from India with Murata’ is enabling the next generation of electronics.

The post Murata to Showcase ’Scaling the Future from India with Murata’ at electronica India 2026 appeared first on ELE Times.

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA says that the first shipments of US-manufactured 5th Generation GaNFast technology, in partnership with GlobalFoundries of Malta, NY (GF, the only US-based pure-play foundry with a global manufacturing footprint, including facilities in the USA, Europe and Singapore), will begin in September, marking a milestone in strengthening the US domestic GaN ecosystem for AI infrastructure and critical national security applications...

submitted by /u/Neat_Ad_6297 [link] [comments]

### 1. Original Behavior and Diagnosis * **Symptom:** The device charged and operated normally when connected to the charger, even allowing it to be unplugged and continue working. However, the failure occurred when turning it off; it wouldn't turn back on independently unless the charger was reconnected. * **Diagnosis Process:** Exhaustive tests were performed, ruling out various components like the power button, battery, and motherboard capacitors, ultimately finding a damaged P-type MOSFET in the power section. ### 2. Tools and Materials Needed * Precision multimeter * Soldering station * Flux and isopropyl alcohol * Precision screwdrivers ### 3. Module Disassembly * Carefully remove the screws to open the module. * Separate the pressure tabs. * Carefully lift the back cover where the battery is attached, being mindful of the wiring connected to the main board. ### 4. Repair Procedure * Locate the power circuit section where the P-type MOSFET identified in the diagnosis operates. * Apply flux and use the soldering station to extract the defective component. * Once the P-type MOSFET causing the power-on failure is removed, clean the area with isopropyl alcohol and proceed as needed to restore the power line. ### 5. Subsequent Tests and Reassembly * Test the receiver's autonomous power-on without connecting an external charger. * Correctly align the circuit board inside the casing, securing the buttons and pins. * Close the cover, tighten the screws, and perform the final operational test. submitted by /u/Aarombts [link] [comments]

Discrete device designer and manufacturer Nexperia B.V. of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) says it will explore a strategic collaboration on advanced power semiconductor solutions for automotive applications with Aurobay Technologies, a division of Horse Powertrain Ltd (a joint venture between Renault Group and Geely)...

A compact LED traffic light module for Arduino and other platforms: how it works, how to wire it, and how to test it with simple sequences.

Finland-based Vexlum — which was spun off from Tampere University of Technology’s Optoelectronics Research Centre in 2017 and develops and manufactures high-power semiconductor vertical-external-cavity surface-emitting laser (VECSEL) technology systems — has appointed Erik McKee as president of the Americas. Based in Denver, Colorado, he will oversee operations and growth across North and South America, supporting accelerating demand for the company’s laser technology in quantum, semiconductor, space, medical and other advanced industrial and scientific applications...

⭐ Оголошується набір у творчі колективи Центру культури та мистецтв КПІ kpi вт, 09/01/2026 - 17:00

🏓 Спортивні секції для студентів kpi вт, 09/01/2026 - 16:00

The use of hardware assisted verification (HAV) technologies was once a luxury, “nice to have” technology for IC design. Because of the costs associated with HAV, especially for the “big box” logic emulators, it was mainly leveraged by the larger companies for their largest SoC projects.

Today with even medium complexity SoCs, modern HAV technologies have become far more accessible and affordable at a time when the use of HAV has become an imperative for helping design teams get massive SoC-powered products to market on time.

In today’s SoC design world, the issue isn’t strictly getting silicon to function properly. The main issue is ensuring that the SoC and the application software that runs on the SoC work together properly and with the highest efficiency.

Let’s examine a common methodology employed with verifying hardware and software together and where the traditional methodology breaks down. We’ll then look at how EDA vendors are offering modern FPGA-based prototyping systems in their HAV suites that bypass the shortcomings of the older methods.

The HW/SW, “chicken and egg” dilemma

On SoC projects, software development and testing can’t wait until silicon is available; on the other hand, embedded software development would need silicon to run on. As a result, design teams have come up with many techniques to make parallel development work. However, born out of necessity, one in particular has emerged over the years as the preferred methodology.

In this methodology, design teams attempt to separate the software stack into hardware-independent and hardware-dependent portions, separated by an operating-system layer and communicating through well-characterized APIs.

Typically, the larger hardware-independent code can be developed in a server environment with standard debugging techniques, using stubs to stand in for the APIs. Then the designers develop the hardware-dependent portion of the code, while the RTL design takes shape, using a hardware emulation system or perhaps even logic simulation as an execution environment.

But this methodology has its flaws. The first, and most obvious, is that it’s not always easy, or even possible, to determine which portions of the code are really hardware independent.

Dependencies accidentally created deep into the application code could go unnoticed, especially when intensive I/O and high computing loads must meet hard timing deadlines. And software developers often have to make some assumptions about execution speeds, cache sizes, and memory latencies—assumptions that may later prove false.

The second flaw of this older methodology is simply the combination of speed and capacity. In the older methodology, the integration and testing of the software with the RTL model of the chip is generally going to execute too slowly, even on an emulation system, to allow extensive exploration of the entire software stack. This leaves two options.

The first is waiting until first silicon is back and hope and pray all the bugs were caught; but hope is not a strategy and a software workaround or shut down part of the chip may not be feasible or acceptable. The second option is to move to a modern, success-oriented methodology that deals with shortcomings of the traditional hardware/software co-verification methodology.

This methodology is centered around hardware-assisted verification (HAV) solutions in general and FPGA-based prototyping in particular. Modern HAV technologies offer a much better methodology and higher likelihood of success that requires less stress and praying to a deity.

Addressing HW/SW co-verification bottlenecks

The end goal when deploying an HAV methodology is to ensure that not only is the SoC hardware functionally correct but that the software running on the SoC is optimized so the entire product meets spec and is optimized for best functionality, performance, and power. Ideally, the full software stack and the complete RTL design should be tested together as soon as both are sufficiently complete and stable to allow meaningful execution runs.

This gives the development team the opportunity to identify bugs and hardware/software interactions early, and before committing to silicon. And good version control ensures that the software team is working with the current RTL model and that the hardware team knows at once if they have just broken the software.

Speed of the HAV technology is the key. To test the full software stack on the SoC model realistically requires the use of an HAV technology, the FPGA-based prototype system. The model of the SoC under development is programmed onto the FPGAs of the prototyping system, allowing software developers to create software and run the software stack to ensure it works with the system.

An FPGA-based prototyping system will be able to run the full software stack on a realistic model of the SoC logic and memory, fast enough for intensive software and system validation. But what about the model’s interaction with the outside world? Verification requires seeing how the design behaves in continuous operation with real-world data.

In the past, many designs have attempted to circumvent the challenge of verifying their designs in continuous operations by trying to identify patterns of input data that will be most challenging to the system. They would synthesize those patterns as scripts and feed them into the prototyping system to observe its response. Unfortunately, this is ultimately a low-probability approach.

As years of development have illustrated, sometimes a bit too graphically, it’s just not possible to anticipate, for example, what streams of video from HD cameras are going to cause an AI system to miscategorize a traffic situation. And, as any communications engineer can attest, it’s equally impossible to predict the patterns of data that will appear on a real-world Gigabit Ethernet link or PCIe bus. As both ADAS and networking engineers have learned, a-priori analysis is no substitute for massive amounts of real-world data.

Ideally, verification engineers could connect the high-speed FPGA-based prototype directly to the cameras, sensors, actuators, and displays of the real system, and subject the system design to real-world data, in all its randomness, unpredictability, and at its natural speed. That could mean running the FPGA-based prototype system in a moving car, on a live network switch, or in a storage controller in a data center.

However, this raises another question: how to get at-speed or near-speed signals from the real world into the FPGA-based prototype. Design teams have tried several approaches, but once again, one solution is emerging.

Intuitively, it might seem reasonable to just implement the critical interfaces in the FPGA-based prototype. After all, the finished SoC will include those interfaces, so they are a real part of the design. And external networks, buses, and control signals could be connected directly into the prototyping system.

But there are serious issues with this approach. The first is that it will divert important design and verification resources away from the main design project. Yes, these interfaces will be present in the finished SoC, but they will almost certainly be implemented as third-party IP. Assuming that the third-party vendors have already been selected, they may or may not provide FPGA models of their IP for a particular FPGA family.

The models may or may not be accurate reproductions of the ASIC interface blocks’ functionality and will certainly differ in timing. Implementing these interface blocks in the FPGA and verifying them potentially becomes a significant FPGA design project in its own right, drawing on critical interface and FPGA skills that are needed elsewhere in the design.

An alternative is to design external interface adapter cards to connect the real-world signals into the prototype system. Such an adapter can run at full real-world speed on the real-world side, and at the speed required by the FPGA-based prototype on the prototype side. But again, there are significant challenges.

To begin with, no high-speed interface adapter is a trivial design, including power considerations, clocking, board design, connector or cable signal integrity, and so on. Then there is the matter of getting the signals back and forth between the adapter card and the prototype system.

Running cables to the system backplane will introduce timing and signal-integrity questions and will require precise understanding of the FPGA-based prototyping system’s internal design. Designing daughter cards to attach directly to expansion connectors or to the FPGA cards themselves within the prototyping system will require an even more detailed understanding of the system’s electrical, mechanical, and thermal requirements.

A modern solution

Take the case of a family of off-the-shelf extension boards for the Veloce proFPGA CS system. It includes I/O adapters for a range of interfaces, including Gigabit and slower Ethernet, PCIe GEN4, USB, DDR4, various Flash memory interfaces, and a range of connector configurations for bringing the FPGA I/O signals out of the box. Such an I/O board, for example, combines Ethernet on an RJ45 connector, a USB connector with UART, a MIPI 60 connector, and a GPIO header, along with user-definable LEDs.

Figure 1 The Veloce proFPGA CS platform is an entry-level solution in which the UNO desktop system delivers FPGA-based prototyping. Source: Siemens EDA

The extender cards plug directly onto connectors on the Veloce proFPGA CS FPGA boards, minimizing latency and signal-integrity issues. This also saves the user from having to provide external clock and power sources for the boards. Supporting software seamlessly integrates the extension boards into the Veloce proFPGA CS development environment.

Figure 2 The Veloce proFPGA CS boards can be adapted and expanded with the latest FPGA generations and extensions cards equipped with interconnections, interfaces or memories. Source: Siemens EDA

The result is that users can quickly connect an SoC prototype on the Veloce proFPGA CS into the actual environment in which the finished SoC will operate, with the interfaces operating at or near full speed. Software developers can instrument and observe the full software stack executing in the real world, not within the confines of synthetic tests. Hardware engineers can observe hardware/software interactions with live, real-world data at high speeds.

Juergen Jaeger is director of prototyping product strategy at Siemens EDA.

Related Content

• The Growing Use of Hardware-Assisted Verification
• The Case for Hardware-Assisted Verification in Complex SoCs
• Can Hardware-Assisted Verification Save SoC Realization Time?
• Hardware-Assisted Verification: The Real Story Behind Capacity
• Hardware-Assisted Verification: Ideal Foundation for RISC-V Adoption

The post Enhancing SoC HW/SW co-verification with FPGA-based prototyping appeared first on EDN.

Fakery methods, and their impacts on those who are particularly easily fooled, have advanced dramatically in recent times.

My wife and I recently saw the movie Disclosure Day, in which an extra-terrestrial being comes to earth and after much ruckus and travail, is introduced to the world’s population with the advice to “listen”. Frankly, I didn’t much care for the movie, but a lot of people seemed to have enjoyed themselves watching it.

However, a disquieting moment came about just as we were leaving the theater. I heard one woman say to the other that this movie was “proof” that the depiction of an extra-terrestrial alien was real and further “proof” that “the government” is secretly concealing truth from the general public. The fact that the scroll of credits at the end of the movie listed the puppetry experts had made no impression on this lady whatsoever.

If this lady were a close relative of mine, I would be very concerned that she would be a prime target for all kinds of fraudsters seeking to rip her off using pretty much any of the widely publicized scams we see written up in the news lately. What she could seemingly be led to believe was alarming.

Fakery methods have been very much advanced in recent times. Look at this screen shot taken from a Neil deGrasse Tyson video, in which he appears to be in conversation with an alien from “Andromeda”.

I think in looking at this image that Mr. Tyson’s forehead is shown slightly higher than reality, but that isn’t all that obvious.

As to the alien, nothing more need be said.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post Deepfakes appeared first on EDN.

Cree LED Inc of Durham, NC, USA (a Penguin Solutions brand) and US-based Promier Products Inc (trading as LitezAll) have reached a mutually beneficial settlement resolving a patent infringement dispute involving Cree LED’s patents related to LED components used in portable lighting products. As part of the settlement, Cree LED has granted Promier Products a limited license to certain Cree LED patents covering LED components...

Build a compact digital clock using an Arduino Nano ESP32 and a MAX7219-driven 8x32 LED matrix, with WiFi time synchronization, BLE setup, and automatic brightness control.