Feed aggregator

The modern building is intelligent, connected and as a result saves energy. In combination with alternative energy sources and efficient lighting solutions, emissions in the building sector can be drastically reduced. This makes a significant contribution to achieving climate targets. 2,169 exhibitors presented the latest developments in building technology and trends in innovative lighting design at Light + Building in Frankfurt am Main from 3 to 8 March 2024. Over 151,000 visitors travelled to the world’s leading trade fair for lighting and building-services technology.

“The atmosphere at the exhibitors’ booths, in the halls and throughout the exhibition grounds was simply fantastic. We are extremely pleased that so many exhibitors and visitors, as well as our long-standing partners, have continued the success story of the world’s leading trade fair for lighting and building-services technology in 2024,” summarises Wolfgang Marzin, President and Chief Executive Officer of Messe Frankfurt. He adds: “With the switch to renewable energy sources, greater efficiency and sustainability in buildings, the industry has key goals on its agenda. That’s why they used the platform intensively, especially in the first few days, to present and discover innovations and drive forward key topics. After all, if we want to achieve the climate protection goals, the building sector is an essential milestone. It is unfortunate that the rail and air transport strikes have already affected Messe Frankfurt’s third leading international event since the beginning of the year.”

Buildings of tomorrow and inspiring lighting solutions

Key topics are the electrification and digitalisation of homes and buildings in order to reduce emissions and reuse raw materials. At Light + Building, the industry presented the digital and electrotechnical infrastructure for this and, on this basis, showcased solutions for dynamic power control, energy storage systems and applications for connected security. One growing area is the range of e-mobility and charging infrastructure as well as innovations and products for decentralised energy supply systems and components.

Light plays an important role in the architecture of tomorrow. At Light + Building 2024, 65 per cent of exhibitors belonged to this sector. They presented high-quality lighting solutions for indoor and outdoor areas as well as dynamic room concepts. Modern LED installations ensure contemporary efficiency and either blend harmoniously into the architecture or emphasise the design elements. Lighting is to provide maximum visual comfort in all living and working environments. Thanks to the materials used, Acoustic Lighting combines a pleasant lighting atmosphere with sound-absorbing functions. Sustainability plays an essential role in both the materials used and the manufacturing processes. Many manufacturers design luminaires in a way that the raw materials used can be recycled at the end of their useful life.

Light + Building 2024 in figures

The high-quality, extensive and international portfolio of lighting and building-services technology impressed the visitors. 95 per cent of them were extremely satisfied with what was on display and stated that they had achieved 93 per cent of their trade fair attendance targets. The most came to the innovation meeting point from Germany, China, Italy, the Netherlands, France, Switzerland, Belgium, Austria, the UK, Spain and Poland. They came from a total of 146 countries – including, for example, India, the USA, the United Arab Emirates, Australia, Brazil and Singapore. The degree of internationality was thus 51 per cent. The level of internationality among the 2,169 exhibitors was also high at 76 per cent.

Meeting place for the social media community

The social media community also found its home at Light + Building. On 3 and 4 March, the leading content creators in the lighting and building-services technology sector gathered for the Power Creator Days. In addition to live podcasts, expert talks and case studies, visitors had the chance to pedal for a good cause and work together towards a high energy target. A total of 1,510 minutes were cycled on the six fitness bikes. The sponsors will convert the result into a cash donation for the Leberecht Foundation, which Messe Frankfurt will double. The exact amount will be announced on social media further to Light + Building.

The next Light + Building will take place from 8 to 13 March 2026 in Frankfurt am Main.

Voices of the industry Alexander Neuhäuser, General Manager ZVEH (Central Association of the German Electrical and Information Technology Trades)

Alexander Neuhäuser, General Manager ZVEH, Central Association of the German Electrical and Information Technology Trades, says that “Light + Building demonstrates how sector coupling can succeed through the necessary connectivity. The electrical trades integrate photovoltaics, storage, electromobility and heat pumps. They show how the energy industry requirements for controllable consumption devices (SteuVE) can be met and thus take account of the current transformation process. The good atmosphere at this year’s Light + Building 2024 was also noticeable at the joint stand of the electrical trades, which was very busy on all days of the event. The traditional partners’ evening was also a complete success, bringing together the partners of the electrical trades and the industry leaders. We were particularly pleased that so many young people once again took the opportunity to visit the E-House and the workshop street and gain an impression of what is feasible with smart and intelligently connected building automation.”

Wolfgang Weber, CEO, ZVEI, Electro and Digital Industry Association, is of the opinion that, “In the context of climate goals and the economic situation of urgently creating more affordable living space in Germany, technologies are increasingly coming into focus. The exhibiting companies at Light + Building have impressively demonstrated how easily well-designed climate protection can even lead to greater economic efficiency in the operation of houses, buildings and entire neighbourhoods.

Wolfgang Weber, CEO, ZVEI (Electro and Digital Industry Association)

This requires the right solutions, especially from the electrical and digital industry, such as heat pumps, controllable lighting, charging points and an energy management system. This is relevant – not just in Germany and Europe, but worldwide. Light + Building is the right place to present innovative, climate-friendly technologies and solutions and to engage in dialogue with trade visitors from Germany and abroad.”

The post Light + Building 2024: Fulminant innovation show provides a stage for sustainability and efficiency in buildings appeared first on ELE Times.

Micro-LED display startup Q-Pixel Inc of Los Angeles, CA, USA has achieved what it claims is the highest-resolution active-matrix color display: 3K x 1.5K resolution in a screen of ~1.1cm x 0.6cm...

For full-year 2023, molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has reported revenue of €39.3m, up 41% on 2022’s €27.8m...

Managed to save this from the dump yesterday. The thing apperas to be extremely rare as there is no info on it even in Russian internet segment. No ICs inside, only transistors. submitted by /u/AltCtrlGraphene [link] [comments]

Конференція трудового колективу КПІ medialab сб, 04/13/2024 - 18:09

submitted by /u/AutoModerator
[link] [comments]

Microchip’s AVR DU 8-bit MCUs integrate a USB 2.0 full-speed interface that supports power delivery up to 15 W, enabling USB-C charging at up to 3 A at 5 V. According to the manufacturer, this capability, not commonly found in other USB microcontrollers in this class, allows embedded designers to implement USB functionality across a wide range of systems.

In addition to higher power delivery than previous devices, AVR DU microcontrollers also feature improved code protection. To defend against malicious attacks, the devices employ Microchip’s Program and Debug Interface Disable (PDID) function. When enabled, the PDID function locks out access to the programming/debugging interface and blocks unauthorized attempts to read, modify, or erase firmware.

To enable secure firmware updates, the MCUs provide read-while-write flash memory in combination with a secure bootloader. This allows designers to use the USB interface for in-field updates without disrupting product operation.

The AVR DU family of MCUs is suitable for a range of embedded applications, from fitness wearables and home appliances to agricultural and industrial applications. A virtual demonstration of the MCU’s USB bridge is available here.

AVR DU series product page

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post 8-bit MCUs tout 15-W USB power delivery appeared first on EDN.

RA0 microcontrollers from Renesas are low-cost devices that offer low power consumption and a feature set optimized for cost-sensitive applications. The MCUs can be used in such applications as consumer electronics, system control for small appliances, building automation, and industrial control systems.

Based on an Arm Cortex-M23 core, the 32-bit MCUs consume 84.3 µA/MHz in active mode, dropping to just 0.82 mA in sleep mode. A software standby mode cuts current consumption even further, allowing the device to sip just 0.2 µA. These features, coupled with a high-speed on-chip oscillator for fast wakeup, make the MCUs particularly well-suited for battery-operated products.

The first devices in the RA0 series, the RA0E1 group, operate from a supply voltage of 1.6 V to 5.5 V. This means there is no need for a level shifter/regulator in 5-V systems. An on-chip oscillator improves baud rate accuracy and maintains ±1.0% precision over a temperature range of -40°C to +105°C.

Other features of the RA0E1 group of MCUs include: 

• Memory: Up to 64 kbytes of code flash and 12 kbytes of SRAM
• Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
• Communications Peripherals: 3 UARTs, 1 Async UART, 3 Simplified SPIs, 1 IIC, 3 Simplified IICs
• Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, immutable storage, CRC calculator, register write protection
• Security: Unique ID, TRNG, flash read protection

RA0E1 microcontrollers are shipping now. Package options include 20-pin LSSOP, 32-pin LQFP, and QFN with 16, 24, or 32 leads.

RA0E1 product page

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Renesas expands general-purpose MCU choices appeared first on EDN.

The first entry in Teledyne’s 650-V power module family, the TDGM650LS60 integrates a 650-V, 60-A GaN transistor and isolated driver in a single package. The module, which is now available off-the-shelf, acts as a load switch or solid-state switch. Fast switching time and the absence of moving parts make the TDGM650LS60 useful for high-reliability applications in the space, avionics, and military sectors.

The TDGM650LS60 tolerates up to 100 krads of total ionizing does (TID) radiation and operates over a temperature range of -55°C to +125°C. It’s enhancement-mode GaN transistor has a minimum breakdown voltage of 650 V and a stable on-resistance of 25 mΩ. Coupled with the driver’s 5-kV isolation, the TDGM650LS60 ensures robust and reliable operation in challenging environments.

Occupying a 21.5×21.5-mm footprint, the TDGM650LS60 module has solder-down castellation for surface-mount style mounting. A preliminary datasheet can be accessed by using the link to the product page below.

TDGM650LS60 product page

Teledyne e2v HiRel Electronics    

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Hi-rel GaN load switch ships off-the-shelf appeared first on EDN.

A Bluetooth LE 5.4 module, the HCM511S from Quectel, leverages the power of an Arm Cortex-M33 core, along with 352 or 512 kbytes of flash memory. The module, which also provides 32 kbytes of RAM, brings efficient performance to compact connected devices such as digital keys, portable medical devices, and battery-operated motion sensors.

According to Quectel, the Bluetooth module’s transmit power of +6 dBm achieves long-distance transmission, allowing low-power devices to connect cost effectively. Optional support for Bluetooth mesh nodes increases network scalability and allows greater device density over a mesh topology. The HCM511S also offers up to 18 GPIOs, which can be multiplexed for various interfaces, including ADC, USART, I2C, I2S, PDM, SPI, and PWM.

The MCU Bluetooth module comes in a 16.6×11.2×2.1-mm LCC package and weighs just 0.57 g. It operates over a temperature range of -40°C to +85°C. In addition to being certified by the Bluetooth Special Interest Group, the HCM511S is also certified for use in Europe, America, Canada, China, Australia, and New Zealand.

Engineering samples of the HCM511S MCU Bluetooth module are available now.

HCM511S product page

Quectel Wireless Solutions  

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Bluetooth module taps Cortex-M33 processor appeared first on EDN.

Enabling high compute performance at the edge, the Titanium Ti375 FPGA from Efinix packs a quad-core hardened RISC-V block and 370,000 logic elements. It employs the company’s high-density, low-power Quantum compute fabric wrapped with an I/O interface.

The 32-bit hardened RISC-V block (RISCV321 with M, A, C, F, and D extensions and six pipeline stages) offers a Linux-capable MMU, FPU, and custom instruction capability. Paired with an Efinix Sapphire SoC, the Ti375 FPGA helps designers turn a tiny chip into an accelerated embedded compute system.

The Ti375 is manufactured on a 16-nm process and comes in a fine-pitch BGA package with a choice of 529, 676, 900, or 1156 balls. Its full-duplex serializer/deserializer transceiver operates at data rates from 1.25 Gbps to 16 Gbps and supports multiple protocols, including PCIe 4.0, Ethernet SGMII, and Ethernet 10GBase-KR. The FPGA also features a LPDDR4 DRAM controller and MIPI D-PHY.

Samples of the Titanium Ti375 FPGA are shipping now to early access customers.

Ti375 product page

Efinix

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post FPGA integrates hard RISC-V cores appeared first on EDN.

Результати висунення структурними підрозділами претендентів для участі у конкурсі на посаду ректора [оновлено 3] kpi пт, 04/12/2024 - 16:45

КПІ та Католицький університет Парах'янган з Індонезії уклали Меморандум про взаєморозуміння Інформація КП пт, 04/12/2024 - 15:59

Compound Semiconductor Applications (CSA) Catapult has issued its annual report for the financial year 2022–23, highlighting progress in its two focus areas — Net Zero and Future Telecoms — and describing how it has helped industry to bring next-generation compound semiconductor technologies to market...

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has secured $15m in funding from the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act of 2022 that provided the US Department of Defense (DoD) with $2bn to strengthen and revitalize the US semiconductor supply chain...

Весняний інженерний тиждень для майбутніх вступників kpi пт, 04/12/2024 - 11:17

Acquisition adds ASA Motion Link technology to Microchip’s broad Ethernet and PCIe automotive networking portfolio to enable next-generation software-defined vehicles

Microchip Technology Inc. has announced the completed acquisition of Seoul, Korea-based VSI Co. Ltd., an industry pioneer in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for in-vehicle networking (IVN). The terms of the transaction are not disclosed.

The market size of automotive radar, camera and LiDAR modules is expected to grow by greater than two times between 2022 to 2028 to $27B in revenue, according to Yole Group[1]. This anticipated growth is driven by the increased adoption of Advanced Driver Assistance Systems (ADAS), in-cabin monitoring, safety and convenience features (e.g., 360-degree surround view, e-mirrors) and multi-screen digital cockpits for next-generation software-defined vehicles (SDV). These applications will require more highly asymmetric raw data and video links and higher bandwidths, making current, proprietary serializer/deserializer (SerDes) based solutions no longer adequate, both commercially and technically. In response to these developments, the Automotive SerDes Alliance (ASA) was formed in 2019 and released the first open-standard ASA Motion Link (ASA-ML)  specifications.

“This acquisition brings VSI’s knowledgeable team, their market traction and ASA Motion Link technologies and products to Microchip’s expansive automotive networking portfolio to better serve the ADAS megatrend we are focused on,” said Mitch Obolsky, senior vice president of Microchip’s automotive products, networking, and data centre business units. “As the industry converges around three primary IVN pillars – Ethernet, PCIe and ASA Motion Link, camera and display connectivity is one of the fastest growing and largest IVN markets. With VSI, Microchip can now offer products that span all three pillars and also provide automotive security, microcontrollers, motor control, touch and power management solutions to our customers to enable their next-generation software-defined vehicle architectures.”

Today, ASA has over 145 members, including Microchip who is a promoter member. With 11 automotive manufacturers including BMW, GM, Ford, Stellantis and Hyundai-Kia Motors Corporation, the Alliance also includes an ecosystem ranging from Tier 1 suppliers, semiconductor and imager vendors, to test and compliance houses. In addition to being an open standard, ASA-ML brings link layer security and scalability to support 2 Gbps to 16 Gbps line rates. Furthermore, the upcoming specification update will enable ASA-ML to support Ethernet-based architectures.

“Microchip Technology is an established and trusted market leader in automotive networking known for their automotive quality and robust supply chain, and our team is excited to join them to address the growing ADAS and digital cockpit connectivity market,” said Steve Kang, CEO of VSI Co. Ltd. “VSI is a leader in the development of ASA-ML products and was the first to introduce products to the market. Our standards-compliant chipsets are being evaluated by car manufacturers worldwide. We recently collaborated with BMW in a proof of concept to showcase ASA-ML and our product readiness. This acquisition brings together two organizations with a shared commitment to advancing technology through innovation. We look forward to successfully deploying our solutions in production vehicles for years to come.”

In March 2024, BMW Group announced at the Automotive Ethernet Congress in Munich they would shift to using standardized ASA-ML for the upcoming start of productions. BMW has always been at the forefront of in-vehicle networking innovation and strongly believes in leveraging standardized technologies in their vehicle architectures and now also their video architecture.

[1] Sources: LiDAR for Automotive – Radar for Automotive – Status of the Camera Industry – Yole Intelligence, 2023.

The post Microchip Acquires ADAS and Digital Cockpit Connectivity Pioneer VSI Co. Ltd. to Extend Automotive Networking Market Leadership appeared first on ELE Times.

Майдаржавин Ганзоріг: космонавт із сім'ї монгольських кочівників Інформація КП пт, 04/12/2024 - 10:00

Вибори ректора 2024: актуальна інформація medialab пт, 04/12/2024 - 09:17