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CSA Catapult translates research into double pulse testing

Птн, 06/05/2026 - 16:07
Next-generation AI and data-center power electronics are placing new demands on switching performance, efficiency and reliability. Meeting those demands requires high-fidelity switching data that reflects real device and module behaviour under realistic operating conditions...

Kyocera to acquire Ushio’s laser diode business

Птн, 06/05/2026 - 10:50
Kyocera Corp of Kyoto, Japan (which manufactures fine ceramic components) has entered into a share purchase agreement for the laser diode business of Tokyo-based Ushio Inc...

Atomera’s MST-enabled GaN-on-Si devices reduce parasitic interface charge by order of magnitude

Птн, 06/05/2026 - 10:37
Semiconductor materials and technology licensing company Atomera Inc of Los Gatos, CA, USA has announced a new approach to GaN-on-silicon that addresses a key performance barrier limiting its use in mainstream RF applications...

Covalent expands wafer-level characterization through Oxford Instruments collaboration

Птн, 06/05/2026 - 10:29
Covalent Corp of Sunnyvale, CA, USA has announced a strategic collaboration with UK-based Oxford Instruments that expands its semiconductor characterization offering with customer-ready, wafer-level Raman and photoluminescence (PL) workflows. The capability is now available to customers tackling defectivity, stress and strain mapping, process development, and failure analysis at full-wafer scale...

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