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Mojo Vision demonstrating micro-LED advances at Display Week

Semiconductor today - Wed, 05/15/2024 - 11:42
At SID Display Week 2024 in San Jose (14–16 May), Mojo Vision Inc of Saratoga, CA, USA — which is developing and commercializing micro-LED display technology for consumer, enterprise and government applications — is announcing advances in display technology, including demonstrating a monolithic red, green and blue (RGB) panel with 4µm pixel pitch, representing a density of 6350 pixels per inch (ppi)...

EXTENDED ASSORTMENT OF MEAN WELL PRODUCTS

ELE Times - Wed, 05/15/2024 - 11:02

Over the last decades, Mean Well has become one of the most recognisable global providers of power supply modules and converters. However, its product range also includes a broad selection of other solutions, such as KNX equipment for building automation systems.

The assortment described below includes modules compatible with the KNX system, i.e. a standard applied in home and industrial automation systems. They are used to control diverse consumers, for example actuators, motors or components with DALI interfaces for typical illumination systems. Mean Well offers numerous universal solutions for control, but also for the designing and scaling of KNX systems.

KNX AUTOMATION SYSTEMS

KNX is an open source, international standard for building automation systems that facilitates the control of illumination systems, actuators (gates, shutters, electromagnetic locks), ventilation/air conditioning systems (HVAC in its broadest sense), as well as monitoring or alarm systems (including anti-intrusion systems). A range of KNX-compatible consumer electronics products and white goods are now available. As a result, various complex systems can be created, managed, documented and diagnosed using dedicated software.

KNX power supply modulesKNX power supply modules LCM series power supply modulesLCM series power supply modules PWM series power supply modulesPWM series power supply modules Power supply for the KNX components

The first group of KNX-compatible products offered by Mean Well includes two series of power supply modules, namely KNX-20e and KNX-40e, both designed to supply diverse consumers, mostly drivers connected to the KNX networks (30 V DC output and power up to 38.4 W). They operate at standard mains voltage (180–264V AC) or direct current sources (e.g. 254–370 V DC).

The LCM and PWM series encompasses products for LED illumination systems. These are panel-mounted, constant-current (LCM, 350–1050 mA or 500–1400 mA) or constant-voltage products (PWM, 12–48 V DC). They simplify system design by eliminating the need to install additional gates for controllers, as the units can directly activate and control consumers such as LED strips, lamps or lanterns (within the basic range). The converter power rating is up to 200 W (selected models).

Note also that, in addition to their basic functionality, all these KNX-compatible converters ensure mutual synchronisation of operation and remote monitoring of power supply parameters (voltage, current, energy consumption).

KNX drivers and other equipment from the KAA series

Apart from power supply modules, Mean Well provides a range of drivers, interfaces and other auxiliary devices used to design KNX systems. They are suitable for DIN rail mounting (35 mm), which further expands their range of application, even when it comes to retrofitting work on existing systems.

KAA universal driversKAA universal drivers KAA LED drivers

The first product group includes basic drivers, i.e. relay drivers used to actuate motors, actuators, heaters, solenoid valves, etc. They feature eight channels and contacts with current-carrying capacity of 10 A or 16 A. They provide the simplest solution for remote control of consumers. As far as devices designed for LED illumination are concerned, they can additionally be used to dim the lights, for example to control their intensity and activate them with a gradual brightness enhancement effect (linear or logarithmic mode). This functionality is fully integrated with the driver circuit to use the same power source, which greatly simplifies installation/wiring.

KNX-USB interfaceKNX-USB interface KNX switch/repeaterKNX switch/repeater Ethernet-KNX routerEthernet-KNX router KNX system design and scaling

In the table above, you can see elements used to design and scale KNX networks. As the name suggests, a KNX-USB interface provides network access via any desktop computer/laptop equipped with a USB module. Such connections may be required for programming or diagnostic purposes, e.g. to adjust single controller settings. A universal serial interface can also be used to integrate a less typical device with a KNX system, e.g. a single-board computer to be configured as a remote access/control gateway. The switch/repeater comes with two RJ-45 sockets to facilitate connecting or extending network “branches” in a manner eliminating conflicts and interferences thanks to galvanic port insulation and to filtering telegrams (packages) in line with a specific hierarchy which the user can define.

An Ethernet-KNX router makes it possible to use a LAN infrastructure (and also, indirectly, the wireless WLAN infrastructure) to support a KNX system. Such a solution comes particularly handy in areas where routing new cable runs would require refurbishment work, as well as in system modernisation, servicing and scaling. The router is configured via an interface that is accessible from a web browser.

KNX-DALI converterKNX-DALI converter KNX-DALI gateKNX-DALI gate Operation with DALI interface

KNX is a powerful, but still generic standard for control/automation system communication and organisation. Therefore, in various set-ups, it may be necessary to integrate it with much more specialised solutions, such as the DALI interface(Digital Addressable Lighting Interface) used in the field of illumination system design. For example, DLC-02-KN is a gate with an output to two DALI-2 buses to operate a total of 128 control devices (ECG, Electronic Control Gear). Therefore, even very complex illumination systems (residential interiors, offices, and façade/architectural illumination systems) can be integrated with a broader-purpose building automation system. DALI gates ensure access to the diverse capabilities offered by this interface (e.g. RGBW LED strip colour and intensity adjustment, dimming/brightening rate setting, etc.), while also simplifying the presetting of individual functions and entire arrangement programmes which a user can activate via any available interface (smartphone app, wall switch, automatic/timer triggering).

The post EXTENDED ASSORTMENT OF MEAN WELL PRODUCTS appeared first on ELE Times.

BAE Systems awarded $12m THREADS contract to boost effectiveness of RF-based applications

Semiconductor today - Wed, 05/15/2024 - 10:14
The Defense Advanced Research Projects Agency (DARPA) has awarded BAE Systems’ FAST Labs R&D organization in Merrimack, NH, USA a $12m contract for the program THREADS (Technologies for Heat Removal in Electronics at the Device Scale)...

STMicroelectronics is Leading the Green Transition and Accelerating Sustainable Transformation in Technology

ELE Times - Wed, 05/15/2024 - 07:30

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications is among the early changemakers in the ongoing sustainability issue. The company has been consciously adopting environment-friendly norms and practices and has also charted out its plan for achieving carbon neutrality by 2027. ST has been forward-looking in establishing an ecosystem where business and technology stay relevant and focused on sustainability even under lingering geopolitical and economic disturbances. They are building sophisticated and cutting-edge systems and inculcating best practices within the organization with the utmost understanding of the fact that environmental awareness is its own reward in the semiconductor industry.

Group Vice President, Corporate Sustainability at STMicroelectronics

ST published its annual Sustainability Report 2024 that delves into insights into its 2023 performance on the ESG markers.

Rashi Bajpai, Sub-Editor at ELE Times spoke with Mr Jean-Louis Champseix, Group Vice President, Corporate Sustainability at STMicroelectronics, on the subject of carbon neutrality and the many aspects of sustainability that ST works upon actively.

 

 

 

ELE Times: Give insights into your vision and sustainability goals at a time when talks on climate change and the environment have taken centre stage on a global platform.

Jean-Louis Champseix: Sustainability is not just a corporate responsibility, but a core component of our value proposition delivering benefits to our company, our customers, and to society.

We believe that technology has a critical role to play in addressing the environmental, social, and economic challenges facing our world today. We are committed to developing innovative technologies and products that enable the transformation of our economies and societies through digitalization, smarter mobility, and decarbonization.

The company’s approach to sustainability is designed to mitigate risks, capitalize on opportunities presented by the global shift towards a more sustainable economy, and build a resilient business that can thrive in an ever-changing world.

And while climate change and environmental topics at large are at the heart of many sustainability-related discussions, sustainability encompasses not only environmental conservation efforts but also addresses social issues.

This is why ST is dedicated to upholding the highest standards of labor practices, ensuring the health and safety of its employees, and engaging in community development.

ELE Times: How does a giant like ST bring out positive results in tackling sustainability and climate goals? What steps has ST taken to ensure the organization remains driven towards attaining sustainability in all areas?

Jean-Louis Champseix: Our sustainability journey started 30 years ago. Since our first environmental policy back in 1993, we have built, step by step, a robust sustainability strategy endorsed by our top management and supported by ambitious goals and a culture of continuous improvement.

There are at least two success factors.

  • First, we embed more and more sustainability into our operations at all levels. The corporate environmental team is responsible for developing programs and procedures that enable us to work towards our environmental objectives. These are implemented by local sustainability committees, each of which develops a roadmap according to the needs of their respective sites. Our manufacturing sites each have an Environment, Health and Safety (EHS) steering committee responsible for implementing the environmental policy. We also launched a program to embed sustainability in each step of business strategy, planning, and decision-making. This is supported by accelerator workstreams to facilitate cross-organization collaboration in priority areas.
  • Secondly, we consider transparency a must. This is why we have been publicly reporting our target as well as our performance for 27 years. Additionally, socially Responsible Investment (SRI) rating agencies, analysts and investors regularly request detailed feedback on a wide range of Environmental, Social and Governance (ESG) topics to evaluate our corporate behavior and performance. Participating in these evaluations gives us an opportunity to assess our performance within a wider context, benchmark ST against our peers and identify areas for further improvement. It also enables us to monitor investment trends and identify new risks and opportunities. These evaluations have resulted in ST’s inclusion in leading sustainability indices and rankings.

ELE Times: What have been the major challenges that ST had to overcome in the last decade to achieve a significant result in 2023? Also, highlight the top achievements in your journey towards building a more sustainable future for ST globally.

Jean-Louis Champseix: Over the last 28 years, from 1994 to 2023, we have succeeded in drastically mitigating our environmental impact per unit of production. Here are some key figures:

  • -84% of perfluorinated compounds (PFC) emissions
  • -76% of water consumption
  • -56% of electricity consumption
  • +336% of waste recycled.

As for the last decade, we have made remarkable progress in many areas, from climate action to safety.  Let’s look at responsible mineral sourcing. Responsible sourcing means companies can identify the origin of the metals contained in electronic components and ensure their extraction, transport, or trade are not associated with serious abuses related to people, working conditions, or the environment, or with bribery and money laundering. We went from 18.5% of ST products free from conflict minerals in 2012 to 100% over the last few years.

We are also proud of being among the best in class when it comes to ensuring a safe working environment to our employees. Through the collective efforts of our sites, we maintained strong safety performance results in 2023: our employee recordable injury case rate was 0.10, better than our target of 0.13.

Our journey is far from over: we intend to continually improve our performance in all areas of Sustainability.

ELE Times: Help us understand the sustainability strategy and business model that ST has adopted.

Jean-Louis Champseix: Throughout our value chain, we have integrated sustainability into our business model. We have implemented numerous programs to effectively manage our impacts, opportunities, and risks, ensuring that sustainability remains at the forefront of our operations and activities.

Our guiding principles and 24 sustainability goals are detailed in our sustainability charter. This is endorsed by Jean-Marc Chery, our President and CEO. Our progress towards these annual, 2025 and 2027 goals are described in our latest Sustainability report, with a focus on transparency.

In our business model, we leverage our expertise in the semiconductor industry to serve sectors that are pivotal for a sustainable future, such as renewable energy, electric vehicles, and smart grid technologies. The company also maintains a strong commitment to ethical business practices, transparency, and corporate social responsibility. By integrating these principles into its core operations, ST aims to not only achieve financial success but also to foster positive environmental and social outcomes, aligning with the broader goals of sustainable development.

ELE Times: ST has committed to achieving carbon neutrality by 2027. Please elaborate on the Plan of Action.

Jean-Louis Champseix: In 2020, we announced our commitment to becoming carbon neutral by 2027 on scope 1 and 2, and partially scope 3. Our carbon neutrality program comprises five main workstreams:

  • reducing as much as technically possible our direct emissions, that represented more than 50% of our total emissions, through perfluorinated compounds (PFC) abatement systems
  • investing in energy savings, in particular in our manufacturing sites where many energy-saving initiatives are implemented,
  • using renewable energies to reach 100% of electricity coming from renewable sources in 2027,
  • minimizing all our indirect emissions by optimizing product transportation, business travels and employee commuting,
  • sustainable sequestration of what cannot be avoided at the end of our roadmap through credible offsetting programs.

The programs in place at all our manufacturing sites address our direct and indirect emissions in accordance with scopes 1, 2, and partially 3 of the GHG Protocol. In 2023, we continued our progress towards carbon neutrality, with –45% of scopes 1 & 2 (versus 2018) and reaching 71% of renewable electricity sourcing.

More information on ST’s sustainability efforts can be found at https://www.st.com/content/st_com/en/about/sustainability.html

The post STMicroelectronics is Leading the Green Transition and Accelerating Sustainable Transformation in Technology appeared first on ELE Times.

RISC-V Chip Combines CPU, GPU, and NPU Into One Core

AAC - Wed, 05/15/2024 - 02:00
X-Silicon aims to address the current limitations of edge computing with its new low-power “C-GPU” architecture.

My wife did 17.4K on Zoé

Reddit:Electronics - Wed, 05/15/2024 - 01:15
My wife did 17.4K on Zoé

My wife groomed her and I thought of you guys and gals.

submitted by /u/SirGreybush
[link] [comments]

Power-Dense Microcapacitors Pave the Way for On-Chip Energy Storage

AAC - Tue, 05/14/2024 - 20:00
In an early look at on-chip power, researchers have demonstrated that thin-film micro-capacitors can be fabricated on semiconductor chips.

Change of guard at Intel Foundry, again

EDN Network - Tue, 05/14/2024 - 18:24

A little more than a year after he took the reins of Intel’s ambitious bid for semiconductor contract manufacturing, Stuart Pann is retiring while handing over the charge to Kevin O’Buckley. The transition took place on Monday, 13 May, and it once more raised questions about the future viability of Intel’s third-party foundry business.

Pann, a 35-year company veteran, joined Intel during the heydays of the PC revolution in 1981. He returned to the Santa-Clara, California-based semiconductor firm in 2021 to lead the chip manufacturing division, Intel Foundry Services (IFS). He replaced Intel Foundry’s first chief, Randhir Thakur, who later became CEO and managing director of Tata Electronics, the electronics manufacturing arm of Indian conglomerate Tata Group.

Figure 1 Pann, currently in a support role for a smooth transition, will retire at the end of this month. Source: Intel

Now O’Buckley replaces Pann, and it’s a déjà vu of Thakur-to-Pann handover a year ago. For instance, during the first quarter of 2024, Intel Foundry reported revenue of $4.4 billion, which was down by $462 million compared to the first quarter of 2023. That’s mainly attributed to lower revenues from back-end services and product samples.

Pann—who left the company only a few months after Intel Foundry marked the official launch of the manufacturing business as an independent entity to compete with the likes of TSMC and Samsung—set up Intel’s IDM 2.0 Acceleration Office (IAO) to guide the implementation of an internal foundry model. IAO closely works with Intel’s business units to support the company’s internal foundry model.

Intel Foundry, which aims to move beyond traditional foundry offerings and establish itself as the world’s first open-system foundry, faces huge technical and commercial challenges. That includes combining wafer fabrication, advanced process and packaging technology, chiplet standards, software, and assembly and test capabilities in a unified semiconductor ecosystem.

O’Buckley inherits these challenges. He comes from Marvell, where he led the company’s custom chips business as senior VP for the Custom, Compute and Storage Group. O’Buckley came to Marvell in 2019 via its acquisition of Avera Semiconductor, a 1,000-person chip design company that traces its roots to IBM, which offloaded it to GlobalFoundries before it was sold to Marvell. O’Buckley led Avera’s divestiture from GlobalFoundries.

Figure 2 Like his predecessor, O’Buckley will report directly to CEO Pat Gelsinger. Source: Intel

Intel CEO Pat Gelsinger, who has bet Intel’s revival bid on setting up an independent fab business, acknowledges that Intel Foundry is still some distance away from profitability due to the large up-front investment needed to ramp it up. However, time isn’t on Gelsinger’s side, meaning a swift turnaround plan is in order for O’Buckley.

O’Buckley is an outsider, a plus at Intel, where employees are known to have stayed long years; his expertise in the custom chips business will also be an asset at Intel Foundry. Next, during his stint at IBM, he spearheaded the company’s development of 22- and 14-nm FinFET technologies. As Gelsinger puts it, he has a unique blend of expertise in both foundry and fabless companies.

Now comes the tough part, execution.

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Sampling and aliasing

EDN Network - Tue, 05/14/2024 - 16:31

If we want to take samples of some analog waveform, as in doing analog to digital conversions at some particular conversion rate, there is an absolute lower limit to the rate of doing conversions versus the highest frequency component of the analog signal. That limit must not be violated if the sampling process is to yield valid results. We do not want to encounter the phenomenon called “aliasing”.

The term “aliasing” as we use it here has nothing to do with spy thrillers or crime novels. Aliasing is an unwanted effect that can arise when some analog waveform is being sampled for its instantaneous values at regular time intervals that are longer than half the reciprocal of a sampling frequency. If we were to sample some waveform once every microsecond, the sampling interval is half of that one microsecond for which we would have a sampling frequency limit of 2 MHz or faster.

Aliasing will occur if the sampled waveform has frequency component(s) that are greater in frequency than 50% of the sampling frequency. To turn that statement around, aliasing will occur if the sampling frequency is too low. Aliasing will occur at any sampling rate that is lower than twice the highest frequency component of the waveform being sampled.

The next question is: Why?

The late comedian Professor Irwin Corey once posed a similar question: “Why is the sky blue?” His answer was something like “This is a question which must be taken in two parts. The first part is ‘Why?’ ‘Why’ is a question Man has asked since the beginning of time. Why? I don’t know. The second part is ‘Is the sky blue?’ The answer is ‘Yes!'”

Fortunately, we can do a little better than that as follows.

The sampling process can be thought of as multiplying the waveform being sampled by a very narrow duty cycle pulse waveform of zero value for most of the time and of unity value for the very narrow sampling time interval. That sampling waveform will be rich in harmonics. There will be a spectral line at the sampling frequency itself plus spectral lines at each of the sampling frequency’s harmonics as well. Each spectral line will have sidebands as shown in Figure 1 which will extend from those sampling frequency spectral lines up and down the frequency spectrum in keeping with the sampled waveform’s bandwidth.

Figure 1 Sampling versus aliasing where spectral line will have sidebands that will extend from those sampling frequency spectral lines up and down the frequency spectrum in keeping with the sampled waveform’s bandwidth.

The sampling waveform is amplitude modulated by the sampled waveform and so I’ve chosen to call that sampled waveform’s highest frequency component, Fmod. Each bandwidth is 2 * Fmod.

If the sampling frequency is high enough as with Fs1, the illustrated sidebands do not overlap. There is a respectable guard band between them, and no aliasing occurs.

If the sampling frequency starts getting lower as with Fs2, the sidebands start getting closer together and there is a less comfortable, if I may use that word, guard band.

If the sampling frequency gets too low as with Fs3 which is less than twice Fmod, the sidebands overlap, and we have aliasing. Sampling integrity is lost. The sampled waveform cannot be reconstructed from the undersampled output of this now unsatisfactory system.

Consider this an homage to Claude Shannon (April 30, 1916 – February 24, 2001) and his sampling theory.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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UK–APAC Tech Growth Programme report highlights opportunities in Taiwan

Semiconductor today - Tue, 05/14/2024 - 15:15
Opportunities for UK companies across the semiconductor industry in Taiwan are revealed in a new report by international business development consultancy Intralink, which delivers the UK–APAC Tech Growth Programme on behalf of the UK Government...

EPIR orders second Riber MBE 32 MCT research system

Semiconductor today - Tue, 05/14/2024 - 12:59
Molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France says that EPIR Inc of Bolingbrook, IL, USA has ordered its second MBE 32 MCT research system (just two months after delivery of the first), for delivery in 2025, to further strengthen its capacity for the development and production of advanced materials...

EPC presenting power solutions for automotive, robotics, power tools, solar at PCIM Europe

Semiconductor today - Tue, 05/14/2024 - 11:59
In exhibition stand 318 (Hall 9) at the Power, Control and Intelligent Motion (PCIM) Europe 2024 event in Nuremberg, Germany (11–13 May), Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — is exhibiting what it claims is the industry’s most comprehensive portfolio of GaN-based power conversion solutions...

Semiconductor Mega Trends and Career Opportunities

ELE Times - Tue, 05/14/2024 - 10:44

The semiconductor industry is experiencing a profound transformation, propelled by technological advancements, market dynamics, and global initiatives. In India, this transformation is particularly significant, as the nation emerges as a key player in the semiconductor landscape. Let’s delve into the mega trends shaping the semiconductor industry in 2024, the career opportunities they present, and the role of the Electronics Sector Skills Council of India (ESSCI) in preparing professionals for this dynamic field.

Semiconductor Applications Across Diverse Fields:

Semiconductor chips serve as the fundamental building blocks powering a vast array of applications, wielding control over power management, enabling intricate power electronics systems, and orchestrating indispensable functions within electronic devices. From the ubiquitous smartphones and computers to the intricate network of IoT devices, semiconductor chips form the backbone, fuelling innovation and driving the seamless integration of technology into our daily lives.

  • Driving Automotive Innovation: Semiconductor technology has spearheaded transformative advancements in the automotive sector, ushering in a new era of intelligent and dependable vehicles. By seamlessly integrating semiconductor components, automobiles have evolved to possess heightened intelligence, unparalleled reliability, and superior performance. Advanced Driver Assistance Systems (ADAS) rely on semiconductor solutions for critical features such as collision avoidance, lane departure warning, and adaptive cruise control.
  • Revolutionizing Telecommunications: Semiconductor innovation is at the forefront of transforming the telecommunications landscape. With the emergence of 5G networks, semiconductor solutions are crucial for powering base stations, antennas, and network infrastructure, enabling faster data speeds, lower latency, and unparalleled connectivity. In addition to network infrastructure, semiconductor chips are integral to the development of smartphones, enabling advanced features such as AI-driven cameras, augmented reality, and facial recognition.
  • Empowering Healthcare Technologies: Semiconductor technology is revolutionizing healthcare by driving advancements in medical diagnostics and patient care. Medical imaging devices, including MRI and CT scanners, heavily rely on semiconductor components for signal processing and image reconstruction, enabling precise diagnostics and treatment planning. Semiconductor chips also power medical monitoring devices such as wearable fitness trackers and smart health monitors, allowing for continuous health tracking and remote patient monitoring.
  • Transforming Hearables and Wearables: The integration of semiconductor technology has led to remarkable advancements in hearable and wearable devices, revolutionizing the way we interact with technology. Hearables, such as wireless earbuds and smart headphones, leverage semiconductor chips for Bluetooth connectivity, noise cancellation, and audio processing, delivering immersive audio experiences. Similarly, wearable devices, including smartwatches and fitness trackers, rely on semiconductor solutions for sensors, data processing, and connectivity, enabling seamless health and activity tracking.

Career Opportunities in Semiconductor Technology:

As the semiconductor industry evolves in response to these mega trends, it creates exciting career opportunities for professionals across the value chain – designing, fabrication and packaging. From semiconductor design and manufacturing to research and development, there is a growing demand for skilled professionals who can innovate and drive technological advancements in the industry. The sector is expected to see more than 800,000 to 1 million job openings over the next five years, says staffing company Randstad. The government recently approved $15 billion worth of investments into the sector including from the Tata group. India’s burgeoning semiconductor sector is facing a surge in demand for talent, fuelled by new investments and the government’s ambitious plan to transform the country into a chip manufacturing hub.

  1. Semiconductor Design Engineer: Semiconductor design engineers play a crucial role in developing the architecture and circuitry of semiconductor chips. They utilize tools like Electronic Design Automation (EDA) software and simulation tools to design and optimize chip layouts for performance, power efficiency, and manufacturability.
  2. Process Engineer: Process engineers are responsible for developing and optimizing semiconductor manufacturing processes. They work closely with equipment vendors and manufacturing teams to ensure the smooth operation of semiconductor fabrication facilities, improve yield rates, and reduce production costs.
  3. Research Scientist: Research scientists in the semiconductor industry focus on exploring new materials, devices, and technologies to push the boundaries of semiconductor innovation. They conduct experiments, analyse data, and collaborate with cross-functional teams to develop next-generation semiconductor solutions.
  4. Material Engineers – Material engineers in the semiconductor industry are pivotal in researching, selecting, and optimizing the materials used in semiconductor device fabrication. Their expertise spans a wide range of materials, including silicon, gallium arsenide, and various compound semiconductors. Material engineers work closely with semiconductor design teams to ensure that the chosen materials meet the performance requirements of the intended applications while also considering factors such as cost, scalability, and reliability.
  5. Product Marketing Manager: Product marketing managers play a vital role in bringing semiconductor products to market. They conduct market research, develop marketing strategies, and collaborate with sales teams to promote semiconductor products and drive revenue growth.
  6. Quality Assurance Engineer: Quality assurance engineers ensure that semiconductor products meet the highest standards of quality and reliability. They develop and implement test plans, conduct performance testing, and analyse data to identify and address any issues or defects in semiconductor products.
  7. Packaging experts: Packaging experts in the semiconductor industry are instrumental in developing and implementing packaging solutions that safeguard semiconductor chips. Their role entails meticulous selection of packaging materials, designing efficient packaging structures to ensure protection against environmental factors and mechanical stresses, and optimizing designs for thermal management and electrical performance. They collaborate closely with design and manufacturing teams to ensure that packaging solutions meet stringent industry standards while balancing factors such as cost-effectiveness and manufacturability.
  8. Machine maintenance technicians –Machine maintenance technicians also play a crucial role in implementing preventive maintenance schedules, identifying opportunities for equipment upgrades or optimizations, and ensuring compliance with safety regulations and operational standards. Their expertise contributes to the overall efficiency and longevity of semiconductor manufacturing operations.
  9. Safety protocol checkers – These people are integral to maintaining a safe and secure work environment within semiconductor manufacturing facilities. They are responsible for enforcing safety regulations, conducting regular inspections to identify potential hazards, and implementing corrective measures to mitigate risks and prevent accidents. Safety protocol checkers also play a vital role in developing and implementing safety training programs, conducting safety audits, and promoting a culture of safety awareness among employees. Their diligence and vigilance help to safeguard the well-being of personnel, protect semiconductor manufacturing equipment, and maintain the integrity of semiconductor processes.

Qualifications: National Occupational Standards by ESSCI

As the field becomes more specialized, advanced degrees or skill training provide a competitive edge. Specialized qualifications like IC Package, VLSI Design, and Package Design enhance a designer’s expertise. As on date ESSCI has developed 25 NSQF aligned and approved qualifications on semiconductors (Design, Packaging & Manufacturing segment) and is also planning to develop more qualifications as per the need & demand of the industry especially on the Clean Room, Machine Maintenance and other related fragments, which are the need of the hour.

Short Term Qualifications & Upskilling NOS’s

ESSCI offers focused a range of qualifications covering the complete value chain of the semiconductor industry. Short Term courses such as VLSI Design Engineer, concentrating on designing SOC-module functions using software, Embedded Full Stack Engineer, IoT Hardware Analyst are some of the top courses offered for pursuing engineering graduates to gain the knowledge of EDA Tools and system design. ESSCI also provides qualifications for Wafer Back Grinding Engineer and Wafer Dicing Engineer, specialising in wafer manufacturing tasks which can be taught to ITI / Diploma students.

ESSCI also has foundation / upskilling courses in the field of Nano Science & Advance Nano Science which is also in great demand.

Also, there are some basic courses on the Industrial Safety – Electrical & Hazchem which are very crucial & important for the industrial safety requirements. The complete list of our qualifications along with their model curriculum are all uploaded on our website – https://essc-india.org/qualification-packs.php In conclusion, the semiconductor mega trends present unprecedented opportunities for India to assert its leadership in the global semiconductor industry. Through strategic investments, policy support, and talent development initiatives, India is poised to capitalize on these trends, driving innovation, fostering entrepreneurship, and creating a thriving semiconductor ecosystem for generations to come.

Dr-Abhilasha-GaurDr. Abhilasha Gaur, Chief Operating Officer
Electronics Sector Skills Council of India

The post Semiconductor Mega Trends and Career Opportunities appeared first on ELE Times.

Vishay Intertechnology 600 V E Series Power MOSFET in Compact Top-Side Cooling PowerPAK® 8 x 8LR Delivers Industry’s Lowest RDS(ON)*Qg FOM

ELE Times - Tue, 05/14/2024 - 10:12

Fourth-Generation Device Enables Higher Power Ratings and Density Versus D²PAK While Lowering Conduction and Switching Losses to Increase Efficiency

To provide higher efficiency and power density for telecom, industrial, and computing applications, Vishay Intertechnology, Inc. today introduced its first fourth-generation 600 V E Series power MOSFET in the new PowerPAK 8 x 8LR package. Compared to previous-generation devices, the Vishay Siliconix n- channel SiHR080N60E slashes on-resistance by 27 % and resistance times gate charge, a key figure of merit (FOM) for 600 V MOSFETs used in power conversion applications, by 60 % while providing higher current in a smaller footprint than devices in the D²PAK package.

Vishay offers a broad line of MOSFET technologies that support all stages of the power conversion process, from high voltage inputs to the low voltage outputs required to power the latest high tech equipment. With the SiHR080N60E and other devices in the fourth-generation 600 V E Series family, the company is addressing the need for efficiency and power density improvements in two of the first stages of the power system architecture — power factor correction (PFC) and subsequent DC/DC converter blocks. Typical applications will include servers, edge computing, super computers, and data storage; UPS; high intensity discharge (HID) lamps and fluorescent ballast lighting; telecom SMPS; solar inverters; welding equipment; induction heating; motor drives; and battery chargers.

Measuring 10.42 mm by 8 mm by 1.65 mm, the SiHR080N60E’s compact PowerPAK 8 x 8LR package features a 50.8 % smaller footprint than the D²PAK while offering a 66 % lower height. Due to its top-side cooling, the package delivers excellent thermal capability, with an extremely low junction to case (drain) thermal resistance of 0.25 °C/W. This allows for 46 % higher current than the D²PAK at the same on-resistance level, enabling dramatically higher power density. In addition, the package’s gullwing leads provide excellent temperature cycle capability.

Built on Vishay’s latest energy-efficient E Series superjunction technology, the SiHR080N60E features low typical on-resistance of 0.074 Ω at 10 V and ultra low gate charge down to 42 nC. The resulting FOM is an industry-low 3.1 Ω*nC, which translates into reduced conduction and switching losses to save energy and increase efficiency in power systems > 2 kW. For improved switching performance in hard-switched topologies such as PFC, half-bridge, and two-switch forward designs, the MOSFET released today provides low typical effective output capacitances Co(er) and Co(tr) of 79 pF and 499 pF, respectively. The package also provides a Kelvin connection for improved switching efficiency.

The device is RoHS-compliant and halogen-free, and it is designed to withstand overvoltage transients in avalanche mode with guaranteed limits through 100 % UIS testing.

Samples and production quantities of the SiHR080N60E are available now. For lead time information, please contact your local sales office.

The post Vishay Intertechnology 600 V E Series Power MOSFET in Compact Top-Side Cooling PowerPAK® 8 x 8LR Delivers Industry’s Lowest RDS(ON)*Qg FOM appeared first on ELE Times.

Optimize IoT Device Battery Life with Emulation and Profiling Software

ELE Times - Tue, 05/14/2024 - 09:28

Internet of things (IoT) devices have many uses in consumer, medical, and industrial areas. With more IoT devices coming to market, battery duration becomes essential for product quality and customer satisfaction. Their safety depends on battery performance for many of these applications, such as implantable medical devices. When the expected battery life does not meet real-world requirements, the device can become very dangerous for patients.

Battery life requirements are also high for intelligent city or asset-tracking applications. A smart meter in every home or a small asset tracker in every item will need a long-lasting battery, as changing batteries over a large deployment area is not profitable. Therefore, testing and predicting a device’s battery life is more important than ever.

With battery emulation and profiling software, device designers can estimate battery life precisely. Moreover, emulation software can evaluate current drain to modify device designs that can extend battery duration.

Importance of battery profiling software

Batteries are nonideal energy sources because they interact with the device, influencing the current drain of the battery. Precise current consumption results are crucial for maximizing a device’s battery life. Consider the battery’s features when using a DC source to power the device to ensure that the current consumption results correctly imitate the battery current consumption.

There are several reasons why battery profiling and characterization are essential. Users must know how much energy the battery can hold and deliver as it drains over time. The open circuit voltage (VOC) and internal resistance (IR) change as the battery drains. These need to be plotted so that the battery profiles show the actual performance of the battery in the real world. Figure 1 shows a typical plot example of a battery profile.

Verifying the battery’s performance under certain discharge conditions and operating modes is also essential. Factors that influence battery behavior are:

  • Temperature
  • Load current profiles (constant/dynamic)
  • Different operating modes, including constant current, power, and resistance

Battery life depends on these parameters, so making different battery profiles that suit specific discharge situations is essential.

A general-purpose DC source aims to be a perfect voltage source with no output impedance by using remote sensing feedback to maintain its output voltage constant. However, unlike a battery, its voltage does not decrease with load current. Moreover, feedback regulation is not instantaneous, which causes voltage drop and overshoot when loading and unloading changes. A significant transient voltage drop can activate a device’s low-battery-voltage shutdown.

When powering a device with a DC source, emulate the battery’s characteristics for current drain results comparable to those of a battery. A regular DC source differs from a battery, but a DC source that can imitate a battery helps users get more reliable results. Make sure the power supply used has a programmable output resistance.

Extending battery life with emulation software

Using a battery emulator instead of a battery has several advantages for device testing:

  • Creates a safer test environment: By using an emulator, designers do not have to physically charge and discharge batteries, which can become dangerous with repeated cycles.
  • Achieves repeatable results: Characteristics of an emulated battery do not vary from physical batteries, whose characteristics can fluctuate after charging / discharging. They can also vary between different batteries, even in the same model.
  • Reduces test setup times: Designers can instantly simulate any state of charge (SoC) versus manually draining a battery to the desired level to speed testing.

A battery emulator operates through several steps. The initial step is to load a battery profile. This profile is the data from a graph of the battery voltage and internal resistance against the SoC, as shown in Figure 1. Designers can generate a battery profile using battery modeling software or get a profile from a battery provider.

Creating a profile with modeling software will make the profile match the current consumption for a particular device, which is more precise than a generic profile from a battery supplier. For instance, a generic profile is not helpful if the battery supplier makes the profile based on a steady current draw when the device under test has a variable current consumption. Figure 2 shows a battery profiler with a current consumption profile from a device loaded into it. The software repeats the waveform until the battery runs out of power.

Figure 2. Example of a device's current consumption waveform loaded into an advanced battery test and emulation software.Figure 2. Example of a device’s current consumption waveform loaded into an advanced battery test and emulation software.

The next step is to choose the initial SoC and the termination voltage. Designers will link the device to the emulator and begin the battery emulation with software. Battery emulators constantly monitor the current, whether charging or discharging, to dynamically compute the emulated SoC. The emulator continually adjusts its output (voltage and resistance) according to the SoC to match the loaded battery profile. The test finishes when the emulator reaches the termination voltage if the emulator discharges.

Figure 3. Example of a device's battery emulation using advanced battery test and emulation software.Figure 3. Example of a device’s battery emulation using advanced battery test and emulation software.

Designers can learn more about a device’s behavior by quickly emulating a battery at various SoCs. Figure 4 shows the information engineers can obtain from a device’s current drain. Engineers can use the data from this analysis to modify the design of the IoT device to improve battery performance.

Figure 4. Current drain analysis of a pulse oximeter medical IoT device using advanced battery test and emulation software.Figure 4. Current drain analysis of a pulse oximeter medical IoT device using advanced battery test and emulation software. Cycling battery charge/ discharge to determine capacity loss

Engineers need to know the energy a battery can store and deliver to IoT devices. Battery test and emulation software helps visually monitor battery charging and discharging to measure capacity. Software must support constant current (CC) and voltage (CV) modes for charging batteries. When the battery is nearly full using CC mode, the software must switch from CC mode to a mix of CC and CV. This mix is needed because a battery cannot be charged at the same rate when it reaches maximum voltage or capacity.

It is also crucial for the software to support constant current, constant resistance, and continuous power modes when discharging a battery. Engineers can use software to test and emulate current consumption profiles directly from a device. This feature allows engineers to quickly discharge the battery with a profile matching the current drain during usage. Running it throughout the rundown test and simulating it using the actual device to analyze the battery drain is simpler.

Battery performance can deteriorate significantly over a lifetime of charging and discharging. That is why it is essential to simulate battery cycling. Battery test and emulation software is a convenient solution, but the software must support data logging. Also, generating different charging and discharging profiles for a battery is very useful in a battery test and emulation software solution.

Designers can mix various charging and discharging sequences to simulate complex charging and discharging cycling profiles. Then, they can measure how a battery’s performance declines over time. Emulation software solutions are ideal for this as they can enable, for example, up to one thousand cycle operations to assess the battery’s aging effect and reliability under sequence test conditions.

Summary

Battery profiling and emulation software are essential for IoT device power analysis. They help improve battery life, mimic any charge and battery profile state, create more reliable and consistent test environments, and measure capacity loss and aging effects. This is important for product quality, customer satisfaction, and safety in various consumer, medical, and industrial applications.

The software ensures engineers do not have to charge and discharge batteries, which can become dangerous with repeated cycles—instantly simulating any state of charge versus manually draining a battery to the desired level. Battery software helps create a safer test environment, measures accurate, repeatable results, and reduces test setup times.

Andrew Herrera, Product Marketing Manager - Keysight TechnologiesAndrew Herrera, Product Marketing Manager – Keysight Technologies

The post Optimize IoT Device Battery Life with Emulation and Profiling Software appeared first on ELE Times.

Mindgrove Brings First Indigenously-Designed RISC-V MCU to India

AAC - Tue, 05/14/2024 - 02:00
The new RISC-V-based SoC is the first microprocessor owned, designed, and marketed entirely from India to the open market.

Research explores the effects of nuclear magnetic resonance on internal clock of cells

News Medical Microelectronics - Mon, 05/13/2024 - 23:20
A research collaboration between the Faculty of Biochemistry and Molecular Medicine at the University of Oulu, Finland, the University of Innsbruck, Austria, and Florida Tech, USA, explored the effects of nuclear magnetic resonance on the internal clock of cells at different times of day and under oxygen deprivation.

Wolfspeed quarterly revenue hit by weak industrial and energy markets

Semiconductor today - Mon, 05/13/2024 - 20:22
For its fiscal third-quarter 2024 (to end-March 2023), Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has reported revenue of $200.7m, down 4% on $208.4m last quarter but up 4% on $192.6m a year ago...

The Ripple Effects of Robert H. Dennard, Inventor of DRAM and Dennard Scaling

AAC - Mon, 05/13/2024 - 20:00
Dr. Robert Dennard passed away last month. He dedicated more than half a century of his professional life to microelectronics research, resulting in pivotal MOSFET scaling equations and DRAM.

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