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Semiconductor today
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TRUMPF and Optomind demo 100Gbps VCSEL in 800Gbps transceiver at OFC
At the Optical Fiber Communication Conference & Exposition (OFC 2024) in San Diego, CA, USA (24–28 March), TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) – which makes vertical-cavity surface-emitting lasers (VCSELs) and photodiodes for the consumer electronics, datacoms, industrial sensing & heat treatment and automotive markets – is demonstrating 100Gbps VCSEL performance together with customer Optomind Inc of Suwon, South Korea, which provides optical interconnect solutions for data centers including artificial intelligence (AI) and high-performance computing (HPC) networks. With increasing demand for multi-channel high-speed data transmission in artificial intelligence/machine learning (AI/ML)-based hyperscale cloud computing space, 800Gbps data rate at 100Gbps per lane and beyond is essential...
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Ayar Labs showcasing optical interconnect solutions for AI infrastructure at OFC
Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of Santa Jose, CA, USA is presenting its latest technology advances and ecosystem partnerships in booth #1511 at the Optical Fiber Communication Conference & Exposition (OFC 2024) in San Diego, CA, USA (24–28 March)...
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Coherent debuts 800Gbps QSFP-DD form-factor transceiver module for IP-over-DWDM
At the Optical Fiber Communication Conference & Exposition (OFC 2024) in San Diego, CA, USA (26–28 March), materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA is demonstrating its 800Gbps coherent transceiver module in QSFP-DD form factor, operated in 800G ZR mode transmitting over 9000ps/nm of dispersion (equivalent to about 450km of fiber)...
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US Critical Materials announces discovery of gallium at Sheep Creek, Montana
Private rare-earths exploration, development and process technology company US Critical Materials Corp of Salt Lake City, Utah, has confirmed what it calls a “strategically significant” deposit of high-grade gallium on its 6700 acres of claims in Sheep Creek, Montana...
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5N Plus commercializing its GaN-on-Si patents
Specialty semiconductor and performance materials producer 5N Plus Inc (5N+) of Montreal, Québec, Canada is officially launching the commercialization rights for its portfolio of gallium nitride on silicon (GaN-on-Si) patents which, it says, can enable the rapid prototype development and first-to-market commercialization of novel vertical GaN-on-Si power devices by companies operating in the high-power electronics (HPE), electric vehicles (EV) and artificial intelligence (AI) server sectors...
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EFFECT Photonics raises $38m in Series D funding
EFFECT Photonics b.v. – a spin off from the Technical University of Eindhoven (TU/e) in The Netherlands – has secured $38m in a Series D funding round, led by Innovation Industries Strategic Partners Fund, backed by Dutch pension funds PMT and PME, along with co-investor Invest-NL Deep Tech Fund and participation from other existing investors...
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Silicon carbide power device market to grow to $5.33bn in 2026
Benefitting from robust demand from downstream applications, market research firm TrendForce forecasts that the silicon carbide (SiC) power device market will grow to $5.33bn by 2026, with mainstream applications still highly reliant on electric vehicles and renewable energy sources...
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Veeco releases fifth sustainability report
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has released its fifth Sustainability Report highlighting its progress towards environmental, social and governance (ESG) initiatives. Reflecting 2023 data, this Sustainability Report demonstrates continued progress and commitment to executing a robust sustainability strategy, says the firm...
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Riber wins US order for Compact 21 research MBE system
Riber S.A. of Bezons, France — which makes molecular beam epitaxy (MBE) systems as well as evaporation sources — has received an order from a US customer for a Compact 21 research MBE system, for delivery in 2024, to be used for the development of III-V semiconductor materials and devices for microelectronics and photonics...
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MACOM awarded by Northrop Grumman for Supplier Excellence
MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) has received two awards at US-based aerospace & defense technology company Northrop Grumman Corp’s Supplier Excellence Awards...
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Vertical GaN power device firm Odyssey selling assets for $9.52m
Odyssey Semiconductor Technologies Inc of Ithaca, NY, USA — which develops high-voltage vertical power switching components based on proprietary gallium nitride (GaN) processing technology — has entered into a definitive agreement to sell its assets for $9.52m in cash to “a large semiconductor company”...
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Mersen gains €12m in European funding to develop polycrystalline SiC substrate manufacturing
Mersen of Courbevoie, France (which focuses on electrical power and advanced materials for high-tech industries) is to benefit from subsidies totaling over €12m under the European Commission’s Important Project of Common European Interest program in MicroElectronics and Communication Technologies (IPCEI ME/CT)...
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EPC makes available 3-phase BLDC motor drive inverter reference design with 14–65V input range
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has announced the availability of the EPC9193, a 3-phase brushless DC (BLDC) motor drive inverter using the EPC2619 eGaN FET. The EPC9193 operates with a wide input DC voltage ranging from 14V and 65V and has two configurations — a standard unit and a high-current version...
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Coherent awards Tower as Outstanding Innovation and Technology Supplier
Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has recognized specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel as an Outstanding Innovation and Technology Supplier for its silicon photonics based optical transceiver products. The award recognizes Tower’s “unwavering long-term commitment to providing the most advanced technology solutions, enabling the development of Coherent’s market-leading multiple-data-rate nodes for high-speed optical transceivers based on Tower’s PH18 silicon photonics process technology”...
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GaAs Labs sells Mission Microwave
California-based technology investment company GaAs Labs LLC has sold its portfolio company Mission Microwave Technologies LLC of Cypress, CA, USA — a provider of gallium nitride (GaN)-based solid-state power amplifiers (SSPAs) and block upconverters (BUCs) to the satellite communications market — to an investment affiliate of US-based J.F. Lehman Company (JFLCO)...
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UK becomes participating state in EU’s Chips Joint Undertaking, accessing €1.3bn Horizon Europe collaborative research funding
The UK has joined the European Union’s ‘Chips Joint Undertaking’ as a participating state, giving British semiconductor researchers and businesses enhanced access to a €1.3bn fund set aside from Horizon Europe (the European Union’s scientific research initiative) to support research in semiconductor technologies over 2021-2027...
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Sivers signs product development agreement for next-gen AI laser arrays
Sivers Semiconductors AB of Kista, Sweden (which supplies ICs and modules for communications and sensor solutions) says that its subsidiary Sivers Photonics of Glasgow, Scotland, UK has signed a product development agreement with an undisclosed company, helping to develop photonic laser arrays enabling next-generation artificial intelligence (AI)...
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Infinera launches 1.6Tb/s optics to reduce power per bit by up to 75% for AI-driven intra-data-center connectivity
Infinera Corp of San Jose, CA, USA — a vertically integrated manufacturer of digital optical network systems — has announced ICE-D, a new line of high-speed intra-data-center optics based on monolithic indium phosphide (InP) photonic integrated circuit (PIC) technology. ICE-D optics are designed to dramatically lower cost and power per bit while providing intra-data-center connectivity at speeds of 1.6 terabits per second (Tb/s) and greater. The technology enables data-center operators to cost-effectively keep pace with relentless growth in bandwidth, says Infinera...
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University of Jena and TU Braunschweig collaborating on GaN-based photonic devices
Although micro-LEDs exist as single chips and waveguides as fiber-optic cables, the materials required to make them are too heterogenous to integrate these electronics and photonics components onto a single chip. However, a novel etching technique could enable the combining of optoelectronic light sources and photonic fiber optics...
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MACOM showcasing latest products at SATELLITE 2024
MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) is showcasing its latest products for space and hi-reliability applications in booth #1427 at the SATELLITE 2024 event in the Walter E. Washington Convention Center, Washington DC, USA (19–21 March)...
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