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In my recent 2nd generation Google Chromecast teardown, “The Google Chromecast Gen 2 (2015): A Form Factor Redesign with Beefier Wi-Fi, Too,” I noted that I subsequently planned on tearing down the Chromecast Ultra, followed by the 3rd generation Chromecast, chronologically ordered per their respective introduction dates (2016 and 2018).

I’ve subsequently decided to flip-flop that ordering, tackling the 3rd generation Chromecast first, in the interest of grouping together devices with output resolution commonality. All three Chromecast generations, also including 2013’s original version, peak-output 1080p video, although the 3rd generation model also bumped up the frame rate from 30 fps to 60 fps; the Ultra variant you’ll see in the near future conversely did 4K. If you’re wondering why I’m referring to them all in the past tense, by the way, it’s because none of them are in production any longer, although everything but the first-generation Chromecast still gets software updates.

Google also claimed at intro that the Chromecast 3 not only came in new color options:

but was also 15% faster than its predecessor (along with adding support for Dolby Digital Plus and fully integrated Chromecast with Nest smart speakers), although the company was never specific about what “15% faster” meant. Was it only in reference to the already mentioned 1080p60 smoother video-playback option? One might deduce that it also referred to more general UI responsiveness, but if true was this due to faster innate processing—which all users would conceivably experience—or higher wireless network performance, only for those with advanced LANs? Or both? I hope this teardown will help answer these and other questions (like why does Wikipedia list no CPU or memory details for this generation?) to at least a degree.

Generally speaking, I try whenever possible to avoid teardowns of perfectly good hardware that end up being destructive, i.e., leaving the hardware in degraded condition that precludes me from putting it back together afterwards and donating it to someone else. In such cases, I instead strive to focus my attention on already nonfunctional “for parts only” devices sourced from eBay and elsewhere. This time, however, all I could find were still-working eBay options:

although the one I picked was not only inexpensive ($10 plus shipping and sales tax, $16.63 total) but was absent its original packaging:

Here’s a closeup of the micro-USB connector—a legacy approach that’s rapidly being obsoleted by the USB-C successor—at the other end of the USB-A power cable:

And here’s a top view of our patient, as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Followed by a closeup of the top of the main body:

Same goes for the underside:

That printing on the bottom is quite scuffed at this seeming long-time use point, although I suspect it was already faint from the get-go. In the center are “UL Listed” and HDMI logos, with the phrase “ITE E258392” in-between them. And here’s what it says around the circumference:

Google Model NC2-685
1600 Amphitheater Parkway
Mountain View, CA 94043
CAN ICES-3
(B)NMB-3(B)
IC 10395A-NC26A5
FCC ID A4RNC2-6A5B
Made in Thailand
06041HFADVM445

…whatever (some of, I already get the rest of) that means. And phew!

Here’s the HDMI connector on one end of the cable:

And jumping ahead in time a bit, the other end, entering the partially disassembled body:

Back to where we were before in time, the opposite side of the body showcases, left to right, a hardware reset button (you can also reset via software, if the Chromecast is already activated and mobile device-connected), the aforementioned micro-USB power input and a status LED:

Speaking of sides, you probably already noticed the seam around the circumference of the main body. Also speaking of sides, let’s see if it gets us inside. First off, I used the warmed-up iOpener introduced previously in the Chromecast 2 teardown to heat up the presumed glue holding the two halves together at the seam:

Then I set to work with its iFixit-companion Jimmy:

which got me partly, albeit not completely, to my desired end result, complete with collateral damage in the process:

I suspected that the diminutive dallop of under-case thermal paste I’d encountered with the 2nd-generation Chromecast was more substantially applied this time, to counteract the higher heat output associated with the 3rd-generation unit’s “15% faster” boast. So, I reheated the iOpener, reoriented it on the device, waited some more:

and tried, tried again. Yep, there’s paste inside:

Veni, vidi, vici (albeit, in this case, not particularly swiftly):

My, that’s a lot of (sloppily applied, to boot) glue:

The corresponding paste repository on the inside of the upper-case half is an odd spongy donut-shaped thing. I’ve also scraped away some of the obscuring black paint to reveal the metallic layer beneath it, which presumably acts as a secondary heat sink:

Some rubbing alcohol and a tissue cleaned the blue-green goop off the Faraday cage:

Although subsequently removing the retaining screws on either side of the HDMI cable did nothing to get the cage itself off:

Resigning me to just ripping it off (behavior that, as you’ll soon see, wasn’t a one-time event):

Followed by (most of) the black tape underneath it:

I never actually ever got the HDMI cable detached from the lower-case half, but with the screws removed, I was at least able to disconnect it from the PCB:

enabling me to remove the PCB from the remainder of the case…at least theoretically:

This Chromecast-generation time around, there’s an abundance of thermal paste on both sides:

Even after jamming the Jimmy in the gap in attempting to cut the offending paste in half, I still wasn’t able to separate the PCB from the case, specifically down at the bottom where the micro-USB connector was. The ambient light in the room was starting to get dim and I needed to leave for Mass soon, so I—umm—just gave the PCB a yank, ripping it out of the case:

and quickly snapped the remainder of the photos you’ll see, including the first glimpse of the bottom of the PCB:

When I got back home and reviewed the shots, I was first flummoxed, then horrified, and finally (to this very day, in fact) mortified and embarrassed. And I bet that at least a few of you eagle-eyed readers already know where I’m going with this. What’s that in the bottom left-ish edge of the inside of the back half of the case (with the reset button rubber “spring” to its left and the light guide for the activity LED to its right)? Is that…a still-attached screw? Surrounded by a chunk of PCB?

Yes…yes it is. This dissected device is destined solely for the landfill, “thanks” to my rushed ham-handedness. Sigh:

Guess I might as well get this Faraday cage off too:

And clean off the additional inside paste:

The IC in the upper left is Marvell’s Avastar 88W8887 quad wireless transceiver, supporting 1×1 802.11ac, Bluetooth 4.1, NFC and FM, only some of these functions actually implemented in this design. It’s the same chip used in the 2nd generation Chromecast, so the basis for the “15% faster” claim seemingly doesn’t seemingly source here. Next to it on the right is a SK Hynix H5TC4G63EFR-RDA 4 Gbit LPDDR3-1866 SDRAM. Note too the LED in the lower left corner, and the PCB-embedded antennae on both sides. And, since this PCB is “toast” anyway (yes, note the chunk out of it in the lower right, too), I went ahead and lifted the upper right corner of the cage frame to assure myself (and you) that nothing meaningful was hiding underneath:

Back to the previously seen front side of the PCB:

At far left (with the hardware reset switch below it in the lower left corner…and did I mention yet the missing chunk of PCB to the right of it?), peeking out from the cage frame, is a small, obviously Marvell-sourced, IC labeled as follows (ID, anyone?):

MRVL
G868
952GAX

which I suspect has the same (unknown) function(s) as a similarly (but not identically) labeled chip I’d found in the 2nd-generation Chromecast:

MRVL
G868
524GBD

To its left is the much larger Synaptics MM3006, formerly known as the Marvell 88DE3006 (Synaptics having acquired Marvell’s Multimedia Solutions Business in mid-2017). Again, it’s the same IC as in the 2nd generation Chromecast. And finally, at far right is a Toshiba TC58NVG2S0 4 Gbit NAND flash memory. Same flash memory supplier as before. Same flash memory technology as before. But hey, twice the capacity as before (presumably to provide headroom for the added firmware “support for Dolby Digital Plus and fully integrated Chromecast with Nest smart speakers” mentioned earlier)! So, there’s that…

Aside from a bigger flash memory chip (and, ok, getting rid of the magnet integrated into the Chromecast 2’s HDMI connector), what’s different between the 2nd and 3rd generation Chromecasts, and where does Google’s “15% faster” claim come from? The difference, I suspect, originates with the DRAM. I hadn’t specifically mentioned this in the previous teardown, but the Samsung DRAM found there, while also LPDDR3 in technology and 4 Gbit in capacity, was a “K0” variant reflective of a 1600 MHz speed bin. This time, conversely and as already noted, the DRAM runs at 1866 MHz. My guess is that this uptick also corresponds to a slightly faster speed bin for the Marvell-now-Synaptics application processor. And therein lies, between the two, the modest overall system performance boost.

Agree or disagree, readers? Any other thoughts? Let me know in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• The Google Chromecast Gen 2 (2015): A Form Factor Redesign with Beefier Wi-Fi, Too
• Google’s Chromecast with Google TV: Car accessory similarity, and a post-teardown resurrection opportunity?
• The Google Chromecast with Google TV: Realizing a resurrection opportunity
• Google’s Chromecast with Google TV: Dissecting the HD edition
• Teardown: Chromecast streams must have gotten crossed

The post The Google Chromecast Gen 3: Gluey and screwy appeared first on EDN.

The Defence Research and Development Organisation (DRDO) of India has been instrumental in advancing indigenous unmanned aerial vehicle (UAV) technologies to meet the diverse operational requirements of the Indian Armed Forces. Among its notable developments is the Trinetra UAV, a cutting-edge drone system designed to enhance surveillance, reconnaissance, and tactical operations.

Design and Development

The Trinetra UAV, aptly named after the Sanskrit term for “Three Eyes,” signifies a comprehensive surveillance capability. This UAV is engineered to be lightweight and highly portable, primarily constructed from advanced composite materials that ensure structural integrity while minimizing weight. Its compact design facilitates rapid deployment across various terrains, making it an invaluable asset for field operations.

One of the standout features of the Trinetra is its Vertical Take-Off and Landing (VTOL) capability. Utilizing a quadcopter configuration, the UAV can ascend and descend vertically, negating the need for traditional runways or launch systems. This attribute is particularly advantageous in confined or rugged environments where conventional take-off and landing are impractical.

Technical Specifications

While specific technical details of the Trinetra UAV remain classified, insights can be drawn from DRDO’s previous UAV projects, such as the Netra series. The Netra V4+, for instance, boasts an operational range of up to 10 kilometers and a flight endurance exceeding 60 minutes at mean sea level. It is equipped with a high-resolution imaging payload featuring a 10x optical zoom, enabling detailed surveillance from significant distances. Additionally, the Netra V4+ can operate at altitudes up to 400 meters Above Ground Level (AGL) and is designed for ease of transport and quick assembly, weighing approximately 6.5 kilograms.

Given the evolutionary nature of DRDO’s UAV development, it is plausible that the Trinetra UAV incorporates similar or enhanced specifications, tailored to meet the specific demands of modern military operations.

Operational Capabilities

The Trinetra UAV is designed to execute a wide array of missions, encompassing intelligence gathering, border surveillance, and tactical support. Its VTOL capability ensures that it can be deployed in diverse environments without the constraints associated with traditional UAV launch and recovery methods.

Equipped with advanced electro-optical and infrared sensors, the Trinetra provides real-time video streaming and high-resolution imagery, facilitating both day and night operations. This dual-sensor setup ensures continuous situational awareness, enabling ground commanders to make informed decisions based on live intelligence.

Autonomous navigation is a cornerstone of the Trinetra’s operational design. The UAV can follow pre-programmed flight paths using waypoint navigation, allowing it to conduct missions with minimal human intervention. In scenarios where communication is disrupted or battery levels are critically low, the Trinetra is programmed to autonomously return to its launch point, ensuring mission continuity and asset recovery.

Recent Developments

In a strategic move to enhance its unmanned capabilities, the Indian Army has placed a significant order for nearly 700 Trinetra drones. This procurement aims to bolster surveillance and reconnaissance operations, particularly in challenging terrains such as the Himalayas. The deployment of these drones is expected to provide real-time intelligence, thereby improving operational efficiency and response times. This acquisition aligns with the broader strategy of integrating advanced indigenous unmanned systems into the armed forces to address contemporary security challenges.

Strategic Implications

The induction of the Trinetra UAV into the Indian Armed Forces signifies a pivotal shift towards embracing indigenous technologies for defense applications. This move not only reduces dependency on foreign systems but also fosters self-reliance in critical defense technologies. The Trinetra’s capabilities are poised to enhance border surveillance, counter-insurgency operations, and disaster management efforts. Its real-time intelligence-gathering prowess is expected to be a force multiplier, providing commanders with actionable insights and facilitating informed decision-making in complex operational environments.

Conclusion

The DRDO’s Trinetra UAV represents a significant advancement in India’s unmanned aerial capabilities. Its blend of cutting-edge technology, autonomous features, and adaptability to diverse mission requirements positions it as a pivotal asset in modern warfare and surveillance. As the Indian Armed Forces continue to integrate such indigenous systems, the Trinetra UAV stands as a testament to India’s commitment to technological innovation and self-reliance in defense.

The post The Rise of DRDO’s Trinetra UAV in India’s Defense Landscape appeared first on ELE Times.

Лекція «Невідомі сторони війни: 36 років журналістського досвіду» від Норіто Кунісуе kpi вт, 02/18/2025 - 14:08

Since gallium nitride (GaN) suppliers have taken various approaches to package types and sizes, leading to fragmentation and a lack of multiple footprint-compatible sources for customers, Infineon Technologies AG of Munich, Germany has launched the high-performance CoolGaN G3 Transistor 100V in RQFN 5x6 package (IGD015S10S1) and 80V in RQFN 3.3x3.3 package (IGE033S08S1)...

Gallium Nitride (GaN) technology plays a crucial role in enabling power electronics to reach the highest levels of performance. However, GaN suppliers have thus far taken different approaches to package types and sizes, leading to fragmentation and lack of multiple footprint-compatible sources for customers. Infineon Technologies AG addresses this challenge by announcing the high-performance gallium nitride CoolGaN G3 Transistor 100 V in RQFN 5×6 package (IGD015S10S1) and 80 V in RQFN 3.3×3.3 package (IGE033S08S1).

“The new devices are compatible with industry-standard silicon MOSFET packages, meeting customer demands for a standardized footprint, easier handling and faster-time-to- market,” said, Dr. Antoine Jalabert, Product Line Head for mid-voltage GaN at Infineon.

The CoolGaN G3 100 V Transistor devices will be available in a 5×6 RQFN package with a typical on-resistance of 1.1 mΩ. Additionally, the 80 V transistor in a 3.3×3.3 RQFN package has a typical resistance of 2.3 mΩ. These transistors offer a footprint that, for the first time, allows for easy multi-sourcing strategies and complementary layouts to Silicon-based designs. The new packages in combination with GaN offer a low-resistance connection and low parasitics, enabling high performance transistor output in a familiar footprint.

Moreover, this chip and package combination allows for high level of robustness in terms of thermal cycling, in addition to improved thermal conductivity, as heat is better distributed and dissipated due to the larger exposed surface area and higher copper density.

The post Infineon introduces CoolGaN G3 Transistor in new Silicon- footprint packages to drive industry-wide standardization appeared first on ELE Times.

India’s unmanned aerial vehicle (UAV) industry is soaring to new heights, fueled by rapid technological advancements, policy support, and increasing demand across diverse sectors. From bolstering national security to revolutionizing precision agriculture and infrastructure monitoring, drones are becoming indispensable assets. As the Indian government pushes for self-reliance under the “Make in India” initiative, domestic UAV manufacturers are stepping up with cutting-edge innovations and indigenous designs. In this evolving landscape, several companies are leading the charge, redefining aerial intelligence and automation. Here’s a look at the top 10 UAV manufacturers shaping India’s drone ecosystem in 2025.

1. ideaForge Technology Limited

Established in 2007, ideaForge is a Mumbai-based UAV manufacturer renowned for designing and developing drones tailored for mapping, security, and surveillance applications. Serving defense forces and various government departments, ideaForge holds a significant position in the Indian drone industry. In July 2023, the company marked a milestone by launching its initial public offering (IPO), underscoring its growth trajectory. At Aero India 2025, ideaForge unveiled four new UAVs: NETRA 5, SWITCH V2, a Tactical UAV concept, and a Logistics UAV concept, each designed to address operational challenges in high-stakes environments.

2. Asteria Aerospace

Asteria Aerospace is a prominent player in the Indian drone industry, focusing on the development of UAVs for diverse applications across defense and industrial sectors. The company offers a range of drone solutions tailored to meet specific operational requirements, emphasizing innovation and reliability in its products.

3. Zen Technologies

Specializing in defense training solutions, Zen Technologies has expanded its portfolio to include UAVs and related systems for military applications. Leveraging its expertise in simulation and training, the company provides comprehensive drone solutions that enhance defense capabilities and operational readiness.

4. Paras Defence and Space Technologies

Paras Defence is engaged in the design, development, and manufacturing of a wide array of defense and space engineering products, including UAVs. Catering to various segments of the Indian defense industry, the company contributes to the nation’s strategic capabilities by delivering advanced drone technologies and solutions.

5. Garuda Aerospace

Based in Chennai, Garuda Aerospace offers drone-based solutions across multiple sectors, including agriculture, infrastructure, and surveillance. The company’s focus on delivering cost-effective and efficient UAV services has positioned it as a key player in the Indian drone ecosystem, addressing diverse industry needs with innovative approaches.

6. Aarav Unmanned Systems

Aarav Unmanned Systems specializes in providing drone solutions for industrial applications such as mining, urban planning, and agriculture. Their UAVs are engineered to deliver high-quality data, facilitating informed decision-making processes and enhancing operational efficiency across various sectors.

7. NewSpace Research & Technologies

Headquartered in Bengaluru, NewSpace Research & Technologies focuses on developing persistent drones for earth observation and communications. Collaborating with Hindustan Aeronautics Limited (HAL), the company is instrumental in projects like the Combat Air Teaming System (CATS) Infinity, a high-altitude pseudo-satellite UAV designed for extended endurance and strategic operations.

8. Throttle Aerospace Systems Pvt Ltd

Throttle Aerospace Systems (TAS), based in Bengaluru, is a leading entity in the Indian drone manufacturing sector. As the first Directorate General of Civil Aviation (DGCA)-approved maker of civil drones and licensed to produce military drones, TAS offers a range of innovative products and solutions aimed at transforming mobility across various industries.

9. Drones Origin Private Limited

Located in Hyderabad, Drones Origin Private Limited specializes in the indigenous design and manufacturing of drone and UAV components. Positioning itself as a one-stop solution for various drone-related needs, including propulsion and custom designs, the company emphasizes self-reliance and aligns with the ‘Make in India’ initiative, contributing to the nation’s growing drone manufacturing industry.

10. IG Drones

IG Drones is recognized as one of the top ‘Made-in-India’ drone manufacturers, contributing significantly to the country’s UAV landscape. The company focuses on delivering innovative drone solutions that cater to various industry requirements, enhancing operational efficiency and productivity.

 

The rapid expansion of India’s UAV industry is a testament to the technological advancements and entrepreneurial spirit driving the sector. These top 10 manufacturers exemplify the country’s commitment to innovation, self-reliance, and the strategic integration of drone technology across multiple domains.

The post Top 10 UAV Manufacturers in India appeared first on ELE Times.

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At NORD DRIVESYSTEMS, our sustainability strategy for 2025 focuses on acting in an environmentally conscious, responsible and integer manner. A cross-divisional team as well as the management and owners are part of the implementation. Besides NORD’s products, it includes four further fields of action.

 “Our sustainability strategy for 2025 is a promise to our customers, to the public and to ourselves to consequently act in an ecological, economic and socially responsible manner”, emphasizes Carolin von Rönne from the area of Process and Organisational Development & Corporate Sustainability Management at NORD DRIVESYSTEMS. The strategy comprises five key aspects:

Products

When it comes to sustainability, our products at NORD are also our top priority. This is because the design, life cycle and application areas have an impact on the environment. The concept of sustainability is therefore already rooted in the product development process. “Drives can be found in many areas of industry, where they consume a large proportion of the energy used,” explains Carolin von Rönne. “With efficient drive solutions such as the IE5+ synchronous motor, we want to make a significant contribution to reducing CO₂ emissions.“ The NORD ECO service furthermore supports companies in finding the most efficient drive solutions for them.

Governance & processes

The sustainability management was introduced at NORD in 2022. Since then, the company has achieved important milestones such as an annual sustainability report according to GRI, environmental certifications and the integration of international structures. The central objective in this field of action is the establishment of an international governance structure and CSRD-compliant reporting for the entire NORD DRIVESYSTEMS Group with 48 subsidiaries in 36 countries because the success of other factors – in

Environment

In order to coordinate structured measures and document them in a legally secure manner, international environmental management is essential for NORD. This is implemented in accordance with ISO14001 for the largest subsidiaries. In addition, the climate balance for Scope 1–3 is determined group-wide. NORD DRIVESYSTEMS Group further aims to reduce its energy consumption and amount of waste as well as increase the share of self-produced electric power and the use of renewable energies. Existing biodiversity areas are to be further expanded.

People

In times of skills shortage, NORD continues to increase its attractiveness as an employer. The company is currently rolling out a global digital learning management system to offer all employees the opportunity for further individual development. Further targeted campaigns and measures are intended to promote diversity among the workforce. “Inclusion, respect for human rights, strengthening our work culture, safety and continuous transfer of knowledge are only some of the topics we would like to promote”, says Carolin von Rönne.

Supply chain

NORD wants to reassure its customers and employees that sustainable production is given high priority both at manufacturing facilities and in the upstream supply chain. Risk analyses and other processes are carried out within the framework of the Germany Act on Corporate Due Diligence Obligations in Supply Chains (LKSG).

The post NORD DRIVESYSTEMS SUSTAINABILITY STRATEGY FOR 2025 appeared first on ELE Times.

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For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The high-speed operation, large integration density, cost-effectiveness, and excellent reliability have contributed to the widespread adoption of DRAM technology in many electronic devices.

DRAM bit cell—the element that stores one bit of information—has a very basic structure. It consists of one capacitor (1C) and one transistor (1T) integrated close to the capacitor. While the capacitor’s role is to store a charge, the transistor is used to access the capacitor, either to read how much charge is stored or to store a new charge.

The 1T-1C bit cells are arranged in arrays containing word and bit lines, and the word line is connected to the transistors’ gate, which controls access to the capacitor. The memory state can be read by sensing the stored charge on the capacitor via the bit line.

Over the years, the memory community introduced subsequent generations of DRAM technology, enabled by continuous bit-cell density scaling. Current DRAM chips belong to the ’10-nm class’ (denoted as D1x, D1y, D1z, D1a…), where the half pitches of the active area in the memory cell array range from 19 nm down to 10 nm. However, the AI-driven demand for better performing and larger capacity DRAM is propelling R&D into beyond 10-nm generations.

This requires innovations in capacitors, access transistors, and bit cell architectures. Examples of such innovations are high-aspect ratio pillar capacitors, the move from saddle-shaped (FinFET-based) access transistors to vertical-gate architectures, and the transition from 6F2 to 4F2 cell designs—F being the minimum feature size for a given technology node.

A closer look inside a planar 1T-1C DRAM chip: The peripheral circuit

To enable full functionality of the DRAM chip, several other transistors are needed besides the access transistors. These additional transistors play a role in, for example, the address decoder, sense amplifier, or output buffer function. They are called DRAM peripheral transistors and are traditionally fabricated next to the DRAM memory array area.

Figure 1 The 1T-1C-based DRAM memory array and DRAM peripheral area are shown inside a DRAM chip. Source: imec

DRAM peripheral transistors can be grouped into three main categories. The first category is regular logic transistors: digital switches that are repeatedly turned on and off. The second category is sense amplifiers—analog types of transistors that sense the difference in charge between two-bit cells. A small positive change is amplified into a high voltage (representing a logic 1) and a small negative change into zero voltage (representing a logical 0).

These logical values are then stored in a structure of latches called the row buffer. The sense amplifiers typically reside close to the memory array, consuming a significant area of the DRAM chip. The third category is row decoders: transistors that pass a relatively high bias (typically around 3 V) to the memory element to support the write operation.

To keep pace with the node-to-node improvement of the memory array, the DRAM periphery evolves accordingly in terms of area reduction and performance enhancement. In the longer term, more disruptive solutions may be envisioned that break the traditional ‘2D’ DRAM chip architecture. One option is to fabricate the DRAM periphery on a separate wafer, and bond it to the wafer that contains the memory array, following an approach introduced in 3D NAND.

Toward a single and thermally stable platform optimized for peripheral transistors

The three groups of peripheral transistors come with their own requirements. The regular logic transistors must have good short channel control, high on current (Ion), and low off current (Ioff). With these characteristics, they closely resemble the logic transistors that are part of typical systems-on-chips (SoCs). They also need to enable multiple threshold voltages (Vth) to satisfy different design requirements.

The other two categories have more dissimilar characteristics and do not exist in typical logic SoCs. The analog sense amplifier requires good amplification, benefitting from a low threshold voltage (Vth). In addition, since signals are amplified, the mismatch between two neighboring sense amplifiers must be as low as possible. The ideal sense amplifier, therefore, is a very repeatable transistor with good analog functionality.

Finally, the row decoder is a digital transistor that needs an exceptionally thick gate oxide—compared to an advanced logic node—to sustain the higher bias. This makes the transistor inherently more reliable at the expense of being slower in operation.

Figure 2 Here are the main steps needed to fabricate a transistor for DRAM peripheral applications; the critical modules requiring specific developments are underlined. Source: PSS

In addition to these specific requirements, there are a number of constraints that apply to all peripheral transistors. One critical issue is the thermal stability. In current DRAM process flows with DRAM memory arrays sitting next to the periphery, peripheral transistors are fabricated before DRAM memory elements. The periphery is thus subjected to several thermal treatments imposed by the fabrication of the storage capacitor, access transistor, and memory back-end-of-line.

Peripheral transistors must, therefore, be able to withstand ‘DRAM memory anneal’ temperatures as high as 550-600°C for several hours. Next, the cost-effectiveness of DRAM chips must be preserved, driving the integration choices toward simpler process solutions than what logic flows are generally using.

To keep costs down, the memory industry also favors a single technology platform for various peripheral transistors—despite their individual needs. Additionally, there is a more aggressive requirement for low leakage and low power consumption, which benefits multiple DRAM use cases, especially mobile ones.

The combination of all these specifications makes a direct copy of the standard logic process flow impossible. It requires optimization of specific modules, including the transistors’ gate stack, source/drain junctions, and source/drain metal contacts.

Editor’s Note: This is first part of the article series about the latest advancements in DRAM designs. This part focuses on DRAM basics, peripheral circuits, and the journey toward a single, cost-effective, and thermally stable technology platform optimized for peripheral transistors. The second part will provide a detailed account of DRAM periphery advancements.

Alessio Spessot, technical account director, has been involved in developing advanced CMOS, DRAM, NAND, emerging memory array, and periphery during his stints at Micron, Numonyx, and STMicroelectronics.

Naoto Horiguchi, director of CMOS device technology at imec, has worked at Fujitsu and the University of California Santa Barbara while being involved in advanced CMOS device R&D.

Related Content

• DRAM gets more exotic
• FCRAM 101: Understanding the Basics
• DRAM: the field for material and process innovation
• Winbond’s innovative DRAM design and the legacy of Qimonda
• DRAM technology for SOC designers and—maybe—their customers

The post DRAM basics and its quest for thermal stability by optimizing peripheral transistors appeared first on EDN.

Візит делегації компанії NZIA Connect Inc. kpi пн, 02/17/2025 - 19:58

A blast from the past

Older folks may recall the famous Tektronix 576 and 577 curve tracers from half a century ago. A few of these have survived the decades and ended up in some lucky engineer’s home/work lab.

Wow the engineering world with your unique design: Design Ideas Submission Guide

We were able to acquire a Tek 577 curve tracer with a Tek 177 standard test fixture from a local surplus house that had been used at Sandia Labs, but it was not functional. Even being non-functional, these old relics still command a high price, which set us back $500!! With the help of an on-line service manual and some detailed troubleshooting, the old 577 was revived by replacing all the power supply’s electrolytic capacitors and a few op-amps, plus removing the modifications Sandia had installed.

Once operational we went looking for the various Tek device under test (DUT) adapters for the Tek 177 standard test fixture, these adapters are indeed rare and likewise expensive which sent us on the DIY journey!

The DIY journey

Observing a similar path to Jay_Diddy_B1 [1], we set out to develop a DIY adapter to replace the rare and expensive Tek versions. Like the popular T7 multi-function component tester, which employs a small ZIF socket for leaded-component attachment that works very well; we decided to do the same for the custom Tek adapter using the right and left sides of the ZIF socket to facilitate DUT comparisons with the Tek 177 standard test fixture. This can be seen in Figure 1.

Figure 1 Custom ZIF-based Tek 577 adapter where the right and left sides of the ZIF socket facilitate DUT comparisons with the Tek 177 standard test fixture.

As shown in Figure 2, a low-cost PCB was developed with SMD ferrites added to the nominal “Collector” and “Base” 577 terminals to help suppress any parasitic DUT oscillations. Connectors were also added to allow for external cables if desired (something we have never used). The general idea was to use the 6 banana jacks as support for holding the PCB in place with the ZIF on top of the PCB where one can directly attach various DUTs.

This approach has worked well and allows easy attachment of various leaded-components including the T0-126 and T0-220 power devices.

Figure 2 The custom adapter installed on the Tek 177 standard test fixture.

Applying the curve tracer to an SMD DUT

However, this still leaves the SMD types in need of a simple means to apply with the Tek 577 curve tracer with the 177 fixture; we set out to investigate this.

After studying the methods Tektronix utilized, we discovered some low-cost toggle clamps (found on AliExpress and elsewhere) which are used for clamping planar objects to a surface for machining. Figure 3 shows the custom toggle clamps used on a custom SMD DUT along with the custom adapter installed on the Tek 177 standard text fixture.

Figure 3 Custom toggle-type SMD adapter for the Tek 577 where using the pair of toggle arms allows both the right and left sides of the Tek 177 fixture to be utilized for direct SMD component comparisons.

These clamps could be repurposed to act as a clamp to hold a SMD DUT in place, which resulted in a custom PCB being developed to mount directly on top of the ZIF-based PCB previously discussed (Figure 4).

Figure 4 The custom SMD PCB that can be used with toggle clamps. This can be installed on the Tek 177 fixture for the Tek 577.

The toggle arms allow slight pressure to be applied to the SMD DUT where the leads make contact with the PCB’s exposed surfaces. Using a pair of toggle arms allows both the right and left sides of the Tek 177 fixture to be utilized for direct SMD component comparisons.

A connector on the rear of the PCB is mounted on the bottom side and mates with another connector on the ZIF type PCB, which allows connection to the 6 banana jacks that plug into the Tek 177 Fixture. Four nylon standoffs provide mechanical support and hold the two PCBs together. This setup allows easy SMD component installation and removal with little effort. Figure 5 shows both adapters for the Tek 577 with 177 standard test fixture.

Figure 5 Both adapters for the Tek 577 with 177 standard test fixture.

Both the ZIF and the SMD Adapters have served well and allow most components to be easily evaluated with the old Tektronix 576 and 577 curve tracers. Figure 6 shows the custom toggle-type SMD adapter in action with pair of DUTs.

Figure 6 Custom toggle-type SMD adapter in operation with pair of DUTs.

A word of caution

Just a word of caution when using these and any adapters, fixtures, or leads with the Tek 576 and 577 curve tracers: these instruments can produce lethal voltages across the exposed terminals. The Tek 177 standard test fixtures were originally supplied with plastic protective covers and sensor switches which removed the DUT stimulus when the plastic cover was open. In the old Tek service manuals, there was a modification method to defeat the Tek 177 sensor switch which many engineers employed, and many also removed the plastic protective covers.

Anyway, I hope some folks lucky enough to have an old Tek 576 or 577 curve tracer with Tek 177 standard test fixture find these custom DIY adapters useful if they don’t already have the old Tek OEM elusive adapters!

Michael A Wyatt is a life member with IEEE and has continued to enjoy electronics ever since his childhood. Mike has a long career spanning Honeywell, Northrop Grumman, Insyte/ITT/Ex-elis/Harris, ViaSat and retiring (semi) with Wyatt Labs. During his career he accumulated 32 US Patents and in the past published a few EDN Articles including Best Idea of the Year in 1989. All posts by Mike Wyatt below:

References

1. “EEVblog Electronics Community Forum.” SMD Test Fixture for the Tektronix 576 Curve Tracer – Page 1, www.eevblog.com/forum/projects/smd-test-fixture-for-the-tektronix-576-curve-tracer/.

Related Content

• Tracing a transistor’s curves
• Throw it a curve (tracer)
• Trace voltage-current curves on your PC
• Using oscilloscope X-Y displays

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In recent years, the proliferation of unmanned aerial vehicles (UAVs) has necessitated the development of robust counter-drone technologies to address security concerns. India, recognizing this imperative, has seen a surge in companies specializing in anti-drone systems.

This article highlights ten leading Indian manufacturers at the forefront of this critical sector, detailing their technological innovations and contributions.

1. Zen Technologies

Established in 1993, Zen Technologies has been a pioneer in defense training solutions and has expanded into anti-drone technologies. Their comprehensive anti-drone system encompasses detection, tracking, and neutralization capabilities. Utilizing radar, radio frequency (RF) sensors, and electro-optical systems, Zen’s solution can detect and track multiple drones simultaneously. For neutralization, they offer both ‘soft kill’ options, such as RF jamming to disrupt drone communications, and ‘hard kill’ measures, including kinetic systems to physically eliminate threats. Notably, Zen Technologies provides a net-based drone capture mechanism, deploying a dedicated drone equipped with a hanging net to intercept and secure rogue UAVs safely.

2. Bharat Electronics Limited (BEL)

A state-owned enterprise, BEL has collaborated with the Defence Research and Development Organisation (DRDO) to produce an advanced anti-drone system. This system is capable of real-time detection, tracking, and neutralization of micro and small UAVs. It integrates radar, RF detectors, and electro-optical sensors to provide comprehensive situational awareness. The neutralization suite includes both ‘soft kill’ options, like jamming the drone’s communication and navigation signals, and ‘hard kill’ solutions, such as laser-based directed energy weapons to destroy the target.

3. Alpha Design Technologies

Specializing in electronic warfare systems, Alpha Design Technologies has developed advanced solutions to counter UAV threats. Their anti-drone systems are designed to detect, track, and neutralize unauthorized drones using a combination of radar, RF monitoring, and electro-optical tracking. The neutralization methods include jamming and spoofing techniques to disrupt the drone’s control and navigation systems, effectively mitigating potential threats.

4. Adani Defence & Aerospace

A significant player in India’s defense sector, Adani Defence & Aerospace is actively engaged in developing counter-drone technologies. Their approach focuses on creating integrated systems that combine detection and neutralization capabilities. Utilizing radar and RF sensors for detection, their systems can identify and track multiple drone threats. For neutralization, they employ electronic countermeasures to disrupt drone operations, ensuring the protection of critical infrastructure and airspace.

5. Indo Wings Private Limited

As one of India’s fastest-growing drone and anti-drone manufacturers, Indo Wings specializes in advanced UAVs and counter-UAV systems. Their anti-drone solutions are equipped with sophisticated detection technologies, including radar and RF sensors, to identify and track unauthorized drones. Neutralization is achieved through electronic jamming and other countermeasures, effectively addressing potential threats in various environments.

6. Hindustan Aeronautics Limited (HAL)

A state-owned aerospace and defense company, HAL is developing artificial intelligence-driven advanced drones and counter-drone systems for strategic missions. Their focus includes creating solutions capable of operating in high-altitude areas, addressing security challenges along India’s frontiers. HAL’s anti-drone technologies aim to detect and neutralize UAV threats, enhancing the country’s defense capabilities.

7. Paras Aerospace

A subsidiary of Paras Defence and Space Technologies, Paras Aerospace offers a range of UAVs and counter-drone solutions. Their anti-drone systems are designed to detect and neutralize rogue drones using advanced sensor technologies and electronic countermeasures. These systems are suitable for protecting critical infrastructure, public events, and sensitive areas from unauthorized drone activities.

8. Kadet Defence Systems

Specializing in defense technologies, Kadet Defence Systems has developed anti-drone solutions focusing on detection and neutralization. Their systems utilize radar and RF sensors to detect unauthorized drones and employ jamming technologies to disrupt their operations. These solutions are designed to protect military installations, government facilities, and other critical assets from potential drone threats.

9. Throttle Aerospace Systems

Throttle Aerospace Systems has developed the ‘Defender,’ an innovative anti-drone platform that employs vision-based techniques and artificial intelligence. The Defender is capable of actively tracking and neutralizing rogue drones weighing up to 5 kg. This system enhances security by providing an effective solution to counter unauthorized UAVs in various environments.

10. DSE Technologies Pvt. Ltd.

DSE Technologies has secured projects for high-end tactical drone detection and neutralization systems. Their solutions offer both ‘soft-kill’ and ‘hard-kill’ options, emphasizing their expertise in security solutions for Indian forces and national security agencies. These systems are designed to detect, track, and neutralize unauthorized drones, ensuring the protection of critical assets and airspace.

 

India’s anti-drone industry is rapidly evolving, with these companies leading the charge in developing advanced technologies to counter the growing threat of unauthorized UAVs. Through continuous innovation and collaboration, they are enhancing the nation’s security infrastructure and contributing to global counter-drone capabilities.

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The drone industry in the United States has witnessed remarkable growth, driven by startups pioneering advancements across various sectors. From defense and agriculture to public safety and logistics, these companies are redefining the capabilities of unmanned aerial systems (UAS).

This article highlights ten leading U.S.-based drone startups, delving into their innovative technologies and contributions to the industry.

1. Anduril Industries

Founded in 2017, Anduril Industries specializes in AI-driven surveillance and reconnaissance solutions for the defense sector. Their flagship product, the Lattice platform, integrates sensor fusion, machine learning, and mesh networking to provide autonomous monitoring and control of defense assets. Additionally, Anduril has developed the Ghost drone, an autonomous single-rotor UAV controllable via web platforms or mobile applications, enhancing situational awareness in complex environments.

2. Skydio

Established in 2014, Skydio is renowned for its autonomous drones equipped with advanced AI and computer vision. Their drones, such as the Skydio 2+, utilize six 4K navigation cameras to construct a 3D map of their surroundings, enabling obstacle avoidance and autonomous navigation even in GPS-denied environments. Skydio’s technology serves various applications, including infrastructure inspection, public safety, and cinematic content creation.

3. Shield AI

Founded in 2015 by former Navy SEAL Brandon Tseng and his brother Ryan, Shield AI focuses on developing AI-powered drones for military applications. Their V-BAT drone is notable for its vertical takeoff and landing (VTOL) capabilities and autonomous navigation without reliance on GPS or remote control. The V-BAT has demonstrated resilience in electronic warfare environments, successfully identifying and aiding in the neutralization of hostile assets.

4. DroneDeploy

Since its inception in 2013, DroneDeploy has become a leading provider of drone software solutions, enabling users to create detailed aerial maps and 3D models. Their platform supports various industries, including agriculture, construction, and mining, by offering tools for real-time data analysis, progress tracking, and resource management. DroneDeploy’s software is compatible with a wide range of drone hardware, providing flexibility for enterprise applications.

5. Epirus

Epirus, established in 2018, specializes in directed energy systems designed to counter unmanned aerial threats. Their flagship product, the Leonidas system, employs high-power microwave technology to disable swarms of drones instantaneously. This compact and mobile system offers a scalable solution for defense against evolving aerial threats, providing protection for critical infrastructure and military assets.

6. Zipline

Founded in 2014, Zipline has revolutionized logistics through autonomous drone delivery services. Initially focusing on medical supply deliveries in remote regions, Zipline has expanded its operations to include commercial partnerships, such as delivering retail products in urban areas. Their drones are designed for long-range missions, capable of operating in diverse weather conditions to ensure timely deliveries.

7. Corvus Robotics

A participant in Y Combinator’s 2018 cohort, Corvus Robotics develops autonomous indoor drones for warehouse inventory management. Their drones navigate complex indoor environments to perform automated inventory scans, reducing the need for manual counts and increasing operational efficiency. Equipped with advanced sensors and AI algorithms, these drones can operate in GPS-denied spaces, providing real-time data to warehouse management systems.

8. Rotor Technologies

Established in 2021, Rotor Technologies focuses on converting traditional helicopters into unmanned aerial systems. Their Sprayhawk model, based on the Robinson R44 platform, is designed for agricultural applications, featuring a 120-gallon spray tank and autonomous flight capabilities. This approach leverages existing aircraft designs, retrofitting them with advanced avionics and control systems to perform tasks such as crop spraying and cargo transport autonomously.

9. BRINC Drones

Founded in 2018, BRINC Drones develops UAVs tailored for public safety and emergency response. Their drones are designed for both indoor and outdoor operations, featuring two-way communication systems, the ability to breach barriers, and payload delivery capabilities. These features enable first responders to assess situations remotely, communicate with individuals in hazardous environments, and deliver essential supplies during emergencies.

10. Unusual Machines

Unusual Machines, based in Florida, specializes in the manufacturing of drone components and systems. In November 2024, the company garnered attention by appointing Donald Trump Jr. to its advisory board, aiming to repatriate drone manufacturing to the United States. This strategic move aligns with broader efforts to reduce dependence on foreign technology and strengthen domestic production capabilities in the drone industry.

 

These startups exemplify the dynamic and rapidly evolving landscape of the U.S. drone industry. Through innovative technologies and applications, they are expanding the horizons of what unmanned aerial systems can achieve across various sectors.

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У співпраці з НАЕК "Енергоатом" Інформація КП пн, 02/17/2025 - 13:00

SPEAG and Rohde & Schwarz expand their long-term collaboration with the combination of the CMX500 wideband radio communication tester with the DASY8-3D utilising the enhanced DASY8 Application Programming Interface. This combination allows manufacturers of wireless devices to perform Specific Absorption Rate tests of 5G FR1 devices using the future-proof CMX500 multi-technology, multi-channel one-box signaling tester.

SPEAG, a global leader of dosimetric test systems, has combined the CMX500 OBT from Rohde & Schwarz with its advanced specific absorption rate (SAR) measurement system, DASY83D. The CMX500 OBT emulates a 5G new radio (NR) FR1 base station, fulfilling the requirements for SAR testing of 5G NR devices and providing ease of use for the test engineer. The CMX500 radio communication tester supports cellular technologies such as LTE, 5G NR, as well as non-cellular technologies like Wi-Fi, all in a single instrument. The latest test feature sets, including state-of-the-art wireless technologies like NR-NTN, 5G RedCap, and Wi-Fi 7, provides a long-term, future-proof callbox platform.

The evolution of wireless technology has enabled the creation of an increasing number of wireless products that function close to the human body. These products range from cell phones and smart watches to AR/XR goggles, all of which need to ensure their SAR values meet the essential regulatory requirements imposed by many countries. For instance, the Federal Communications Commission (FCC) in the USA, Innovation, Science and Economic Development (ISED) in Canada, and the European Union have all established stringent SAR regulations and continuously developed safety standards for decades. Several other countries, including China, Vietnam, and India, have gradually adopted similar market access regulation requirements regarding the SAR of radio equipment in recent years. Globally, numerous regulatory test labs and market surveillance test labs are equipped with SPEAG systems for SAR testing.

The successful collaboration between SPEAG and Rohde & Schwarz is testimony to the long-term strategy of both companies for leadership and innovation in test and measurement applications for the wireless industry.

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What’s going on at Intel, the largest beneficiary of the U.S. push to onshore chip manufacturing? While the semiconductor industry was still reeling from a Bloomberg report about TSMC in talks for a controlling stake in Intel Foundry at the Trump administration’s request, The Wall Street Journal threw another stunner about Broadcom considering a bid for Intel’s CPU business.

Figure 1 Despite its financial woes, Intel has the largest and most advanced chip manufacturing operation owned by a U.S. company.

Intel, once a paragon of semiconductor technology excellence, has been on a losing streak for nearly a decade. Pat Gelsinger, the company’s overly ambitious former CEO, made an expensive bid to take Intel into the chip contract manufacturing business, which eventually became a liability for the Santa Clara, California-based semiconductor giant.

Meanwhile, it continued to lose market share in its bread-and-butter CPU business to archrival AMD and largely ceded the artificial intelligence (AI) chips boom to Nvidia. In this backdrop, according to Bloomberg, the previous U.S. administration considered Intel Foundry’s merger with GlobalFoundries (GF), which produces older generation chips and abandoned cutting-edge process nodes years ago.

While that was a non-starter, the present U.S. administration seems to have taken a more pragmatic approach by engaging TSMC to take partial ownership of Intel’s fabs, thus throwing a financial lifeline to money-losing Intel. Moreover, TSMC, in full control of its chip manufacturing operations, is expected to bring stability with its highly successful fabrication process recipes.

However, as the Bloomberg report points out, these talks are in an early stage and it’s not clear what’s in it for TSMC. While Taiwanese super fab expressed its lack of interest in Intel’s foundries a few months ago, its about-face on this matter seems to be linked to the current geopolitical turmoil. More details on this matter are expected to emerge in the coming days.

Broadcom eying Intel’s CPU business

The case for Broadcom potentially acquiring Intel’s CPU and related design businesses is less mysterious. The WSJ story claims that Broadcom is studying the possibility of acquiring Intel’s chip design business. If this matures alongside TSMC’s potential takeover of Intel Foundry, it’ll be the end of the road for the Intel brand as we know it.

However, the report clarifies that, like the TSMC matter, Broadcom’s talks regarding Intel are preliminary and largely informal. Furthermore, Broadcom will only proceed if Intel finds a manufacturing partner; here, it’s important to note that Broadcom and TSMC are working separately.

Figure 2 Despite losing market share to AMD and Nvidia, Intel owns a rich array of semiconductor design resources and patents.

The semiconductor industry rumor mill is in full swing, and we are likely witnessing the fall of an American corporate icon in real-time. This is a stark remainder of the semiconductor industry’s hyper competitive nature, which doesn’t spare missteps of even storied companies like Intel.

Intel’s woes are clearly beyond the reflection phase, and the damage done during Gelsinger’s tenure seems irreparable. However, the U.S. administration also sees Intel as an entity critical to national security. Will that be a blessing in disguise or a catalyst for its quick demise? Time will tell.

Related Content

• EU Chips Act: After Theory, Practice
• Intel Will Rely on TSMC for its Rebound
• Intel: Gelsinger’s foundry gamble enters crunch
• Intel Foundry: Leveraging Process Edge for Profit
• Intel Halts Products, Slows Roadmap in Years-Long Turnaround

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The electronics industry is experiencing a significant shift towards more compact and powerful systems. To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

These diverse product families, with top- and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and offer significantly improved performance, reliability, and ease of use. The product families target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.

The TOLL package offers outstanding Thermal Cycling on Board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.

The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve excellent robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95 percent, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.

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For fiscal second-quarter 2025 (for continuing operations, to 29 December 2024), Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has reported revenue of $180.5m, down 7% on $194.7m last quarter and 13% on $208.4m a year ago, but slightly above the midpoint of the $160–200m guidance range...

By: STMicroelectronics

Zonal platform. Domain architecture. Those are words people almost never hear in the context of the car they will drive in the next decade. When most people think of the future, they imagine an electric vehicle with a high level of driver assistance or autonomous driving capabilities – and all the latest digital media capabilities built in. While we might wonder what such a car would look like and how it would drive, we rarely think about what would need to take place in the unseen parts of the vehicle to make this reality. Yet, it’s exactly what is driving a hidden revolution: the move to zonal architecture and software-defined vehicles.

Let’s take a step back. A few years ago, most industry pundits foresaw the growing popularity of EVs (electric vehicles), and governments set ambitious goals, such as phasing out fossil fuel vehicles in the European Union by 2035. Many of these objectives are still in effect. And while some consumer adoption has slowed, the hype curve forecasts that the industry is about to pick up steam. Certain analysts simply think that consumers are waiting for longer-range, more reliable and extensive charging networks, as well as more affordable options.

Why is everyone talking about architecture? Understanding what’s unseen The premium platform electric (PPE) of the Q6 e-tron from Audi at the ST Booth at electronica 2024

So why is the car of tomorrow not here already? Because building the kind of vehicles consumers are clamoring for requires the industry to rethink how cars are designed. OEMs, Tier 1 suppliers, and others have realized that one of their best solutions was to create new platforms to enable greater efficiency and more quickly introduce technological advancements. For instance, in May 2024, Audi revealed its Premium Platform Electric (PPE). Developed jointly with Porsche, the platform makes its Q6 e-tron series significantly more efficient and capable.

Yet, despite a renewed emphasis on the car architecture, almost no one ever gets to see this “platform.” It’s for this reason that the ST Booth at electronica 2024 in Munich, Germany, will give attendees the unique opportunity to see one of the most hidden aspects of modern vehicles: an electronic/electrical (E/E) architecture. The exhibit shows the wiring harness of an actual car currently on the market, peeling back the curtain to expose the quiet revolution happening in the automotive industry.

What is a car architecture and how has it evolved? A car architecture with ECUs (blue boxes) and a battery (yellow box)

The first electronic system to make its way into mainstream vehicles was the electronic fuel injector (EFI) in the 70s, which replaced the carburetor. It used an Electronic Control Unit (ECU) to inject fuel into the engine, improving performance and reducing air pollution. As more ECUs brought electric windows or seats, for instance, engineers moved to a distributed architecture where one central gateway talked to multiple ECUs around the car. It enabled the prioritization of ECUs, ensuring that safety features, such as steering or braking, took precedence.

Afterward, as advanced driver assistance systems and new functionalities were invented and the industry maxed out the number of ECUs it could on a single platform, the industry moved to the domain architecture. This structure categorizes ECUs into domains, such as advanced driver-assistance systems (ADAS), powertrain, chassis, safety, infotainment, and more. Each domain has a gateway that talks to ECUs that control numerous devices and sensors. Many car makers have adopted this architecture today, for good reasons, optimizing it with each new iteration to make it more efficient. In the same vein, other car makers with the same goal in mind are exploring zonal architectures.

What is a zonal architecture? Moving to a zonal architecture enables predictive maintenance and other AI features

The zonal architecture organizes ECUs by their physical location inside the vehicle. It leverages a new generation of ECUs with powerful processing functions and a central High-Performance Computing Unit (HPCU) that supports fast communication protocols like Ethernet. Consequently, it simplifies platform design by reducing cable lengths and gauges, among other things. A central HPCU can also deal with the amount of data, computational throughput, and power required by high-performance ADAS functions, as well as new applications, such as AI.

This helps car makers move toward software-defined vehicles – an important step in speeding up innovation and allowing smartphone-like upgrades over time, thanks to over-the-air updates. This explains why S&P Global Mobility predicts that nearly 40% of the new cars manufactured in 2034 will feature a zonal architecture.

Seeing what is hidden: the Q6 e-tron onboard network exhibit

The Q6 e-tron onboard network exhibit on the ST booth at electronica is a great example of a car maker optimizing its architecture. The domain platform features 1,500 cables totaling over 3,500 meters (about 3,900 yards) and weighing nearly 60 kilograms (130 lb). It also includes over 400 connectors that can interconnect around 100 ECUs. It’s rare to see this harness laid out in public. The exhibit exemplifies the expertise it takes to ensure that all ECUs and connectors serve to optimize the platform rather than weighing it down. It’s a new way of thinking that demands highly specialized know-how and extensive knowledge of the overall product.

The move to a zonal architecture demonstrates this point even more. Conservatively, a vehicle switching to a zonal architecture would see its overall harness weight shrink by around 20%, increasing the battery’s range or gas mileage. A lighter car takes less energy to travel a set distance, thus improving its efficiency and reducing operating costs since consumers can drive more for less. Hence, it is fascinating that while the lighter and simpler harness is entirely hidden from the user, its impact is very visible.

What are the innovations needed for the hidden revolution? Software is taking the wheel Software is driving vehicles

Another way the hidden architecture makes itself known to users is through the many software features consumers want to use and see improved throughout the life of their vehicle. Not many realize how applications govern cars, but they still demand features like 360º camera vision as well as connected and cloud-based systems that provide entertainment, over-the-air updates, and other smartphone-like capabilities. Most drivers don’t know that the harness is directly responsible for enabling a new generation of software-defined vehicles, but they expect predictive maintenance applications for a better experience. And car makers know that instead of a recall, a software update can help save a lot of time, significantly reduce costs, and improve brand appreciation.

Today, software increasingly controls every aspect of the car, thanks in part to the rise of real-time virtualization, which improves the use of hardware resources by ensuring developers can do more with the same components. It’s all about decoupling the code from what it runs on. Thanks to containers and hypervisors, it is possible to run multiple software modules on one hardware ecosystem and still enjoy proper segregation to protect against interference. The technology is already popular in servers and data centers to create secure, safe, and efficient systems. It’s no wonder car makers are bringing it to their new vehicles.

Another advantage of this software paradigm is that it is responsible for the explosion of data generation and the centralization of processing capabilities for improved analysis and decision-making. New architectures have enabled car makers to install hundreds of sensors when they were limited to a few dozen in previous platforms. And more importantly, thanks to the more powerful ECUs and HPCUs, OEMs can future-proof systems and run powerful algorithms but still enjoy a more straightforward development experience. If one software platform can run more applications, it will enable car makers to offer more and richer features while keeping costs down, and ensure consumers get more value out of their vehicles.

Hardware metamorphosis

As we alluded to, the advent of software-defined vehicles and the decoupling of the hardware from the application is only possible if car makers choose microcontrollers and microprocessors that can meet their safety requirements while also offering the computational power and hardware IPs necessary to make this a reality. Engineers must find devices that can support real-time virtualization, numerous I/Os, and a large, embedded, and fast memory that facilitates over-the-air updates. MCUs must be designed and certified for automotive use with specialized safe redundancy built-in, especially as ECUs handle more and more safety applications.

It’s easy to see that this new evolution in car architecture represents a unique electrical challenge, as engineers must create robust, safe, and efficient power distribution mechanisms. It’s the reason why many are adopting smart switches. Unlike the classic melting fuses and mechanical relays, these new electronic switches are faster. As a result, they can offer far greater protection against an adverse electrical event because they respond much quicker than classical components. Their electronic nature also makes them vastly more accurate and flexible. Indeed, they come with monitoring features to enable real-time load management and control. Moreover, they are resettable, which saves from having to replace them manually.

The traditional fuse box that car makers can do away with when using smart fuses.

Another critical benefit of smart fuses is their tiny size compared to traditional switches and relays. Because eFuses are so small and electronically controlled, car makers can use shorter harnesses since, among other things, they no longer need to route cables to a large fuse box that must be user accessible. Moreover, the significantly higher accuracy means that the harness can be thinner, thus further contributing to weight reduction. A smaller design with fewer components that are more robust and accurate also helps improve overall reliability. Hence, while some engineers are still evaluating the cost of eFuses, the overall savings over the architecture’s lifetime explain their increasing popularity.

Taking a step back, we see that power distribution is also a much more critical engineering challenge because vehicles are dealing with far greater loads. Most architectures must handle 12 V, but the industry is moving to 48 V. EV chargers must also be able to handle very high voltages and power levels (up to 3,500 kW today). Hence, one of the most popular solutions is to use wide bandgap devices, such as silicon carbide (SiC). The fast switching frequencies of SiC MOSFETs and diodes mean they can handle a lot more power without the energy losses of previous devices, enabling smaller traction inverters, faster charging modules, and more efficient compressors, among other things.

The evolving role of semiconductor companies Engineers working on a car architecture

The domain and zonal car architectures emerging today testify to a new reality: everything is connected, and all roads (harnesses, in this case) lead to close cooperation between the key actors of the industry – car makers, Tier 1s, and semiconductor companies. Companies like ST understand how to support platform designers in their quest to decouple the hardware from the software and improve efficiency, safety, and robustness. Together, they create the innovations essential to the future of vehicles that will drive demand for the next generation of cars. It’s for this reason that existing carmakers and new startups are creating ever more intimate partnerships with semiconductor makers and why the market is going through such a disruption.

ST’s ability to grasp new engineering challenges is evidenced through its products. The Stellar family of devices has unique virtualization capabilities to future-proof the software-driven vehicles of tomorrow while its software ecosystem helps reduce development times and meet regulatory requirements. Similarly, STi²Fuse can shrink the overall harness, reduce the bill of materials, and optimize the overall power distribution. Additionally, silicon carbide power devices continue to bring new levels of efficiency. In essence, it’s by offering a wide range of solutions that semiconductor companies can be the close partners that car makers need them to be as they drive the new architectures that will meet the hopes and expectations of their customers.

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