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News for the compound semiconductor and advanced silicon industryDOE announces 2017 solid-state lighting R&D funding opportunity
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CGD’s senior VP of global sales to lead expansion into additional markets
Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — says that Henryk Dabrowski, appointed as senior VP of global sales last year, will lead its global sales strategy by expanding into additional markets exploiting the advantages offered by ICeGaN. As part of that expansion, CGD is growing its sales organization and will be hiring regional sales managers for both EMEA and North America who will report to Dabrowski...
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Former Wolfspeed CEO Gregg Lowe joins Power Integrations’ board
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) says that Gregg Lowe is joining its board of directors on 15 February...
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Power Integrations’ CEO Balu Balakrishnan to retire
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) says that Balu Balakrishnan, CEO since 2002, is retiring from that role once a successor is in place. The board of directors has retained an executive search firm to assist in identifying its next CEO. Balakrishnan, 70, intends to serve as executive chairman of the board for as long as is needed to ensure a smooth transition to his successor, and is expected to remain on the board of directors thereafter...
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CEA-Leti presents advances in integrated optics on silicon
At Photonics West 2025 in San Francisco (25–30 January), micro/nanotechnology R&D center CEA-Leti of Grenoble, France presented three papers detailing its latest improvements to chemical detection, high-speed communication and LiDAR performance with integrated optics on silicon...
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AlixLabs showcasing latest APS findings at SPIE Advanced Lithography + Patterning
Sweden-based AlixLabs AB (which was spun off from Lund University in 2019) has used its Atomic Layer Etching (ALE) Pitch Splitting technology (APS) technology to etch structures corresponding to commercial 3nm semiconductor processes on test silicon provided by Intel. The results will be shared in full by chief technology officer & co-founder Dmitry Suyatin at the SPIE Advanced Lithography + Patterning trade show in San Jose, CA, USA (23–27 February)...
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Taiyo Nippon Sanso selling BRUTE Peroxide in Japan
After supplying Peroxidizer highly concentrated hydrogen peroxide gas delivery systems since 2013, industrial gas company Taiyo Nippon Sanso Corp (TNSC) of Tokyo, Japan (part of Nippon Sanso Holdings Group) has added to the BRUTE suite of chemicals by beginning to sell BRUTE Peroxide in Japan...
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Nimy collaborating with M2i to secure gallium supply for US government and defense industry
Mining firm Nimy Resources Ltd of Perth, Western Australia has executed a non-binding collaboration agreement with Nevada-based M2i Global Inc (Minerals Metals Initiatives) to assure a supply of gallium in support of the US Department of Defense (DOD)...
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Silicon carbide patent activity grows strongly in Q4/2024, reports KnowMade
Technology intelligence and IP strategy consulting company KnowMade says that, for fourth-quarter 2024, its quarterly SiC Patent Monitor shows robust growth, with over 900 new patent families and 400 newly granted patents. This period saw over 100 patents expire or be abandoned and involved seven notable patent transfers...
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Philip Brace to succeed Liam K. Griffin as president & CEO of Skyworks
Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) has appointed Philip Brace as president & CEO and a member of the board of directors, effective 17 February...
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Navitas’ GaN and SiC devices adopted in Dell’s family of 60–360W AI notebook adapters
Navitas Semiconductor Corp of Torrance, CA, USA says that both its GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductor technologies have been adopted into Dell’s family of notebook adapters, from 60W to 360W...
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MACOM European Semiconductor Center wins multi-year contract for France 2030-funded MAGENTA program
MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) says that its France-based European Semiconductor Center (MESC) has been awarded a multi-year contract from French Government agency Banque Publique d’Investissement (BPI) to lead the development and manufacturing of advanced semiconductor products, in collaboration with public and private sector partners...
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Teledyne HiRel releases wideband 50GHz RF switch for K bands and beyond
Teledyne HiRel Semiconductors of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has announced the availability of its latest rad-tolerant wideband 50GHz RF switch...
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SBTi validates onsemi near-term science-based targets for emissions reduction
Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA says that the Science Based Targets initiative (SBTi) has approved its near-term science-based emissions reduction targets. Validation of these targets attests that the planned decrease of onsemi’s greenhouse gas (GHG) emissions is aligned to the ambition of limiting global temperature rise to 1.5°C...
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APC chooses Luminus as worldwide sales channel and go-to-market partner
APC Electronics (APC-E) of Bend, OR, USA — which researches, develops and manufactures wide-bandgap power semiconductor products — has announced Luminus Devices Inc of Sunnyvale, CA, USA — which designs and makes LEDs and solid-state technology (SST) light sources for illumination markets — as its exclusive worldwide sales channel and go-to-market partner...
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AlixLabs collaborates with Linköping University
AlixLabs AB of Lund, Sweden — which was spun off from Lund University in 2019 and has developed the Atomic Layer Etching (ALE) Pitch Splitting technology (APS) — has entered into a research collaboration with Linköping University on gallium nitride (GaN) and indium nitride (InN) deposition and etch, strengthening not only their own respective expertise in RF and power electronics but also aligning with the Swedish semiconductor sector...
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Cree LED launches XLamp XP-L Photo Red S Line LEDs
Cree LED Inc of Durham, NC, USA (a Penguin Solutions brand) has launched XLamp XP-L Photo Red S Line LEDs for horticulture lighting. Designed for next-generation luminaires, the new LEDs deliver what is claimed to be outstanding efficiency and durability...
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Lumentum appoints Michael Hurlston as president & CEO as Alan Lowe retires
Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for cloud/AI, networking and industrial and consumer laser applications) has appointed Michael Hurlston as president & CEO and director, effective 7 February. He succeeds Alan Lowe, who has served as president & CEO since 2015 and will continue to serve on the board of directors and as an advisor...
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Vishay launches 650V and 1200V silicon carbide Schottky diodes in SOT-227 package
Discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc of Malvern, PA, USA has introduced 16 new 650V and 1200V silicon carbide (SiC) Schottky diodes in the industry-standard SOT-227 package...
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Riber’s full-year revenue grows 5% to €41.2m in 2024
For fourth-quarter 2024, molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has reported revenue of €22.7m, remaining strong as it was down just 2% on a high basis of comparison off €23.1m a year ago...
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Mitsubishi Electric joins Horizon Europe’s FLAGCHIP project
Tokyo-based Mitsubishi Electric Corp is to begin developing a prototype to demonstrate a junction-temperature estimation technology for power modules, which it is pursuing as a partner in the European Union’s Horizon Europe project aimed at developing advanced power modules and improving the cost efficiency of renewable energy power generation. The firm is participating through its European subsidiary Mitsubishi Electric R&D Centre Europe B.V., which has joined the project ‘Flagship Advanced Solutions for Condition and Health Monitoring in Power Electronics’ (FLAGCHIP)...
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