Semiconductor today

In first-quarter 2026, patent activity in silicon carbide (SiC) technology remained particularly dynamic, both upstream in substrates and epitaxial wafers and downstream in power devices and modules, according to technology intelligence and IP strategy consulting company KnowMade in two new patent monitoring services dedicated to SiC technology:...

Infineon Technologies AG of Munich, Germany has introduced the EiceDRIVER 2EDL90xG3, a 120V common footprint gate driver designed to enable silicon (Si) and gallium nitride (GaN) power designs on the same PCB...

At the 30th International Semiconductor Laser Conference (ISLC 2026) in Tampere, Finland (14-17 June), photonic simulation CAD software developer Photon Design Ltd of Oxford, UK showcased its industry-first, simulation tools for quantum dot lasers and photonic crystal surface-emitting lasers (PCSELs)...

Based on preliminary, unaudited accounting data as of end-May, NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company focused on non-kinetic effects and directed-energy technologies, electronic warfare and defense mobility programs, software-orchestrated defense systems and advanced manufacturing) expects its stockholders' equity to materially exceed the $4m requirement applicable under the NYSE American continued-listing rules for companies with a history of losses...

Graphene-based electronic device design, development and manufacturing company Paragraf of Somersham, Cambridgeshire, UK is forming a new Advisory Committee that will include Oreste Donzella, Jean-Michel Richard and Thomas Piliszczuk. Donzella and Richard will also join Paragraf’s board as non-executive directors...

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has announced the results of its preliminary atomic oxygen (AO) exposure testing for its space-grade thin-film PV products. Testing has shown significant resilience to atomic oxygen in low Earth orbit (LEO)...

Infineon Technologies AG of Munich, Germany has introduced a 24kW battery backup unit (BBU) DC–DC reference design for high-voltage (HV) DC bus architectures in artificial intelligence (AI) data centers. The design is said to be the first of its kind to operate directly from a battery stack to an 800V DC bus, using 650V and 1200V silicon carbide (SiC) technology. It achieves a power density of 450W/in3 and efficiency exceeding 99% within the same physical form factor as existing low-voltage (LV) BBU implementations, addressing a key infrastructure bottleneck as data centers transition to higher-voltage DC distribution...

With artificial intelligence workloads redefining the power requirements of modern data centers (and rapidly increasing GPU power levels and denser rack configurations pushing server power infrastructure to its limits), Infineon Technologies AG of Munich, Germany has hence introduced two system-level solutions targeting server ODMs and OEMs: an 18kW three-phase power supply unit (PSU) reference design optimized for 50V rack architecture, and a 30kW three-phase interleaved T-Type power factor correction (PFC) evaluation board designed for 800VDC or ±400VDC rack architectures with power sidecar. Both are part of Infineon’s broad AI server power delivery portfolio, helping customers to accelerate time-to-market while achieving higher rack power, improved efficiency, and better thermal performance...

In response to growing demand from AI data centers and the shift towards solid-state power protection, Infineon Technologies AG of Munich, Germany is expanding its CoolSiC JFET portfolio with new devices, package options and configurations, aiming to support high-performance power distribution and protection systems...

The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At the recent PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), Munich-based Infineon Technologies AG hence introduced EasyPACK S, a compact power module and packaging concept specifically designed to meet these requirements. With a package height of only 5.6mm and a footprint of about 33mm x 36mm, EasyPACK S is said to enable significant system miniaturization while ensuring reliable thermal performance and reduced electromagnetic interference. The first modules available in the new package integrate Infineon’s CoolSiC MOSFETs 1200V G2 as well as IGBT4 and IGBT7 1200V technology...

Infineon Technologies AG of Munich, Germany has begun sampling silicon carbide (SiC) bidirectional switches (BDS) built on rugged 750V CoolSiC G2 technology. A vertically integrated dual-die with common drain design in a top-side-cooled Q-DPAK package integrates two power switches into one to simplify design and enable the evolution of legacy topologies. The 750V CoolSiC BDS is said to deliver the reliability margin that modern grids and energy systems demand, resulting in the lowest total cost of ownership during the application lifetime...

With power conversion architectures in automotive and industrial applications evolving rapidly (placing new demands on switching topologies, thermal management, and system integration), Infineon Technologies AG of Munich, Germany has made available samples of the H-DPAK, a new addition to its top-side-cooling package family, housing integrated half-bridge (HB) devices in 750V CoolSiC G2 technology...

Wireless technology company Baylin Technologies Inc of North York, Ontario, Canada (which provides passive and active RF and satellite communications products and services) says that its Advantech Wireless subsidiary has recently received purchase orders totalling over CDN$9m for its Genesis C-band and Ku-band solid-state power amplifiers (SSPAs) ranging from 200W to 500W...

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company focused on non-kinetic effects and directed-energy technologies, electronic warfare and defense mobility programs, software-orchestrated defense systems and advanced manufacturing) has provided an update on the commercial pipeline of its photonics and laser activities, centered on Lyocon S.r.l. and supported by the firm’s strategic collaboration with SunCubes S.r.l., i.e. the LaserTech Business Line. Management believes that the commercial activity reflected in the current tracker demonstrates growing market adoption of NUBURU’s blue-laser technologies and supports continued execution of the firm’s Defense & Security platform strategy...

Eggtronic of Modena, Italy (which provides mixed-signal IC controllers for power electronics) has released a jointly developed 500W solar microinverter reference platform with Renesas Electronics Corp of Tokyo, Japan...

The research institute TNO (the Netherlands Organization for Applied Scientific Research in Delft) and equipment provider Advanced Semiconductor Materials Lithography (ASML) of Veldhoven, The Netherlands have announced a new partnership that aims to strengthen the European semiconductor ecosystem through the development and industrialization of photonic chips. The collaboration focuses on the utilization of TNO’s new Photonic Chip Pilot Line currently under construction at the High Tech Campus in Eindhoven...

Infineon Technologies AG of Munich, Germany says that its CoolGaN Transistor 100V devices have been selected by BRC Solar GmbH of Ettlingen, Germany (which provides module-level power electronics for photovoltaic systems) as the core switching technology for its Power Optimizer...

ClassOne Technology of Kalispell, MT, USA (which manufactures electroplating and wet-chemical process systems for ≤200mm wafers) has announced record follow-on orders from Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) for multiple Solstice S8 single-wafer wet processing systems to support AOI’s expanding production of optical devices in Houston...

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that the Massachusetts Institute of Technology (MIT) Lincoln Laboratory has purchased two Hyperion 300mm metal-organic chemical vapor deposition (MOCVD) systems as part of a partnership made possible by the Massachusetts Governor’s Office and the Northeast Microelectronics Coalition (NEMC). The systems will support research on gallium nitride (GaN) power electronics, radio-frequency applications, and next-generation two-dimensional materials, and will be available to users across the NEMC ecosystem and beyond...

AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials at plants in China — says that Tracy Liu has been appointed to its board of directors, which has hence expanded from four to five directors...