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When it comes to choosing software solutions for your business, the decision between Software as a Service (SaaS) and traditional software can be daunting. Each has its own set of benefits and drawbacks, and what works for one company might not be ideal for another. So, how do you decide which is best for you? Let’s explore the key differences and advantages of each to help you make an informed decision.

Cost Considerations

One of the most significant differences between SaaS and traditional software is the cost structure. Traditional software typically requires a hefty upfront investment. You’ll need to purchase licenses, invest in hardware, and possibly hire IT staff to manage installations and maintenance. These costs can add up quickly, especially for small to mid-sized businesses.

SaaS, on the other hand, operates on a subscription model. You pay a regular fee that usually covers everything from software access to updates and customer support. This spreads out the costs over time and can make budgeting easier. There’s no need for a large capital expenditure upfront, which can free up resources for other critical areas of your business. Additionally, SaaS eliminates the need for dedicated IT infrastructure, potentially saving you money on both personnel and physical space.

Flexibility and Scalability

In today’s fast-paced business environment, flexibility and scalability are crucial. Traditional software can be rigid, often requiring complex installations and significant downtime when scaling up. If your business grows, you might need to purchase additional licenses or even new hardware, which can be both time-consuming and costly.

SaaS excels in this area. It’s designed to be flexible and scalable, allowing you to adjust your usage based on your current needs. Whether you’re expanding your team or adding new features, SaaS can scale effortlessly without major disruptions. This agility is particularly valuable for businesses experiencing rapid growth or those with fluctuating demands.

Accessibility and Collaboration

Another critical factor to consider is accessibility. Traditional software is usually installed on individual computers or servers within your office. This can limit access to your team members who work remotely or travel frequently. Collaboration can also be challenging, as sharing files and information often requires manual processes or additional software.

SaaS offers a distinct advantage here. Being cloud-based, SaaS applications can be accessed from anywhere with an internet connection. This makes it easier for your team to collaborate in real-time, no matter where they are. Imagine your sales team being able to update the CRM system from the field, or your remote employees working seamlessly with in-office staff. This level of accessibility can significantly boost productivity and improve communication across your organization.

Updates and Maintenance

Keeping software up-to-date is essential for security and performance. Traditional software often requires manual updates, which can be time-consuming and disruptive. You might also need IT staff to manage these updates, adding to your operational costs.

SaaS simplifies this process. Updates and maintenance are handled by the provider and are usually rolled out automatically. This ensures that your software is always current with the latest features and security patches, without any effort on your part. This hands-off approach to updates can save you time and reduce the risk of running outdated or vulnerable software.

Security and Reliability

Security is a top concern for any business. Traditional software security relies heavily on your internal IT team’s capabilities. You need to ensure that all security measures are in place, which can be challenging and resource-intensive.

SaaS providers invest heavily in security to protect their clients’ data. They employ advanced encryption, conduct regular security audits, and often have dedicated security teams. Additionally, SaaS solutions typically include automated SaaS backups, ensuring your data is safe and recoverable in case of an incident. This level of security and reliability can give you peace of mind, knowing that your data is protected by experts.

Conclusion

Choosing between SaaS and traditional software depends on your specific business needs and circumstances. SaaS offers cost efficiency, flexibility, scalability, and enhanced collaboration, making it an excellent choice for businesses looking for modern, adaptable solutions. Traditional software might still be suitable for companies with specific needs that require on-premises solutions or have substantial existing infrastructure.

Ultimately, the best choice is the one that aligns with your business goals, budget, and operational requirements. By carefully evaluating the benefits of each option, you can make a decision that drives your business forward and improves overall efficiency. So, take a closer look at what SaaS and traditional software can offer, and choose the path that best supports your strategic objectives.

The post SaaS vs Traditional Software: What’s Best for You? appeared first on Electronics Lovers ~ Technology We Love.

With the goal of decarbonizing AI server racks, the new series of power supply units (PSUs) focus on efficiency, ranging from 3 kW to 12 kW.

Schematic and explanation how it works: https://danyk.cz/hodiny_en.html submitted by /u/Different-Sign-4793 [link] [comments]

Хімічний квест від ХТФ medialab чт, 05/30/2024 - 18:42

З непохитною вірою і силою духу Інформація КП чт, 05/30/2024 - 18:20

Malaysia and Taiwan were among the early semiconductor outposts during the late 1960s when U.S. companies like Intel began to outsource their assembly and test operations to Asia. Over half a century, while Taiwan has reached the design and manufacturing pinnacle, Malaysia mostly remained busy on back-end tasks related to chip assembly, packaging, and testing.

Malaysia—which currently accounts for 13% of the semiconductor packaging, assembly, and testing market—is now looking to position itself as a global IC design and manufacturing hub amid U.S. restrictions on China’s chip industry. According to a report published in Reuters, the Malaysian government plans to pour $107 billion into its semiconductor industry for IC design, advanced packaging, and manufacturing equipment for semiconductor chips.

Malaysia, long seeking to move beyond back-end chip assembly and testing and into high-value, front-end design work, is confident that time is now on its side. It’s worth noting here that Malaysia isn’t merely eyeing U.S. or western semiconductor outfits; chip firms in China aiming to diversify supply chains are also considering Malaysia for packaging and assembly operations as well as setting up design centers.

While Intel is setting up a $7 billion advanced packaging plant and Infineon is building a $5.4 billion power semiconductors fab in Malaysia, a Reuters report provides details of Chinese chip firms tapping Malaysian partners to assemble a portion of their high-end chips in the wake of U.S. sanctions.

Take the case of Xfusion, formerly a Huawei unit, joining hands with NationGate to assemble GPU servers in Malaysia and thus avoid U.S. sanctions. Likewise, chip assembly and testing firm TongFu Microelectronics is building a new facility in Malaysia in a joint venture with AMD. Next, RISC-V processor firm StarFive is setting up a design center in Penang.

However, Malaysia will need an immaculate execution besides pouring money into its ambitions to move up the semiconductor ladder as other destinations like India and Vietnam are also vying for a stake in chip design and manufacturing services. Moreover, while U.S. restrictions on China’s chip industry bring Malaysia new possibilities, it’s important to note that the country has been trying to move beyond back-end chip assembly and testing and into high-value front-end design work for quite some time.

So, while China’s chip outfits moving to Malaysia will add weight to the country’s efforts to become a semiconductor hub in Asia, it will still require a strong execution besides tax breaks, subsidies, and visa exemption fees. Malaysia has an experienced workforce and sophisticated equipment, critical elements in the semiconductor design recipe.

What’s required next is a few promising startups in semiconductor design and advanced packaging domains, as hinted by Malaysian Prime Minister Anwar Ibrahim during his policy speech.

Related Content

• Chip foundries find niches in Malaysia
• Malaysia seeks to foster electronics cluster
• Infineon to Invest Extra €5B in Malaysia SiC Fab
• Infineon launches Malaysia power semiconductor fab
• Malaysia’s semiconductor journey spanning half a century
• Leveraging Malaysia’s Semiconductor Design Strengths to Accelerate Deep-Tech Innovations

The post Has Malaysia’s ‘semiconductor moment’ finally arrived appeared first on EDN.

The operation of a contactless electric bell is based on a change in the electrical resistance of a temperature-sensitive element (thermistor) when a finger approaches the bell button or upon contact with it. To exclude the possibility of continuous calls, a gradient relay is used in the device, which turns on the bell only under the condition of a short change (increase) in the temperature of the thermosensitive element.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The operation of the contactless electric bell is based on the use of a gradient relay [1–3] with a temperature-sensitive sensor. When a finger approaches a temperature-sensitive sensor (thermistor), its temperature rises, therefore, its resistance changes. The gradient relay is activated, including the bell. The sensitivity of the device is such that a small local change in the temperature of the sensor leads to the activation of the bell. After removing the finger, the resistance of the thermistor will return to its original state, the bell will be disconnected.

The use of such a device is especially important during epidemics, since the transmission of viruses and microbes without contact with a dirty button is less likely.

The contactless electric bell in Figure 1 is made using the comparator U1.1 of the LM339 chip. The device works as follows.

Figure 1 Electrical circuit of the non-contact doorbell.

The ratio of resistive divider resistances R1 and Rsens is desirable to choose 1:1. In the initial state, when the device is switched on, at the junction point of resistors R1 and Rsens, the voltage at the inputs of the comparator U1.1 is the same and approximately equal to half of the supply voltage. Therefore, the voltage at the output of the comparator is zero. The thermistor Rsens is an element that provides a contactless change in the state of the resistive divider of the input circuit of the device.

If you bring your finger to the thermosensitive element—resistor Rsens, its resistance will change. You can just breathe on this resistor. This will cause an imbalance in the voltage across the comparator inputs. The voltage at the right terminal of the resistor R3 due to the presence of the capacitor C1 will remain unchanged for some time. At the same time, the voltage at the left terminal of R3 will change, allowing the comparator to switch.

A high logic level voltage appears at the output of the comparator. This voltage is supplied to the base of the output transistor VT1 BC547 or its analogue, the transistor opens and connects the bell (electromagnetic sound generator with integrated oscillator circuit HCM1612X) to the power source. If you move your finger away from the resistor Rsens, the resistance of the thermistor will return to its original state, the device will return to its original state, and the bell will be disconnected.

Resistors with both positive and negative temperature coefficient of resistance can be used as resistor Rsens. The device will work in either case. To ensure proper operation of the device, you may have to swap the inputs of the comparator U1.1 (pins 4 and 5).

Michael A. Shustov is a doctor of technical sciences, candidate of chemical sciences and the author of over 800 printed works in the field of electronics, chemistry, physics, geology, medicine, and history.

Related Content

• Ring your bell; light your light
• Use a proximity sensor to create a cat doorbell
• Overcoming design obstacles in video doorbells
• Linearize thermistors with new formula
• Temperature-to-period circuit provides linearization of thermistor response
• Designing with temperature sensors, part one: sensor types
• Log amp linearizes thermistors

References

1. Shustov M.A. “Gradient relay”. Radioamateur (BY). 2000. No. 10. pp. 28–29.
2. Shustov M.A., Shustov A.M. “Gradient Detector a new device for the monitoring and control of the signal deviations”. Elektor Electronica Fast Forward Start-Up Guide 2016–2017. 2017. pp. 44–47.
3. Shustov M.A., Shustov A.M. “Electronic Circuits for All”. London, Elektor International Media BV, 2017, 397 p.; “Elektronika za sve: Priručnik praktične elektronike”. Niš: Agencija EHO, 2017; 2018, 392 St. (Serbia).

The post Contactless electric bell on a gradient relay appeared first on EDN.

Finally finished a project that took way too much time to complete. I made a big 7-segment display clock (1470x480x51mm) with the use of WS2812B LEDs and ESP32 as the brain. Since the clock is meant for inside use, the frame was built out of four 12mm plywood boards stacked together. There is also a 3mm acrylic sheet inbetween, which is used as protection for the light diffusing film for LEDs. There is a big cutout in the back, where all of the electronics are mounted inside of a 3D printed case. There are three tactile switches on the case, which are used for setting the clock in access-point mode or to update the program via FTDI. Since the clock is using ESP32, it gets its time from an NTP server. I made a simple web interface for it, where some settings can be changed (WiFi credentials, NTP server, LED color/brightness...). Besides displaying the time, it also displays date and temperature, which is taken from the DS18B20 sensor that is attached to the outside of the case. The design itself is very bad from the aspect of manufacturing, since there are a lot of easy improvements that could be implemented to shorten the time needed to assemble it. The clock is also not suitable for outside use, not only because of the main frame (wood), but also because of the fact that the LEDs are not bright enough for the clock to be useable during daylight hours. submitted by /u/Yacob135 [link] [comments]

Thia is a controller for shutters that failed and was given to me for repair. The component on the left is a mains voltage bridge rectifier. Two mosquitos decided to try and short it out. Did not end well for them. submitted by /u/DolfinButcher [link] [comments]

Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — has signed a memorandum of understanding (MoU) with Taiwan’s Industrial Technology Research Institute (ITRI) to solidify a partnership in developing high-performance GaN solutions for USB-PD adaptors. The MoU also covers the sharing of domestic and international market information, joint visits to potential customers, and promotion...

Nuvoton Technology Corporation, a global leader in embedded controller and secure IC solutions, announced today that Google’s ChromeOS plans to use the first commercial chip built on the OpenTitan open source secure silicon design as an evolution of its security chip for Chromebooks. This is a result of years of co-development and a close partnership between the companies.

The new chip is based on OpenTitan, a commercial-grade open source silicon design that provides a trustworthy, transparent, and secure silicon platform. It will be used by Google to provide the best protection to Chromebook users. OpenTitan ensures that the system boots from a known good state using properly verified code and establishes a hardware root of trust (RoT) for a variety of system-critical cryptographic operations.

“Hardware security is something we don’t compromise on. We are excited to partner with the dream team of Nuvoton, a valued, historic, strategic partner, and lowRISC, a leader in secure silicon, to maintain this high bar of quality.” said Prajakta Gudhadhe, Sr Director, ChromeOS Platform Engineering. “Google is proud of taking an active role in helping build OpenTitan into a first of a kind open source project, and now we’re excited to see Nuvoton and lowRISC take the next big step and implement a first-of-its-kind open source chip that will protect users all over the world.”

“Nuvoton has been a reliable supplier of embedded controllers (EC) to Chromebooks and Baseboard Management Controllers (BMC) to Google servers in the past decade,” said Erez Naory, VP of Client and Security Products at Nuvoton. “We have now expanded this collaboration with Google and our other OpenTitan partners to bring a new strengthened security IC to Google products and the open market.”

With the goal of making a completely transparent and trustworthy secure silicon platform, the open source project has been developed in the past five years by the OpenTitan coalition of companies hosted by lowRISC C.I.C., the open silicon ecosystem organization. The dedication and expertise of OpenTitan’s skilled community of contributors brought this industry-leading technology to life, producing the world’s first open source secure chip with commercial-grade design verification (DV), testing, and continuous integration (CI).

“Google’s integration of OpenTitan into Chromebooks is a watershed moment — the era of commercial-grade open source silicon has truly arrived,” said Dr. Gavin Ferris, CEO of lowRISC, OpenTitan’s non-profit host organization. “It’s a fantastic validation of the Silicon Commons approach adopted by our OpenTitan project partners and proves that collaborative engineering, driven by an unerring focus on quality and transparency, can successfully deliver products meeting the most stringent security requirements.”

The OpenTitan secure silicon samples are available to the broader market through an early access program and will be in volume production by 2025.

The post Nuvoton Develops OpenTitan based Security Chip as Next Gen Security Solution for Chromebooks appeared first on ELE Times.

submitted by /u/careyi4 [link] [comments]

“Do you have the time?” With the University of Michigan’s latest memristor discovery, AI chips may soon note the sequence of events.

Формування студентами індивідуальних освітніх траєкторій: правила визначено Інформація КП чт, 05/30/2024 - 00:44

submitted by /u/Tom0204 [link] [comments]

In the latest addition to its high-power UV-A LED series, Luminus Devices Inc of Sunnyvale, CA, USA – which designs and makes LEDs and solid-state technology (SST) light sources for illumination markets – has introduced the SST-08H-UV as the improved version of its SST-08-UV...

In this article, we use the concept of magnetic field intensity to help explain how complex permeability models the losses of a magnetic core.

Axus Technology of Chandler, AZ, USA – a provider of chemical-mechanical polishing/planarization (CMP), wafer thinning and surface-processing solutions – has received $12.5m in capital funding from IntrinSiC Investment LLC of Palo Alto, CA, USA, a private equity firm that invests in suppliers of key enabling technology for silicon carbide (SiC). In addition, the firm has secured a significant revolving and term line of credit from a leading national bank...

Яким був Київ понад 70 років тому? medialab ср, 05/29/2024 - 18:41