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GaN, DPD tech improve 5G RU energy efficiency

EDN Network - Thu, 02/27/2025 - 19:57

MaxLinear and RFHIC have collaborated on a power amp solution for high-power macro cell radio units (RUs) that lowers power consumption, weight, and volume. The setup combines RFHIC’s GaN power amplifiers with MaxLinear’s digital predistortion (DPD) technology running on the Sierra radio SoC. The companies will showcase the solution at next week’s Mobile World Congress 2025.

MaxLinear’s DPD technology (MaxLIN) and Sierra radio chip, combined with RFHIC’s ID19801D GaN power amplifier and SDM19007-30H drive amplifier, achieve 55.2% line-up power efficiency with ACLR < -61 dBc and EVM < 3% at 49.6 dBm (91 W). The setup operates in the PCS band (1930–1995 MHz) with 2×NR10MHz carriers.

The Sierra radio SoC supports all major RU applications, including conventional macro, massive MIMO, pico, and all-in-one small cells. It integrates an RF transceiver supporting up to 8 transmitters, digital frontend with MaxLIN, low-PHY baseband processor, O-RAN split 7.2x fronthaul interface, and Arm Cortex-A53 quad-core CPU subsystem.

RFHIC’s ID series GaN power transistors operate from 1.8 GHz to 4.2 GHz, delivering saturated power levels of 410 W, 460 W, 700 W, and 800 W. The SDM series two-stage GaN hybrid drive amplifiers, internally matched to 50 Ω, cover 1.8 GHz to 4.1 GHz with output power options of 40 W, 60 W, and 80 W.

MaxLinear

RFHIC

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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1 A, 20V PWM DAC current source with tracking preregulator

EDN Network - Thu, 02/27/2025 - 19:32

This design idea reprises another “1A, 20V, PWM controlled current source.” Like the earlier circuit, this design integrates an LM3x7 adjustable regulator with a PWM DAC to make a programmable 20 V, 1 A current source. It profits from the accurate internal voltage reference and overload and thermal protection features of this time proven Bob Pease masterpiece! 

However, unlike the earlier design idea that requires a floating, fixed output 24-VDC power adapter, this sequel incorporates a ground-referred boost preregulator that can run from a 5-V regulated or unregulated supply rail. The previous linear design has limited power efficiency that actually drops below single-digit percentages when driving low voltage loads. The preregulator in this version fixes that by tracking the input-output voltage differential across the LM3x7, maintaining it at a constant 3 V. This provides adequate dropout-suppressing headroom for the LM3x7 while minimizing wasted power and unnecessary heat.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Here’s how it works. LM317 fans will recognize Figure 1 as the traditional LM317 constant current source topology that maintains Iout = Vadj/Rs by forcing the ADJ pin to be 1.25 V more negative (a.k.a. less positive) than the OUT pin. It has worked great for 50 years, but of course the only way you can vary Iout is by changing R. 

Figure 1 A classic LM317 constant current source where: Iout = Vadj/R = 1.25v/Rs.

Figure 2 shows another (easier) way to make Iout programmable. The circuit enables control of ampere-scale Iout with only milliamps of Ic control current. 

Figure 2 A modification that makes the current source variable where: Iout = (Vadj – IcRc)/Rs – Ic.

Figure 3 shows this idea fleshed out and put to practical use. Note that Rs = R4 and Rc = R5.

Figure 3 U2 current source programmed by U1 PWM DAC and powered by U3 tracking preregulator.

Figure 2’s Ic control current is provided by the Q2 Q3 complementary pair. Since Q3 provides tempco compensation for Q2, it should be closely thermally coupled with its partner. Q4 does some nonlinearity compensation by providing curvature correction to Q2’s Ic control current generation. The daisy chain of three 1N4001 diodes provides bias for Q2 and Q4.

The PWM input frequency is assumed to be 10 kHz or thereabouts. Ripple filtering is the purpose of C1 and C2 and gets some help from an analog subtraction cancellation trick first described in “Cancel PWM DAC ripple with analog subtraction.”

About that tracking preregulator thing: Control of U3 to maintain the 3 V of headroom required to hold U2 safe from dropout relies on Q1 acting as a simple differential amplifier. Q1 drives U3’s Vfb voltage feedback pin to maintain Vfb = 1.245 V. Therefore (if Vbe = Q1’s base-emitter bias, typically ~0.6 V for Ie = ~500 µA)

Vfb/R7 = ((U2in – U2out) – Vbe)/R6
1.245v = (U2in – U2out – 0.6v)/(5100/2700)
U2in – U2out = 1.89 * 1.245v + 0.6v = 3v

 Note, if you want to use this circuit with a different preregulator with a different Vfb, just adjust:

R7 = R6 Vfb/2.4v

Finally, a note about overvoltage. Current sources have the potential (no pun!) for output voltage to soar to damaging levels (destructive of U3’s internal switch and downstream circuitry too) if deprived of a proper load. R11 and R12 protect against this by utilizing U3’s built in OVP feature to limit max open circuit voltage to about 30 V if the load is lost.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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The Apple iPhone 16e: No more fiscally friendly “SE” for thee (or me)

EDN Network - Thu, 02/27/2025 - 19:10
A new “entry level” iPhone

Truthfully, I originally didn’t plan on covering the new iPhone 16e, Apple’s latest “entry-level” phone preceded by three generations worth of iPhone SE devices.

I knew a fourth-generation offering was coming (and sooner vs later), since European regulations had compelled Apple to phase out the SEs’ proprietary Lightning connector in favor of industry-standard USB-C. The iPhone SE 3, announced in 2022, had already been discontinued at the end of last year in Europe, in fact, along with the similarly Lightning-equipped iPhone 14, both subsequently also pulled from Apple’s product line across the rest of the world coincident with the iPhone 16e’s unveiling on February 19, 2025. Considering the heavy company-wide Apple Intelligence push, the iPhone SE 3 was also encumbered by its sub-par processor (A15 Bionic) and system memory allocation (4 GBytes), both factors suggesting the sooner-vs-later appearance of a replacement.

But how exciting could a new “entry-level” (translation: cost-optimized trailing-edge feature set) smartphone be, after all? Instead, I was planning on covering Amazon’s unveiling of its new AI-enhanced (and Anthropic-leveraging, among others) Alexa+ service, which happened earlier today as I write these words on the evening of February 26. That said, as Amazon’s launch event date drew near, I began hearing that no new hardware would be unveiled, just the upgraded service (in spite of the fact that Amazon referred to it as a “Devices & Services event”), and that what we now know of as Alexa+ would only beta-demoed, not actually released until weeks or months later. Those rumors unfortunately all panned out; initial user upgrades won’t start until sometime in March, more broadly rolling out over an unspecified-duration period of “time”.

What those in attendance in New York (no virtual livestream was offered) saw were only tightly scripted, albeit reportedly impressive (when they worked, that is, which wasn’t always the case), demos. As we engineers know well, translating from curated demos to real-world diverse usage experiences rarely goes without a hitch or few. Then there were the indications of longstanding (and ongoing) struggles with AI “hallucinations”, another big-time technology hit. Add in the fact that Alexa+ won’t run on any of the numerous, albeit all geriatric, Amazon devices in my abode, and I suspect at last for a while, I’ll be putting my coverage plans on hold.

Pricing deviations from prior generations

Back to the iPhone 16e then, which I’m happy to report ended up being far more interesting than I’d anticipated, both for Apple’s entry-level and broader smartphone product line and more generally for the company’s fuller hardware portfolio. Let’s begin with the name. “SE” most typically in the industry refers to “Special Edition”, I’ve found, but Apple has generally avoided clarifying the meaning here, aside from a brief explanation that Phil Schiller, Apple’s then-head of Worldwide Product Marketing (and now Apple Fellow), gave a reporter back in 2016 at the first-generation iPhone SE unveiling.

And in contrast to the typical Special Edition reputation, which comes with an associated price tag uptick, Apple’s various iPhone SE generations were historically priced lower than the mainstream and high-end iPhone offerings that accompanied them in the product line at any point in time. To accomplish this, they were derivations of prior-generation mainstream iPhones, for which development costs had already been amortized. The iPhone SE 3, for example, was form factor-reminiscent of the 2017-era, LCD-based iPhone 8, albeit with upgraded internals akin to those in the 2021-era iPhone 13.

The iPhone 16e marks the end of the SE generational cadence, at least for now. So, what does “e” stand for? Once again, Apple isn’t saying. I’m going with “economy” for now, although reality doesn’t exactly line up with that definitional expectation. The starting price for the iPhone SE 3 at introduction was $429. In contrast, the iPhone 16e begins at $599 and goes up from there, depending on how much internal storage you need. Not only did Apple ratchet up the price tag, as it’s more broadly done in recent years, it also broke through the perception-significant $499 barrier, which frankly shocked me. In contrast, if you’ll indulge a bit of snark, I chuckled when I noticed Google’s response to Apple’s news: a Pixel 8a price cut to $399.

Upgrades

That said, RAM jumps from 4 GBytes on the iPhone SE 3 to (reportedly: as usual, Apple didn’t reveal the amount) 8 GBytes. The iPhone SE 3’s storage started at 64 GBytes; now it’s 128 GBytes minimum. The 4.7” diagonal LCD has been superseded by a 6.1” OLED; more generally, Apple no longer sells a single sub-6” smartphone. And the front and rear cameras are both notably resolution-upgraded from those in the iPhone SE. The front sensor array also now supports TrueDepth for (among other things) FaceID unlock, replacing the legacy Touch ID fingerprint sensor built into the no-longer-present Home button, and the rear one, although still only one, includes 2x optical zoom support.

Turning now to the internals, there are three particularly notable (IMHO) evolutions that I’ll focus on. Unsurprisingly, the application processor was upgraded for the Apple Intelligence era, from the aforementioned A15 Bionic to the A18. But this version of the newer SoC is different than that in the iPhone 16, only enabling 4 GPU cores versus 5 on the mainstream iPhone 16 (and 6 on the iPhone 16 Pro). Again, as I mentioned before, I suspect that all three A18 variants are sourced from the same sliver of silicon, with the iPhone 16e’s version detuned to maximize usable wafer yield. Similarly, there may also be clock speed variations, another spec that Apple unfortunately doesn’t make public, between the three A18 versions.

In-house 5G chip

More significant to me is that this smartphone marks the initial unveil of Apple’s first internally developed LTE-plus-5G cellular subsystem. A quick history lesson; as regular readers already know, the company generally prefers to be vertically integrated versus external supplier-dependent, when doing so makes sense. One notable example was the transition from Intel x86 to Apple Silicon Arm-based computer chipsets that began in 2020. Notable exceptions (at least to date) to this rule, conversely, include volatile (DRAM) and nonvolatile (flash) memory, and image sensors. As with Intel in CPUs, Apple has long had a “complicated” (among other words) relationship with Qualcomm for cellular chipsets. Specifically, back in April 2019, the two companies agreed to drop all pending litigation between them, shortly after Qualcomm had won a patent infringement lawsuit, and which had begun two years earlier. Three months later, Apple dropped $1B to buy the bulk of Intel’s (small world, eh?) cellular modem business.

Six years later, the premier C1 cellular modem marks the fruits (Apple? Fruit? Get it?) of the company’s longstanding labors. Initial testing results on pre-release devices are encouraging from performance and network-compatibility standpoints, and Apple’s expertise in power consumption coupled with the tight coupling potential with other internally developed silicon subsystems, operating systems and applications are also promising. That said, this initial offering is absent support for ultra-high-speed—albeit range-restrictive, interference-prone and coverage-limitedmmWave, i.e., ultrawideband (UWB) 5G. For that matter, speaking of wireless technologies, there’s no short-range UWB support for AirTags and the like in the iPhone 16e, either.

Whose modem—Apple’s own, Qualcomm’s, or a combination—will the company be using in its next-generation mainstream and high-end iPhone 17 offerings due out later this year? Longer term, will Apple integrate the cellular modem—at minimum, the digital-centric portions of it—into its application processors, minimally at the common-package or perhaps even the common-die level? And what else does the company have planned for its newfound internally developed technology; cellular service-augmented laptops, perhaps? Only time will tell. Apple is rumored to also be developing its own Wi-Fi transceiver silicon, with the aspiration of supplanting today’s Broadcom-supplied devices in the future.

Wireless charging support

Speaking of wireless—and cellular modems—let’s close out with a mention of wireless charging support. The iPhone 16e still has it. But in a first since the company initially rolled out its MagSafe-branded wireless charging capabilities with the iPhone 12 series in October 2020, there are no embedded magnets this time around (or in future devices as well?).

Initial speculation suggested that perhaps they got dropped because they might functionally conflict with the C1 cellular modem, a rumor that Apple promptly squashed. My guess, instead, is that this was a straightforward bill-of-materials cost reduction move on the company’s part, perhaps coupled with aspirations toward system weight and thickness reductions, and maybe even a desire to otherwise devote the available internal cavity volume for expanded battery capacity and the like. After all, as I’ve mentioned before, anyone using a case on their phone needs to pick a magnet-inclusive case option anyway, regardless of whether magnets are already embedded in the device. That all said, I’m still struck by the atypical-for-Apple backstep the omission of magnets represents, not to mention the Android-reminiscent aspect of it.

Future announcements?

The iPhone 16e isn’t the only announcement that Apple has made so far in 2025. Preceding it were, for example:

And what might be coming down the pike? Well, with today’s heavy discounts on current offerings as one possible indication of the looming next-generation queue’s contents, there’s likely to be:

  • An M4 upgrade to the 13” and 15” MacBook Air, and
  • An Apple Intelligence-supportive hardware update to the baseline iPad

Further down the road, I’m guessing we’ll also see:

You’ll note that I mindfully omitted a Vision Pro upgrade from the 2025 wishlist 😉 Stay tuned for more press release-based unveilings to come later this spring, the yearly announcement-rich WWDC this summer, and the company’s traditional yearly smartphone and computer family generational-upgrade events this fall. I’ll of course cover the particularly notable stuff here in the blog. And for now, I welcome your thoughts on today’s coverage in the comments!

Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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Former ams Osram CEO Alexander Everke to succeed Kim Schindelhauer as chairman of Aixtron’s Supervisory Board

Semiconductor today - Thu, 02/27/2025 - 18:15
Deposition equipment maker Aixtron SE in Herzogenrath, near Aachen, Germany has announced Alexander Everke, who has been a member of its Supervisory Board since May 2024, as the successor to the Supervisory Board chairmanship. Existing chairman Kim Schindelhauer will resign from the position at the conclusion of the Annual General Meeting on 15 May, when Aixtron will also propose the election of Ingo Bank as a new member of the Supervisory Board...

Blower Soldering Definition, Process, Working, Uses & Advantages

ELE Times - Thu, 02/27/2025 - 14:05
What is Blower Soldering?

Blower soldering is a technique that utilizes a hot air blower or a hot air rework station to melt solder and create electrical connections between components. Unlike traditional soldering, which uses a heated metal tip to apply solder, blower soldering employs a controlled stream of heated air to achieve uniform soldering, making it ideal for surface-mount device (SMD) components and rework applications.

This method is widely used in electronics repair, PCB assembly, and component rework due to its precision and ability to work with delicate electronic parts.

How Blower Soldering Works

Blower soldering involves the following key steps:

  1. Preparation:
    • Ensure the work area is clean and free of dust.
    • Secure the printed circuit board (PCB) using a fixture or holder.
    • Select the appropriate solder paste or pre-applied solder.
  2. Temperature & Airflow Settings:
    • Adjust the hot air blower or rework station to the required temperature, typically between 250-450°C, depending on the solder type and components.
    • Regulate the airflow to prevent displacement of small components.
  3. Heating Process:
    • Direct the hot air over the target area in a circular or sweeping motion to evenly distribute the heat.
    • Observe the solder as it melts and forms solid electrical connections.
  4. Cooling & Inspection:
    • Allow the soldered area to cool naturally or use a cooling fan.
    • Inspect the joints for uniformity and strength using a magnifying glass or microscope.
  5. Cleaning:
    • Remove excess flux or residues using isopropyl alcohol and a brush.
Blower Soldering Process
  1. Component Installation:
  • Position the SMD components onto the PCB with solder paste applied.
  1. Heating with Hot Air Blower:
  • Apply heat evenly to reflow the solder paste and attach the components securely.
  1. Cooling Phase:
  • Allow the solder joints to solidify properly before handling the PCB.
  1. Quality Check & Testing:
  • Inspect for soldering defects such as bridges, cold joints, or insufficient solder.
Uses & Applications of Blower Soldering

Blower soldering is widely used in various electronics-related fields, including:

  1. Surface-Mount Technology (SMT) Assembly
  • Ideal for soldering micro-sized SMD components that cannot be soldered using traditional methods.
  1. PCB Repair & Rework
  • Used to remove and replace defective components on circuit boards.
  1. BGA & QFN Package Soldering
  • Enables effective reflow soldering of Ball Grid Array (BGA) and Quad Flat No-Lead (QFN) components.
  1. Desoldering Applications
  • Allows for easy removal of soldered components by melting the existing solder.
  1. Prototyping & Low-Volume Manufacturing
  • Useful for rapid prototyping of circuit designs before mass production.
Advantages of Blower Soldering

Blower soldering offers several benefits:

  1. Precision Heating:
    • Ensures uniform temperature distribution, reducing thermal stress on components.
  2. Non-Contact Soldering:
    • Unlike soldering irons, it prevents direct physical contact, minimizing damage to delicate parts.
  3. Ideal for Complex Components:
    • Suitable for soldering fine-pitch components, including BGA and QFN packages.
  4. Rework & Repair Flexibility:
    • Allows easy removal and replacement of individual components without damaging the PCB.
  5. Even Heat Distribution:
    • Reduces the chances of cold joints or uneven solder application.
  6. Compatible with Lead-Free Soldering:
    • Supports modern RoHS-compliant lead-free soldering processes.
Disadvantages of Blower Soldering

Despite its advantages, blower soldering has some limitations:

  1. Risk of Overheating:
    • Excessive heat can damage sensitive electronic components.
  2. Component Displacement:
    • High airflow settings may blow away lightweight SMD components.
  3. Learning Curve:
    • Requires skill and practice to control airflow and temperature accurately.
  4. Limited for Through-Hole Soldering:
    • Not ideal for soldering through-hole components, which require traditional soldering techniques.
  5. Equipment Cost:
    • High-quality hot air rework stations can be expensive compared to basic soldering irons.
Conclusion

Blower soldering is a highly effective method for assembling and repairing modern electronic circuits, particularly for SMD components and rework applications. With proper technique and equipment, it ensures reliable and high-quality soldering results. However, it requires careful control of temperature and airflow to prevent damage to sensitive components.

As electronics continue to shrink in size and complexity, blower soldering remains an essential technique in PCB manufacturing, prototyping, and repair industries. Whether you are an electronics hobbyist or a professional technician, mastering blower soldering can significantly improve your ability to work with advanced circuit designs.

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Rohde & Schwarz advances AI/ML-powered neural receiver testing in collaboration with NVIDIA

ELE Times - Thu, 02/27/2025 - 12:56

Rohde & Schwarz, in collaboration with NVIDIA, has achieved a significant breakthrough in AI-driven wireless communication research. The latest proof-of-concept to be showcased at MWC 2025 in Barcelona leverages digital twin technology and high-fidelity ray tracing for more realistic testing of neural receivers for 5G-Advanced and 6G.

Rohde & Schwarz continues to push the boundaries of AI-driven wireless communication research with its latest milestone in neural receiver design and testing. To be showcased at MWC 2025 in Barcelona, the latest proof-of-concept, developed in collaboration with NVIDIA, integrates digital twin technology and high-fidelity ray tracing to create a robust framework for testing 5G-Advanced and 6G neural receivers under realistic propagation conditions. The objective is to bridge the gap between AI-driven wireless simulations and real-world deployment, thereby facilitating more efficient and accurate testing of next-generation receiver architectures.

This marks the fourth significant milestone in a long-term collaboration of Rohde & Schwarz with NVIDIA with demonstration showcased at past Mobile World Congress events. The joint demonstrations have pioneered advancements in AI/ML for wireless communications over the past years, from the training of neural receivers for handling analog impairments to the design of custom constellations for pilotless communications.

At the core of the demonstration is NVIDIA Sionna, a GPU-accelerated open-source library for link-level simulations, which provides ray-traced wireless channel models to generate realistic RF propagation conditions. The simulation results can then be seamlessly transferred to the R&S SMW200A vector signal generator from Rohde & Schwarz, which emulates complex real-world radio channels without requiring expensive external RF fading equipment. This advanced testbed enables testing and verification of AI/ML-based receiver algorithms and supports data-driven fine-tuning of neural components using realistic training data.

To ensure that the digital twin and ray-tracing models accurately reflect real-world conditions, the simulation is calibrated with data from a dedicated channel-sounding measurement campaign set in an urban street-canyon environment. By combining these precise measurements with NVIDIA Sionna, the ray tracer’s ability to model material interactions and electromagnetic propagation is further refined. The result is a calibrated version of the digital twin of the physical RF environment. This combination of technologies enables more accurate site-specific testing and validation of next-generation machine learning-based communication algorithms, including applications such as neural receivers and ML-based CSI feedback enhancements.

Gerald Tietscher, Vice President Signal Generators, Power Supplies and Meters at Rohde & Schwarz, said: “The collaboration with NVIDIA marks a significant milestone in advancing AI/ML applications in wireless communications. Our work has already demonstrated the potential of AI in wireless system design, from custom constellations to neural receivers handling real-world impairments. Now, with the integration of digital twins and ray tracing, we are further expanding the possibilities of AI-driven signal processing.”

Soma Velayutham, Vice President of Telecommunications at NVIDIA, said: “Digital twin technology has transformative potential in wireless system design. By integrating advanced NVIDIA ray tracing and machine learning into receiver development, Rohde & Schwarz is paving the way for AI-native 6G networks poised to offer outstanding efficiency and innovation compared with conventional implementations.”

Rohde & Schwarz is a key contributor to global 6G research, collaborating with industry partners, research institutions, and standardization bodies to develop the next generation of wireless technologies, expected to be commercially deployed by 2030.

Visitors to MWC 2025 can experience this milestone demonstration live and speak with experts from Rohde & Schwarz and NVIDIA at the Rohde & Schwarz booth 5A80 in hall 5 of the Fira Gran Via in Barcelona from March 3 to 6, 2025. For further information on AI/ML for 6G networks, visit: https://www.rohde-schwarz.com/_257029.html

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Проректор Андрій Шишолін про результати міжнародної діяльності університету в 2024 році

Новини - Thu, 02/27/2025 - 12:47
Проректор Андрій Шишолін про результати міжнародної діяльності університету в 2024 році
Image
kpi чт, 02/27/2025 - 12:47
Текст

На засіданні Вченої ради КПІ ім. Ігоря Сікорського 10 лютого з доповіддю "Міжнародна співпраця для сталого розвитку університету – результати 2024 року" виступив проректор з науково-педагогічної роботи (з міжнародних зв'язків) Андрій Шишолін. Представляємо читачам її повну версію.

Major Solar Power Plants in Madhya Pradesh Driving Renewable Energy Growth

ELE Times - Thu, 02/27/2025 - 12:44

Madhya Pradesh, a central Indian state, has emerged as a significant hub for solar energy, contributing substantially to India’s renewable energy goals. The state’s vast land resources and high solar irradiance make it an ideal location for large-scale solar power projects. This article provides an overview of the major solar power plants in Madhya Pradesh, highlighting their capacities, unique features, and contributions to the state’s energy landscape.

  1. Rewa Ultra Mega Solar Power Project

Commissioned in 2018, the Rewa Ultra Mega Solar Power Project is a landmark in India’s renewable energy sector. Located in the Gurh tehsil of Rewa district, this 750 MW solar park spans approximately 1,590 acres. It was among the first projects in India to achieve grid parity, with a first-year tariff of INR 2.97 per unit, significantly lower than previous records. The project is operated by Rewa Ultra Mega Solar Limited (RUMSL), a joint venture between Madhya Pradesh Urja Vikas Nigam Limited and the Solar Energy Corporation of India. Notably, about 24% of the energy produced is supplied to the Delhi Metro Rail Corporation, meeting 60% of its daytime energy requirements.

  1. Welspun Solar MP Project

Situated in Bhagwanpura village of Neemuch district, the Welspun Solar MP Project is a 151 MW photovoltaic power station. This project underscores the state’s commitment to harnessing solar energy and contributes significantly to the local grid, supporting both residential and industrial consumers.

  1. Agar Solar Park

The Agar Solar Park, currently under development, is poised to add 550 MW to Madhya Pradesh’s solar capacity. Developed by RUMSL, this project is part of a broader initiative to establish multiple solar parks across the state, aiming for a combined capacity of 1.5 GW. The Agar Solar Park is expected to play a crucial role in meeting the region’s energy demands sustainably.

  1. Shajapur Solar Park

Also under development by RUMSL, the Shajapur Solar Park will contribute an additional 450 MW to the state’s renewable energy portfolio. This project, along with the Agar and Neemuch Solar Parks, reflects Madhya Pradesh’s strategic efforts to expand its solar infrastructure and reduce reliance on fossil fuels.

  1. Neemuch Solar Park

The Neemuch Solar Park is set to enhance the state’s solar capacity by 500 MW. Developed by RUMSL, this project is part of the trio of solar parks, including Agar and Shajapur, collectively aiming to add 1.5 GW of renewable energy to Madhya Pradesh’s grid. These initiatives are instrumental in positioning the state as a leader in India’s solar energy sector.

  1. Omkareshwar Floating Solar Power Park

A pioneering project, the Omkareshwar Floating Solar Power Park is being constructed on the reservoir of the Omkareshwar Dam in Khandwa district. With a planned capacity of 600 MW, this floating solar installation is among the largest globally. The project is being developed in phases, with the initial phase commissioned in August 2024, adding 90 MW to the grid. This innovative approach not only utilizes existing water bodies but also minimizes land usage, showcasing a sustainable model for future projects.

  1. ACME Solar Energy-Madhya Pradesh Solar PV Park

Commissioned in March 2014, the ACME Solar Energy-Madhya Pradesh Solar PV Park is a 30 MW photovoltaic power project. Located in Madhya Pradesh, this plant contributes to the state’s renewable energy supply, supporting both local communities and industries.

Upcoming Investments by NTPC

In a significant development, India’s state power company NTPC has announced plans to invest over $23 billion in renewable energy projects in Madhya Pradesh. This investment will encompass various projects, including solar, wind, and pumped hydro, aiming to add up to 20 GW of capacity. This initiative underscores the state’s potential and attractiveness for large-scale renewable energy investments.

Conclusion

Madhya Pradesh’s strategic investments and developments in solar energy have positioned it as a frontrunner in India’s renewable energy landscape. The state’s combination of large-scale solar parks, innovative floating solar projects, and substantial upcoming investments reflects a robust commitment to sustainable energy solutions. These initiatives not only contribute to meeting regional energy demands but also play a vital role in India’s overarching goal of transitioning to a greener and more sustainable energy future.

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Anritsu’s Test Solutions Contribute to Enhanced Communication Performance by Combining SK Telecom and POSTECH’s Antenna Expansion Technologies with AI

ELE Times - Thu, 02/27/2025 - 12:28

Anritsu Corporation is pleased to announce that SK Telecom (SKT), the largest mobile operator in South Korea, and Pohang University of Science and Technology (POSTECH), a university that is a leader in advanced research, have selected the Anritsu Radio Communication Test Station MT8000A for the verification of the technologies used to realize mobile communication that combines antenna expansion technologies with Artificial Intelligence (AI).

Driving this development is a need to address the growing requirement for innovation in 5G-Advanced mobile communication systems, specified in 3GPP Release 18 and beyond. This development has achieved real-time AI-based optimization that helps solve the problem of interference arising from increasing the number of antennas mounted on a smartphone from the typical four to the current maximum of eight. This demonstration utilized the MT8000A as a base station simulator for mobile communications, revealing a remarkable improvement in the data transmission speed despite the smartphone under test remaining the same size as a conventional device and operating within the same frequency bandwidth.

The MT8000A complies with the 3GPP test standards and supports a wide range of tests, including RF measurements, protocol tests, and application tests for 5G mobile network technologies. The hardware is based on a modular architecture, making it easy to reconfigure according to the test requirements, such as higher-order MIMO (4×4 MIMO) and carrier aggregation (8CA).

To contribute to the advancement of cutting-edge telecommunications technology, Anritsu will continue to support R&D for next-generation networks by leveraging 6G and AI while strengthening our efforts to be an innovator in the area of these technologies.

The demo video for this verification will be showcased at the Mobile World Congress (MWC) Barcelona 2025 Anritsu booth, from March 3 to March 6, 2025, in Barcelona, Spain.

The post Anritsu’s Test Solutions Contribute to Enhanced Communication Performance by Combining SK Telecom and POSTECH’s Antenna Expansion Technologies with AI appeared first on ELE Times.

New Vishay Intertechnology High Voltage MLCCs Deliver Extended Capacitance for Commercial Applications

ELE Times - Thu, 02/27/2025 - 12:08

Available With C0G (NP0) and X7R Dielectrics, Devices Feature Voltages to 3000 VDC and Capacitance From 1.5 pF to 100 nF in Seven Case Sizes From 1206 to 2225

Vishay Intertechnology, Inc. today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high voltage commercial applications. Offered in seven case sizes ranging from 1206 to 2225, VJ….W1HV High Voltage MLCC Commercial Series devices extend the capacitance values of the company’s existing high voltage MLCCs with the ultra stable C0G (NP0) dielectric and are also available with the X7R dielectric for even higher capacitance.

The devices released today are manufactured in a base metal electrode (BME) system with a dry sheet technology process to reduce costs for a wide range of high voltage applications. The MLCCs will be used as input filtering, output filtering, and snubber capacitors for alternative and conventional energy generation, distribution, metering, management, and storage; industrial automation, motor drives, power tools, and welding equipment; consumer appliances; telecom mobile and fixed infrastructure; and medical instrumentation.

VJ….W1HV High Voltage MLCC Commercial Series devices with the C0G (NP0) dielectric offer high voltages to 3000 VDC, capacitance values from 1.5 pF to 82 nF, and a temperature coefficient of capacitance (TCC) of 0 ppm/°C ± 30 ppm/°C from -55 °C to +125 °C. X7R devices provide capacitance from 100 pF to 100 nF, voltages to 2000 VDC, and TCC of ± 15 % from -55 °C to +125 °C.

The MLCCs feature a nickel barrier with 100 % tin terminations and are available with polymer terminations for additional protection against board flexure damage. The devices are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

Dielectric

Case code

Maximum voltage (V)

Capacitance

Minimum

Maximum

C0G (NP0)

1206

3000

1.5 pF

10 nF

1210

3000

10 pF

10 nF

1808

3000

2.2 pF

3.3 nF

1812

3000

10 pF

22 nF

1825

3000

10 pF

39 nF

2220

2000

10 pF

47 nF

2225

2000

10 pF

82 nF

X7R

1206

2000

100 pF

1.2 nF

1210

2000

100 pF

1.2 nF

1808

2000

150 pF

1.8 nF

1812

2000

270 pF

1.8 nF

1825

1000

1.0 nF

100 nF

2220

1000

1.0 nF

1.8 nF

2225

1000

1.0 nF

1.8 nF

Samples and production quantities of the VJ….W1HV High Voltage MLCC Commercial Series devices are available now, with lead times of 18 weeks.

The post New Vishay Intertechnology High Voltage MLCCs Deliver Extended Capacitance for Commercial Applications appeared first on ELE Times.

The QLDPC code breakthrough in quantum error correction

EDN Network - Thu, 02/27/2025 - 09:44

The quantum low-density parity check (QLDPC) codes, the “holy grail” of quantum error correction research and development for 30 years, have a breakthrough, according to the Vancouver-based Photonic Inc. These codes use fewer quantum bits (qubits) than traditional surface code approaches. The company’s chief quantum officer, Stephanie Simmons, sat with EE Times to explain how this low-overhead error correction technology works to realize the promised exponential speedups in quantum computing.

Read the full story at EDN’s sister publication EE Times.

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Cellvest Energy: Powering a Global Green Energy Revolution with Next-Gen Battery Solutions & Fin-Tech Innovation

ELE Times - Thu, 02/27/2025 - 09:35

A game-changing, 501 Cr (INR) startup disrupting the $800 billion global energy storage market

The energy storage industry in India has witnessed a game-changing moment with the official launch of Cellvest Energy Private Ltd., a next-generation energy startup that is redefining businesses access to battery storage solutions. The high-profile event, held at Conrad Hotel, Bangalore, brought together industry leaders, policymakers, and Global energy experts to discuss the future of sustainable power.

With a market valuation of 501 Cr, Cellvest is addressing some of the most pressing challenges in the energy sector, including high capital costs, short battery lifespans, and limited access to cutting-edge storage technology. Unlike traditional models that require businesses to make heavy upfront investments, Cellvest is pioneering a flexible financing model, offering options to rent, lease-to-own, or purchase battery solutions outright, making sustainable energy more accessible than ever before.

“The energy transition cannot happen if storage remains financially out of reach for businesses. At Cellvest, we are eliminating this barrier by providing companies with a smarter way to adopt green energy—through financing models that fit their needs, whether it’s rental, lease-to-own, or purchase,” said Vijay Kallat, Managing Director of Cellvest Energy Private Ltd. “Our solutions are designed to be affordable, scalable, and long-lasting, ensuring that businesses never have to compromise on sustainability due to cost.”

During the launch event, Cellvest’s leadership team spoke about the next-generation battery technology, which lasts up to five times longer than conventional storage solutions, and can be deployed at an ultra-affordable USD 10-15 per kW. The company also shared insights into its global expansion strategy, highlighting partnerships and its commitment to scaling operations globally.

“For too long, businesses have had to choose between sustainability and affordability. With Cellvest, they no longer have to make that choice. By combining best-in-class battery technology with innovative financing, we are making clean energy solutions viable for industries of all sizes,” added Krishnadeep Menon, Director of Cellvest Energy Private Ltd.

The event concluded with the agreement between Cellvest Energy and Cellex Battery Systems reinforcing Cellvest’s position as a disruptor in the $800 billion global energy storage market. The company is now actively working on projects with industries across the globe further strengthening its vision of making sustainable power truly accessible for all.

The post Cellvest Energy: Powering a Global Green Energy Revolution with Next-Gen Battery Solutions & Fin-Tech Innovation appeared first on ELE Times.

Rohde & Schwarz and u-blox validate module compliance with the new Chinese GNSS automotive specification GB/T 45086.1-2024

ELE Times - Thu, 02/27/2025 - 07:46

u-blox, a leading global supplier of GNSS modules, and Rohde & Schwarz have successfully validated u- blox’s latest automotive GNSS module in accordance with the recently published Chinese GB/T test requirement for automotive on-board GNSS positioning systems using an automated R&S SMBV100B based GNSS simulator solution. This cutting-edge solution will be demonstrated at Mobile World Congress 2025 in Barcelona.

GNSS (Global Navigation Satellite System) plays an increasingly important role in the automotive industry to enable new infotainment and autonomous driving applications. To ensure the required quality of on-board automotive GNSS systems, the Chinese National Automotive Standardization Technical Committee created the “requirements and test methods for on-board positioning system” guidelines. Rohde & Schwarz is proud to have contributed to the drafting of the standard. These requirements were released on November 28, 2024 with an “implementation date“ of June 2025. While the test specification is currently only recommended, it is expected to become mandatory within the upcoming Chinese eCall standard.

The automotive GNSS standard requires on-board positioning systems to pass a range of requirements such for tracking sensitivity, acquisition sensitivity, time to first fix, location accuracy and velocity accuracy, in different multi-constellation and BeiDou-only modes. The standard also defines special events such as week number rollover tests, leap second handling, radio frequency interference and unexpected pseudo range errors to test the overall robustness of the positioning system. In order to pass the test cases, the GNSS receiver must be able to process signals from two frequency bands simultaneously.

Many of the tests cannot be performed in a real-world environment with live GNSS signals since they are difficult to implement, time-consuming, costly and impossible to reproduce. This is where the Rohde & Schwarz solution becomes essential. These tests can be performed with R&S SMBV100B GNSS simulator in the lab under controlled and repeatable conditions. It provides advanced simulation capabilities for configuring realistic and complex, yet repeatable GNSS scenarios that can be run under controlled conditions. Together with the R&S CMWrun sequencer software, a R&S NGC101 power supply and the R&S SMBVB-K364 software option, the R&S SMBV100B becomes an automated test solution executing the test sequence and providing a pass/fail result as well as test reports. The test solution is of special interest to GNSS silicon suppliers, GNSS module providers, Tier1 developers of Telematic Control Units (T-Box in China) and infotainment systems certification companies and vehicle OEMs selling to the Chinese market.

For the automotive ecosystem to validate compliance to this new test specification in an automated, standards-compliant, repeatable and timely manner, cooperation between suppliers in this industry becomes increasingly important. To this effect Rohde & Schwarz is pleased to co-operate with u-blox. Gerald Tietscher, Vice President Signal Generators remarked: “We are delighted to collaborate with u-blox to enable the automotive positioning ecosystem with a robust, standard compliance and automated solution to validate their products against the emerging Chinese GNSS standard.”

This partnership enabled pre-compliance tests across the u-blox portfolio of automotive GNSS receivers, including the ZED-F9L and ZED-F9K, as well as the upcoming u-blox 20 product family. Andreas Thiel, Head of Business Units, and Co-founder at u-blox AG, remarked: “We are pleased that Rohde & Schwarz selected u-blox and our EVK-F9DR as reference kit to showcase this new automated test solution. With R&S advanced testing tools, automotive companies targeting the Chinese market can seamlessly validate their u- blox-based on-board positioning systems against GB/T 45068 and other standards.”

The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.

The post Rohde & Schwarz and u-blox validate module compliance with the new Chinese GNSS automotive specification GB/T 45086.1-2024 appeared first on ELE Times.

🇯🇵 Курси японської мови

Новини - Thu, 02/27/2025 - 03:22
🇯🇵 Курси японської мови
Image
kpi чт, 02/27/2025 - 03:22
Текст

Українсько-Японський центр КПІ повідомляє, що набір на курси японської мови буде проводитися з 2 по 22 вересня. Заявка подається онлайн.

Penn State granted $4.3m of US CHIPS Act funding via MMEC

Semiconductor today - Wed, 02/26/2025 - 20:19
Penn State University aims to enhance its R&D capabilities in next-generation semiconductor technology thanks to $4.3m in infrastructure funding and in-kind support through its membership of the Midwest Microelectronics Consortium (MMEC), of which Penn State is a charter member...

Nimy’s $1.15m share placement to fund follow-up drilling at gallium discovery

Semiconductor today - Wed, 02/26/2025 - 20:09
Mining firm Nimy Resources Ltd of Perth, Western Australia says that it is on track to establish a maiden JORC (Australasian Joint Ore Reserves Committee) resource at its Western Australia gallium discovery after raising $1.15m from professional and otherwise exempt investors...

Overdesign

EDN Network - Wed, 02/26/2025 - 18:09

How much needless stuff is designed into modern products? How much do we suffer when we’re trying to use software products sometimes described as “bloatware”? What was the origin of the term “bells and whistles” as an attribute of products that are overly complex?

Back in 1940, a then-new drawbridge was opened for service along the Belt Parkway in Brooklyn, NY. It was called the Mill Basin Bridge.

That structure has since been replaced by a higher bridge with enough vertical clearance above the underlying waterway so that boat traffic can pass in and out unimpeded, but back then, the roadway of that 1940 bridge had to be repeatedly raised and lowered as boat traffic came and went underneath. Figure 1 is a screenshot of a roadway section in its up position.

Figure 1 A roadway section of the Mill Basin Bridge in the up position where the attendant must deploy two large steel barriers that stop traffic so that they can raise the roadway.

There was an observation tower at that bridge in which a bridge attendant would be stationed. It was his job to get that roadway raised and lowered when needed and to halt automobile traffic when the roadway was up. Part of his task was to operate two huge steel barriers that would cross the roadway in both directions when the roadway was impassable. Those barriers were multi-ton behemoths designed to ensure that no car was ever going to traverse a raised roadbed and fall into the water below.

One day, as a water vessel needed to get by, the attendant activated those huge barriers to go into position, but as he did so, he spotted a speeding motorist coming along who was not going to be able to stop in time before crashing into the barrier ahead. The attendant reversed the barrier control motors but because it looked like the barrier would not be out of the way in time, he left his post in the tower and tried to physically push that barrier by hand away from the car’s path. He did not succeed, the oncoming car crashed into the barrier and that attendant was killed.

My father was one of the emergency crew who responded to that disaster. He told me all about it the following day. Dad was the foreman of that part of the NYC Department of Bridges which serviced that bridge. There had been many other incidents of this ilk as well involving those same barriers and when they occurred, our house telephone would ring at any time of day or night and my father would have to go off to work as a result.

Years later, those steel barriers were removed and replaced with slender wooden crossing gates painted with red and white stripes. Those stripes could be seen by oncoming motorists from quite far away so no car ever went up a raised roadbed. Yes, the painted gates may have been now and then smithereened, but no repeat of the above tragedy ever took place, at least so far as I was ever told.

The overdesign aspect of all this is that those immense steel barriers were not only unnecessary, they were a danger in their own right. Putting them in was a major cost item with negative impact (no pun intended) on the drawbridge’s operating history.

Those barriers were a tragic example of overdesign.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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