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POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the hyperscale data-center, telecom and artificial intelligence (AI) markets — has won for the ‘Most Innovative Chip-scale Packaging/Optical Sub Assembly Product’ at the ECOC Awards...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the hyperscale data-center, telecom and artificial intelligence (AI) markets — has announced with high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service provider Semtech Corp of Camarillo, CA, USA the immediate availability for customer sampling of high-performance 1.6T receiver optical engines for AI and cloud networks...

Mojo Vision Inc of Cupertino, CA, USA — which is developing and commercializing micro-LED display technology for consumer, enterprise and government applications — has appointed Dr Waguih Ishak to its advisory board, bringing decades of leadership experience in photonics and optoelectronics to its efforts to apply its micro-LED technology to the development of high-speed optical interconnects for AI infrastructure...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the hyperscale data-center, telecom and artificial intelligence (AI) markets — has announced a strategic collaboration with Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs for SATCOMs and photonic lasers for AI data centers) to develop high-performance and cost-effective external light source (ELS) modules tailored for co-packaged optics (CPO) and next-generation AI infrastructure...

India’s electronics manufacturing landscape is set for a major transformation under the newly launched Electronics Component Manufacturing Scheme (ECMS). The scheme, aimed at increasing domestic production of non-semiconductor components, has seen an industry-wide runaway response with proposals for investment totaling ₹1.15 lakh crore, well over twice the scheme’s initial aim of ₹59,000 crore.

Based on industry estimates, the rise in participation under ECMS can assist in doubling domestic value addition in the manufacture of finished electronic products from the present 15–20% to 35–40% in the next five years. This is a significant improvement towards diminishing dependence on imports and consolidating India as an international manufacturing powerhouse.

The program has received proposals from 249 firms, including major component segments like flexible printed circuit boards, electro-mechanical components, multi-layer PCBs, sub-assemblies, display modules, camera modules, and lithium-ion cells. These proposals are to be soon assessed by a committee for approval.

Amongst the largest investment proposals, enclosures for mobile phones, IT hardware, and other associated devices represent ₹35,813 crore. Other prominent segments comprise flexible PCBs (₹16,542 crore), electro-mechanical components (₹14,362 crore), multi-layer PCBs (₹14,150 crore), and display module sub-assemblies (₹8,642 crore). Cumulatively, more than 100 companies have offered investments of over ₹65,000 crore in merely three important segments electro-mechanical components, enclosures, and PCBs.

Industry specialists perceive the ECMS as a game changer in the electronics value chain that has the potential to generate mass employment on a large scale, facilitate technology transfer, and improve global competitiveness. The unprecedented response is also regarded as an indicator of increased confidence in India’s manufacturing ecosystem.

Union Minister for Electronics and IT Ashwini Vaishnaw revealed that against a production target of ₹4,56,500 crore, the government had received proposals for manufacturing electronics components worth over ₹10,34,000 crore. This staggering response underscores the scale of industry interest and further validates the ECMS as a transformative initiative for India’s electronics manufacturing sector.

He called this a “game changer,” emphasizing how the scheme reflects global trust in India’s electronics sector and its potential to transform the country into a manufacturing powerhouse.

The sector has called upon state governments to supplement the Centre’s effort by enhancing ease of doing business, streamlining regulatory procedures, and providing sector-specific incentives to maintain the momentum of investments. Collective action is likely to open up more opportunities, especially in component manufacturing, which would be the bedrock of self-reliant electronics production.

Through involvement by both national and international firms, the ECMS is considered a horizontal programme that will benefit all verticals of the electronics industry. By promoting the creation of sub-assemblies and core components in the country, the initiative will enhance India’s capability in electronic manufacturing and provide a basis for industrial growth in the long term.

The post India Targets 40% Local Value Addition in Electronics with New Component Scheme appeared first on ELE Times.

A homing sensor is a device used in certain machines to detect a fixed reference point, allowing the machine to determine its exact starting position. When powered on, the machine moves until it triggers the sensor, so it can accurately track movement from that point onward. It’s essential for precision and repeatability in automated motion systems.

Selecting the right homing sensor can have a big impact on accuracy, dependability, and overall cost. Here is a quick rundown of the three main types:

Mechanical homing sensors: These operate through contact-direct switches or levers to determine position.

• Advantages: Straightforward, budget-friendly, and easy to install.
• Drawbacks: Prone to wear over time, slower to respond, and less accurate.

Magnetic homing sensors: Relying on magnetic fields, often via Hall effect sensors, these do not require physical contact.

• Advantages: Long-lasting, effective in harsh environments, and maintenance-free.
• Drawbacks: Can be affected by magnetic interference and usually offer slightly less resolution than optical sensors.

Optical homing sensors: These use infrared light paired with slotted discs or reflective surfaces for detection.

• Advantages: Extremely precise, quick response time, and no mechanical degradation.
• Drawbacks: Sensitive to dust and misalignment and typically come at a higher cost.

In clean, high-precision applications like 3D printers or CNC machines, optical sensors shine. For more demanding or industrial environments, magnetic sensors often strike the right balance. And if simplicity and low cost are top priorities, mechanical sensors remain a solid choice.

Figure 1 Magnetic, mechanical, and optical homing sensors are available in standard configurations. Source: Author

The following parts of this post detail the design framework of a universal homing sensor adapter module.

We will start with a clean, simplified schematic of the universal homing sensor adapter module. Designed for broad compatibility, it accepts logic-level inputs—including both CMOS and TTL-compatible signals—from nearly any homing sensor head, whether it’s mechanical, magnetic, or optical, making it a flexible choice for diverse applications.

Figure 2 A minimalistic design highlights the inherent simplicity of constructing a universal homing sensor module. Source: Author

The circuit is simple, economical, and built using easily sourced, budget-friendly components. True to form, the onboard test button (SW1) mirrors the function of a mechanical homing sensor, offering a convenient stand-in for setup and troubleshooting tasks.

The 74LVC1G07 (IC1) is a single buffer with an open-drain output. Its inputs accept signals from both 3.3 V and 5 V devices, enabling seamless voltage translation in mixed-signal environments. Schmitt-trigger action at all inputs ensures reliable operation even with slow input rise and fall times.

Optional flair: LED1 is not strictly necessary, but it offers a helpful visual cue. I tested the setup with a red LED and a 1-KΩ resistor (R3)—simple, effective, and reassuringly responsive.

As usual, I whipped up a quick-and-dirty breadboard prototype using an SMD adapter PCB (SOT-353 to DIP-6) to host the core chip (Figure 3). I have skipped the prototype photo for now—there is only a tiny chip in play, and the breadboard layout does not offer much visual clarity anyway.

Figure 3 A good SMD adapter PCB gives even the tiniest chip time to shine. Source: Author

A personal note: I procured the 74LVC1G07 chip from Robu.in.

Just before the setup reaches its close, note that machine homing involves moving an axis toward its designated homing sensor—a specific physical location where a sensor or switch is installed. When the axis reaches this point, the controller uses it as a reference to accurately determine the axis position. For reliable operation, it’s essential that the homing sensor is mounted precisely in its intended location on the machine.

While wrapping up, here are a few additional design pointers for those exploring alternative options, since we have only touched on a straightforward approach so far. Let’s take a closer look at a few randomly picked additional components and devices that may be better suited for the homing task:

• SN74LVC1G16: Inverting buffer featuring Schmitt-trigger input and open-drain output; ideal for signal conditioning and noise immunity.
• SN74HCS05: Hex inverter with Schmitt-trigger inputs and open-drain outputs; useful for multi-channel logic interfacing.
• TCST1103/1202/1300: Transmissive optical sensor with phototransistor output; ideal for applications that require position sensing or the detection of an object’s presence or absence.
• TCRT5000: Reflective optical sensor; ideal for close-proximity detection.
• MLX75305: Light-to-voltage sensor (EyeC series); converts ambient light into a proportional voltage signal, suitable for optical detection.
• OPBxxxx Series: Photologic slotted optical switches; designed for precise object detection and position sensing in automation setups.

Moreover, compact inductive proximity sensors like the Omron E2B-M18KN16-M1-B1 are often used as homing sensors to detect metal targets—typically a machine part or actuator—at a fixed reference point. Their non-contact operation ensures reliable, repeatable positioning with minimal wear, ideal for robotic arms, linear actuators, and CNC machines.

Figure 4 The Omron E2B-M18KN16-M1-B1 inductive proximity sensor supports homing applications by detecting metal targets at fixed reference points. That enables precise, contactless positioning in industrial setups. Source: Author

Finally, if this felt comfortably familiar, take it as a cue to go further; question the defaults, reframe the problem, and build what no datasheet dares to predict.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

• Reflective Object Sensors
• Smart PIR Sensor for Smart Homes
• Inductive Proximity Switch w/ Sensor
• The role of IoT sensors in smart homes and cities
• Radar sensors in home, office, school, factory and more

The post Universal homing sensor: A hands-on guide for makers, engineers appeared first on EDN.

Upgraded Smart Running Trail in Suzhou Industrial Park Achieves Perfect Fusion of Technology and Art

The Jinji Lake Luminous Trail, a project developed by the Suzhou Industrial Park, has won the 2025 MUSE Design Gold Award and the IES Illumination Award of Excellence.

MUSE Design Awards

In June, the Jinji Lake Luminous Trail was honored with the Gold Award in the Innovative Lighting Design category at the 2025 MUSE Design Awards. Recognized as a highly authoritative international award in the global creative design field and often hailed as “the Oscars of the design world,” the trail was one of only two recipients of the highest honor in this category, fully demonstrating the project’s outstanding innovation and design standards.

IES Illumination Awards

In addition to the MUSE Design Award, the Jinji Lake Luminous Trail also received the Award of Excellence in the Control Innovation category at the IES Illumination Awards in August of the same year. The IES Illumination Awards are presented annually by the Illuminating Engineering Society of North America (IES), an organization with over a century of history. Alongside the Lighting Design Awards from Lighting magazine and the IALD International Lighting Design Awards from the International Association of Lighting Designers, the IES Illumination Awards are considered one of the three most prestigious lighting design awards in the world today, representing the highest global design standards of the year. The IES award is the longest-standing of these accolades.

Nuvoton NUC1311 MCU Empowers the Interactive Lighting System and Smart Sensors of the Jinji Lake Trail

Within the trail’s overall smart system, the core control unit is powered by Nuvoton NUC1311 series microcontroller.

The NUC1311’s 5V operating voltage significantly enhances its stability and high noise immunity in harsh outdoor conditions. Furthermore, it supports Bosch-licensed CAN Bus IP, ensuring reliability and industrial-grade communication security during high-speed data transmission. These features enable the NUC1311 to provide real-time, stable smart lighting control for the Jinji Lake Trail’s interactive lighting systems and smart sensing devices, even in the humid and high-interference environment of the lakeside.

The Jinji Lake Luminous Trail was a key urban renewal project for the Suzhou Industrial Park in 2024. It involved upgrading the lighting systems of the Jinshuiwan Trestle Bridge and the lakeside walkways. By integrating technologies such as smart running poles and Bluetooth sensors, two distinctive trails were created: a 15 km smart running trail and a 3.5 km light-chasing interactive trail. The former combines smart planning and AI cameras to enable light interaction and cultural tours, while the latter utilizes DMX512 and Bluetooth dual-mode control, allowing users to select lighting effects via a mobile app for an immersive and interactive experience.

“Our years of partnership with Nuvoton have given us a deep appreciation for the high stability of their products, their comprehensive hardware and software ecosystem, and their excellent real-time service,” stated a representative from Suzhou Tianping. “These advantages are key reasons why we continue to choose Nuvoton products for our large-scale projects. We look forward to deepening our collaboration with Nuvoton in more areas in the future.”

The international design awards received by the Jinji Lake Luminous Trail not only symbolize the successful integration of technology and art but also highlight the formidable strength and international competitiveness of Nuvoton’s MCUs in the fields of smart cities, smart lighting, and interactive design. Moving forward, Nuvoton Technology will continue to provide high-quality, high-performance MCU solutions to help more partners create innovative applications and drive the development of smart cities to new heights.

The post Nuvoton NUC1311 Microcontroller Powers Jinji Lake Luminous Trail appeared first on ELE Times.

Пам'яті Касянчика Дмитра Олександровича kpi нд, 10/05/2025 - 22:59

In this article, we will examine the basic principles of FM demodulation through the simplest frequency discriminator: a differentiator.

Hi guys! Last weekend I want to play CS on my PC, but when I turned monitor on, i noticed that the indication light on monitor do not works properly, just flashing fast. I dissasembled monitor, and take the power board to my father to do diagnostic, assuming that the problem is on that component. My father told me that the problem is faulty HBR5200 SMD diode. I tried to find it in shops in my country (Serbia), but it is unsucceful. I looked on few old PCBs and find diode that could be appropriate. We used SR5200, it's not SMD diode, but we fitted it, because it has same specifications. Monitor works perffectly. submitted by /u/nikelic [link] [comments]

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Learn how the OpenGMSL standard enables edge connectivity, linking sensors and displays to zonal compute nodes in a modern software-defined vehicle (SDV) architecture.

The chronological proximity of Amazon and Google’s dueling new technology and product launch events on Tuesday and Wednesday of this week was highly unlikely to have been a coincidence. Which company, therefore, reacted to the other? Judging solely from when the events were first announced, which is the only data point I have as an outsider, it looks like Google was the one who initially put the stake in the ground on September 2nd with an X (the service formerly known as Twitter) post, with Amazon subsequently responding (not to mention scheduling its event one day earlier in the calendar) two weeks later, on September 15.

Then again, who can say for sure? Maybe Amazon started working on its event ahead of Google, and simply took longer to finalize the planning. We’ll probably never know for sure. That said, it also seems from the sidelines that Amazon might have also gotten its hands on a leaked Google-event script (to be clear, I’m being completely facetious with what I just said). That’s because, although the product specifics might have differed, the overall theme was the same: both companies are enhancing their existing consumer-residence ecosystems with AI (hoped-for) smarts, something that they’ve both already announced as an intention in the past:

• Amazon, with a generative AI evolution-for-Alexa allusion two years ago, subsequently assigned the “Alexa+” marketing moniker back in February, and
• Google, which foreshadowed the smart home migration to come within its announcement of the Google Assistant-to-Gemini transition for mobile devices back in March.

Quoting from one of Google’s multiple event-tied blog posts as a descriptive example of what both companies seemingly aspire to achieve:

The idea of a helpful home is one that truly takes care of the people inside it. While the smart home has shown flashes of that promise over the last decade, the underlying AI wasn’t anywhere as capable as it is today, so the experience felt transactional, not conversational. You could issue simple commands, but the home was never truly conversational and seldom understood your context.

 Today, we’re taking a massive step toward making the helpful home a reality with a fundamentally new foundation for Google Home, powered by our most capable AI yet, Gemini. This new era is built on four pillars: a new AI for your home, a redesigned app, new hardware engineered for this moment and a new service to bring it all together.

Amazon’s hardware “Hail Mary”

Of the two companies, Amazon has probably got the most to lose if it fumbles the AI-enhancement service handoff. That’s because, as Ars Technica’s coverage title aptly notes, “Alexa’s survival hinges on you buying more expensive Amazon devices”:

Amazon hasn’t had a problem getting people to buy cheap, Alexa-powered gadgets. However, the Alexa in millions of homes today doesn’t make Amazon money. It’s largely used for simple tasks unrelated to commerce, like setting timers and checking the weather. As a result, Amazon’s Devices business has reportedly been siphoning money, and the clock is ticking for Alexa to prove its worth.

I’m ironically a case study of Amazon’s conundrum. Back in early March, when the Alexa+ early-access program launched, I’d signed up. I finally got my “Your free Early Access to Alexa+ starts now” email on September 24, a week and a day ago, as I’m writing this on October 2. But I haven’t yet upgraded my service, which is admittedly atypical behavior for a tech enthusiast such as myself.

Why? Price isn’t the barrier in my particular case (though it likely would be for others less Amazon-invested than me); mine’s an Amazon Prime-subscribing household, so Alexa+ is bundled versus costing $19.99 per month for non-subscribers. Do the math, though, and why anyone wouldn’t go the bundle-with-Prime route is the question (which, I’d argue, is Amazon’s core motivation); Prime is $14.99 per month or $139/year right now.

So, if it’s not the service price tag, then what alternatively explains my sloth? It’s the devices—more accurately, my dearth of relevant ones—with the exception of the rarely-used Alexa app on my smartphones and tablets (which, ironically, I generally fire up only when I’m activating a new standalone Alexa-cognizant device).

Alexa+ is only supported on newer-generation hardware, whereas more than half (and the dominant share in regular use) of the devices currently activated in my household are first-generation Echoes, early-generation Echo Dots, and a Tap. With the exception of the latter, which I sometimes need to power-cycle before it’ll start streaming Amazon Music-sourced music again, they’re all still working fine, at least for the “transactional” (per Google’s earlier lingo) functions I’ve historically tasked them with.

And therefore, as an example of “chicken and the egg” paralysis, in the absence of their functional failure, I’m not motivated to proactively spend money to replace them in order to gain access to additional Alexa+ services that might not end up rationalizing the upfront investment.

Speakers, displays, and stylus-augmented e-book readers

Amazon unsurprisingly announced a bevy of new devices this week, strangely none of which seemingly justified a press release or, come to think of it, even an event video, in stark contrast to Apple’s prerecorded-only approach (blog posts were published a’plenty, however). Many of the new products are out-of-the-box Alexa+ capable and, generally speaking, they’re also more expensive than their generational precursors. First off is the curiously reshaped (compared to its predecessor) Echo Studio, in both graphite (shown) and “glacier” white color schemes:

There’s also a larger version of the now-globular Echo Dot (albeit still smaller than the also-now-globular Echo Studio), called the Echo Dot Max, with the same two color options:

And two also-redesigned-outside smart displays, the Echo Show 11 and latest-generation Echo Show 8, which basically (at least to me) look like varying-sized Echo Dots with LCDs stuck to their fronts. They both again come in both graphite and glacier white options:

and also have optional, added-price, more position-adjustable stands:

This new hardware begs the perhaps-predictable question: Why is my existing hardware not Alexa+ capable? Assuming all the deep learning inference heavy lifting is being done on the Amazon “cloud”, what resource limitations (if any) exist with the “edge” devices already residing in my (at least semi-) smart home?

Part of the answer might be with my assumption in the prior sentence; perhaps Amazon is intending for them to have limited (at least) ongoing standalone functionality if broadband goes down, which would require beefier processing and memory than that included with my archaic hardware. Perhaps, too, even if all the AI processing is done fully server-side, Amazon’s responsiveness expectations aren’t adequately served by my devices’ resources, in this case also including Wi-Fi connectivity. And yes, to at least some degree, it may just be another “obsolescence by design” case study. Sigh. More likely, my initial assumption was over-simplistic and at least a portion of the inference functions suite is running natively on the edge device using locally stored deep learning models, particularly for situations where rapid response time (vs edge-to-cloud-and-back round-trip extended latency) is necessary.

Other stuff announced this week included three new stylus-inclusive, therefore scribble-capable, Kindle Scribe 11” variants, one with a color screen, which this guy, who tends to buy—among other content—comics-themed e-books that are only full-spectrum appreciable on tablet and computer Kindle apps, found intriguing until he saw the $629.99-$679.99 price tag (in fairness, the company also sells stylus-less, but notably less expensive Colorsoft models):

and higher-resolution indoor and outdoor Blink security cameras, along with a panorama-stitching two-camera image combiner called the Blink Arc:

A curious blue re-embrace

Speaking of security cameras, Ring founder Jamie Siminoff, who had previously left Amazon post-acquisition, has returned and was on hand this week to personally unveil also-resolution-bumped (this time branded as Retinal Vision) indoor- and outdoor-intended hardware, including an updated doorbell camera model:

Equally interesting to me are Ring’s community-themed added and enhanced services: Familiar Faces, Alexa+ Greetings, and (for finding lost dogs) Search Party. And then there’s this notable revision of past stance, passed along as a Wired coverage quote absent personal commentary:

It’s worth noting that Ring has brought back features that allow law enforcement to request footage from you in the event of an incident. Ring customers can choose to share video, and they can stay anonymous if they opt not to send the video. “There is no access that we’re giving police to anything other than the ability to, in a very privacy-centric way, request footage from someone who wants to do this because they want to live in a safe neighborhood,” Siminoff tells WIRED.

A new software chapter

Last, but not least (especially in the last case) are several upgraded Fire TVs, still Fire OS-based:

and a new 4K Fire TV Stick, the latter the first out-of-box implementation example of Amazon’s newfound Linux embrace (and Linux-derived Android about-face), Vega OS:

We’d already known for a while that Amazon was shutting down its Appstore, but its Fire OS-to-Vega OS transition is more recent. Notably, there’s no more local app sideloading allowed; all apps come down from the Amazon cloud.

Google’s more modest (but comprehensive) response

Google’s counterpunch was more muted, albeit notably (and thankfully, from a skip-the-landfill standpoint) more inclusive of upgrades for existing hardware versus the day-prior comparative fixation on migrating folks to new devices, and reflective of a company that’s fundamentally a software supplier (with a software-licensing business model). Again from Wired’s coverage:

This month, Gemini will launch on every Google Assistant smart home device from the last decade, from the original 2016 Google Home speaker to the Nest Cam Indoor 2016. It’s rolling out in Early Access, and you can sign up to take part in the Google Home app.

There’s more:

Google is bringing Gemini Live to select Google Home devices (the Nest Audio, Google Nest Hub Max, and Nest Hub 2nd Gen, plus the new Google Home Speaker). That’s because Gemini Live has a few hardware dependencies, like better microphones and background noise suppression. With Gemini Live, you’ll be able to have a back-and-forth conversation with the chatbot, even have it craft a story to tell kids, with characters and voices.

But note the fine print, which shouldn’t be a surprise to anyone who’s already seen my past coverage: “Support doesn’t include third-party devices like Lenovo’s smart displays, which Google stopped updating in 2023.”

One other announced device, an upgraded smart speaker visually reminiscent of Apple’s HomePod mini, won’t ship until early next year. There was one other announced device, an upgraded smart speaker visually reminiscent of Apple’s HomePod mini, which won’t ship until early next year.

And, as the latest example of Google’s longstanding partnership with Walmart, the latter retailer has also launched a line of onn.-branded, Gemini-supportive security cameras and doorbells:

That’s what I’ve got for you today; we’ll have to see what, if anything else, Apple has for us before the end of the year, and whether it’ll take the form of an event or just a series of press releases. Until then, your fellow readers and I await your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Disassembling the Echo Studio, Amazon’s Apple HomePod foe
• Amazon’s Echo Auto Assistant: Legacy vehicle retrofit-relevant
• Lenovo’s Smart Clock 2: A “charged” device that met a premature demise
• The 2025 Google I/O conference: A deft AI pivot sustains the company’s relevance
• Google’s fall…err…summer launch: One-upping Apple with a sizeable product tranche

The post Amazon and Google: Can you AI-upgrade the smart home while being frugal? appeared first on EDN.

Візит делегації Міжнародного Комітету Червоного Хреста (ICRC) kpi пт, 10/03/2025 - 17:04

Благодійний концерт «Під покровом захисників України» у КПІ ім. Ігоря Сікорського kpi пт, 10/03/2025 - 17:01

🎨 Національний музей Тараса Шевченка запрошує на виставки та екскурсії kpi пт, 10/03/2025 - 14:32

As technology advances, most everyday devices depend on short-range communication to exchange or gather data. Although wireless technologies such as Wi-Fi and Bluetooth dominate the market, they are not always the ideal option especially for low-power applications where efficiency, simplicity, and cost management are most important. In these instances, infrared (IR) communication is still an efficient option that energizes applications such as smart meters, wearable electronics, medical devices, and remote controls.

But using an infrared link is not always easy. An IR diode cannot just be attached to a microcontroller pin and be efficient. In order to avoid saturating the diode and to provide a robust signal, a low-frequency carrier is often employed, which then must be modulated by the data stream. Historically, this has involved using more modem chips, timers, and mixers increasing cost, complexity, and additional board space to the design.

The Inefficient Signal Generation Challenge

Fundamentally, infrared communication relies on two key signals:

1. Carrier Frequency – a square wave that paces the IR diode at a suitable frequency.
2. Data Stream – the content of the communication, which must modulate the carrier.

In most implementations, these signals are from various peripherals on a microcontroller and must be merged externally. This adds more components and uses multiple I/O pins, which is not conducive to small, battery-powered devices.

A Smarter Way Forward

Since recent microcontrollers started meeting this challenge, they now provide easier mechanisms for IR signal generation. Instead of needing a separate modem chip, some of these devices combine the timer output (carrier frequency) with the communication output (data) internally. The result is a ready modulation that can directly drive an infrared diode.

An example that offers such capability is RA4C1. Being an 80 MHz device with low-power operating modes down to 1.6 V, it offers an SCI/AGT mask function that combines a UART or IrDA interface output with a timer signal and thus makes it possible to generate the required modulated IR output without any external hardware.

Design Flexibility

The reason this method is efficient is because it is flexible:

• Developers have the option of utilizing a basic UART output that is modulated by a timer-generated carrier.
• Or they can implement an integrated IrDA interface, with provisions for direct modulation or phase-inverted output based on the application requirement.

Both schemes present a clean, stable signal while minimizing the amount of external components and I/O pins needed.

For designers of small electronics like handheld meters, fitness monitors, or household appliances space and power efficiency are key considerations. An IR communication solution with minimal IR circuitry saves cost and enhances reliability by eliminating outside circuitry. It also aids in speeding up product development as engineers no longer need to spend extra time connecting individual modem chips or modulation hardware.

Conclusion:

Infrared communication remains to provide a reliable, low-cost solution for short-range connectivity, particularly in environments where the inclusion of a full radio system is not warranted. With newer microcontrollers embracing built-in modulation capabilities, establishing an IR connection has never been simpler. This change makes it possible for developers to provide smarter, power-sensing products while maintaining simplicity and low cost.

(This article has been adapted and modified from content on Renesas.)

The post Infrared Communication Made Simple for Everyday Devices appeared first on ELE Times.

Power over Ethernet (PoE) is not rocket science, but it’s not plug-and-play magic either. This short primer walks through the basics with a few practical nudges for those curious to try it out.

It’s a technology that delivers electrical power alongside data over standard twisted-pair Ethernet cables. It enables a single RJ45 cable to supply both network connectivity and power to powered devices (PDs) such as wireless access points, IP cameras, and VoIP phones, eliminating the need for separate power cables and simplifying installation.

PoE essentials: From devices to injectors

Any network device powered via PoE is known as a powered device or PD, with common examples including wireless access points, IP security cameras, and VoIP phones. These devices receive both data and electrical power through Ethernet cables from power sourcing equipment (PSE), which is classified as either “endspan” or “midspan.”

An endspan—also called an endpoint—is typically a PoE-enabled network switch that directly supplies power and data to connected PDs, eliminating the need for a separate power source. In contrast, when using a non-PoE network switch, an intermediary device is required to inject power into the connection. This midspan device, often referred to as a PoE injector, sits between the switch and the PD, enabling PoE functionality without replacing existing network infrastructure. A PoE injector sends data and power together through one Ethernet cable, simplifying network setups.

Figure 1 A PoE injector is shown with auto negotiation that manages power delivery safely and efficiently. Source: http://poe-world.com

The above figure shows a PoE injector with auto negotiation, a safety and compatibility feature that ensures power is delivered only when the connected device can accept it. Before supplying power, the injector initiates a handshake with the PD to detect its PoE capability and determine the appropriate power level. This prevents accidental damage to non-PoE devices and allows precise power delivery—whether it’s 15.4 W for Type 1, 25.5 W for Type 2, or up to 90 W for newer Type 4 devices.

Note at this point that the original IEEE 802.3af-2003 PoE standard provides up to 15.4 watts of DC power per port. This was later enhanced by the IEEE 802.3at-2009 standard—commonly referred to as PoE+ or PoE Plus—which supports up to 25.5 watts for Type 2 devices, making it suitable for powering VoIP phones, wireless access points, and security cameras.

To meet growing demands for higher power delivery, the IEEE introduced a new standard in 2018: IEEE 802.3bt. This advancement significantly increased capacity, enabling up to 60 watts (Type 3) and circa 100 watts (Type 4) of power at the source by utilizing all four pairs of wires in Ethernet cabling compared to earlier standards that used only two pairs.

As indicated previously, VoIP phones were among the earliest applications of PoE. Wireless access points (WAPs) and IP cameras are also ideal use cases, as all these devices require both data connectivity and power.

Figure 2 This PoE system is powering a fixed wireless access (FWA) device.

As a sidenote, an injector delivers power over the network cable, while a splitter extracts both data and power—providing an Ethernet output and a DC plug.

A practical intro to PoE for engineers and DIYers

So, PoE simplifies device deployment by delivering both power and data over a single cable. For engineers and DIYers looking to streamline installations or reduce cable clutter, PoE offers a clean, scalable solution.

This brief session outlines foundational use cases and practical considerations for first-time PoE users. No deep dives: just clear, actionable insights to help you get started with smarter, more efficient connectivity.

Up next is the tried-and-true schematic of a passive PoE injector I put together some time ago for an older IP security camera (24 VDC/12 W).

Figure 3 Schematic demonstrates how a passive PoE injector powers an IP camera. Source: Author

In this setup, the LAN port links the camera to the network, and the PoE port delivers power while completing the data path. As a cautionary note, use a passive PoE injector only when you are certain of the device’s power requirements. If you are unsure, take time to review the device specifications. Then, either configure a passive injector to match your setup or choose an active PoE solution with integrated negotiation and protection.

Fundamentally, most passive PoE installations operate across a range of voltages, with 24 V often serving as practical middle ground. Even lower voltages, such as 12 V, can be viable depending on cable length and power requirements. However, passive PoE should never be applied to devices not explicitly designed to accept it; doing so risks damaging the Ethernet port’s magnetics.

Unlike active PoE standards, passive PoE delivers power continuously without any form of negotiation. In its earliest and simplest form, it leveraged unused pairs in Fast Ethernet to transmit DC voltage—typically using pins 4–5 for positive and 7–8 for negative, echoing the layout of 802.3af Mode B. As Gigabit Ethernet became common, passive PoE evolved to use transformers that enabled both power and data to coexist on the same pins, though implementations vary.

Seen from another angle, PoE technology typically utilizes the two unused twisted pairs in standard Ethernet cables—but this applies only to 10BASE-T and 100BASE-TX networks, which use two pairs for data transmission.

In contrast, 1000BASE-T (Gigabit Ethernet) employs all four twisted pairs for data, so PoE is delivered differently—by superimposing power onto the data lines using a method known as phantom power. This technique allows power to be transmitted without interfering with data, leveraging the center tap of Ethernet transformers to extract the common-mode voltage.

PoE primer: Surface touched, more to come

Though we have only skimmed the surface, it’s time for a brief wrap-up.

Fortunately, even beginners exploring PoE projects can get started quickly, thanks to off-the-shelf controller chips and evaluation boards designed for immediate use. For instance, the EV8020-QV-00A evaluation board—shown below—demonstrates the capabilities of the MP8020, an IEEE 802.3af/at/bt-compliant PoE-powered device.

Figure 4 MPS showcases the EV8020-QV-00A evaluation board, configured to evaluate the MP8020’s IEEE 802.3af/at/bt-compliant PoE PD functionality. Source: MPS

Here are my quick picks for reliable, currently supported PoE PD interface ICs—the brains behind PoE:

• TI TPS23730 – IEEE 802.3bt Type 3 PD with integrated DC-DC controller
• TI TPS23731 – No-opto flyback controller; compact and efficient
• TI TPS23734 – Type 3 PD with robust thermal performance and DC-DC control
• onsemi NCP1081 – Integrated PoE-PD and DC-DC converter controller; 802.3at compliant
• onsemi NCP1083 – Similar to NCP1081, with auxiliary supply support for added flexibility
• TI TPS2372 – IEEE 802.3bt Type 4 high-power PD interface with automatic MPS (maintain power signature) and autoclass

Similarly, leading semiconductor manufacturers offer a broad spectrum of PSE controller ICs for PoE applications—ranging from basic single-port controllers to sophisticated multi-port managers that support the latest IEEE standards.

As a notable example, TI’s TPS23861 is a feature-rich, 4-channel IEEE 802.3at PSE controller that supports auto mode, external FET architecture, and four-point detection for enhanced reliability, with optional I²C control and efficient thermal design for compact, cost-effective PoE systems.

In short, fantastic ICs make today’s PoE designs smarter and more efficient, especially in dynamic or power-sensitive environments. Whether you are refining an existing layout or venturing into high-power applications, now is the time to explore, prototype, and push your PoE designs further. I will be here.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

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• Simple circuit design tutorial for PoE applications
• Power over Ethernet (PoE) grows up: it’s now PoE+
• Power over Ethernet (PoE) to Power Home Security & Health Care Devices

The post PoE basics and beyond: What every engineer should know appeared first on EDN.

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