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Netherlands-based independent deep-tech venture capital fund PhotonVentures has received investment from national financing and development institution Invest-NL and a group of new private investors, with Invest-NL contributing €5m. This not only strengthens the fund’s capital base but also underscores the importance of the photonics industry for the Netherlands, as well as its competitive position in Europe and globally, says PhotonVentures. Integrated photonics is one of the key technologies in which Europe, and particularly the Netherlands, plays a significant role. To maintain this position, substantial investments from both the private and public sectors are essential, it adds...

🎥 NASA Space Apps Challenge 2024 kpi пт, 10/11/2024 - 19:00

The chiplet design movement is gathering steam, and the availability of one-stop advanced packaging solutions is a testament to this semiconductor technology’s advancement toward mass production. Such coordinated solutions for advanced packaging are crucial in the vertically disintegrated world of chiplets.

Take the case of Faraday Technology Corp., an ASIC design service and IP provider now eyeing advanced packaging-coordinated platforms for the vertical disintegration of chiplets. Such platforms streamline the advanced packaging processes by integrating multiple vendors and multi-source chiplets while providing three core services: design, packaging, and production.

In this role, Faraday aims to coordinate the vertically disintegrated vendors of chiplet, high-bandwidth memory (HBM), interposer, and 2.5D/3D packaging while offering chiplets design, testing analysis, production planning, outsourcing procurement, inventory management, and 2.5D/3D advanced packaging services.

On its part, Faraday designs and implements major chiplets, including I/O dies, SoC/compute dies, and interposers. Next, to ensure seamless integration of multi-source dies, Faraday has inked strategic partnerships with fabs and OSATs to support passive/active interposer manufacturing with through-silicon via (TSV) and thus effectively manage 2.5D/3D packaging logistics.

Figure 1 Faraday has introduced an advanced packaging coordinated platform for the vertical disintegration of chiplets.

Faraday’s partners include fabs such as Intel Foundry, Samsung Foundry and UMC as well as several OSATs. These partners help Faraday ensure capacity, yield, quality, reliability, and schedule in production for chiplets with multi-source dies.

One-stop chiplet solutions

Faraday has unveiled a 2.5D packaging platform jointly developed with Kiwimoore, a Shanghai, China-based interconnect solutions provider. The advanced packaging platform—which has successfully entered the mass production stage—incorporates Kiwimoore’s chiplet interconnect and network domain-specific accelerator (NDSA) solutions.

Besides NDSA, Kiwimoore provided various chiplets, including a 3D general-purpose base die and high-speed I/O die. On the other hand, Faraday integrated multi-source chiplets from different semiconductor manufacturers, encompassing compute dies, HBM design, and production.

Figure 2 Kiwimoore provided a general-purpose base die and a high-speed I/O die for this chiplet project.

The two companies collaborated on chiplet SoC/interposer design integration, testing and analysis, outsourced procurement, and production planning services. Mochen Tien, CEO of Kiwimoore, acknowledged that Faraday’s supply chain capabilities ensured stable supply of critical components like interposers and HBM memory.

Such system-level product design integration services allow chipmakers to focus on core die development, shortening design cycles and reducing R&D costs. “Through our close collaboration, we have successfully simplified the chiplet design and packaging processes and quickly integrated chiplets from different suppliers,” said Flash Lin, COO of Faraday.

The emergence of such one-stop solutions with flexible services and business models complements chiplets’ system-level design as well as the broader ecosystem encompassing multi-source chiplets, packaging, and manufacturing. It also reveals the larger technology blueprint in the commercial realizations of chiplet design and packaging.

Related Content

• Chiplet Standard Goes 3D
• Will 2024 be the year of advanced packaging?
• Chiplets advancing one design breakthrough at a time
• Heterogeneous Integration and the Evolution of IC Packaging

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TriEye Ltd of Tel Aviv, Israel — which claims to have pioneered the first CMOS-based shortwave infrared (SWIR) image-sensing solutions — and HLJ Technology of Hsinchu, Taiwan — which was founded in 2001 and provides vertical-cavity surface-emitting laser (VCSEL) and photodiode solutions for consumer electronics, optical connectivity, and automotive markets — have announced the joint demonstration of a VCSEL-powered SWIR sensing and imaging solution...

Repairing the road on a laptop adapters PCB. It seems like client tried to repair the adapter himself and messed up the road. submitted by /u/Faloin [link] [comments]

Industrial gas company Taiyo Nippon Sanso Corp (TNSC) of Tokyo, Japan (part of Nippon Sanso Holdings Group) says that The Ohio State University is to purchase and use a TNSC SR4000HT-RR-LV metal-organic chemical vapor deposition (MOCVD) reactor for its nitride R&D and a halide vapor phase epitaxy (HVPE) reactor for gallium oxide applications...

In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module. To achieve this functionality, it is common to use high-side disconnect switches (e.g. MOSFETs) to prevent a load short circuit from affecting the battery. Infineon Technologies AG has now introduced the EiceDRIVER 1EDL8011, a high-side gate driver designed to protect battery-powered applications such as cordless power tools, robotics, e-bikes, and vacuum cleaners in the event of a fault.

The device provides fast turn-on and turn-off of high-side N-channel MOSFETs with its high gate current capabilities. It consists of an integrated charge pump with an external capacitor to provide strong start-up. The internal charge pump provides the MOSFET gate voltage when the operating input voltage is low. The gate driver IC manages inrush current and provides fault protection. Undervoltage Lockout (UVLO) protection at input voltage prevents the device from operating under hazardous conditions. The driver is available in a DSO-8 package, making it ideal for space-constrained designs. It includes overcurrent protection (OCP), adjustable current setting threshold, time delay and a safe start-up mechanism with flexible blanking during MOSFET turn-on transitions.

The 1EDL8011 has a wide operating voltage range of 8 V to 125 V and a high gate sinking current of up to 1 A, allowing for efficient switching. Additionally, the product has an extremely low off-mode quiescent current of 1 µA, helping to minimize power consumption in sleep mode. The device also includes a VDS sense feature that is used to trigger an overcurrent shutdown by monitoring the drain-to-source voltage of the disconnect MOSFET.

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Rohde & Schwarz, in collaboration with wireless communications engineering experts IMST GmbH, has developed a patented antenna digital twin solution, effectively addressing a multitude of challenges and delivering considerable benefits for vehicle manufacturers and their suppliers to optimize automotive connectivity. The solution combines measurements of the antenna characteristics with simulation of the electromagnetic wave propagation to optimize the antennas’ design and their position to ensure for example optimal WiFi coverage inside the vehicle.

Vehicle manufacturers face several challenges when integrating antennas out- or in-side their vehicles. Performing antenna simulations is complex and time consuming, and simulation results have to be proven by physical measurements. Accurate measurements in-side the vehicle are simply not possible due to the closed vehicle environment. A combination of measurements and simulation is needed in order to achieve the best antenna position and therefore also connectivity performance for the user in-side the vehicle.

Rohde & Schwarz has joined forces with IMST to develop a process, divided into three steps. The first involves the characterization of physical antennas using Rohde & Schwarz test equipment, including an anechoic chamber, a R&S ZNA vector network analyzer, and the R&S AMS32 software. The second step focuses on the creation of a digital twin by involving the easy to use Near Field to Far Field Transformation Algorithm (FIAFTA). This is followed by a 3D EM simulation of a virtual scenario using EM-TWIN software from IMST.

The antenna digital twin solution from Rohde & Schwarz and IMST offers multiple benefits. Notably, it brings about a significant reduction in cost and time for antenna suppliers and vehicle manufacturers through the front-loading of antenna validation by combining measurements and simulations. It ensures the accurate and consistent characterization of physical antennas through the use of anechoic chambers and vector network analyzers in conjunction with the R&S AMS32 automation software.

Moreover, the solution significantly reduces development time as EM-TWIN simulation results are available within hours, not days. The performance of the antenna can be enhanced as production tolerances and reflections from the vehicles’ bodies are considered. The patented EM-TWIN digital antenna twin source technology provides an exceptional high level of modeling accuracy.

This solution allows for the optimal location of the antenna to be found before the physical vehicle is available, thereby avoiding expensive and time-consuming development cycles. The ability to identify the optimal location of the antenna and verify in-vehicle wireless coverage is a significant advantage, particulalry because conventional measurements are extremely difficult and unreliable within the physical contriants of the vehicle. In summary, the patented antenna digital twin solution from Rohde & Schwarz and IMST accelerates design cycles and optimizes the location of antennas on vehicles, thereby improving coverage and performance before prototypes and chassis become available.

The post Patented antenna digital twin solution from Rohde & Schwarz and IMST optimizes automotive connectivity appeared first on ELE Times.

Infineon Technologies AG of Munich, Germany has partnered with Canada-based AWL-Electricity Inc to provides it with CoolGaN GS61008P, allowing the development of advanced wireless power solutions for various industries...

Available in the Space-Saving SOP-4 Package, Automotive Grade Device Delivers Industry’s Fastest Turn-On and Turn-Off Times of 0.1 ms Typical

Vishay Intertechnology, Inc. today introduced the industry’s first 1 Form A solid-state relay to offer AEC-Q102 qualification and a 100 V load voltage. Offered in the low profile SOP-4 package, the Vishay Semiconductors VORA1010M4 delivers the industry’s fastest turn-on and turn-off times of 0.1 ms typical, in addition to the highest operating temperature to +125 °C.

The fast turn-off time of the optically isolated device released today is a result of its integrated turn-off circuit, while its combination of a state-of-the-art infrared emitter and photovoltaic diode array delivers its fast turn-on time. This switching performance makes the solid-state relay ideal for safety-critical applications, while its compact SOP-4 package saves space over competing solutions in the DIP-4 package.

Offering an isolation voltage of 3750 VRMS, the Automotive Grade VORA1010M4 is designed to provide clean, bounce-free switching for glass dimming, lighting control, inverters, motor controls, and battery management systems (BMS) in electric (EV) and hybrid electric (HEV) vehicles; industrial motor drives and controls; security and automation systems; and telecom servers and datacenters.

The post Vishay Intertechnology 1 Form A Solid-State Relay Is Industry’s First to Offer AEC-Q102 Qualification and a 100 V Load Voltage appeared first on ELE Times.

🎥 Київські політехніки створюють унікальні бронеавтівки для ЗСУ kpi пт, 10/11/2024 - 09:10

Optimized for AC/DC power supplies in industrial applications, Rohm’s PWM controller ICs support a wide range of power semiconductors. Mass production has begun for four variants: the BD28C55FJ-LB for low-voltage MOSFETs; BD28C54FJ-LB for medium- to high-voltage MOSFETs; BD28C57LFJ-LB for IGBTs; and BD28C57HFJ-LB for SiC MOSFETs.

The parts come in standard SOP-J8 packages (equivalent to JEDEC SOIC8), offering pin-to-pin compatibility with commonly used power supply components to minimize redesign and modification efforts. Each variant includes a self-recovery undervoltage lockout function with voltage hysteresis. According to Rohm, this improves application reliability by reducing threshold voltage error to ±5%, compared to the typical ±10% of standard products.

With an input voltage range of 6.9 V to 28.0 V, the PWM controllers provide a circuit current of 2.0 mA, a maximum startup current of 75 µA, and a maximum duty cycle of 50%. The lineup will be expanded to include products for driving GaN devices and variants that support a maximum duty cycle of 100%.

The BD28C55FJ-LB, BD28C54FJ-LB, BD28C57LFJ-LB, and BD28C57HFJ-LB are now available through Rohm’s authorized distributors. 

Rohm Semiconductor 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post PWM controllers drive FETs and IGBTs appeared first on EDN.

Keysight’s 4881HV wafer test system enables parametric tests up to 3 kV, accommodating both high and low voltage in a single pass. Its high-voltage switching matrix facilitates this one-pass operation, boosting productivity and efficiency.

The system’s switching matrix scales up to 29 pins and integrates with precision source measure units, allowing flexible measurements from low current down to sub-pA resolution at up to 3 kV on any pin. High-voltage capacitance measurements with up to 1-kV DC bias are also possible. This switching matrix enables a single 4881HV to replace separate high-voltage and low-voltage test systems, increasing efficiency while reducing the required footprint and testing time.

Power semiconductor manufacturers can use the 4881HV to perform process control monitoring and wafer acceptance testing up to 3 kV, meeting the future requirements of automotive and other advanced applications. To safeguard operators and equipment during tests, the system features built-in protection circuitry and machine control, ensuring they are not affected by high-voltage surges. Additionally, it complies with safety regulations, including SEMI S2 standards.

To request a price quote for the 4881HV test system, click the product page link below.

4881HV product page

Keysight Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post System performs one-pass wafer test up to 3 kV appeared first on EDN.

Diodes’ AP33771C and AP33772S sink controllers enable designers to transition from proprietary charging ports, legacy USB ports, and barrel-jack ports to a standard USB Type-C PD 3.1 port. These controllers can be embedded into battery-powered devices and other types of equipment using a USB Type-C socket as a power source.

Both ICs manage DC power requests for devices with USB Type-C connectors, supporting the PD 3.1 extended power range (EPR) of up to 140 W and adjustable voltage supply (AVS) of up to 28 V. The AP33771C provides multiple power profiles for systems without an MCU, featuring eight resistor-settable output voltage levels and eight output current options. In contrast, the AP33772S uses an I2C communications interface for systems equipped with a host MCU.

The sink controllers’ built-in firmware supports LED light indication, cable voltage-drop compensation, and moisture detection. It also offers safety protection schemes for overvoltage, undervoltage, overcurrent, and overtemperature. No programming is required to activate the firmware in the AP33771C, while designers have the option of using I2C commands to configure the AP33772S.

Housed in a 3×3-mm, 14-pin DFN package, the AP33771C is priced at $0.79 each in 1000-unit quantities. The AP33772S, in a 4×4-mm, 24-pin QFN package, costs $0.84 each in like quantities.

AP33771C product page 

AP33772S product page 

Diodes

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Sink controllers ease shift to USB-C PD appeared first on EDN.

Teledyne LeCroy has announced an integrated platform for validating the limits of auto-negotiation and link training (AN/LT) in 800-Gbps Ethernet. As an extension to the existing LinkExpert software, the new functionality leverages the Xena Z800 Freya Ethernet traffic generator and the SierraNet M1288 protocol analyzer to test Ethernet’s AN/LT specifications.

The fully automated test platform simplifies interoperability testing across various Ethernet switches and network interface cards. It tests each equalizer tap to its maximum limit to verify protocol compliance and ensure links re-establish if limits are exceeded. The system also verifies the stability of the SerDes interface and validates that all speeds can be negotiated to support backward compatibility.

The SierraNet M1288 protocol analyzer provides full stack capture, deep packet inspection, and analysis for links up to 800 Gbps. It also offers jamming capabilities for direct error injection on the link at wire speed. The Xena Z800 Freya Ethernet traffic generator can test up to 800G Ethernet using PAM4 112G SerDes, achieving the best possible signal integrity and bit error rate performance.

LinkExpert with the AN/LT test functionality is now shipping as part of the SierraNet Net Protocol Suite software.

SierraNet M1288 product page 

Xena Z800 Freya product page 

Teledyne LeCroy 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Platform advances 800G Ethernet AN/LT validation appeared first on EDN.

A tulip-shaped antenna from Kyocera AVX is designed for ultra-wideband (UWB) applications, covering a frequency range of 6.0 GHz to 8.5 GHz. The surface-mount antenna is manufactured using laser direct structuring (LDS) technology, which enables a 3D pattern design. LDS allows the antenna to operate both on-board and on-ground, offering an omnidirectional radiation pattern with consistent 360° phase stability.

The antenna’s enhanced phase stability, constant group delay, and linear polarization are crucial for signal reconstruction, improving the accuracy of low-energy, short-range, and high-bandwidth USB systems. It can be placed anywhere on a PCB, including the middle of the board and over metal. This design flexibility surpasses that of off-ground antennas, which require ground clearance and are typically positioned along the perimeters of PCBs.

The tulip antenna is 6.40×6.40×5.58 mm and weighs less than 0.1 g. It is compatible with SMT pick-and-place assembly equipment and complies with RoHS and REACH regulations. When installed on a 40×40-mm PCB, the antenna typically exhibits a maximum group delay of 2 ns, a peak gain of 4.3 dBi, CW power handling of 2 W, and an average efficiency of 61%. 

Designated P/N 9002305L0-L01K, the tulip antenna is produced in South Korea and is now available through distributors Mouser and DigiKey.

9002305L0-L01K antenna product page

Kyocera AVX 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Tulip antenna delivers 360° stability for UWB appeared first on EDN.

Creating a software-defined version of ADI

Embedded World this year has had a quite clear focus on the massive growth in the application space of edge computing and the convergence of IoT, AI, security, and underlying sensor technologies. A stop by the Analog Devices Inc (ADI) booth reveals quite clearly that the company aims to address the challenges of heterogeneous debugging and security compliance in embedded systems. “For some companies, an intelligent edge refers to the network edge or the cloud edge, for us it means right down to sensing, taking raw data off sensors and converting them into insights,” says Jason Griffin, managing director of software engineering and security solutions at ADI. “So bridging the physical and digital words, that’s our sweet spot.” ADI aims to bolster embedded solutions and security software where “as the signal chain becomes more digital, we add on complex security layers.” As an established leader in the semiconductor industry, ADI’s foundational components now require more software enablement, “so as we move up the stack, moving closer to our customer’s application layer, we’re starting to add an awful lot more software where our overall goal is to create a software-defined version of ADI and meet customers at their software interface.” The company is focusing their efforts on open source development “we’re open sourcing all our tools because we truly believe that software developers should own their own pipeline.” 

Enter CodeFusion Studio

This is where CodeFusion Studio comes into play, the software development environment was built to help develop applications on all ADI digital technologies. “In the future, it will include analog too,” notes Jason. “There’s three main components to CodeFusion Studio: the software development kit that includes usage guides and reference guides to get up and running; the modern Visual Studio Code IDE so customers can go to the Microsoft marketplace and download it to facilitate heterogenous debug and application development;  and a series of configuration and productivity tools where we will continue to expand CodeFusion Studio.” The initial release of this software includes a pin config tool, ELF file explorer, and a heterogeneous debug tool.  

Config tools

Kevin Townsend, embedded systems engineer offered a deeper dive into the open source platform starting with the config tools. “There’s not a ton of differentiation in the config tools themselves, every vendor is going to give you options to configure pin mux, pin config, and generate code to take those config choices and set up your device to solve your business problem.” The config tools themselves are more or less standard, “in reality, you have two problems with pin mux and pin config: you’ve got to capture your config choices, and every tool will do that for you, for example, I could want ADC6 on Pin B4, or UART TXD and RXD on C7 and D9, the problem with most of those tools today is that they lock you into a very opinionated sense of what that code should look like. So most vendors will generate code for you like everybody else but it will be based on the vendor-specific choices of RTOSs (real-time operating systems), my SDKs; and if I’m a moderately complex-to-higher-end customer, I don’t want to have anything to do with those, I need to generate code for my own scheduler, my own APIs in-house.” 

So CodeFusion Studio’s tool has done is decouple config choice capture from code generation, “we save all of the config choices for your system, we save all of that into a JSON file which is human and machine readable and rather than just generating opinionated code for you right away, we have an extensible command-line utility that takes this JSON file and it will generate code for you based upon the platform that you want.” The choices can include MSDK (microcontrollers SDK), Zephyr 3.7, ThreadX, or an in-house scheduler maybe used by a larger tech company. “I can take this utility and we have a plug-in based architecture where it’s relatively trivial for me to write my own export engine.” This gives people the freedom to generate the code they need. 

Figure 1: CodeFusion Studio Config tool demo at the ADI booth at Embedded World 2024.

ELF file explorer

Kevin bemoaned that half of a software developer’s day was spent doing meetings while the other half was spent doing productive work where so much of that already-reduced time had to include debug, profiling, and instrumentation. “That’s kind of the bread and butter of doing software development but traditionally, I don’t feel like embedded has tried to innovate on debug, it’s half of my working day and yet we’re still using 37-year-old tools like gdb on the command line to debug the system we’re using.” 

He says “if I want to have all my professional profiling tools to understand where all my SRAM or flash is going, I have to buy an expensive proprietary tool.” Kevin strongly feels that making a difference for ADI customers does not involve selling another concrete tool but an open platform that does not simply generate code, but to generates code that enables customers to get the best possible usage of their resources. “MCUs are a commodity at the end of the day, people are going to buy them for a specific set of peripherals, but it’s a lot of work to get the best possible usage out of them.” 

The ELF file explorer is one such example to improve the quality of life for developers. The ELF file is analogous to the .exe file for Windows desktop application, “it’s like an embedded .exe” , says Kevin. “It is kind of the ultimate source of the truth of the code that I am running on my device but it is a block box.” ELF file explorer attempts to take these opaque systems and build “windows” into them so see what is going on in the final binary. “There’s nothing in this tool that I couldn’t do on the command line but I would need 14 different tools, an Excel spreadsheet, and a piece of paper with pencil, and it would take me three hours.” Instead, developers can finalize debugging in a fraction of the time to potentially speed up time-to-market. 

“So for example, I can see the 10 largest symbols inside my image where I’m running out of flash; where is it all going?” In this case, the tool allows the user to readily see the 10 largest functions (Figure 2) with the ability to right click on it to go to the symbol source and get a view directly into the source code. 

Figure 2: CodeFusion Studio ELF file explorer tool demo.

Heterogenous Debug

The heterogenous debug tool is aimed at simplifying multi-core architecture debugging, this is quickly becoming a necessity in modern embedded development environments where implementing 2 cores or beyond is becoming commonplace. Kevin Townsend explains “almost all the debug tools that exist in the MCU space today are designed for one core at a time, they’re designed to solve one and analyze one thread of data on one architecture. You could have a design with an Arm core, a RISC-V core, an Xtensa DSP core, and maybe some proprietary instruction set from a vendor, all on the same chip; and I need to trace data as it moves through the system in a very complex way.” An example is used with an analog front end that goes to DSP for processing and then to an Arm core for further processing, and a final RISC-V core that might control a BLE radio to send a signal out to a mobile device. 

“It breaks down the ability to debug multiple cores in parallel inside the same IDE, in the same moment in time”, this diverges from the traditional approach with different IDEs, pipelines, and debuggers where the developer has to set a breakpoint on one core and switch over the the next processor’s tools to continue the debug process. This process is inherently cumbersome and fraught with human error and oversight where quite often, different cores might be controlled with different JTAG connectors causing the developer to manually switch connections as well while switching (alt-tabbing) between tools. 

In the heterogenous debug tool, users with multiple debuggers connected to multiple cores can readily visualize code for all the cores (there is no limit to the number) and they can set breakpoints on each (Figure 3). Once the offending line of code is found and fixed, the application can be rebuilt with the change and run to ensure that it works. 

Figure 3: The heterogenous debug tool demo at showing how a user can debug a system using a RISC-V and Arm core to play the game 2048. 

Trusted Edge Security Architecture

“We have our Trusted Edge Architecture which we’re embedding into our SDK as well as having security tooling within CodeFusion Studio itself, its all SDK-driven APIs so customers can use it pretty easily,” said Jason Griffin. Kevin Townsend also adds “traditional embedded engineers haven’t had to deal with the complexities of security, but now you have all this legislation coming down the pipeline there is a pressure that has never existed before for software developers to deliver secure solutions and they often don’t have the expertise.” The Trusted Edge Security Architecture is a program that offers access to crypto libraries all embedded within the software that can be used on an MCU (Figure 4). The secure hardware solutions include tamper-resistant key storage, root of trust (RoT), and more to provide a secure foundation for embedded devices. “How do we give you, out of the box, something that complies with 90% of the requirements in cybersecurity,” says Kevin, “We can’t solve everything, but we really need to raise the bar in the software libraries and software components that we integrate into our chips to really reduce the pressure on software developers.” 

Figure 4: ADI Trusted Edge Security Architecture demo.

Aalyia Shaukat, associate editor at EDN, has worked in design publishing industry for six years. She holds a Bachelor’s degree in electrical engineering from Rochester Institute of Technology, and has published works in major EE journals as well as trade publications.

Related Content

• A new embedded software platform meshes analog and digital
• Analog Devices’ integrated transceiver for next-generation software defined radio (SDR)
• Smart sensor fusion: Analog Devices and Linear Techno

The post Analog Devices’ approach to heterogeneous debug appeared first on EDN.

The evaluation of electric vehicle motors is based on many factors. Mainly, it is based on three factors- durability, performance, and reliability of an electric vehicle motor.

The evaluation system for the assessment of an electric vehicle’s motor simulates the real-world driving conditions. It measures and records vital parameters such as speed, torque, power, and temperature.

Thereafter, the data collected by the evaluation system is used to identify key areas of improvement in the performance of an electric vehicle’s motor.

The key parameters on which an electric vehicle’s motor is evaluated are as follows:

First, constant load testing. In this testing method, a fixed load is applied to an electric vehicle’s motor for a constant time period. This load can be set to a predetermined value. And then, it records the motor’s performance in terms of its temperature, torque, speed, and power consumption.

Second, real-time DC- A real-time DC is built to assess the effectiveness of different energy management controllers in a variety of road conditions.

Third, EVREVO. This testing method evaluates any evaluation software without waiting for the other vehicle parts to be installed on it.

Fourth, EV motor test systems. This test system simulates the driving conditions prevailing on roads. This aid the driver to hone his/ her driving skills pertaining to different parameters. For instance, acceleration, deceleration, and other road and load conditions.

Thereafter, the data collected from these sources is used to identify areas of improvement in the performance and design of an electric vehicle.

Fifth, input voltage control. The allowed voltage range should be selected before the test, and each test point should work as quickly as possible.

Sixth, efficiency maps. They are installed in an electric vehicle’s simulation model. It gives vital inputs about the performance of an electric vehicle’s motor, battery, and other components.

Seventh, simulation calculation. It can be used to derive the distribution of operating points under different conditions. This can help to match the motor system to the whole vehicle and get a more accurate efficiency performance.

Eight, analytical hierarchy process (AHP). It is used to quantitatively measure the relative performance of different types of batteries. For example, lithium-ion batteries, fuel cells, and hybrid batteries.

Ninth, airgap eccentricity. It detects any major defect that may occur in any variable speed induction motor.

Tenth, input voltage control. It maintains a specific voltage range at each point of an electric vehicle’s motor.

Eleventh, step load testing. In this method, a specific load is applied in incremental steps to an electric vehicle’s motor. Thereafter, the response of that motor is monitored at each load level. This enables to assess the ability of that motor to handle increasing loads without any decrease in performance or overheating. This helps to determine that motor’s load capacity and performance under different conditions.

Twelfth, peak load testing. It is undertaken to evaluate an electric vehicle’s motor’s ability to withstand any sudden high loads or short bursts of power demand. In this method, that motor is subjected to its maximum rated load or slightly higher than that limit for a brief period of time. This helps to assess that motor’s ability to withstand any such spurt in peak load without overheating or failing.

Thirteenth, endurance testing. In this method, a load is continuously applied to an electric vehicle’s motor for a prolonged period. This type of testing helps to evaluate that motor’s reliability, durability, and thermal performance under prolonged operating conditions.

Fourteenth, regenerative load testing. In this method, an electric vehicle’s motor is subjected to variable loads in regenerative mode. This helps to evaluate its efficiency in both recovering and converting kinetic energy into electrical energy during the process of deceleration.

Fifteenth, thermal load testing. It is aimed at assessing an electric vehicle’s motor’s thermal management system. In this method, a motor is operated under heavy loads or at maximum power for an extended period. During this process, its change in temperature is monitored. Hence, this testing helps in determining the effectiveness of that motor’s cooling system so that it can maintain an optimal operating range of temperature.

The post High-precision evaluation of an electric vehicle’s motors appeared first on ELE Times.

Every year during extreme weather, infants, toddlers, and disabled adults are sickened or die overlooked in vehicles. While the numbers are not huge, each case is a tragedy for a family and community. Accordingly, regulators are moving toward requiring that new vehicles be able to detect the presence of a human left in an otherwise empty vehicle. New regulations are not a question of if, but of when and of how.

This presents vehicle manufacturers with a classic Goldilocks problem. There are three primary techniques for human-presence detection in an enclosed environment, presenting a range of cost points and capabilities.

The first alternative is infrared detection: simply looking for a change in the infrared signature of the back-seat region—a change that might indicate the presence of a warm body or of motion. Infrared technology is, to say the least, mature. And it is inexpensive. But it has proved extraordinarily difficult to derive accurate detection from infrared signatures, especially over a wide range of ambient temperatures and with heat sources moving around outside the vehicle.

In an application where frequent false positives will cause the owner to disable the system, and a steady false negative can cause tragedy, infrared is too little.

Then there are radars, cameras

Radar is the second alternative. Small, low-power radar modules already exist for a variety of industrial and security applications. And short-wavelength radar can be superbly informative—detecting not only the direction and range of objects, but even the shapes of surfaces and subtle motions, such as respiration or even heartbeat. If anything, radar offers the system developer too much data.

Radar is also expensive. At today’s prices it would be impractical to deploy it in any but luxury vehicles. Perhaps if infrared is too little, radar is a bit too much.

A closely related approach uses optical cameras instead of radar transceivers. But again, cameras produce a great flood of data that requires object-recognition processing. Also, they are sensitive to ambient light and outside interference, and they are powerless to detect a human outside their field of view or concealed by, say, a blanket.

Furthermore, the fact that cameras produce recognizable images of places and persons creates a host of privacy issues that must be addressed. So, camera-based approaches are also too much.

Looking for just right

Is there something in between? In principle there is. Nearly all new passenger vehicles today offer some sort of in-vehicle Wi-Fi. That means the interior of the vehicle, and its near surroundings, will be bathed from time to time in Wi-Fi signals, spanning multiple frequency channels.

For its own internal purposes, a modern Wi-Fi transceiver monitors the signal quality on each of its channels. The receiver records what it observes as a set of data called Channel State Information, or CSI. This CSI data comes in the form of a matrix of complex numbers. Each number represents the amplitude and phase on a particular channel at a particular sample moment.

The sampling rate is generally low enough that the receiver continuously collects CSI data without interfering with the normal operation of the Wi-Fi (Figure 1). In principle it should be possible to extract from the CSI data stream an inference on whether or not a human is present in the back seat of a vehicle.

Figure 1 To detect a human presence using Wi-Fi, a receiver records what it observes as a set of data called CSI, which can be done without interfering with the normal operation of the Wi-Fi. Even small changes in the physical environment around the Wi-Fi host and client will result in a change of the amplitude and state information on the various channels. Wi-Fi signals take multiple paths to reach a target, and by looking at CSI at different times and comparing them, we can understand how the environment is changing over time. Source: Synaptics

And since the Wi-Fi system is already in the vehicle, continuously gathering CSI data, the incremental cost to extract the inference could be quite modest. The hardware system would require only adding a second Wi-Fi transceiver at the back of the vehicle to serve as a client on the Wi-Fi channels. This might just be the middle ground we seek.

A difficult puzzle

The problem is that there is no obvious way to extract such an inference from the CSI data. To the human eye, the data stream looks completely opaque (Figure 2). There is no nice, simple stream of bearing, range, and amplitude data. There may not even be the gross changes in signature upon which infrared detectors depend. The data stream looks like white noise. But it is not.

Figure 2 Making accurate inferencing of what the CSI data is sensing in real-world scenarios is a key challenge as much of it looks the same. Using a multi-stage analysis pipeline, the Synaptics team combined spectral analysis, a set of compact, very specialized deep-learning networks, and a post-processing algorithm to continuously process the CSI data stream. Source: Synaptics

Complicating the challenge is the issue of interference. In the real world, the vehicle will not be locked in a laboratory. It will be in a parking lot, with people walking by, perhaps peering at the windows. Given the nature of young humans, if they were to discover that they could set off the alarm, they would attempt to do so by waving, jumping about, or climbing onto the vehicle.

All this activity will be well within the range of the Wi-Fi signals. Making accurate inferences in the presence of this sort of interference, or of intentional baiting, is a compounding problem.

But the problem has proven to be solvable. Recently, researchers at Synaptics have reported impressive results. Using a multi-stage analysis pipeline, the team combined spectral analysis, a set of compact, very specialized deep-learning networks, and a post-processing algorithm to continuously process the CSI data stream. The resulting algorithm is compact enough for implementation in modest-priced system-on-chip (SoC), but it has proved highly accurate.

Measured results

The Synaptics developers produced CSI data using Wi-Fi devices in an actual car. They performed tests with and without an infant doll and with babies, in both forward- and rear-facing infant seats. The team also tested with children and a live adult, either still or moving about. In addition to tests in isolation, they performed tests with various kinds of interference from humans outside the car, including tests in which the humans attempted to tease the system.

Overall, the system achieved 99% accuracy across the range of tests. In the absence of human interference, the system was 100% accurate, recording no false positives or false negatives at all. Given that a false negative caused by outside interference will almost certainly be transient, the data suggest that the system would be very powerful at saving human passengers from harm.

Using the CSI data streams from existing in-vehicle Wi-Fi devices as a means of detecting human presence is inexpensive enough to deploy in even entry-level cars. Our research indicates that a modestly priced SoC is capable, given the right AI-assisted algorithm, of achieving an excellent error rate, even in the presence of casual or intentional interference from outside the vehicle.

This combination of thrift and accuracy makes CSI-based detection a just-right solution to the Goldilocks problem of in-vehicle human presence detection.

Karthik Shanmuga Vadivel is principal computer vision architect at Synaptics.

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