Збирач потоків

🚨 Знайомтеся: ваш уповноважений з антикорупції kpi ср, 10/30/2024 - 14:48

Epiwafer and substrate maker IQE plc of Cardiff, Wales, UK says that chief executive officer Americo Lemos has left the company with immediate effect...

Devices Combine High Peak Output Currents to 4 A With High Operating
Temperatures to +125 °C and Low Propagation Delay of 200 ns

Vishay Intertechnology, Inc. has introduced two new IGBT and MOSFET drivers in the compact, high isolation stretched SO-6 package. Delivering high peak output currents of 3 A and 4 A, respectively, the Vishay Semiconductors VOFD341A and VOFD343A offer high operating temperatures to +125 °C and low propagation delay of 200 ns maximum.

Consisting of an AlGaAs LED optically coupled to an integrated circuit with a power output stage, the optocouplers released today are intended for solar inverters and microinverters; AC and brushless DC industrial motor control inverters; and inverter stages for AC/DC conversion in UPS. The devices are ideally suited for directly driving IGBTs with ratings up to 1200 V / 100 A.

The high operating temperature of the VOFD341A and VOFD343A provides a higher temperature safety margin for more compact designs, while their high peak output current allows for faster switching by eliminating the need for an additional driver stage. The devices’ low propagation delay minimizes switching losses while facilitating more precise PWM regulation.

The optocouplers’ high isolation package enables high working voltages up to 1.140 V, which allows for high voltage inverter stages while still maintaining enough voltage safety margin. The RoHS-compliant devices offer high noise immunity of 50 kV/µs, which prevents fail functions in fast switching power stages.

The post Vishay Intertechnology IGBT and MOSFET Drivers in Stretched SO-6 Package Enable Compact Designs, Fast Switching, and High Voltages appeared first on ELE Times.

Many industrial applications today are transitioning to higher power levels with minimized power losses, which can be achieved through increased DC link voltage. Infineon Technologies AG addresses this challenge by introducing the CoolSiC Schottky diode 2000 V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000 V. The product family is suitable for applications with DC link voltages up to 1500 VDC and offers current ratings from 10 to 80 A. This makes it ideal for higher DC link voltage applications such as in solar and EV charging applications.

The product family comes in a TO-247PLUS-4-HCC package, with 14 mm creepage and 5.4 mm clearance distance. This, together with a current rating of up to 80 A, enables a significantly higher power density. It allows developers to achieve higher power levels in their applications with only half the component count of 1200 V solutions. This simplifies the overall design and enables a smooth transition from multi-level topologies to 2-level topologies.

In addition, the CoolSiC Schottky diode 2000V G5 utilizes the .XT interconnection technology that leads to significantly lower thermal resistance and impedance, enabling better heat management.   Furthermore, the robustness against humidity has been demonstrated in HV-H3TRB reliability tests. The diodes exhibit neither reverse recovery current nor forward recovery and feature a low forward voltage, ensuring enhanced system performance.

The 2000 V diode family is a perfect match for the CoolSiC MOSFETs 2000 V in the TO-247Plus-4 HCC package that Infineon introduced in spring 2024. The CoolSiC diodes 2000 V portfolio will be extended by offering them in the TO-247-2 package, which will be available in December 2024. A matching gate driver portfolio is also available for the CoolSiC MOSFETs 2000 V.

The post CoolSiC Schottky diode 2000 V enables higher efficiency and design simplification in DC link systems up to 1500 VDC appeared first on ELE Times.

The RISC-V-based MPUs support mission-critical intelligent edge applications with TSN Ethernet switching and AI capabilities

The global edge computing market is expected to grow by more than 30 percent in the next five years, serving mission-critical applications in the aerospace, defense, military, industrial and medical sectors. To meet this increasing demand for reliable, embedded solutions for mixed-criticality systems, Microchip Technology has announced the PIC64HX family of microprocessors (MPUs). Unlike traditional MPUs, the PIC64HX is purpose-built to address the unique demands of intelligent edge designs.

The latest in Microchip’s 64-bit portfolio, the PIC64HX is a high-performance, multicore 64-bit RISC-V MPU capable of advanced Artificial Intelligence and Machine Learning (AI/ML) processing and designed with integrated Time-Sensitive Networking (TSN) Ethernet connectivity and post-quantum-enabled, defense-grade security.

PIC64HX MPUs are specifically designed to deliver comprehensive fault tolerance, resiliency, scalability and power efficiency.

“The PIC64HX MPU is truly groundbreaking in the number of advanced features we are able to provide with a single solution,” said Maher Fahmi, corporate vice president of Microchip’s communications business unit. “And, integrating TSN Ethernet switching into the MPU helps developers bring standards-based networking connectivity and compute together to simplify system designs, reduce system costs and accelerate time to market.”

The integrated Ethernet switch includes a TSN feature set with support for important emerging standards: IEEE P802.1DP TSN for Aerospace Onboard Ethernet Communications, IEEE P802.1DG TSN Profile for Automotive In-Vehicle Ethernet Communications and IEEE/IEC 60802 TSN Profile for Industrial Automation.

Eight 64-bit RISC-V CPU cores—SiFive Intelligence X280—with vector extensions help enable

high-performance compute for mixed-criticality systems, virtualization and vector processing to accelerate AI workloads. The PIC64HX MPU allows system developers to deploy the cores in multiple ways to enable SMP, AMP or dual-core lockstep operations. WorldGuard hardware architecture support is provided to enable hardware-based isolation and partitioning.

“Next-generation aircraft require a new generation of processors for mission-critical applications such as flight control, cockpit display, cabin networking and engine control. The OHPERA Consortium views RISC-V technology as an essential component of the future of safe and sustainable aircraft,” said Christophe Vlacich, OHPERA technical Leader. The OHPERA Consortium is composed of leading aerospace companies with the mutual goal of evaluating new technologies for next-generation aircraft.  “We are pleased to see the upcoming availability of commercial products like Microchip’s PIC64HX MPU with the compute performance, partitioning, connectivity and security needed to shape the future of aviation.”

The expected arrival of quantum computers poses an existential threat as it will make current security measures ineffective. As a result, government agencies and enterprises worldwide are beginning to call for the inclusion of post-quantum cryptography in any critical infrastructure. Addressing current and future security needs, the PIC64HX is one of the first MPUs on the market to support comprehensive defense-grade security including the recently NIST-standardized FIPS 203 (ML-KEM) and FIPS 204 (ML-DSA) post-quantum cryptographic algorithms.

The PIC64HX MPU is a powerful and versatile solution for intelligent edge applications, addressing key requirements for low latency, security, reliability and compliance with industry standards.

Development Tools

The PIC64HX MPU is supported by a comprehensive package of tools, libraries, drivers and boot firmware. Multiple open-source, commercial and real-time operating systems are supported including Linux and RTEMS, as well as hypervisors such as Xen. PIC64HX MPUs leverage Microchip’s extensive Mi-V ecosystem of tools and design resources to support its RISC-V initiatives. To help reduce development cycles and accelerate time to market, Microchip offers the Curiosity Ultra+ PIC64HX evaluation kit and is partnering with single-board computer partners.

“Aries Embedded has long been a supporter of the RISC-V ecosystem,” said Andreas Widder, Aries Embedded CEO. “We are proud to be a lead System-on-Module partner for the PIC64HX and look forward to helping Microchip enable mission critical intelligent edge applications.”

The post Microchip Expands 64-bit Portfolio with High-Performance, Post-Quantum Security-Enabled PIC64HX Microprocessors appeared first on ELE Times.

Ганна Шиманська. Використовує освітні можливості kpi ср, 10/30/2024 - 11:11

Using the most advanced GaN manufacturing technology available today, Aizu, Japan, is now the company’s second factory to produce a complete portfolio of GaN-based power semiconductors

NEWS HIGHLIGHTS:

• TI adds GaN manufacturing in Japan, quadrupling its internal GaN manufacturing capacity between its factories in the United States and Japan.
• TI’s GaN-based semiconductors are in production and available now.
• TI enables the most energy-efficient, reliable and power-dense end products with the widest portfolio of integrated GaN-based power semiconductors.
• TI has successfully piloted the development of GaN manufacturing on 300mm wafers.

Texas Instruments has announced it has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan. Coupled with its existing GaN manufacturing in Dallas, Texas, TI will now internally manufacture four times more GaN-based power semiconductors, as Aizu ramps to production.

“Building on more than a decade of expertise in GaN chip design and manufacturing, we have successfully qualified our 200mm GaN technology – the most scalable and cost-competitive way to manufacture GaN today – to start mass production in Aizu,” said Mohammad Yunus, TI’s senior vice president of Technology and Manufacturing. “This milestone enables us to manufacture more of our GaN chips internally as we grow our internal manufacturing to more than 95% by 2030, while also sourcing from multiple TI locations, ensuring a reliable supply of our entire GaN portfolio of high-power, energy-efficient semiconductors.”

The power of GaN technology

An alternative to silicon, GaN is a semiconductor material that offers benefits in energy-efficiency, switching speed, power solution size and weight, overall system cost, and performance under high temperatures and high-voltage conditions. GaN chips provide more power density, or power in smaller spaces, enabling applications such as power adapters for laptops and mobile phones, or smaller, more energy-efficient motors for heating and air conditioning systems and home appliances.

Today, TI offers the widest portfolio of integrated GaN-based power semiconductors, ranging from low- to high-voltage, to enable the most energy-efficient, reliable and power-dense electronics.

“With GaN, TI can deliver more power, more efficiently in a compact space, which is the primary market need driving innovation for many of our customers,” said Kannan Soundarapandian, vice president of High-Voltage Power at TI. “As designers of systems such as server power, solar energy generation and AC/DC adapters face challenges to reduce power consumption and enhance energy efficiency, they are increasingly demanding a reliable supply of TI’s high-performance GaN-based chips. TI’s product portfolio of integrated GaN power stages enables customers to achieve higher power density, improved ease of use and lower system cost.”

Further, with the company’s proprietary GaN-on-silicon process, more than 80 million hours of reliability testing, and integrated protection features, TI GaN chips are designed to keep high-voltage systems safe.

Most advanced GaN manufacturing technology available today

Using the most advanced equipment available for GaN chip manufacturing today, TI’s new capacity enables increased product performance and manufacturing process efficiency, as well as a cost advantage.

Also, the more advanced, efficient tools used in TI’s expanded GaN manufacturing can produce smaller chips, packing even more power. This design innovation can be manufactured using less water, energy and raw materials, and end products that use GaN chips enjoy these same environmental benefits.

Scaled for future advances

The performance benefits of TI’s added GaN manufacturing also enable the company to scale its GaN chips to higher voltages, starting with 900V and increasing to higher voltages over time, furthering power-efficiency and size innovations for applications like robotics, renewable energy and server power supplies.

In addition, TI’s expanded investment includes a successful pilot earlier this year for development of GaN manufacturing processes on 300mm wafers. Further, TI’s expanded GaN manufacturing processes are fully transferable to 300mm technology, positioning the company to readily scale to customer needs and move to 300mm in the future.

Committed to responsible, sustainable manufacturing

Expanding supply and innovation in GaN technology is the latest example of TI’s commitment to responsible, sustainable manufacturing. TI has committed to use 100% renewable electricity in its U.S. operations by 2027, and worldwide by 2030.

The post Texas Instruments expands internal manufacturing for gallium nitride (GaN) semiconductors, quadrupling capacity appeared first on ELE Times.

Delivers SMT and IP67 for high-efficiency performance in automotive, consumer, medical, and industrial applications

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, announces the C&K Switches KSC DCT Series Tactile Switches. The KSC DCT (Dual Circuit Technology) series are sealed IP67-rated, momentary-action tactile switches for surface-mount technology (SMT), designed to give users a positive, adaptable tactile feeling.

The KSC DCT is the first tactile switch to offer single pole double throw (SPDT) functionality in a small 6.2 x 6.2 x 5.2 millimeters size. The switches feature a soft actuator that withstands an operating force of 4.75N (+/-1.25N) and has a lifespan of 300K life cycles. The KSC DCT Series is a logical choice for seamless integration into existing or next-generation designs, providing outstanding, long-term reliability in even the dustiest environments.

The KSC DCT Tactile Switches offer these key features and benefits:

• SPDT Functionality: Added reliability due to one input and two outputs in a single tactile switch.
• Compact Footprint: Fits applications where space is limited.
• IP67 Sealing: Provides high contact reliability, protecting against dust and water ingress.
• J-Bend SMT Package: Enables standard assembly mounting using typical pick-and-place machines. (Gullwing-type terminations are also available.)
• Cost-Efficient: SMT makes it ideal for high-volume applications.

The KSC DCT Series Tactile Switches are ideally suited for:

• Transportation: Automotive door handles, EV charging station units, two- and three-wheelers.
• Consumer Electronics: Power tools, lawn mowers, snow blowers, home appliances.
• Medical Devices: Electrosurgical instruments, portable medical devices.
• Industrial Applications: Elevators, fire alarm equipment.

“By designing the unique functionality of dual-circuit technology tactile switches into such a small form factor, Littelfuse engineers are enabling electronics designers to provide their end-customers a journey to a safer world,” said Jeremy Hebras, Vice President of Digital & Technical Developments, Electronics Business Unit Engineering, at Littelfuse. “Thanks to the KSC DCT’s patented design, everyone can now precisely monitor the actual status of an electromechanical surface-mount technology tactile switch, even when the switch is not in use, which helps discriminate a silent signal versus a device malfunction.”

The increased safety needs of today’s end users require active failure verification: with the added single pole double throw (SPDT) functionality, the KSC DCT tactile switch allows a system to actively verify failures, like an unwanted door opening.

How it works: Dual-Circuit Technology (DCT) is a feature that creates two independent output signals inside the body of one tactile switch–Single Pole Double Throw (SPDT). The KSC DCT tactile switch has a Common, Normally Close (NC), and Normally Open (NO) pin. Suppose the designer chooses to use both NC and NO circuitry. In that case, it provides a Changeover signal that allows the designer to use both circuitries to define the logic of the signal and take actions based on the defined logic. In an automotive door handle, for example, both NC and NO circuitries are used before making any decision. The logic is at rest; the NC contact is closed while the NO contact is open. When a user pushes the button, nothing will happen until the NC contact is open and the NO contact is closed.

The post Littelfuse Unique KSC DCT Tactile Switches Provide Dual-Circuit Technology with SPDT Functionality, Superior Safety appeared first on ELE Times.

Spectrum Instrumentation launches flagship series of AWG cards in PCIe format

Scientists and engineers now have a way to produce high-frequency arbitrary waveforms, with high purity and low distortion, directly from their PC. Using the new PCIe flagship AWG cards from Spectrum Instrumentation and cost-effective COTS (Commercial-of-the-shelf) PC-parts, it is possible to generate nearly any waveform with up to 10 GS/s output rates, 2.5 GHz bandwidth, and 16-bit vertical resolution. The new cards make a powerful alternative to benchtop AWGs that often face a bottleneck when loading data for new waveforms. The cards offer a massive onboard memory of up to 8 GigaSamples (16 GB) and the possibility to stream data at up to 10 GigaBytes per second directly from CPUs or even GPUs. Four different models make up the M5i.63xx AWG series, offering a perfect fit solution for every application.

Insert the cards into a suitable PC and it turns into one of the most powerful signal generation instruments on the market. The four AWG variants deliver waveform generation with bandwidths of 2.5 and 1.5 Gigahertz (GHz) and output rates of 10, 5 or 3.2 Gigasamples per second (GS/s). The units combine 16-bit vertical resolution with programmable full-scale outputs. Single outputs deliver up to ±500 mV into 50 Ohm and ±1.0 V into high impedance loads – or double the range in differential mode.

Ultrafast data streaming

Each card comes with 2 GSample of onboard memory (8 GSample optional) and high-speed data transfer using a 16 lane, Gen 3, PCIe bus. This ultrafast bus allows data to be sent to cards at a staggering 10 GB/s. For demanding applications, data can even be continuously streamed directly to the AWG for replay in a FIFO mode – a process that allows almost limitless waveform production. Add Spectrum’s SCAPP driver package, which allows FIFO streaming directly to and from a GPU, and turbocharge the waveform processing even further.

The four new AWG flagships in PCIe format combine up to 10 GS/s speed, up to 2.5 GHz bandwidth, and 16-bit resolution. In the diagram, a two-channel M5i.6357 generates the two signals (I and Q component) for a Quadrature-Modulation.

Versatile Waveform Generation

Waveforms can be output in Single-shot, Repeated and Multiple Replay modes. To maximize memory efficiency, Multiple Replay can be used to output segmented data and can also be combined with FIFO streaming. Waveform replay can be initiated by a simple software command or via a trigger event. Trigger signals can be input on two external trigger lines.

Multi-channel Systems

Individual cards have one or two analog output channels. To create larger multi-channel systems, cards can be connected together using the company’s proprietary Star-Hub clock and trigger synchronization module. Star-Hub allows systems with up to eight cards to share a common clock and trigger, delivering fully synchronous output rates of 5 GS/s on up to 16 channels, or 10 GS/s on up to eight channels.

Mixed AWG and Digitizer Systems

The new flagship AWGs are available with one or two output channels, which can be used single-ended or differential (see front panel on the right).

The four new models of the M5i.63xx AWG series and the seven variants of the M5i.33xx digitizer series are designed for working together, making them ideal for use in stimulus-response, receiver-transmitter or closed-loop type testing systems. For example, if two Star-Hubs are used, ultrafast MIMO systems can be built that contain up to 8 AWGs and 8 digitizers. This allows the creation of systems with up to 16 transmit and 16 receiver channels, each channel with 5 GS/s.

Easy connection with other devices

For easy system integration, the front-panel hosts four multi-function SMA connectors. These can perform a variety of Input/Output tasks like Asynchronous Digital-I/O, Synchronous Digital-Out, Trigger Output, Run and Arm status flags, or the System Clock. By switching the multi-function I/O lines to digital outputs, another four synchronous output channels can be added to the AWG. As such, a single AWG card can generate up to two analog and four digital outputs, in parallel, at full speed. As an option, a Digital Pulse Generator firmware is available to turn the four digital outputs into digital generators outputs. All these features are very helpful when interfacing with other equipment for experiment control or in OEM projects.

Fully programmable

Fully programmable, the cards run under Windows or LINUX operating systems, using today’s most popular and powerful software languages. All products are shipped together with SDKs for C++, C#, Python, VB.NET, Julia, Java and IVI. Drivers are also provided for third-party software products LabVIEW and MATLAB.

Five Year Warranty

The Spectrum M5i.63xx series AWGs are available for immediate delivery. All cards are shipped factory tested and include a five-year warranty, with software and firmware updates, free of charge, for the lifetime of the product.

The post New flagship AWG cards generate waveforms with 10 GS/s speed and 2.5 GHz bandwidth appeared first on ELE Times.

This is the board of an Alcatel Speedtouch Pro ADSL modem, sold circa 1999 and 2000s. It's got an Intel i960 RISC processor inside, a pair of AMD AM29L flash chips and Hynix ram chips. At the back, it's got an RS232 port labeled "Console", a 10Base-T ethernet port, ADSL input (up to 8Mb/s downstream / 1Mb/s upstream), a beefy latching power switch and 4 dip switches. submitted by /u/Business-Error6835 [link] [comments]

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received an order from the Ohio State University’s Krishna Infrared Detectors (KIND) Laboratory for a GENxcel R&D molecular beam epitaxy (MBE) system, to be used for epitaxial growth of gallium antimonide (GaSb) for infrared (IR) detectors for consumer, automotive, defense and industrial applications...

submitted by /u/One-Cardiologist-462 [link] [comments]

🎲 Вебінар "Міжнародні стандарти з публічної доброчесності: ознайомлення" kpi вт, 10/29/2024 - 18:23

Altum RF of Eindhoven, The Netherlands (which designs RF, microwave and millimeter-wave semiconductors) has announced a two-year contract with the European Space Agency (ESA) under the ARTES (Advanced Research in Telecommunications Systems) Core Competitiveness (CC) Programme, for the design and development of high-efficiency monolithic microwave integrated circuit (MMIC) power amplifiers, which will be tailored for phased-array Ka-band satellite communication systems in space applications. The Netherlands Space Office (NSO) was instrumental in facilitating the contract...

­Не заблукати у хмарах. До 135-річчя від дня народження Ігоря Сікорського та 110-річчя його перельоту із Санкт-Петербурга до Києва Інформація КП вт, 10/29/2024 - 17:49

Silicon carbide (SiC) once thrived amid substrate shortages. However, according to DIGITIMES Asia, 2024 saw a significant shift where Chinese manufacturers dramatically ramped up production, resulting in a collapse of prices for mainstream 6-inch substrates and a steep decline in 8-inch prices...

submitted by /u/Aadkins13 [link] [comments]

140 років українському жіночому руху: потяг до рівності Інформація КП вт, 10/29/2024 - 16:14

A method of measuring both the inductance and the paralleled capacitance of a transformer winding was presented some years ago at in this URL. That essay should be read to best follow the thesis of this one.

That essay’s target devices were high voltage transformers whose secondary windings and secondary loadings from long Cockcroft-Walton voltage multipliers yielded so much paralleled capacitance across the primary windings that conventional LC test instruments were rendered useless for making transformer winding inductance measurements. Instead, dual resonance testing methods overcame that problem.

It should be noted that the above essay referred to measurements being made on ferrite core transformers but is also applicable to low frequency transformers with laminated steel cores such as the following device in Figure 1. Although iron core properties are known to change markedly versus excitation level, this measurement technique itself is not inherently limited to ferrite core transformers which fact is demonstrated by the following example.

Figure 1 A line frequency power transformer with laminated steel cores.

Test results for this iron core transformer were analyzed using the same GWBASIC code as before and can be seen in Figure 2.

Figure 2 The test results for the line frequency transformer in Figure 1.

Averaging the multiple readings, the primary winding apparently exhibits 338 mHy, the full secondary exhibits 70.7 mHy, one side of the secondary exhibits 17.1 mHy, while the other side of the secondary exhibits 17.3 mHy; thus revealing some imbalance between two otherwise identical windings. But, with leakage inductance and measurement tolerances, nothing is ever perfect, right?

The shunt capacitance calculation results which are very small, and even negative, tell us that the shunt capacitance of this transformer is essentially negligible.

Just as a quick check, 70.7 / 17.1 = 4.134 and 70.7 / 17.3 = 4.087 which are close to, but somewhat above, the nominal 4.000 ratio that would nominally apply for the 2:1 turns ratio.

My suspicion is that we were seeing the effects of leakage inductances.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• Dual resonance transformer test
• CFL dissection
• Recover the leakage energy of a flyback transformer
• Power Tips #91: How to improve flyback efficiency with a nondissipative clamp
• Power Tips #133: Measuring the total leakage inductance in a TLVR to optimize performance

The post Dual resonance revisited appeared first on EDN.

Test and measurement technology leader Rohde & Schwarz with decades of expertise is set to showcase at electronica 2024, held in its home city Munich. Visitors will be able to experience the company’s wide range of solutions designed to help them tackle their test and measurement challenges in the development, verification, and production of electronic components and devices – from the everyday to the extraordinary.

The 60th anniversary edition of the world’s leading electronics trade fair, electronica, is coming to Munich from November 12 to 15, 2024. Munich-based T&M expert Rohde & Schwarz will welcome trade show visitors to booth A3.307 at the Messe München fairgrounds, where they will exhibit a variety of test and measurement solutions tailored to developers and test engineers. Highlight applications will range from day-to-day test and measurement tasks – like verifying RF frontends or optimizing wide bandgap power designs – to dedicated solutions for emerging technologies – like radar, non-terrestrial networks or particle accelerators and quantum computing.

Ensuring reliability in power electronics
Rohde & Schwarz will showcase a variety of applications based on its next-generation oscilloscopes of the MXO 5 and MXO 5C series at electronica that assist engineers to ensure the reliablity of their power electronics. The eight-channel MXO 5 oscilloscope coupled with the R&S RT-ZISO isolated probing system delivers unparalleled accuracy, sensitivity, dynamic range and bandwidth. With these features it is the ideal solution for characterization, verification and debug of the next generation of wide-bandgap (WBG) power designs with SiC and GaN, demonstrated at the event.

In another setup, the MXO 5 oscilloscope will demonstrate that multi-phase buck converter design validation can be easy and delivers reliable results. High-speed multi-phase buck converter SoCs offer various operational benefits to meet demands in big data and other applications requiring lower voltages, higher currents and faster switching times.

And in a demonstration in partnership with PE Systems GmbH, visitors will be able to experience a double pulse tester system employing the new rackmount optimized MXO 5C oscilloscope without a display along with probes and power supplies from Rohde & Schwarz. The fully automated test system for characterizing power conductors and passive components allows the user to search for optimal driver parameters and conduct verification measurements on entire power electronic systems.

Wideband modulated load pull
To verify the system level performance of RF frontends across different impedances, Rohde & Schwarz will present a new solution for wideband modulated load pull, using the R&S SMW200A vector signal generator, the R&S RTP164 oscilloscope and new software option R&S RTP-K98 to characterize non-linear devices fast and precisely. With this solution users can validate RF frontends for load impedance variation as seen when driving RF signals into an antenna over a wider frequency range.

Conducted emission measurements
For both device developers and conformance test houses, the R&S EPL1000 EMI test receiver offers fast, accurate and reliable EMI compliance measurements up to 30 MHz and fully complies with CISPR 16-1-1. The R&S EPL1000 features 4-channel click rate analysis, a real-time spectrogram function and automated measurements, making it ideal for conducted voltage and current measurements. Typical applications include pre-compliance measurements, pre-certification and certification in line with IEC, EN, CISPR and FCC.

Gigabit Multimedia Serial Link (GMSL) signal integrity analysis
Gigabit Multimedia Serial Link (GMSL) from Analog Devices is a cost-efficient and scalable SerDes technology that achieves a new level of performance for high-resolution digital video transport in camera and display-based applications. At electronica, Rohde & Schwarz will feature the R&S RTP oscilloscope performing key signal integrity measurements such as eye diagrams to validate and debug a GMSL link.

Automotive radar functional testing
The new R&S RadEsT automotive radar tester is an ultra-compact, versatile radar target simulator that meets the full range of testing needs – from lab-based functional testing to vehicle-level production checks and beyond. Visitors can learn how to streamline radar sensor testing using the R&S RadEsT in radar sensor calibration, ADAS/AD functional testing and on OEM production lines.

Electric drivetrain component testing
Even marginal improvements in electric drivetrain efficiency and performance can significantly enhance overall electric vehicle (EV) operation. At electronica, Rohde & Schwarz will present a solution for OEMs and their suppliers to characterize and optimize drivetrain components, such as inverters and battery management systems. The solution is based on the MFIA from Zurich Instruments, the MXO 5 oscilloscope and the R&S NGM power supply.

Non-terrestrial network testing
Rohde & Schwarz is pushing the limits of seamless global coverage over land, sea and air with its test solutions for non-terrestrial networks (NTN) that offer extensive protocol verification and compliance with GCF/PTCRB and operator‑specific standards like Skylo, enhancing the reliability and efficiency of satellite-based communications. In a demo setup at electronica, the CMX500 radio communication tester will emulate complex multi-orbit (LEO, MEO, GSO, GEO) and multi-band (L/S/Ku/Ka Band) satellite environments, simulating a wide range of network conditions to ensure NTN-NR devices perform flawlessly anywhere in the world. In addition, test cases for NB-NTN, using the advanced CMW500 wideband radio communication tester, will also be showcased.

RedCap device testing
5G RedCap devices offer reduced features and operate on 5G standalone networks only. This results in greater reliability, lower latency, and improved performance and efficiency. Rohde & Schwarz will present specialized testing for RedCap device R&D with a comprehensive solution based on the CMX500 radio communication tester. Visitors will be able to learn how to ensure optimal device performance and regulatory compliance with extensive LTE and 5G NR protocol verification as defined in 3GPP 5G Release 17.

Researching game-changing technologies
Rohde & Schwarz, in collaboration with Zurich Instruments, addresses particle accelerators physics, quantum computing and other extraordinary scientific and industrial research applications. Experiments in accelerators physics, for instance in synchrotron labs, often require precise measurements of pulse amplitude or timing jitter. Oscilloscopes are indispensable for continuous monitoring for the entire signal, while the UHF-BOX Boxcar Averager from Zurich Instruments streamlines the data acquisition by capturing the directly the integrated pulse amplitude in real-time.

Service and calibration in great hands
Leading-edge technology belongs in expert hands. The Rohde & Schwarz support network spans multiple time zones and reaches every corner of the globe. At electronica, Rohde & Schwarz will spotlight its comprehensive service portfolio, including accredited calibration services, repair services directly from Rohde & Schwarz, training courses and industry insights from the R&S Technology Academy, as well as a 24/7 hotline and on-site support.

Moreover, as a world leader in RF product manufacturing with extensive vertical integration, Rohde & Schwarz also offers its expertise to other electronic product manufacturers. At electronica, visitors can learn about the high-precision electronic manufacturing services (EMS) available at the Rohde & Schwarz plants in Memmingen and in Teisnach.

Rohde & Schwarz will be at electronica 2024 in hall A3 at booth 307 from November 12 to 15, 2024.

The post Rohde & Schwarz at electronica 2024: Test and measurement solutions from the everyday to the extraordinary appeared first on ELE Times.