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Дрони КПІшників рятують життя на фронті medialab вт, 04/23/2024 - 13:34

NORD drive solutions for the process industry

From 10 to 14 June 2024, NORD will be presenting a wide range of products at ACHEMA in Frankfurt am Main. The focus is on ATEX-compliant drive concepts for the process industry and the robust heavy-duty MAXXDRIVE® industrial gear unit, in particular for agitator and mixer applications. Further focal points at the trade fair will be the new decentralised NORDAC ON/ON+ frequency inverters, the revolutionary DuoDrive geared motors and IE5+ synchronous motors as well as the NORDCON APP with NORDAC ACCES BT. Interested trade visitors can find out more about NORD’s wide range of solutions at the trade fair grounds in Frankfurt am Main in Hall 8.0, Stand B52.

Whether in the chemical, pharmaceutical or food industries: Companies that extract, transport or process raw materials require industry-specific, innovative drive solutions. As a system supplier, NORD offers matched drive systems consisting of gear unit, motor and drive electronics that are tailored to the respective requirements of the customer application.

ATEX drives for explosion-protected areas Flammable gases and dust in processing industries create serious safety risks. NORD has decades of experience with gas and dust explosion protection and offers particularly robust electric motors with powers from 0.12 to 200 kW especially for this field of use. The explosion-protected electric motors can be operated in category 2D or 3D dust atmospheres (zones 21 and 22) as well as in category 2G or 3G gas atmospheres (zones 1 and 2) and are approved according to ATEX and HazLoc. The dust-protected motors feature the ignition protection category “Protection by enclosure” (tD). Depending on the requirements, the motors in the gas explosion protection version are available in the following ignition protection classes: increased safety
(e), pressure-resistant encapsulation (d/de) and non-sparking design.

Industrial gear units for high torque applications NORD’s MAXXDRIVE® industrial gear units power heavy-duty applications such as agitators, mixers and grinders in food or cosmetic production. The parallel and right-angle gear units cover a speed ratio range from 5.54:1 to 400:1 – and with a first-stage gear unit, even up to 30,000:1. They feature:

• High output torques from 15 to 282 kNm for reliable operation even under extreme conditions
• Torsionally rigid, one-piece UNICASE housing for a longer bearing life and efficient power transmission
• Large low-friction roller bearings for extremely high radial and axial load capacities and a long service life
• High-precision axis alignment for guaranteed quiet running
For mixer and agitator applications, the industrial gear units can also be equipped with a SAFOMI-IEC
adapter:
• The adapter is available for parallel gear units and in sizes 7 to 11, i.e. for maximum output torques from 25
to 75 kNm.
• The adapter is compact and simple in design and has an integrated oil expansion volume; oil tanks and hoses as well as the radial shaft seal that is subject to leakage and wear between gear unit and IEC cylinder are therefore not required.

Decentralised drive electronics

The NORDAC ON frequency inverters are part of the NORD modular system and can be optimally combined with the manufacturer’s motors.
• NORDAC ON was designed for applications with asynchronous motors,
• NORDAC ON+ was designed for the combination with highly efficient IE5+ synchronous motors.
The inverters are designed for power ranges from 0.37 to 3 kW.

Energy-efficient IE5+ synchronous motors

The IE5+ motor generation from NORD DRIVESYSTEMS guarantees the highest level of efficiency and operational reliability, thanks to IE5+ technology. The motors are available as a TENV smooth-surface motor, as a TEFC motor with cooling fins and as an integrated DuoDrive motor. The latter combines a highefficiency IE5+ motor and a single-stage helical gear unit in one housing. The IE5+ synchronous motors with motor efficiencies of up to 95% are available in the TEFC version with a power of up to 4.0 kW, in the TENV
version with up to 2.2 kW and in the DuoDrive version with up to 3.0 kW.

Mobile maintenance and commissioning

With the NORDCON APP for mobile maintenance and commissioning of NORD frequency inverters, NORD enables the diagnosis, analysis, parametrisation and monitoring of the drive systems via a mobile terminal device for service use. The NORDAC ACCESS BT is a Bluetooth stick that is used directly with the frequency inverter – this ensures convenient mobile access to the drive data while at the same time access control.

NORD will present its comprehensive range of solutions at ACHEMA in Hall 8.0, Stand B52.

The post NORD DRIVESYSTEMS at ACHEMA 2024 appeared first on ELE Times.

AquiSense Technologies LLC of Erlanger, KY, USA (which designs and makes UV-C LED water disinfection systems) says that its UV-C LED technology has been integrated into NASA’s Potable Water Dispenser aboard the International Space Station (ISS) and has been operational since August 2023...

On April 22, Rohde & Schwarz inaugurated a new facility center in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. The opening marks a strategic milestone for the technology company: it not only increases its presence in the third-largest city in India, but also strengthens its commitment to the Make in India initiative of the government by fostering innovation across the automotive, telecom, semiconductor, electronics, aerospace and defense sectors.

Rohde & Schwarz India, the Indian subsidiary of the German-based, global technology company Rohde & Schwarz, celebrated the grand opening of its new future-oriented facility located in the heart of Bengaluru’s prestigious Manyata Tech Park.

Andreas Pauly, President and Chief Technology Officer (CTO) of Rohde & Schwarz

While inaugurating the new offices, Andreas Pauly, President and Chief Technology Officer (CTO) of Rohde & Schwarz, said: “We are proud to expand our presence in Bengaluru. For Rohde & Schwarz, India is not merely a growth market but a vital component of our global strategy. The new facility marks a significant milestone in our journey toward strengthening our position as a trusted partner in India’s evolving technological landscape. Moreover, it reflects our contribution to the Make in India initiative through a large team of highly skilled engineers.”

For more than 90 years, Rohde & Schwarz has had a tradition of innovation, helping to develop current and future cutting-edge technologies. By expanding R&D activities in India, Rohde & Schwarz is able to enhance technological excellence for the highly dynamic Indian market. The R&D team in Bengaluru is involved in developing next-generation solutions for the company’s Test and Measurement Division.

Yatish Mohan, Managing Director Rohde & Schwarz India

Yatish Mohan, Managing Director, Rohde & Schwarz India, added: “For the past 25 years, we have fostered technological advancement in India through strategic partnerships with government agencies, training institutes and technology firms. Our presence spans multiple locations throughout the country, encompassing tier-II cities directly and via our extensive channel partner network. We are excited about the opportunities that our new facility brings, allowing us to enhance our services to the Indian technology industry and facilitate innovation in the electronics, semiconductor, automotive and telecommunications sectors.”

The new facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. This addition reinforces the commitment of Rohde & Schwarz to delivering high-quality products and services to its customers across India and beyond. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions. This strategic move underscores the company’s intention to enhance customer experience and accessibility, providing clients with hands-on experiences and seamless access to cutting-edge technology solutions.

The post Rohde & Schwarz expands footprint in India by opening new state-of-the-art facility in Bengaluru appeared first on ELE Times.

Intel and ASML collaborated on the high NA EUV lithography tools to pioneer the next generation of chips.

submitted by /u/External_Asparagus10 [link] [comments]

Toyoda Gosei Co Ltd of Kiyosu, Aichi Prefecture, Japan has developed deep ultraviolet (UV-C) LEDs with light output that is among the highest in the world, it is claimed...

The new SiTime data center clock chip delivers 10x higher performance than quartz crystal-based devices in half the space.

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) has received the EcoVadis Platinum Medal for the second consecutive year, representing the highest level of recognition for sustainability performance. Lumentum remains in the top one percent of companies assessed by EcoVadis in the past year, increasing its overall score from 78 points to 80 points. In the environmental category, the firm increased its score by 10 points from last year. Medals are awarded based on the percentile rank of a company compared with the performance of all rated companies...

Keysight Technologies Inc of Santa Rosa, CA, USA has introduced RFPro Circuit, a next-generation radio frequency (RF) simulation tool targeting the complex, multi-physics requirements of RF integrated circuit (RFIC) designers. Wireless, automotive and satellite designers can now deliver robust designs that overcome performance challenges in dense 3D packaging, taking advantage of interoperability and automation to form complex workflows, says the firm...

ROHM group of Kyoto, Japan and STMicroelectronics of Geneva, Switzerland have expanded the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with ROHM group company SiCrystal GmbH of Erlangen, Germany. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg for a minimum expected value of $230m...

Nvidia CEO Jensen Huang calls Palladium the only appliance more important to him than the refrigerator. At Cadence Design Systems annual event in Santa Clara, California, he also acknowledged that Nvidia has the largest installation of Palladium emulation systems.

Earlier, during a fireside chat, Huang said that Blackwell AI processor would not exist without Palladium. So, what’s Palladium and why is it making waves for large and powerful chip designs? It’s an emulation tool built around Cadence’s custom processors, and it’s used for pre-silicon hardware debugging.

Figure 1 Palladium Z3 and Protium X3 deliver fast pre-silicon verification and validation of the large, complex chip designs. Source: Cadence

At CadenceLive, held on 17 April 2024, the EDA toolmaker unveiled Palladium Z3 alongside Protium X3. “The supercharged Palladium Z3 and Protium X3 are built to deliver fast pre-silicon verification and validation of the largest and most complex devices,” said Dhiraj Goswami, corporate VP of hardware system verification R&D at Cadence.

Palladium Z3, which offers approximately 1.5 times the performance of its predecessor Palladium Z2, can scale from 16 million gates to all the way 48 billion gates. It also features specialized apps for tasks such as 4-state emulation, mixed-signal emulation, safety emulation, and fine-grained power analysis.

Next, the Protium X3 system, built around AMD Epyc processors paired to AMD Versal Premium VP1902 adaptive system-on-chips (SoCs), provides physical prototyping to accelerate bring-up times for pre-silicon software validation of complex, multi-billion gate chip designs. It’s also 1.5 times faster than its predecessor, Protium X2.

Palladium and Protium create a virtual version of a chip to start writing software while waiting for the physical chip to return from the fab. That’s how chip design emulation accelerates time to market. However, though Palladium Z3 and Protium X3 work in tandem, as explained above, they facilitate different types of workloads.

Figure 2 Palladium Z3 and Protium X3 feature a unified compiler and common virtual and physical interfaces. Source: Cadence

Nvidia, which used Palladium Z3 and Protium X3 predecessors in designing just-announced Blackwell AI processors, is already testing these upgraded systems in some of its AI processor designs. “The next-generation Palladium and Protium systems push the boundaries of capacity and performance to help enable a new era of generative AI computing,” said Scot Schultz, senior director for networking at Nvidia.

Today’s large chip designs serving applications like AI and high-performance computing (HPC) increasingly demand emulation solutions that offer higher performance along with faster and more predictable compile debug. New emulation systems such as Palladium fill the need with early software development, hardware-software verification, and debug tasks.

Related Content

• Hardware emulation for everyone
• On-chip debug eases MCU-based design
• Design Compilation in Hardware Emulators
• Maximizing hardware emulation’s value for networking designs

The post Palladium emulation: Nvidia’s Jensen Huang is a fan appeared first on EDN.

My Blackmagic Design video cameras are compatible with numerous editing software packages, but the company’s own DaVinci Resolve is a particularly compelling option. For one thing, there’s a close-knit synergy—or at least the natural potential for one—whenever the hardware and software come from the same company. DaVinci Resolve, for example, is able to access the camera’s gyroscope-generated metadata in order to implement post-capture stabilization of video footage; an admittedly inferior alternative to the in-body stabilization (IBIS) offered by competitors’ cameras, which operates during initial footage capture, but better than nothing.

The baseline DaVinci Resolve suite is also completely free, and robustly featured to boot. That said, Blackmagic’s cameras come bundled (at least from the factory…this is something often in-advance stripped out of used units offered for resale) with license keys for the paid DaVinci Resolve Studio variant, which offers some key enhancements for more advanced videography use cases. Each license key allows for two concurrent-use “seats”, and deactivating (at least temporarily) one installation associated with your key and account in order to activate another is straightforward…but it requires a “live” Internet connection to Blackmagic’s server farm, which may not be feasible if you’re “in the field” at the time.

Alternatively, therefore, the company also sells (through its various retail partners) USB activation dongles. Here’s an example, from Sweetwater’s site:

As you can see, they cost the same as a software license key: $295, which is a bit “salty”, both absolutely and relative to “free”. But last May, shortly after buying my two cameras (only one of which came with a key), I came across a claimed “used” one on eBay for just over $100. For the flexibility of two additional concurrent active “seats”, if no other reason, I took the plunge.

When the dongle arrived (from a Vietnam-based seller, it turns out, contrary to the upfront U.S.-sourced claim, and which in retrospect should have been my first warning sign), the packaging was admittedly a bit sketchy:

But the dongle itself looked legit, at least at initial quick glance (as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes):

And it was recognized by both MacOS and Windows systems, along with (at least at the time, keep reading) correctly activating DaVinci Resolve Studio installs on both O/Ss:

(keen-eyed readers will notice that I’ve gone ahead and added the Satechi hub to the Mac mini “stack” covered in one of last month’s blog posts, to give me easy front-panel access to various interface and expansion connectors)

More recently, however, I decided to update my various DaVinci Resolve Studio “seats” to latest-version 18.6. Afterwards, my ability to continue activating them via the dongle abruptly ceased. Jumping on Google, I learned that I wasn’t alone in my dismay (not to mention its root cause):

Like some previous releases we also have blocked some dongle key ids that are counterfeit. If you purchased second hand or not from an authorized reseller you may have one of those.

Unsurprisingly, the original seller (whose eBay account is still active as I write these words; note, too, that the seeming same person(s) was/were also selling “used” dongles on Amazon at the same time I bought mine on eBay) hasn’t responded to my outreach. That said, I give eBay plenty of kudos; the rep to whom I reported the issue promptly issued me a future-purchase coupon for the full amount.

But I was still curious to see what else I could find out about this forgery. I’ll probably eventually do a proper teardown, so stay tuned for that, although note that I’m not going to also drop $300 on a legit one for comparison purposes (!!!). For now, I’ll share some screenshots of how the dongle self-identifies to both MacOS:                                           

Screenshot

and Windows:

I’m pretty sure the first time I heard the adage “if it sounds too good to be true, it probably is” was as a child, and came from my parents. Decades later, the wisdom still applies. Caveat emptor, folks! Sound off with your thoughts in the comments.

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Prosumer and professional cameras: High quality video, but a connectivity vulnerability
• Counterfeit threats for electronic parts
• Fake ICs: Another weapon in their detection
• A deep dive inside a USB flash drive
• Peering inside a multiport USB-C (and Thunderbolt 3?) hub
• Guide for spotting counterfeit Cisco equipment

The post USB activation dongles: Counterfeit woes appeared first on EDN.

Благодійна допомога від партнерів із Баварії Інформація КП пн, 04/22/2024 - 17:01

The post Renesas’ New FemtoClock 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms appeared first on ELE Times.

Germany’s ZSW (Zentrum für Sonnenenergie- und Wasserstoff-Forschung — or Center for Solar Energy and Hydrogen Research — Baden-Württemberg) and cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA have announced a strategic research partnership focused on advancing thin-film photovoltaics (PV). The partnership will focus not only on performance but also on the potential to develop and optimize all-thin-film tandem technologies on a gigawatt scale...

• New STM32MP2 MPUs with 64-bit processing and edge AI acceleration
• Built for speed, security, and reliability
• Leverage the STM32 ecosystem for rapid development and secure provisioning

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Digital transformation is happening everywhere, driving improvements including greater business productivity, better healthcare, and enhanced safety and energy management throughout buildings, utilities, and transport networks. Critical enabling technologies include cloud computing, data analytics, artificial intelligence (AI), and the Internet of Things (IoT). ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world. These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.

“Our embedded MPUs address the trend that’s pushing more workloads and greater demands to smart devices, often deployed at the IoT edge, for faster response and increased efficiency,” said Stephane Henry, General Purpose MPU Division General Manager, STMicroelectronics. “The new STM32MP2 devices we are announcing today extend the performance trajectory, introducing our most powerful processing engine, now adding edge AI, and supported by the STM32 ecosystem to accelerate product development.”

Architected for demanding and time-sensitive workloads, AI inferencing, and communication, and featuring state-of-the-art cyber security, the STM32MP2 MPUs are built to withstand up to 10 years of continuous operation.

State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm’s TrustZone architecture, to keep sensitive data and keys secret. Certification to SESIP Level 3, the leading security test methodology for IoT devices and compliance, is ongoing for STM32MP2 MPUs to satisfy forthcoming tougher cyber-protection requirements in key territories worldwide. These include the US CyberTrust mark and stipulations in the EU’s Radio Equipment Directive that are due to become mandatory in 2025.

“Together with ST, we tackled the challenge of connecting our devices to the cloud. From opening locks remotely to granting new access rights, our products are shaping the future of access management,” said Marco Temporiti, R&D Software Manager, ISEO. “Thanks to the STM32MP2 microprocessor with its strong encryption capabilities, we are able to build an industrial-grade gateway with unmatched reliability and security. The seamless integration with Yocto Linux has streamlined our development process, allowing us to innovate with ease. And, ST’s 10-year longevity program also ensures a long product lifecycle at reduced cost, setting a new standard in the industry.”

“We worked with ST to build a 2-channel network audio adapter, leveraging the STM32MP1 series microprocessors to handle tasks like converting network digital audio signals for transmission and reception. The robust processing power, Ethernet connectivity and adaptable audio output interfaces were key considerations in choosing the STM32MP1 series for integration into our products,” said Yue XIONG, CEO, S-TRACK. “Now, we’re enthusiastic about the possibilities presented by ST’s latest MPUs, particularly the STM32MP2 series, which deliver improved power efficiency, enabling us to minimize cooling requirements in our enclosed casings. Additionally, the integrated Cortex-M co-processor eliminates the need for a separate microcontroller, and support for Gigabit Ethernet with precision time protocol (PTP) enables accurate data transfer and synchronization among devices. With this advanced technology, our goal is to broaden our product range to include 16-channel offerings.”

The first STM32MP2 MPUs are scheduled to enter volume production in June 2024. Sample requests and pricing information are available from local ST sales offices.

The post STMicroelectronics Powers Up the Intelligent Edge with Second-Generation STM32 Microprocessors, Bringing Performance Boost and Industrial Resilience appeared first on ELE Times.

Електроноші київських політехніків на передовій medialab пн, 04/22/2024 - 12:21

Лекторій для молоді “Знайди себе в антикорупції” kpi пн, 04/22/2024 - 11:57