ELE Times

Rohde & Schwarz is driving the commercialization of 5G-based New Radio non-terrestrial networks, with successful certification of the highest number in GCF conformance test cases for NR-NTN to date. The validation covers all three domains, RF, RRM, and PCT.

Following the successful validation of the first 5G-based NR-NTN at the PTCRB (PCS Type Certification Review Board), Rohde & Schwarz continues its efforts to enable validation at the GCF (Global Certification Forum). The validated test cases within GCF WI-555 (Work Item) are defined in accordance with the 3GPP test specifications for RF (Radio Frequency), RRM (Radio Resource Management), and PCT (Protocol Conformance Testing) and were executed with Rohde & Schwarz conformance test solutions.

All measurements were conducted on the R&S TS8980 Conformance Test Platform, the R&S TS-RRM, and the CMX500 in frequency range 1 (FR1), verifying the latest NR-NTN chipset from Samsung as the device under test (DUT).

3GPP conformance testing is essential for ensuring that devices and networks comply with global standards. 5G NR-NTN testing presents challenges that extend beyond those encountered in traditional terrestrial networks, primarily due to the vastly different operating environment and the dynamic nature of satellite-based communication.

At the core of the Rohde & Schwarz conformance test solutions is the CMX500 5G one-box signaling tester, which also supports early research and development through integrated fading and channel emulation, along with an intuitive tool for visualizing satellite constellations – all in a single-box test setup. In addition, the user-friendly R&S CONTEST test system software platform facilitates the seamless execution of 3GPP test cases.

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ROHM develops the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in automotive applications.

In the automotive sector, power demand is increasing, particularly in high-end vehicle models. 48V power supply systems are gaining attention as a highly efficient alternative to conventional 12V power supply systems. With widespread adoption expected around 2030, there is a growing need for 80V power MOSFETs capable of delivering even lower power losses than standard 100V devices.

ROHM’s new products enable downsizing in comparison to standard automotive MOSFET packages such as the TO-252 (6.6 × 10.0mm) by adopting the HPLF5060 (4.9 × 6.0mm) and DFN3333 (3.3 × 3.3mm) packages.

The HPLF5060 features Gull-Wing Leads, while the DFN3333 features Wettable Flank Technology, which contributes to improved reliability on PCBs (Printed Circuit Boards). Furthermore, by adopting Copper Clip Junction Technology to enhance heat dissipation, these devices are capable of handling high currents. All models comply with the automotive reliability standard AEC-Q101, ensuring high reliability.

The product lineup of these packages will be further expanded in the near future. In addition, development of TOLG (TO-Leaded with Gullwing, 9.9 × 11.7mm) packaged products has begun, with continued expansion of the lineup of high-power, high-reliability 80V MOSFETs.

Application Examples

Automotive 48V systems: Main inverter control circuits, electric motors, electric water pumps, etc.

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• Industrial-grade vibration sensor delivers the latest wide-bandwidth and dynamic range sensing.
• Intelligent sensor processing unit (ISPU 2.0) inside the sensor boosts signal processing and edge AI performance while reducing energy consumption.
• Provides the first compelling alternative to piezosensors for condition monitoring, combining performance, lightweight design, ease of integration, ultra-accuracy, and energy efficiency.

A global semiconductor leader serving customers across the spectrum of electronic applications introduces an intelligent vibration sensor designed for industrial condition monitoring that requires high accuracy, reliability, and energy efficiency.

Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advance digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range up to 125°C to withstand harsh conditions, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments.

Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities, to optimize production flow.

“Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensors, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.”

“The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range, wide bandwidth, and high-temperature capability, combined with ease of adoption and a cost-effective, simplified circuit design, allowed us to replace the incumbent piezosensor technology. Moreover, the integrated ISPU 2.0 processor positions complex signal processing and rapid AI inference close to the sensing element, enabling smarter system responses,” said  Andrea Torcelli, Chief Technology Officer at Bonfiglioli S.P.A.

By enabling predictive and prioritizing maintenance, remote condition monitoring allows companies to improve equipment uptime and operating efficiency while eliminating unexpected failures and enhancing safety. Fortune Business Insights states the global market for this technology will exceed $5 billion by 2032, growing at over 9% CAGR1.

Further technical information:

The IIS3DWB10IS vibration sensor is the first digital sensor with wide bandwidth and embedded processing to deliver performance meeting the needs of high-end industrial condition monitoring applications, offering a compelling alternative to piezoelectric sensors.

Accurate measurement of vibrations above 10 kHz, with a large dynamic range up to 200g, combines with a noise floor as low as 35 µg/sqrt(Hz). This is comparable to the noise performance of piezoelectric sensors. Moreover, the IIS3DWB10IS delivers equivalent accuracy and sensitivity, adding digital-sensing advantages including smaller size, lower power consumption, simplified electrical and mechanical design, and greater flexibility in the computational partitioning.

ISPU 2.0 (Intelligent Sensor Processing Unit) introduces new hardware accelerators to perform real-time signal processing and AI at the edge. These hardware accelerators make frequently used functions faster and more power-efficient. The core is C-programmable and contains on-chip program and data RAM.

The supporting ecosystem provides software libraries that facilitate executing typical vibration monitoring algorithms in the ISPU, including FFT, filtering, envelope, velocity severity, and anomaly detection. With 40 MIPS and 40 MFLOPS digital signal processing, the ISPU 2.0 delivers up to four times the processing performance of the previous generation. In addition, the ISPU 2.0 sensor interface supports six times faster data transfer with the MEMS circuitry.

The IIS3DWB10IS also contains a 2048×80-bit FIFO register and an accurate temperature sensor. The sensor’s rugged MEMS-based design supports operation up to 125°C. The IIS3DWB10IS is supported in ST’s 10-year industrial longevity program. The IIS3DWB10IS is a 4.5 mm x 4.5 mm x 1.5 mm 16-lead LGA package with wettable flanks that facilitate automatic optical inspection in high-quality surface-mount assembly processes. The product is scheduled to be available by July 2026 from $25 for orders of 1000 pieces. 

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