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As part of a big push towards the development of India’s semiconductor industry, Electronics and IT Minister Ashwini Vaishnaw has sanctioned the setup of the ‘NaMo Semiconductor Laboratory’ at IIT Bhubaneswar. The ₹4.95 crore estimated facility will enhance India’s strength in chip design, fabrication, and research.

The new laboratory, as per an announcement by the Ministry of Electronics and Information Technology (MeitY), will be a state-of-the-art facility with the machinery and software required for training in semiconductors, design, and fabrication. The center is hoped to be instrumental in developing a rich talent pool of engineers and researchers equipped with industry-standard skills for India’s emerging semiconductor industry.

The ministry underscored that the initiative is consistent with the government’s overall vision of transforming India into a global center for semiconductor manufacturing and innovation. The lab will also aid in the creation of qualified professionals for future chip manufacturing and packaging facilities in the country.

The officials said that the setup of the NaMo Semiconductor Laboratory would act as a catalyst for India’s rapidly growing semiconductor ecosystem, reiterating flagship programs like ‘Make in India’ and ‘Design in India’.

As the global semiconductor industry is experiencing explosive growth, the step is likely to enhance India’s role in the international value chain and spur the country’s march toward technological independence.

The post Ashwini Vaishnaw Approves NaMo Semiconductor Lab at IIT Bhubaneswar appeared first on ELE Times.

Welcome to the second All About Circuits Summit Day of 2025! This guide will introduce the features of this Wednesday's schedule and help you plan your month-long participation.

“AI is redefining the role of designers by automating design engineering, improving verification accuracy, and shortening development cycles,” says Satoshi Shibatani, vice president of EDA Technology and Design Services Division at Renesas, in an exclusive conversation with ELE Times. As various professions worldwide undergo a profound shift in their thought processes and operations, largely driven by the emergence of AI, ELE Times takes the hot seat with Satoshi Shibatani of Renesas, the second most prominent company in the automotive microcontroller market in 2024, to discuss the dynamics of the changing role specifically in the landscape of product design and development. 

He remarks, “The role of an engineer is evolving from ‘manual designer’ to ‘AI-collaborative design strategist,’ underlining the impact AI has made on the role of an engineer in the landscape of product development. Through this, he also reflects on the expectations that the companies have of the prospective engineers, which is to become more and more AI-friendly and intelligence-collaborative.

How’s the transformation playing out? 

“At Renesas, we have been advancing design efficiency using AI through the company-wide ‘Design by AI Project’ since 2021, and it has already shown results across many development processes,” says Satoshi, reflecting on the prevalent use of AI at Renesas specifically for product design and development. This captures the early adoption approach that Renesas pursued with the AI technology to enable growth and transformation in the product development cycle. 

Which part is most AI-based now? 

Since design is one of the most important and complex stages of product development, it is vital to know which part has been most affected by AI. Among the various processes involved in the design cycle of a product, verification is one aspect that has been widely affected owing to the emergence of AI. “In verification, generative AI is used for RTL (Register Transfer Level) reviews and spec analysis, which is expected to enable early bug detection and a significant reduction in verification processes,” says Satoshi. 

With this illustration, he simply shows how AI has influenced decision-making at the level of product design through venturing into such intricate processes as bug detection.

How exactly is Renesas using AI? 

At Renesas, AI is being integrated into design through what the company describes as a “collaborative design style.” Rather than relying on AI solely for automation, designers interact with its outputs, assess the results, and propose improvements. “In this model, AI serves not merely as an automation tool but as a collaborative partner that enhances human thinking. Innovation is driven by human creativity, and rapid trial-and-error cycles help us reach our potential and foster continuous breakthroughs,” Satoshi remarks.

How’s the role of engineers changing then? 

As AI takes a more central role in design, the role of engineers at Renesas is also transforming. Shibatani explains that the shift is from being a “manual designer” to becoming an “AI-collaborative design strategist.” This means engineers are now expected to go beyond traditional design skills and embrace new capabilities such as data literacy, prompt engineering, AI model interpretation, and the use of collaborative AI tools. 

“We provide training programs covering AI tool usage, interactive design support with generative AI, model building, and output evaluation and improvement,” he adds, noting that Renesas is actively shaping an environment to support this talent development and ensure engineers are equipped for the future.

What’s the real efficiency metric? 

While aims and efforts do count, metrics make the final case for business. “For design optimization, AI has improved design efficiency by up to 30% in some cases,” says Satoshi as he underlines the real metric conveying the impact of AI usage in the product design and development cycle at Renesas. He states that the company has been consistently enhancing design efficiency since 2021. As a result, apart from the improved productivity through automation, AI usage has contributed to better PPA (Performance, Power, Area) metrics at Renesas. 

Why is it not all good yet?

In the conversation, he further touches upon the various challenges that accompany AI prevalence in the development cycle. It includes “data quality, vendor collaboration, security, and tool integration,” says Satoshi, underlining the fact that no system is devoid of challenges for the engineers. He further states that to address the very issue of data quality, Renesas has built a system that quantitatively measures AI data quality by combining existing EDA tools and technologies. 

As with any system, the AI-powered processes are going through a transition phase wherein various modes and operations are yet to be witnessed. At this stage, AI is significantly improving analysis speed and accuracy by parsing large design datasets and specifications to auto-generate verification plans and test benches. However, it continues to operate under human supervision and is not fully autonomous. Sensitive customer data remains excluded from training and is discarded after use, while strict traceability measures are in place to ensure reliability and prevent hallucinations.

The post The role is evolving from “manual designer” to “AI-collaborative design strategist,” says Satoshi Shibatani of Renesas. appeared first on ELE Times.

India is on the verge of an electric revolution. With the government aiming at 30% EV penetration by 2030 and vehicle electrification being a key element of the country’s decarbonization roadmap, power electronics has emerged to be among the very crucial and lucrative sectors in this transformation.

Power electronics, including inverters, onboard chargers, DC-DC converters, and battery management systems (BMS), are all essential to harness energy efficiently and maximize performance from EVs. Two-wheelers to electric buses, the whole spectrum of EVs depends on these systems to efficiently execute the conversion, controlling, and distribution of electrical energy.

As the global automotive industry accelerates toward electrification, power electronics have emerged as the driving force behind innovation in electric vehicle. These intelligent systems regulate energy flow, drive efficiency, fast charging, and ensure consistent performance across vehicle segments.

In 2024, the global market for power electronics in electric vehicles surged to USD 28.5 billion, and it’s poised for a meteoric rise projected to exceed USD 70 billion by 2030, driven by a robust CAGR of over 17%. In India, the automotive power electronics market was valued at USD 11.98 billion in 2024 and is projected to grow to USD 22.7 billion by 2034, with a CAGR of 6.6%.

As the Indian EV market grows further, power electronics is seeing extreme localization, investment flows, and technological upgrades-in a clear push towards high-value manufacturing and strategic partnerships.

India’s Five-Year Data Snapshot of the EV Power Electronics Market (2019-2024):

Between 2019 and 2024, India’s EV power electronics market evolved significantly. In 2019, the market size was ₹1,050 crore, driven by early adoption in fleet EVs and pilot policy programs. In 2020, it grew to ₹1,350 crore, supported by the FAME-II extension and state-level EV policies. By 2021, the market reached ₹1,870 crore, fueled by a surge in electric two-wheeler sales and increased component imports. In 2022, local development of BMS and inverters gained momentum, pushing the market to ₹2,720 crore. In 2023, investments in silicon carbide (SiC) production and EMS facilities elevated the market to ₹3,590 crore. The estimated value for 2024 is ₹4,450 crore, driven by the Make in India initiative and rising demand from electric light commercial vehicles (e-LCVs) and electric buses.

Current Market Conditions and Trends:

1. Increasing Demand in the 2W and 3W

Electric two-wheelers and three-wheelers, but most of all in last-mile logistics, food delivery, and shared riding, make up over 80% of the EV sales in India. These require:

• Compact motor controllers, low-voltage
• DC-DC converters integrated
• BMS that is basic but efficient

Startups such as Ola Electric, Ather Energy, Yulu, and Euler Motors are engaged in localizing power electronics with design, testing and fabrication facilities within India.

2. Localization Drive by the Government

The Indian government’s localization drive has prioritized power electronics under the Production Linked Incentive (PLI) schemes for Advanced Chemistry Cell (ACC) battery storage and auto components, designating them as verticals of strategic importance. These incentives aim to bolster domestic manufacturing of inverters and EV chargers, foster the development of EMS (Electronics Manufacturing Services) clusters, and establish robust testing and standardization infrastructure through institutions like ARAI and ICAT. States such as Tamil Nadu, Karnataka, Uttar Pradesh, and Telangana are rapidly emerging as key hubs for EV component production, reinforcing India’s ambition to become a global manufacturing powerhouse in electric mobility.

3. SiC/GaN Technology

SiC and GaN technologies in India are still in their early stages, with manufacturers largely dependent on imports, through companies like Tata Elxsi, Servotech and Exicom are advancing local SiC packaging and vertical integration while some institutions are actively engaged in R&D for high-voltage inverter systems.

Segmentation:

• For two- and three-wheeler EVs, the market demands low-cost inverters, compact BMS, and DC-DC converters. This segment includes over 25 OEMs and a growing retrofitting market.
• Passenger EVs require 400V inverters, onboard chargers, and smart BMS, with companies like Tata and Mahindra driving demand.
• Commercial EVs, such as electric buses and e-LCVs, need rugged, high-voltage inverters and chargers.
• EV chargers require AC-DC converters and controller boards, with over 6,000 charging stations planned by FY 2026.
• Fleet and utility EVs—used by logistics firms, warehouses, and airport fleets—benefit from remote diagnostics and telematics-integrated BMS.

Key Indian Players:

• Tata Elxsi is working on inverters, BMS, and simulation software, with active development in SiC technology.
• Servotech Power focuses on EV chargers, onboard chargers, and DC-DC converters, and plans to manufacture SiC modules in India.
• Exicom specializes in battery packs, BMS, and electronics for light commercial vehicles, and is scaling up production for commercial EVs.
• Ola Electric is developing integrated powertrain systems, with in-house controller and BMS design underway.
• Delta India supplies power conversion systems to Tata Motors and public charging infrastructure.

Growth Drivers and Future Outlook:

Government initiatives and the flourishing private sector work together to provide electronics in India aesthetic power. Supporting localism, the drivers include PLI implementation schemes, import duties granted on the concept of localization, and, on the other hand, electrification of public transport under the PM e-Bus Sewa Yojana. Compliance by fleet operators has been instrumental in accelerating demand; some of them are leading corporate examples, such as Tata, Amazon, and Flipkart. Progressive state EV policies have been sowing the fertile grounds of land, subsidies, and demand-side incentives for manufacturing and innovation.

Opportunities (2025–2030):

The next five years open immense commercial opportunities. India shall become a regional export hub for EV inverters, especially to Southeast Asian and MENA markets. The indigenous development of GaN-based OBCs and DC-DC converters grows ever more attractive, backed by scalable EMS units crafted for startups and MSMEs. Also, modular powertrain kits for retrofitting ICE vehicles offer a good retrofit market in the Tier-2 and Tier-3 cities.

Challenges:

Despite building momentum, some barriers remain in place. As of now, India does not have any domestic entities manufacturing SiC wafers and the high import duties on the GaN components and control ICs continue to eat into margins. There is also an acute shortage of skills in automotive-grade electronics design, and the industry grapples with issues relating to standards and thermal management-a big concern for operating under tropical climates that India presents.

Commercial forecast: By 2030 & onward:

The Mutually Enforced Power Electronics Market in India is slated to exponentially shoot past ₹20,000 crore by around 2030, with over 10 million EVs present on roads of India. Demand would come through the mid-range inverter platforms for domestic as well as for export purposes, with the scaling up of Tier-2 and Tier-3 supplier networks alongside deeper MSME integrations into the EV value chain.

Conclusion:

Power electronics are taking center stage in India’s fast charging electric vehicle landscape, which will support everything from 750V electric buses on major expressways to low-cost e scooters in Tier-2 cities. As vehicle electrification scales up, power electronics will determine not only the operational efficiency and reliability of EVs but also the worldwide competitiveness of India’s EV manufacturing ecosystem.

With supportive government policies in place, a large domestic demand base, growing R&D capabilities, along with increased attention from domestic and global investors, India stands on the cusp of becoming a global hub for EV power electronics manufacturing and innovation.

For OEMs, component makers, and tech entrepreneurs, the window of opportunity is now. Investment in localized, scalable, and intelligent power electronics solutions will reduce import dependency and costs while paving the way to assure dominance in one of the fastest-growing clean tech markets globally.

The future of India’s EV growth, and development, is not just about batteries and motors. It’s about the invisible engine that makes it all possible i.e power electronics.

The post Electric Mobility Drives India’s Power Electronics Expansion appeared first on ELE Times.

Nanoelectronics research center imec of Leuven, Belgium has welcomed AIXTRON, GlobalFoundries, KLA Corp, Synopsys and Veeco as first partners in its 300mm gallium nitride (GaN) open innovation program track for low- and high-voltage power electronics applications...

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has announced the launch and first commercial multi-tool order for its new Lumina+ metal-organic chemical vapor deposition (MOCVD) system. Launch services and space systems firm Rocket Lab Corp of Long Beach, CA, USA (the parent company of space power provider SolAero Technologies Corp) has purchased the tools as part of its ongoing project under the Department of Commerce’s CHIPS and Science Act to expand domestic production of compound semiconductor products at its facility in Albuquerque, New Mexico...

Since the early 2000s, ultra-wideband (UWB) technology has gradually found its way into a variety of commercial applications that require secure and fine-ranging capabilities. Well-known examples are handsfree entry solutions for cars and buildings, locating assets in warehouses, hospitals, and factories, and navigation support in large spaces like airports and shopping malls.

A characteristic of UWB wireless signal transmission is the emission of very short pulses in the time domain. In impulse-radio (IR) UWB technology, this is taken to the extreme by transmitting pulses of nanoseconds or even picoseconds. Consequently, in the frequency domain, it occupies a bandwidth that is much wider than wireless ‘narrowband’ communication techniques like Wi-Fi and Bluetooth.

UWB technology operates over a broad frequency range (ranging typically from 6 to 10 GHz) and uses channel bandwidths of around 500 MHz and higher. And because of that, its ranging accuracy is much higher than that of narrowband technologies.

Today, UWB can provide cm- to mm-level location information between a transmitter (TX) and receiver (RX) that are typically 10-15 meters apart. In addition, enhancements to the UWB physical layer—as part of the adoption of the IEEE 802.15.4z amendment to the IEEE standard for low-rate wireless networks—have been instrumental in enabling secure ranging capabilities.

Figure 1 Here is a representation of UWB and narrowband signal transmission, in the (top) frequency and (bottom) time domain. Source: imec

Over the years, imec has contributed significantly to advancing UWB technology and overcoming the challenges that have hindered its widespread adoption. That includes reducing its power consumption, enhancing its bit rate, increasing its ranging precision, making the receiver chip more resilient against interference from other wireless technologies operating in the same frequency band, and enabling cost-effective CMOS silicon chip implementations.

Imec researchers developed multiple generations of UWB radio chips, compliant with the IEEE 802.15.4z standard for ranging and communication. Imec’s transmitter circuits operate through innovative pulse shape and modulation techniques, enabled by advanced polar transmitter, digital phase-locked loop (PLL), and ring oscillator-based architectures—offering mm-scale ranging precision at low power consumption.

At the receiver side, circuit design innovations have contributed to an outstanding interference resilience while minimizing power consumption. The various generations of UWB prototype transmitter and transceiver chips have all been fabricated with cost-effective CMOS-compatible processing techniques and are marked by small silicon areas.

The potential of UWB for radar sensing

Encouraged by the outstanding performance of UWB technology, experts have been claiming for some time that UWB’s potential is much larger than ‘accurate and secure ranging.’ They were seeing opportunities in radar-like applications which, as opposed to ranging, employ a single device that emits UWB pulses and analyzes the reflected signals to detect ‘passive’ objects.

When combined with UWB’s precise ranging capabilities, this could broaden the applications to automotive use cases such as in-cabin presence detection and monitoring the occupants’ gestures and breathing, aimed at increasing their safety.

Or think about smart homes, where UWB radar sensors could be used to adjust the lighting environment based on people’s presence. In nursing homes, the technology could be deployed to initiate an alert based on fall detection without the need for intrusive camera monitoring.

Enabling such UWB use cases will be facilitated by IEEE 802.15.4ab, the next-generation standard for wireless technology, which is expected to be officially released around year-end. 802.15.4ab will offer multiple enhancements, including radar functionality in IR-UWB devices, turning them into sensing-capable devices.

Fourth gen IR-UWB radio compliant with 802.15.4z/ab

At the 2025 Symposium on VLSI Technology and Circuits (VLSI 2025), imec presented its fourth-generation UWB transceiver, compliant with the baseline for radar sensing as defined by preliminary versions of 802.15.4ab. Baseline characteristics include, among others, enhanced modulation supported by high data rates.

Additionally, imec’s UWB radar sensing technology implements unique features offering enhanced radar sensing capabilities (such as extended range) and a record-high data rate of 124.8 Mbps integrated in a system-on-chip (SoC). Being also compliant with the current 802.15.4z standard, the new radio combines its radar sensing capabilities with communication and secure ranging.

Figure 2 The photograph captures fourth-generation IR-UWB radio system. Source: imec

A unique feature of imec’s IR-UWB radar sensing system is the 2×2 MIMO architecture, with two transmitters and two receivers configured in full duplex mode. In this configuration, a duplexer controls whether the transceiver operates in transmit or receive mode. Also, the TXs and RXs are paired together—TX1-RX1, TX1-RX2, and TX2-RX2—connected by the duplexer.

This allows the radar to simultaneously operate in transmit and receive mode without having to use RF switches to toggle from one mode to the other. This way of working enables reducing the nearest distance over which the radar can operate—a metric that is traditionally limited by the time needed to switch between both modes.

Imec’s full-duplex-based radar can operate in the range between 30 cm and 3 m, a breakthrough achievement. In this full-duplex MIMO configuration, the nearest distance is only restricted by the radar’s 500-MHz bandwidth.

The IR-UWB 2TRX radar physically implements two antenna elements, each antenna being shared between one TX and one RX. The 2×2 MIMO full-duplex configuration, however, enables an array with three antennas virtually, which substantially improves the radar’s angular resolution and area consumption.

Compared with state-of-the-art single-input-single-output (SISO) radars, the radar consumes 1.7x smaller area with 2.5 fewer antennas, making it a highly performant, compact, and cost-effective solution. Advanced techniques are used to isolate the TX from the RX signals, resulting in >30dB isolation over a 500-MHz bandwidth.

Figure 3 This architecture of the 2TRX was presented at VLSI 2025. Source: imec

Signal transmission relies on a hybrid analog/digital polar transmitter, introducing filtering effects in the analog domain for signal modulation. This results in a clean transmit signal spectrum, supporting the good performance and low power operation of the UWB radar sensor.

Finally, in addition to the MIMO-based analog/RF part, the UWB radar sensing device features an advanced digital baseband (or modem), responsible for signal processing. This component extracts relevant information such as the distance between the radar and the object, and an estimation of the angle of arrival.

Proof-of-concept: MIMO radar for in-cabin monitoring

The features of IR-UWB MIMO-based radar technology are particularly attractive for automotive use cases, where the UWB radar can be used not only to detect whether someone is present in the car, for example, child presence detection, but also to map the vehicle’s occupancy and monitor vital signs such as breathing. This capability is currently on the roadmap of several automotive OEMs and tier-1 suppliers.

But today, no radar technology can deliver this functionality with the required accuracy. Particularly challenging is achieving the angular resolution needed to detect two targets at the same (short) distance from the radar. In addition, for breathing monitoring, small movements of the target must be discerned within a period of a few seconds.

Figure 4 The in-cabin IR-UWB radar was demonstrated at PIMRC 2025. Source: imec

At the 2025 IEEE International Symposium on Personal, Indoor and Mobile Radio Communications (IEEE PIMRC 2025), imec researchers presented the first proof-of-concept, showing the ability of IR-UWB MIMO radar system to perform two in-cabin sensing tasks: occupancy detection and breathing rate estimation. In-cabin measurements were carried out inside a small car.

The UWB platform was placed in front of an array of two in-house developed antenna elements placed in the center of the car ceiling, close to the rear-view mirror. The distance from the antennas to the center of the driver and front passenger seats was 55 cm.

The experimental results confirm achieving a high precision for estimating the angle-of-arrival and breathing rate. For instance, for a scenario where both passenger and driver seats are occupied, the UWB radar system achieves a standard deviation of less than 1.90 degrees and 2.95 bpm, for angle-of-arrival and breathing rate estimations, respectively.

Figure 5 Extracted breathing signals for driver and passenger were presented at PIMRC 2025. Source: imec

Imec researchers also highlight an additional benefit of using UWB technology for in-cabin monitoring: the TRX architecture, which is already used in some cars for keyless entry, can be re-purposed for the radar applications, cutting the overall costs.

High data rate opens doors to data streaming applications

In addition to radar sensing capabilities, this IR-UWB transceiver offers another feature that sets it apart from existing UWB solutions: it provides a record-high data rate of 124.8 Mbps, the highest data rate that is still compatible with the upcoming 802.15.4ab standard.

This is about a factor of 20 higher than the 6.8 Mbps data rate currently in use in ranging and communication applications; it results from an optimization of both the analog front-end and digital baseband. The high data rate also comes with a low energy per bit—much lower than consumed by Wi-Fi—especially at the transmit side.

These features will unlock new applications in both audio and video data streaming. Possible use cases are next-generation smart glasses or VR/AR devices, for which the UWB TRX’s small form factor is an added advantage.

Adding advanced ranging to UWB portfolio

In the last two decades, IEEE 802.15.4z-compliant UWB technology has proven its ability to support mass-market secure-ranging and localization deployments, enabling use cases across the automotive, smart industry, smart home, and smart building markets. Supported by the upcoming IEEE 802.15.4ab standard, emerging UWB devices can now also be equipped with radar functionality.

Imec’s fourth generation of IR-UWB technology is the first (publicly reported) 802.15.4ab compliant radar-sensing device, showing robust radar-sensing capabilities; it’s suitable for automotive as well as smart home use cases. The record high data rate also shows UWB’s potential to tap new markets: low-power data streaming for smart glasses or AR/VR devices.

The IEEE 802.15.4ab standard supports yet another feature: advanced ranging. This will enhance the link budget for signal transmission, translating into a fourfold increase in the ranging distance—up to 100 m in the case of a free line of sight. This feature is expected to significantly enhance the user experience for keyless entry solutions for cars and smart buildings.

Not only can it improve the operating distance, but it can also better address challenging environments such as when the signal is blocked by another object, for example, body blocking. Ongoing developments will enable this advanced ranging capability as a new feature in imec’s fifth generation of UWB technology.

The future looks bright for UWB technology. Not only do technological advances follow each other at a rapid pace, but ongoing standardization efforts help shape current and future UWB applications.

Christian Bachmann is the portfolio director of wireless and edge technologies at imec. He oversees UWB and Bluetooth programs enabling next-generation low-power connectivity for automotive, medical, consumer, and IoT applications. He joined imec in 2011 after working with Infineon Technologies and the Graz University of Technology.

Related Content

• Ultra-wideband tech gets a boost in capabilities
• The transformative force of ultra-wideband (UWB) radar
• All Ultra-Wideband (UWB) systems are not created equal
• A short primer on ultra-wideband (UWB) radar technology
• A look at the many lives of ultra-wideband (UWB) standard

The post Next-gen UWB radio to enable radar sensing and data streaming applications appeared first on EDN.

Board blew up and malted/evaporated all the traces. submitted by /u/Ill-Knee-8003 [link] [comments]

Efinix has doubled its Titanium FPGA family, adding devices with transceivers up to 25.8 Gbps to support AI, edge, and industrial applications.

Пам'яті Григор'єва Артура Олександровича kpi пн, 10/06/2025 - 22:47

S1104 (860A) vs 1N4007 (1A) diode. submitted by /u/_st0le [link] [comments]

The dual launch places Snapdragon at the center of AI-focused mobile and PC experiences.

Спартакіада КПІ ім. Ігоря Сікорського 2025 стартувала! kpi пн, 10/06/2025 - 19:34

I designed the circuit in Figure 1 as a part of a data transmission system that has a carrier frequency of 400 kHz using on-off keying (OOK) modulation.

I needed to detect the presence of the carrier by distinguishing it from other signals of different frequencies. It was converted to digital with a 5-V logic. I wanted to avoid using programmable devices and timers based on RC circuits.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The resulting circuit is made up of four chips, including a crystal time base. In brief, this system measures the time between the rising edges of the received signal on a cycle-by-cycle basis. Thus, it detects if the incoming signal is valid or not in a short time (approximately one carrier cycle, that is ~2.5 µs). This is done independently of the signal duty cycle and in less time than other systems, such as a phase-locked loop (PLL), which may take several cycles to detect a frequency.

Figure 1 A digital frequency divider circuit that detects the presence of a 400-kHz carrier, distinguishing it from signals of other frequencies, after it has been converted to digital using 5-V logic.

How it works

In the schematic, IC1A and IC1B are the 6.144 MHz crystal oscillator and a buffer, respectively. For X1, I used a standard quartz crystal salvaged from an old microprocessor board.

The flip-flops IC2A and IC2B are interconnected such that a rising edge at the IC2A clock input (connected to the signal input) produces, through its output and IC2B input, a low logic level at IC2B Q output. Immediately afterwards, the low logic level resets IC2A, thereby leaving IC2B ready to receive a rising edge at its clock input, which causes its Q output to return to high again. Since the IC2B clock input is continuously receiving the 6.144 MHz clock, the low logic level at its output will have a very short duration. That very narrow pulse presets IC3, which takes its counting outputs to “0000”.

If IC4A is in a reset condition, that pulse will also set it in the way explained below, with the effect of releasing IC4B by deactivating its input (pin 4 of IC4) and enabling IC3 by pulling its input low.

From that instant, IC3 will count the 6.144 MHz pulses, and, if the next rising edge of the input signal occurs when IC3’s count is at “1110” or “1111”, IC1C’s output will be at a low level, so the IC4B output will go high, indicating that a cycle with about the correct period (2.5µs) has been received. Simultaneously, IC3 will be preset to start a new count. If the next rising edge occurred when the IC3 count was not yet at “1110”, IC3 would still be preset, but the circuit output would go low. This last scenario corresponds to an input frequency higher than 400 kHz.

On the contrary, if, after the last rising edge, a longer time than a valid period passes, the functioning of the circuit will be the following. When the IC3 count reaches the value “1111”, a 6.144 MHz clock pulse will occur at the signal input instead of a rising edge. This will make the IC4A Q output take the low level present at the IC3 output and the IC4A data input.

The low level at IC4A Q output will set IC4B, and the circuit output will go low. As IC4A Q output is also connected to its own input, that low level caused by a pulse at its clock input will prevent that flip-flop from responding to further clock pulses. From then on, the only way of taking IC4A out of that state will be by applying a low level (could be a very narrow pulse, as in this case) at its input (pin 10 of IC4). That would establish a forbidden condition for an instant, making IC4A first pull high both Q and , and immediately change to low.

As a result of the circuit logic and timing, after a complete cycle with a period of approximately 2.5 µs is received, the circuit output goes high and remains in that state until a shorter cycle is received, or until a longer time than the correct period elapses without a complete cycle.

Testing the circuit

I tested the circuit with signals from 0 to 10 MHz. The frequencies between 384 kHz and 405 kHz, or periods between 2.47 µs and 2.6 µs, produced a high level at the output. These values correspond to approximately 15 to 16 pulses of the 6.144 MHz clock, being the first of those pulses used to end the presetting of the counter IC3, so it is not counted.

Frequencies lower than 362 kHz or higher than 433 kHz produced a low logic level. For frequencies between 362 kHz and 384 kHz and between 405 kHz and 433 kHz, the circuit produced pulses at the output. That means that for an input period between 2.31 µs and 2.47 µs or between 2.60 µs and 2.76 µs, there will be some likelihood that the output will be in a high or low logic state. That state will depend on the phase difference between the input signal and the 6.144 MHz clock.

Figure 2 shows a five-pulse 400 kHz burst (lower trace), which is applied to the input of the circuit. The upper trace is the output; it can be seen that after the first cycle has been measured. The output goes high, and it stays in that state as more 2.5 µs cycles keep arriving. After a time slightly higher than 2.5 µs without a complete cycle (~2.76 µs), the output goes low.

Figure 2 A five-pulse 400-kHz burst applied to the input of the digital frequency divider circuit (CH2) and the output (CH2) after the first cycle has been measured.

Ariel Benvenuto is an Electronics Engineer and a PhD in physics, and works in research with IFIS Litoral in Santa Fe, Argentina.

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The post A digital frequency detector appeared first on EDN.

Пам'яті Вячеслава Петровича Желяскова kpi пн, 10/06/2025 - 19:13

💧 Міжнародна конференція "ВОДНІ ТЕХНОЛОГІЇ: від традиційних методів до сучасних тенденцій" kpi пн, 10/06/2025 - 18:51

🚀 III відкритий інженерний конкурс для школярів «Збудуй свою МРІЮ» учнів 8-11 класів kpi пн, 10/06/2025 - 18:40

In last month’s smart ring overview coverage, I mentioned two things that are particularly relevant to today’s post:

• I’d be following it up with a series of more in-depth write-ups, one per ring introduced in the overview, the first of which you’re reading here, and
• Given the pending ITC (International Trade Commission) block of further shipments of RingConn and Ultrahuman smart rings into the United States, save for warranty-replacements for existing owners, and a ruling announced a few days prior to my submission of the overview writeup to Aalyia, I planned to prioritize the RingConn and Ultrahuman posts in the hopes of getting them published prior to the October 21 deadline, in case US readers were interested in purchasing either of them ahead of time (note, too, that the ITC ruling doesn’t affect readers in other countries, of course).

Color compatibility

Since the Ultrahuman Ring AIR was the first one that came into my possession, I’ll dive into its minutiae first. To start, I’ll note, in revisiting the photo from last time of all three manufacturers’ rings on my left index finger, that the Ultrahuman ring’s “Raw Titanium” color scheme option (it’s the one in the middle, straddling the Oura Gen3 Horizon to its left and the RingConn Gen 2 to its right) most closely matches the patina of my wedding band:

Here’s the Ultrahuman Ring AIR standalone:

Skip the app

Next up is sizing, discussed upfront in last month’s write-up. Ultrahuman is the only one of the three that offers a sizing app as a (potential) alternative to obtaining a kit, although candidly, I don’t recommend it, at least from my experiences with it. Take a look at the screenshots I took when using it again yesterday in prepping for this piece (and yes, I intentionally picked a size-calibrating credit card from my wallet whose account number wasn’t printed on the front!):

I’ll say upfront that the app was easy to figure out and use, including the ability to optionally disable “flash” supplemental illumination (which I took advantage of because with it “on”, the app labeled my speckled desktop as a “noisy background”).

That said, first off, it’s iOS-only, so folks using Android smartphones will be SOL unless they alternatively have an Apple tablet available (as I did; these were taken using my iPad mini 6). Secondly, the app’s finger-analysis selection was seemingly random (ring and middle finger on my right hand, but only middle finger on my left hand…in neither case the index finger, which was my preference). Thirdly, app sizing estimates undershot by one or multiple sizes (depending on the finger) what the kit indicated was the correct size. And lastly, the app was inconsistent use-to-use; the first time I’d tried it in late May, here’s what I got for my left hand (I didn’t also try my right hand then because it’s my dominant one and I therefore wasn’t planning on wearing the smart ring on it anyway):

Sub-par charging

Next, let’s delve a bit more into the previously mentioned seeming firmware-related battery life issue I came across with my initial ring. Judging from the June 2024 date stamps of the documentation on Ultrahuman’s website, the Ring AIR started shipping mid-last year (following up on the thicker and heavier but functionally equivalent original Ultrahuman R1).

Nearly a year later, when mine came into my possession, new firmware updates were still being released at a surprisingly (at least to me) rapid clip. As I’d mentioned last month, one of them had notably degraded my ring’s battery life from the normal week-ish to a half day, as well as extending the recharge time from less than an hour to nearly a full day. And none of the subsequent firmware updates I installed led to normal-operation recovery, nor did my attempted full battery drain followed by an extended delay before recharge in the hope of resetting the battery management system (BMS). I should also note at this point that other Redditors have reported that firmware updates not only killed rings’ batteries but also permanently neutered their wireless connectivity. 

What happened to the original ring? My suspicion is that it actually had something to do with an inherently compromised (coupled with algorithm-worsened) charging scheme that led to battery overcharge and subsequent damage. Ultrahuman bundles a USB-C-to-USB-C cable with the ring, which would imply (incorrectly, as it turns out) that the ring charging dock circuitry can handle (including down-throttling the output as needed) any peak-wattage USB-C charger that you might want to feed it with, including (but not limited to) USB-PD-capable ones.

In actuality, product documentation claims that you should connect the dock to a charger with only a maximum output of 5W/2A. After doing research on Amazon and elsewhere, I wasn’t able to find any USB-C chargers that were that feeble. So, to get there at all, I had to dig out of storage an ancient Apple 5W USB-A charger, which I then mated to a third-party USB-A-to-USB-C cable.

That all said, following in the footsteps of others on the Ultrahuman subreddit who’d had similar experiences (and positive results), I reached out to the Reddit forum moderators (who are Ultrahuman employees, including the founder and CEO!) and after going through a few more debugging steps they’d suggested (which I’d already tried, but whatevah), got shipped a new ring.

It’s been stable through multiple subsequent firmware updates, with the stored charge dropping only ~10-15% per day (translating to the expected week-ish of between-charges operating life). And the pace of new firmware releases has also now notably slowed, suggestive of either increasing code stability or a refocus on development of the planned new product that aspires to avoid Oura patent infringement…I’m hoping for the more optimistic former option!

Other observations

More comments, some of which echo general points made in last month’s write-up:

• Since this smart ring, like those from Oura, leverages wireless inductive charging, docks are ring-size-specific. If you go up or down a size or a few, you’ll need to re-purchase this accessory (one comes with each ring, so this is specifically a concern if, like me, you’ve already bought extras for travel, elsewhere in the house, etc.)

• There’s no battery case available that I’ve come across, not even a third-party option.
• That 10-15% per day battery drop metric I just mentioned is with the ring in its initial (sole) “Turbo” operating mode, not with the subsequently offered (and now default) “Chill” option. I did drop it down to “Chill” for a couple of days, which decreased the per-drop battery-level drop by a few percent, but nothing dramatic. That said, my comparative testing wasn’t extensive, so my results should be viewed as anecdotal, not scientific. Quoting again from last month’s writeup:

Chill Mode is designed to intelligently manage power while preserving the accuracy of your health data. It extends your Ring AIR battery life by up to 35% by tracking only what matters, when it matters. Chill Mode uses motion and context-based intelligence to track heart rate and temperature primarily during sleep and rest.

• It (like the other smart rings I also tested) misinterpreted keyboard presses and other finger-and-hand movements as steps, leading to over-measurement results, especially on my dominant right hand.
• While Bluetooth LE connectivity extends battery life compared to a “vanilla” Bluetooth alternative, it also notably reduces the ring-to-phone connection range. Practically speaking, this isn’t a huge deal, though, since the data is viewed on the phone. The act of picking the phone up (assuming your ring is also on your body) will also prompt a speedy close-proximity preparatory sync.
• Unlike Oura (and like RingConn), Ultrahuman provides membership-free full data capture and analysis capabilities. That said, the company sells optional Powerplug software add-ons to further expand app functionality, along with extended warranties that, depending on the duration, also include one free replacement ring in case your sizing changes due to, for example, ring-encouraged and fitness-induced weight loss.
• The app will also automatically sync with other health services, such as Fitbit and Android’s built-in Health Connect. That said, I wonder (but haven’t yet tested to confirm or deny) what happens if, for example, I wear both the ring and an inherently Fitbit-cognizant Google Pixel Watch (or, for that matter, my Garmin or Withings smartwatches).

• One other curious note: Ultrahuman claims that it’s been manufacturing rings not only in its headquarters country, India, but also in the United States since last November in partnership with a contractor, SVtronics. And in fact, if you look at Amazon’s product page for the Ring AIR, you’ll be able to select between “Made in India” and “Made in USA” product ordering options. Oura, conversely, has indicated that it believes the claimed images of US-located manufacturing facilities are “Photoshop edits” with no basis in reality. I don’t know, nor do I particularly care, what the truth is here. I bring it up only to exemplify the broader contentious nature of ongoing interactions between Oura and its upstart competitors (also including pointed exchanges with RingConn).

Speaking of RingConn, and nearing 1,600 words at this point, I’m going to wrap up my Ultrahuman coverage and switch gears for my other planned post for this month. Time (and ongoing litigation) will tell, I guess, as to whether I have more to say about Ultrahuman in the future, aside from the previously mentioned (and still planned) teardown of my original ring. Until then, reader thoughts are, as always, welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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