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News for the compound semiconductor and advanced silicon industryDOE announces 2017 solid-state lighting R&D funding opportunity
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From road to rack: 800V EV innovations redefining AI data-center power architecture
For the past decade the electric vehicle industry has become the dominant application area for power electronics. For most power electronics players, the automotive industry has been their main source of revenue for years, and power electronics innovations have focused mainly on improving efficiency and performance across the e-powertrain...
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Ayar Labs joins NVIDIA NVLink Fusion ecosystem to bring CPO to rack-scale AI infrastructure
Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — has joined the NVIDIA NVLink Fusion ecosystem, and is making its products optically and electrically compatible with NVIDIA optical and SerDes technologies. This allows hyperscalers and system innovators to build optically connected AI infrastructure around NVIDIA’s NVLink Fusion platform and partner ecosystem...
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University of Texas at Dallas and Attolight launch new demo lab for wide-bandgap R&D
The University of Texas at Dallas (UTD) and quantitative cathodoluminescence (CL) solutions provider Attolight SA of Ecublens, Switzerland have announced the opening of a new demonstration laboratory at the university. The equipment is designed to support the rapidly growing wide-bandgap (WBG) semiconductor industry by offering advanced material characterization services and collaborative research opportunities...
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Cree LED launches XLamp XE-B LEDs for directional lighting
Cree LED Inc of Durham, NC, USA (a Penguin Solutions brand) has launched its new XLamp XE-B LEDs, extending the XLamp Element family into an even smaller form factor to enable new levels of design flexibility and performance. The XE-B LEDs feature an ultra-compact 0.9mm x 1.4mm package engineered to deliver high intensity in optical systems, whether used individually or in arrays...
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Sivers and GlobalFoundries to develop silicon photonics for AI infrastructure
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs and lasers for AI data-center, SATCOM, defense and telecom applications) has announced a strategic collaboration with GlobalFoundries of Malta, NY (GF, the only US-based pure-play foundry with a global manufacturing footprint, including facilities in the USA, Europe and Singapore) to develop silicon photonics solutions for the high-growth AI infrastructure market...
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Wise Integration unveiling digital control roadmap for next-gen power conversion at PCIM
In booth 243 (Hall 6) at the PCIM 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 May), fabless company Wise Integration of Hyeres, France is showcasing its latest WiseWare-powered AC–DC demo boards, highlighting its roadmap toward distributed digital control with the new generation of WiseGan Digital First power ICs...
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EPC supporting NVIDIA MGX-based AI infrastructure with 800V-to-12.5V power conversion
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has provided additional details on its EPC91123 evaluation board, an 800VDC-to-12.5VDC, 6kW isolated converter designed to support next-generation AI data-center power architectures. As a contributor to the NVIDIA MGX AI Factory ecosystem, EPC contributes advanced GaN-based power conversion solutions designed to support emerging 800VDC server architectures, enabling higher power density, improved efficiency, and scalable rack-level power delivery for next-generation AI infrastructure...
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EPC supporting NVIDIA MGX-based AI infrastructure with 800V-to-12.5V power conversion
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has provided additional details on its EPC91123 evaluation board, an 800VDC-to-12.5VDC, 6kW isolated converter designed to support next-generation AI data-center power architectures. As a contributor to the NVIDIA MGX AI Factory ecosystem, EPC contributes advanced GaN-based power conversion solutions designed to support emerging 800VDC server architectures, enabling higher power density, improved efficiency, and scalable rack-level power delivery for next-generation AI infrastructure...
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Aixtron’s CCS R&D system to be centerpiece of Penn State’s new semiconductor lab
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that its Close Coupled Showerhead (CCS) R&D system will serve as the centerpiece of a new semiconductor research facility at Penn State’s Materials Research Institute (MRI)...
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Aixtron’s CCS R&D system to be centerpiece of Penn State’s new semiconductor lab
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that its Close Coupled Showerhead (CCS) R&D system will serve as the centerpiece of a new semiconductor research facility at Penn State’s Materials Research Institute (MRI)...
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Power Integrations unveils space-saving, ultra-slim auxiliary PSU reference designs for NVIDIA Kyber 800VDC AI data center
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) has introduced two new ultra-slim, compact auxiliary power supply reference designs for 800VDC AI data centers. The single-output, 15W design is only 30mm by 30mm with a 7mm profile, while the isolated, six-rail, 35W design is only 80mm by 60mm with an 8mm profile...
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Wolfspeed launches data-center solutions team in Silicon Valley
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — is expanding into the rapidly growing data-center market with the creation of a dedicated data-center solutions team and regional office in the San Francisco Bay Area. The new data-center solutions team is targeted at enabling closer alignment with leading hyperscalers, ODMs and the entire ecosystem to build differentiated products and solutions for AI and other data-center applications...
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QPT opens customer demos of MicroDyno test platform
Independent power electronics company Quantum Power Transformation (QPT) Ltd of Cambridge, UK — which was founded in 2019 and develops gallium nitride (GaN)-based electric motor controls — has opened customer demonstrations of its MicroDyno test platform, now updated with full field oriented control (FOC) and real-time dynamic cogging correction. The platform is available for in-person demos at QPT’s new R&D facility in Edinburgh, with remote-access demos available for international customers unable to travel...
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BluGlass executes $1m option shortfall agreement, plus potential extra $500,000
BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) visible laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has secured a firm commitment of $1m, with the potential to be raised to $1.5m in total, following the execution of a shortall agreement in relation to options with an exercise price of $0.26 which expired on 31 May...
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Latest issue of Semiconductor Today now available
For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month...
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Infineon joins NVIDIA’s MGX AI Factory ecosystem
Infineon Technologies AG of Munich, Germany, which provides power systems and IoT, has joined NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power management solutions will support NVIDIA’s MGX architecture and 800VDC power architecture, an open, modular reference architecture designed for AI factories in the agentic AI era. 800VDC MGX-compatible power racks help existing AI infrastructure to scale AI compute performance and power density, creating an upgrade path for future AI infrastructure...
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Infineon introduces first silicon carbide power module operating at 205°C
Infineon Technologies AG of Munich, Germany is introducing a new 1300V silicon carbide (SiC) module within the HybridPACK Drive family that is capable of continuous operation at temperatures up to 205°C. Existing designs typically allow up to 175°C. This increase enables automotive OEMs and tier-1 suppliers to deliver higher peak and continuous output power from existing inverter designs or, in new designs, reduce system complexity and overall cost...
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IQE’s full-year 2025 revenue falls 17.6%, as 40% drop in wireless outweighs 15% growth in photonics
For full-year 2025, epiwafer and substrate maker IQE plc of Cardiff, Wales, UK has reported revenue of £97.3m, down 17.6% on 2024’s £118m...
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Purdue and Taiwan’s GCCS partner to scale silicon carbide substrates to 8- and 12-inches
Purdue University has formed a strategic partnership with Taiwan-based GeChi Compound Semiconductor Co (GCCS) to accelerate the commercialization of silicon carbide (SiC). The collaboration targets the critical thermal, power and 6G bottlenecks currently constraining the next generation of high-compute infrastructure...
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RFMW to distribution RFHIC’s GaN RF and microwave solutions worldwide
RF, microwave and power component distributor RFMW of San Jose, CA, USA (a Division of Exponential Technology Group Inc) has announced a global distribution agreement with South Korea-based RFHIC Corp...
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