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On April 22, Rohde & Schwarz inaugurated a new facility center in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. The opening marks a strategic milestone for the technology company: it not only increases its presence in the third-largest city in India, but also strengthens its commitment to the Make in India initiative of the government by fostering innovation across the automotive, telecom, semiconductor, electronics, aerospace and defense sectors.

Rohde & Schwarz India, the Indian subsidiary of the German-based, global technology company Rohde & Schwarz, celebrated the grand opening of its new future-oriented facility located in the heart of Bengaluru’s prestigious Manyata Tech Park.

Andreas Pauly, President and Chief Technology Officer (CTO) of Rohde & Schwarz

While inaugurating the new offices, Andreas Pauly, President and Chief Technology Officer (CTO) of Rohde & Schwarz, said: “We are proud to expand our presence in Bengaluru. For Rohde & Schwarz, India is not merely a growth market but a vital component of our global strategy. The new facility marks a significant milestone in our journey toward strengthening our position as a trusted partner in India’s evolving technological landscape. Moreover, it reflects our contribution to the Make in India initiative through a large team of highly skilled engineers.”

For more than 90 years, Rohde & Schwarz has had a tradition of innovation, helping to develop current and future cutting-edge technologies. By expanding R&D activities in India, Rohde & Schwarz is able to enhance technological excellence for the highly dynamic Indian market. The R&D team in Bengaluru is involved in developing next-generation solutions for the company’s Test and Measurement Division.

Yatish Mohan, Managing Director Rohde & Schwarz India

Yatish Mohan, Managing Director, Rohde & Schwarz India, added: “For the past 25 years, we have fostered technological advancement in India through strategic partnerships with government agencies, training institutes and technology firms. Our presence spans multiple locations throughout the country, encompassing tier-II cities directly and via our extensive channel partner network. We are excited about the opportunities that our new facility brings, allowing us to enhance our services to the Indian technology industry and facilitate innovation in the electronics, semiconductor, automotive and telecommunications sectors.”

The new facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. This addition reinforces the commitment of Rohde & Schwarz to delivering high-quality products and services to its customers across India and beyond. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions. This strategic move underscores the company’s intention to enhance customer experience and accessibility, providing clients with hands-on experiences and seamless access to cutting-edge technology solutions.

The post Rohde & Schwarz expands footprint in India by opening new state-of-the-art facility in Bengaluru appeared first on ELE Times.

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Toyoda Gosei Co Ltd of Kiyosu, Aichi Prefecture, Japan has developed deep ultraviolet (UV-C) LEDs with light output that is among the highest in the world, it is claimed...

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) has received the EcoVadis Platinum Medal for the second consecutive year, representing the highest level of recognition for sustainability performance. Lumentum remains in the top one percent of companies assessed by EcoVadis in the past year, increasing its overall score from 78 points to 80 points. In the environmental category, the firm increased its score by 10 points from last year. Medals are awarded based on the percentile rank of a company compared with the performance of all rated companies...

Keysight Technologies Inc of Santa Rosa, CA, USA has introduced RFPro Circuit, a next-generation radio frequency (RF) simulation tool targeting the complex, multi-physics requirements of RF integrated circuit (RFIC) designers. Wireless, automotive and satellite designers can now deliver robust designs that overcome performance challenges in dense 3D packaging, taking advantage of interoperability and automation to form complex workflows, says the firm...

ROHM group of Kyoto, Japan and STMicroelectronics of Geneva, Switzerland have expanded the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with ROHM group company SiCrystal GmbH of Erlangen, Germany. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg for a minimum expected value of $230m...

Nvidia CEO Jensen Huang calls Palladium the only appliance more important to him than the refrigerator. At Cadence Design Systems annual event in Santa Clara, California, he also acknowledged that Nvidia has the largest installation of Palladium emulation systems.

Earlier, during a fireside chat, Huang said that Blackwell AI processor would not exist without Palladium. So, what’s Palladium and why is it making waves for large and powerful chip designs? It’s an emulation tool built around Cadence’s custom processors, and it’s used for pre-silicon hardware debugging.

Figure 1 Palladium Z3 and Protium X3 deliver fast pre-silicon verification and validation of the large, complex chip designs. Source: Cadence

At CadenceLive, held on 17 April 2024, the EDA toolmaker unveiled Palladium Z3 alongside Protium X3. “The supercharged Palladium Z3 and Protium X3 are built to deliver fast pre-silicon verification and validation of the largest and most complex devices,” said Dhiraj Goswami, corporate VP of hardware system verification R&D at Cadence.

Palladium Z3, which offers approximately 1.5 times the performance of its predecessor Palladium Z2, can scale from 16 million gates to all the way 48 billion gates. It also features specialized apps for tasks such as 4-state emulation, mixed-signal emulation, safety emulation, and fine-grained power analysis.

Next, the Protium X3 system, built around AMD Epyc processors paired to AMD Versal Premium VP1902 adaptive system-on-chips (SoCs), provides physical prototyping to accelerate bring-up times for pre-silicon software validation of complex, multi-billion gate chip designs. It’s also 1.5 times faster than its predecessor, Protium X2.

Palladium and Protium create a virtual version of a chip to start writing software while waiting for the physical chip to return from the fab. That’s how chip design emulation accelerates time to market. However, though Palladium Z3 and Protium X3 work in tandem, as explained above, they facilitate different types of workloads.

Figure 2 Palladium Z3 and Protium X3 feature a unified compiler and common virtual and physical interfaces. Source: Cadence

Nvidia, which used Palladium Z3 and Protium X3 predecessors in designing just-announced Blackwell AI processors, is already testing these upgraded systems in some of its AI processor designs. “The next-generation Palladium and Protium systems push the boundaries of capacity and performance to help enable a new era of generative AI computing,” said Scot Schultz, senior director for networking at Nvidia.

Today’s large chip designs serving applications like AI and high-performance computing (HPC) increasingly demand emulation solutions that offer higher performance along with faster and more predictable compile debug. New emulation systems such as Palladium fill the need with early software development, hardware-software verification, and debug tasks.

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The post Palladium emulation: Nvidia’s Jensen Huang is a fan appeared first on EDN.

Київські політехніки на семінарі ACASD 2024 Інформація КП пн, 04/22/2024 - 17:31

My Blackmagic Design video cameras are compatible with numerous editing software packages, but the company’s own DaVinci Resolve is a particularly compelling option. For one thing, there’s a close-knit synergy—or at least the natural potential for one—whenever the hardware and software come from the same company. DaVinci Resolve, for example, is able to access the camera’s gyroscope-generated metadata in order to implement post-capture stabilization of video footage; an admittedly inferior alternative to the in-body stabilization (IBIS) offered by competitors’ cameras, which operates during initial footage capture, but better than nothing.

The baseline DaVinci Resolve suite is also completely free, and robustly featured to boot. That said, Blackmagic’s cameras come bundled (at least from the factory…this is something often in-advance stripped out of used units offered for resale) with license keys for the paid DaVinci Resolve Studio variant, which offers some key enhancements for more advanced videography use cases. Each license key allows for two concurrent-use “seats”, and deactivating (at least temporarily) one installation associated with your key and account in order to activate another is straightforward…but it requires a “live” Internet connection to Blackmagic’s server farm, which may not be feasible if you’re “in the field” at the time.

Alternatively, therefore, the company also sells (through its various retail partners) USB activation dongles. Here’s an example, from Sweetwater’s site:

As you can see, they cost the same as a software license key: $295, which is a bit “salty”, both absolutely and relative to “free”. But last May, shortly after buying my two cameras (only one of which came with a key), I came across a claimed “used” one on eBay for just over $100. For the flexibility of two additional concurrent active “seats”, if no other reason, I took the plunge.

When the dongle arrived (from a Vietnam-based seller, it turns out, contrary to the upfront U.S.-sourced claim, and which in retrospect should have been my first warning sign), the packaging was admittedly a bit sketchy:

But the dongle itself looked legit, at least at initial quick glance (as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes):

And it was recognized by both MacOS and Windows systems, along with (at least at the time, keep reading) correctly activating DaVinci Resolve Studio installs on both O/Ss:

(keen-eyed readers will notice that I’ve gone ahead and added the Satechi hub to the Mac mini “stack” covered in one of last month’s blog posts, to give me easy front-panel access to various interface and expansion connectors)

More recently, however, I decided to update my various DaVinci Resolve Studio “seats” to latest-version 18.6. Afterwards, my ability to continue activating them via the dongle abruptly ceased. Jumping on Google, I learned that I wasn’t alone in my dismay (not to mention its root cause):

Like some previous releases we also have blocked some dongle key ids that are counterfeit. If you purchased second hand or not from an authorized reseller you may have one of those.

Unsurprisingly, the original seller (whose eBay account is still active as I write these words; note, too, that the seeming same person(s) was/were also selling “used” dongles on Amazon at the same time I bought mine on eBay) hasn’t responded to my outreach. That said, I give eBay plenty of kudos; the rep to whom I reported the issue promptly issued me a future-purchase coupon for the full amount.

But I was still curious to see what else I could find out about this forgery. I’ll probably eventually do a proper teardown, so stay tuned for that, although note that I’m not going to also drop $300 on a legit one for comparison purposes (!!!). For now, I’ll share some screenshots of how the dongle self-identifies to both MacOS:                                           

Screenshot

and Windows:

I’m pretty sure the first time I heard the adage “if it sounds too good to be true, it probably is” was as a child, and came from my parents. Decades later, the wisdom still applies. Caveat emptor, folks! Sound off with your thoughts in the comments.

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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• Guide for spotting counterfeit Cisco equipment

The post USB activation dongles: Counterfeit woes appeared first on EDN.

Благодійна допомога від партнерів із Баварії Інформація КП пн, 04/22/2024 - 17:01

Текст доповіді ректора М.З. Згуровського на Конференцію трудового колективу університету 11 квітня 2024 року M.Zgurovsky пн, 04/22/2024 - 15:43

The post Renesas’ New FemtoClock 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms appeared first on ELE Times.

Germany’s ZSW (Zentrum für Sonnenenergie- und Wasserstoff-Forschung — or Center for Solar Energy and Hydrogen Research — Baden-Württemberg) and cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA have announced a strategic research partnership focused on advancing thin-film photovoltaics (PV). The partnership will focus not only on performance but also on the potential to develop and optimize all-thin-film tandem technologies on a gigawatt scale...

• New STM32MP2 MPUs with 64-bit processing and edge AI acceleration
• Built for speed, security, and reliability
• Leverage the STM32 ecosystem for rapid development and secure provisioning

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Digital transformation is happening everywhere, driving improvements including greater business productivity, better healthcare, and enhanced safety and energy management throughout buildings, utilities, and transport networks. Critical enabling technologies include cloud computing, data analytics, artificial intelligence (AI), and the Internet of Things (IoT). ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world. These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.

“Our embedded MPUs address the trend that’s pushing more workloads and greater demands to smart devices, often deployed at the IoT edge, for faster response and increased efficiency,” said Stephane Henry, General Purpose MPU Division General Manager, STMicroelectronics. “The new STM32MP2 devices we are announcing today extend the performance trajectory, introducing our most powerful processing engine, now adding edge AI, and supported by the STM32 ecosystem to accelerate product development.”

Architected for demanding and time-sensitive workloads, AI inferencing, and communication, and featuring state-of-the-art cyber security, the STM32MP2 MPUs are built to withstand up to 10 years of continuous operation.

State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm’s TrustZone architecture, to keep sensitive data and keys secret. Certification to SESIP Level 3, the leading security test methodology for IoT devices and compliance, is ongoing for STM32MP2 MPUs to satisfy forthcoming tougher cyber-protection requirements in key territories worldwide. These include the US CyberTrust mark and stipulations in the EU’s Radio Equipment Directive that are due to become mandatory in 2025.

“Together with ST, we tackled the challenge of connecting our devices to the cloud. From opening locks remotely to granting new access rights, our products are shaping the future of access management,” said Marco Temporiti, R&D Software Manager, ISEO. “Thanks to the STM32MP2 microprocessor with its strong encryption capabilities, we are able to build an industrial-grade gateway with unmatched reliability and security. The seamless integration with Yocto Linux has streamlined our development process, allowing us to innovate with ease. And, ST’s 10-year longevity program also ensures a long product lifecycle at reduced cost, setting a new standard in the industry.”

“We worked with ST to build a 2-channel network audio adapter, leveraging the STM32MP1 series microprocessors to handle tasks like converting network digital audio signals for transmission and reception. The robust processing power, Ethernet connectivity and adaptable audio output interfaces were key considerations in choosing the STM32MP1 series for integration into our products,” said Yue XIONG, CEO, S-TRACK. “Now, we’re enthusiastic about the possibilities presented by ST’s latest MPUs, particularly the STM32MP2 series, which deliver improved power efficiency, enabling us to minimize cooling requirements in our enclosed casings. Additionally, the integrated Cortex-M co-processor eliminates the need for a separate microcontroller, and support for Gigabit Ethernet with precision time protocol (PTP) enables accurate data transfer and synchronization among devices. With this advanced technology, our goal is to broaden our product range to include 16-channel offerings.”

The first STM32MP2 MPUs are scheduled to enter volume production in June 2024. Sample requests and pricing information are available from local ST sales offices.

The post STMicroelectronics Powers Up the Intelligent Edge with Second-Generation STM32 Microprocessors, Bringing Performance Boost and Industrial Resilience appeared first on ELE Times.

Електроноші київських політехніків на передовій medialab пн, 04/22/2024 - 12:21

Лекторій для молоді “Знайди себе в антикорупції” kpi пн, 04/22/2024 - 11:57

Due to the continual expansion of charging infrastructure and the coming need for infrastructure replacements, the emergence of electric vehicle direct current (EV DC) charging holds long-term market viability and presents a promising business venture for companies specializing in power electronics, reckons market analyst firm Yole Group. Meanwhile, alternating current (AC) chargers will persist alongside onboard chargers (OBCs) in vehicles until DC infrastructure becomes universally established, a process anticipated to take 10–15 years, says the firm in ‘DC Charging for Automotive 2024’, an update of its annual report...

The US Department of Defense has awarded $14.4m via the Defense Production Act Investment (DPAI) Program to specialty semiconductor and performance materials producer 5N Plus Inc of Montreal, Québec, Canada to sustain and expand the capability to produce space-qualified germanium substrates used in solar cells for both commercial and national security defense satellites. The effort supports the 2024 National Defense Industrial Strategy to continue and expand support for domestic production within the resilient supply chains strategic priority area...

Залу Вченої ради КПІ прикрасило погруддя Ігоря Сікорського Інформація КП пн, 04/22/2024 - 08:30

Printed Circuit Board Assembly (PCBA) is a pivotal process in electronics manufacturing, facilitating the creation of fully functional circuit boards essential for various electronic devices. Understanding the nuances of PCBA, including its types, manufacturing process, and applications, is crucial for professionals in the electronics industry and enthusiasts alike. Let’s explore the complete details about it!

Types of PCBA Technologies:

PCBA employs two primary technologies: Surface-Mount Technology (SMT) and Through-Hole Technology (THT). SMT mounts components directly onto the surface, ideal for small and sensitive components, optimizing space utilization and production efficiency. THT, an earlier method, involves inserting components through holes in the PCB, which is suitable for more significant components requiring robust bonding.

Steps in Manufacturing Process:

Its manufacturing process comprises several critical steps:

• Solder Paste Stenciling: Solder paste Application onto designated PCB areas. 
• Pick and Place: Precise positioning of electronic components and Surface Mount Devices (SMDs). 
• Reflow Soldering: Heating the board to melt solder paste, securing components upon cooling. 
• Inspection and Quality Control: Thorough examination to ensure proper component attachment. 
• Insertion of Through-Hole Components: Add PTH components if required. 
• Manual and Wave Soldering: Manual or automated soldering methods for PTH components. 
• Testing and Final Inspection: Functional testing to detect any performance issues.

Uses and Applications of PCBA:

PCBA finds extensive applications across various industries:

• Consumer Electronics: Essential for smartphones, tablets, TVs, and home appliances, enabling compact designs and advanced features. 
• Computing and Networking: Vital components in computers, servers, routers, and switches for data processing and connectivity. 
• Automotive Industry: Integral to vehicle electronics for navigation, infotainment, safety, and electrification. 
• Industrial Applications: Utilized in machinery control systems, robotics, and automation technology for industrial processes. 
• Medical Devices: At the forefront of wearable health monitors, diagnostic imaging equipment, and medical technology, ensuring reliability and precision.

Advanced Technologies:

Technology upgrades always roll out new challenges and opportunities for PCB assembly, resulting in a bumpy but steady road of innovation and productivity. One of the current trends is 3D packaging and System-in-Package (SiP), which are examples of the new wave of APT. APT contains a wide range of functions from one package, which diminishes their size, improves operations extent, or is effective with changing ambient temperatures.

Besides that, the development of embedded component packaging (ECP) facilitates putting passive components into the PCB substrate, which not only helps reduce the use of the board but also provides the circuit with improved operation. Similarly, advanced technologies such as PCBA are also very capable of providing solutions for low-size, high-speed, and high-density designs that fit the modern requirements of the electronics industry.

Automation and Robotics:

Automation and robotics dramatically help the PCBA procedure speed up successfully and render more productivity, precision, and repeatability. With the automated pick-and-place machines that exactly position all parts of the PCB on the pallet, the time required to assemble the motherboards is significantly decreased and human errors are greatly eliminated.

Incorporating robot arms with soldering facilities allows for accurate and uniform soldering joints, consequently improving the product’s overall reliability. Furthermore, there is Automatic Optical Inspection (AOI) to identify defects and anomalies; therefore, quality control is achieved, and rework is minimized. Automation and robotics can speed up the PCBA process as well as make products of high quality with their significant role in the field of modern electronics manufacturing.

Challenges and Solutions in PCBA:

However, PCBA’s merits are often shadowed by several complex production-line issues. One of the main problems that the scaling down of parts presents is their manipulation and arrangement; thus, a higher level of devices must be used, and advanced technologies must be applied to reach precision. Matching the electrical and mechanical specifications of the components with the PCB material is of utmost importance to avoid solder joint breaking and warping of the board.

Significantly higher complexity in the designs also brings through the testing and inspection procedures to find any defects, and it has to be product reliability. However, even though these problems seem unsolvable at this moment, the possibilities offered by automated equipment, material science, and improved testing methods hold the key to finding the solution.

Future Trends:

The growth of IoT gadgets and wearable technology are the niche areas that will increase the need for smaller, more efficient PCBAS with high connectivity. In additive manufacturing, which includes 3D printing, the process allows for fast prototyping and individual designs with the aid of PCB.

Additionally, it will help gain an advantage as a result of introducing AI and ML algorithms in PCBA processes, which will enhance production efficiency and ensure predictive maintenance and quality control. The trend of sustainable manufacturing practices, consisting of utilizing materials and eco-processes, is increasing and more customer-demanding and regulatory-based.

Conclusion

PCBA is a multifaceted process crucial for developing electronic devices across diverse industries. PCBA enables innovation, functionality, and reliability in consumer electronics, automotive, and medical applications. Understanding the intricacies of PCBA is essential for professionals involved in electronics manufacturing, contributing to the advancement of technology and the development of cutting-edge products.

The post A Comprehensive Guide To Explore PCBA appeared first on Electronics Lovers ~ Technology We Love.