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• New STM32MP2 MPUs with 64-bit processing and edge AI acceleration
• Built for speed, security, and reliability
• Leverage the STM32 ecosystem for rapid development and secure provisioning

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Digital transformation is happening everywhere, driving improvements including greater business productivity, better healthcare, and enhanced safety and energy management throughout buildings, utilities, and transport networks. Critical enabling technologies include cloud computing, data analytics, artificial intelligence (AI), and the Internet of Things (IoT). ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world. These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.

“Our embedded MPUs address the trend that’s pushing more workloads and greater demands to smart devices, often deployed at the IoT edge, for faster response and increased efficiency,” said Stephane Henry, General Purpose MPU Division General Manager, STMicroelectronics. “The new STM32MP2 devices we are announcing today extend the performance trajectory, introducing our most powerful processing engine, now adding edge AI, and supported by the STM32 ecosystem to accelerate product development.”

Architected for demanding and time-sensitive workloads, AI inferencing, and communication, and featuring state-of-the-art cyber security, the STM32MP2 MPUs are built to withstand up to 10 years of continuous operation.

State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm’s TrustZone architecture, to keep sensitive data and keys secret. Certification to SESIP Level 3, the leading security test methodology for IoT devices and compliance, is ongoing for STM32MP2 MPUs to satisfy forthcoming tougher cyber-protection requirements in key territories worldwide. These include the US CyberTrust mark and stipulations in the EU’s Radio Equipment Directive that are due to become mandatory in 2025.

“Together with ST, we tackled the challenge of connecting our devices to the cloud. From opening locks remotely to granting new access rights, our products are shaping the future of access management,” said Marco Temporiti, R&D Software Manager, ISEO. “Thanks to the STM32MP2 microprocessor with its strong encryption capabilities, we are able to build an industrial-grade gateway with unmatched reliability and security. The seamless integration with Yocto Linux has streamlined our development process, allowing us to innovate with ease. And, ST’s 10-year longevity program also ensures a long product lifecycle at reduced cost, setting a new standard in the industry.”

“We worked with ST to build a 2-channel network audio adapter, leveraging the STM32MP1 series microprocessors to handle tasks like converting network digital audio signals for transmission and reception. The robust processing power, Ethernet connectivity and adaptable audio output interfaces were key considerations in choosing the STM32MP1 series for integration into our products,” said Yue XIONG, CEO, S-TRACK. “Now, we’re enthusiastic about the possibilities presented by ST’s latest MPUs, particularly the STM32MP2 series, which deliver improved power efficiency, enabling us to minimize cooling requirements in our enclosed casings. Additionally, the integrated Cortex-M co-processor eliminates the need for a separate microcontroller, and support for Gigabit Ethernet with precision time protocol (PTP) enables accurate data transfer and synchronization among devices. With this advanced technology, our goal is to broaden our product range to include 16-channel offerings.”

The first STM32MP2 MPUs are scheduled to enter volume production in June 2024. Sample requests and pricing information are available from local ST sales offices.

The post STMicroelectronics Powers Up the Intelligent Edge with Second-Generation STM32 Microprocessors, Bringing Performance Boost and Industrial Resilience appeared first on ELE Times.

Електроноші київських політехніків на передовій medialab пн, 04/22/2024 - 12:21

Лекторій для молоді “Знайди себе в антикорупції” kpi пн, 04/22/2024 - 11:57

Due to the continual expansion of charging infrastructure and the coming need for infrastructure replacements, the emergence of electric vehicle direct current (EV DC) charging holds long-term market viability and presents a promising business venture for companies specializing in power electronics, reckons market analyst firm Yole Group. Meanwhile, alternating current (AC) chargers will persist alongside onboard chargers (OBCs) in vehicles until DC infrastructure becomes universally established, a process anticipated to take 10–15 years, says the firm in ‘DC Charging for Automotive 2024’, an update of its annual report...

The US Department of Defense has awarded $14.4m via the Defense Production Act Investment (DPAI) Program to specialty semiconductor and performance materials producer 5N Plus Inc of Montreal, Québec, Canada to sustain and expand the capability to produce space-qualified germanium substrates used in solar cells for both commercial and national security defense satellites. The effort supports the 2024 National Defense Industrial Strategy to continue and expand support for domestic production within the resilient supply chains strategic priority area...

To avoid distortion and slow transitions in an operational amplifier's output signal, it's important to understand slew rate. In this article, we examine its causes and effects.

Printed Circuit Board Assembly (PCBA) is a pivotal process in electronics manufacturing, facilitating the creation of fully functional circuit boards essential for various electronic devices. Understanding the nuances of PCBA, including its types, manufacturing process, and applications, is crucial for professionals in the electronics industry and enthusiasts alike. Let’s explore the complete details about it!

Types of PCBA Technologies:

PCBA employs two primary technologies: Surface-Mount Technology (SMT) and Through-Hole Technology (THT). SMT mounts components directly onto the surface, ideal for small and sensitive components, optimizing space utilization and production efficiency. THT, an earlier method, involves inserting components through holes in the PCB, which is suitable for more significant components requiring robust bonding.

Steps in Manufacturing Process:

Its manufacturing process comprises several critical steps:

• Solder Paste Stenciling: Solder paste Application onto designated PCB areas. 
• Pick and Place: Precise positioning of electronic components and Surface Mount Devices (SMDs). 
• Reflow Soldering: Heating the board to melt solder paste, securing components upon cooling. 
• Inspection and Quality Control: Thorough examination to ensure proper component attachment. 
• Insertion of Through-Hole Components: Add PTH components if required. 
• Manual and Wave Soldering: Manual or automated soldering methods for PTH components. 
• Testing and Final Inspection: Functional testing to detect any performance issues.

Uses and Applications of PCBA:

PCBA finds extensive applications across various industries:

• Consumer Electronics: Essential for smartphones, tablets, TVs, and home appliances, enabling compact designs and advanced features. 
• Computing and Networking: Vital components in computers, servers, routers, and switches for data processing and connectivity. 
• Automotive Industry: Integral to vehicle electronics for navigation, infotainment, safety, and electrification. 
• Industrial Applications: Utilized in machinery control systems, robotics, and automation technology for industrial processes. 
• Medical Devices: At the forefront of wearable health monitors, diagnostic imaging equipment, and medical technology, ensuring reliability and precision.

Advanced Technologies:

Technology upgrades always roll out new challenges and opportunities for PCB assembly, resulting in a bumpy but steady road of innovation and productivity. One of the current trends is 3D packaging and System-in-Package (SiP), which are examples of the new wave of APT. APT contains a wide range of functions from one package, which diminishes their size, improves operations extent, or is effective with changing ambient temperatures.

Besides that, the development of embedded component packaging (ECP) facilitates putting passive components into the PCB substrate, which not only helps reduce the use of the board but also provides the circuit with improved operation. Similarly, advanced technologies such as PCBA are also very capable of providing solutions for low-size, high-speed, and high-density designs that fit the modern requirements of the electronics industry.

Automation and Robotics:

Automation and robotics dramatically help the PCBA procedure speed up successfully and render more productivity, precision, and repeatability. With the automated pick-and-place machines that exactly position all parts of the PCB on the pallet, the time required to assemble the motherboards is significantly decreased and human errors are greatly eliminated.

Incorporating robot arms with soldering facilities allows for accurate and uniform soldering joints, consequently improving the product’s overall reliability. Furthermore, there is Automatic Optical Inspection (AOI) to identify defects and anomalies; therefore, quality control is achieved, and rework is minimized. Automation and robotics can speed up the PCBA process as well as make products of high quality with their significant role in the field of modern electronics manufacturing.

Challenges and Solutions in PCBA:

However, PCBA’s merits are often shadowed by several complex production-line issues. One of the main problems that the scaling down of parts presents is their manipulation and arrangement; thus, a higher level of devices must be used, and advanced technologies must be applied to reach precision. Matching the electrical and mechanical specifications of the components with the PCB material is of utmost importance to avoid solder joint breaking and warping of the board.

Significantly higher complexity in the designs also brings through the testing and inspection procedures to find any defects, and it has to be product reliability. However, even though these problems seem unsolvable at this moment, the possibilities offered by automated equipment, material science, and improved testing methods hold the key to finding the solution.

Future Trends:

The growth of IoT gadgets and wearable technology are the niche areas that will increase the need for smaller, more efficient PCBAS with high connectivity. In additive manufacturing, which includes 3D printing, the process allows for fast prototyping and individual designs with the aid of PCB.

Additionally, it will help gain an advantage as a result of introducing AI and ML algorithms in PCBA processes, which will enhance production efficiency and ensure predictive maintenance and quality control. The trend of sustainable manufacturing practices, consisting of utilizing materials and eco-processes, is increasing and more customer-demanding and regulatory-based.

Conclusion

PCBA is a multifaceted process crucial for developing electronic devices across diverse industries. PCBA enables innovation, functionality, and reliability in consumer electronics, automotive, and medical applications. Understanding the intricacies of PCBA is essential for professionals involved in electronics manufacturing, contributing to the advancement of technology and the development of cutting-edge products.

The post A Comprehensive Guide To Explore PCBA appeared first on Electronics Lovers ~ Technology We Love.

This beast is almost impossible to carry by one person. Aside from the normal frequency counter stuff, there is a full CPU inside built on descrete ICs. Extracted boards on the last photo are arithmetic logic unit and RAM. submitted by /u/AltCtrlGraphene [link] [comments]

First project I've done on my own with no tutorial to follow. Using an L293D to drive 4 5v pumps and controlling them with 4 capacitive soil moisture probes. Working pretty good so far! submitted by /u/Immediate-Court-6894 [link] [comments]

Формула миру в дії medialab сб, 04/20/2024 - 22:07

Enjoy this taste of the rich collection of technology news from last week’s Embedded World trade show in Nuremberg, Germany.

Mirrored a symbol in the schematic for better readability, got a phonecall, forgot to mirror the signals too when I continued. Did this botch so I can continue writing the firmware whilst waiting for the fixed board to arrive. So, how is your "Revision A" going? submitted by /u/DolfinButcher [link] [comments]

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Infineon Technologies AG supplies its power semiconductor devices to FOXESS, a fast-growing leader in the green energy industry and a manufacturer of inverters and energy storage systems. The two sides aim at promoting the development of green energy. Infineon will provide FOXESS with its CoolSiC MOSFETs 1200 V, which will be used with EiceDRIVER gate drivers for industrial energy storage applications. At the same time, FOXESS’ string PV inverters will use Infineon’s IGBT7 H7 1200 V power semiconductor devices.

The global market for photovoltaic energy storage systems (PV-ES) has grown at a high speed in the last years. As competition in the PV-ES market accelerates, improving power density has become key to success, and how to improve efficiency and power density for energy storage applications has attracted much attention. Infineon’s CoolSiC MOSFET 1200 V and IGBT7 H7 1200 V series power semiconductor devices adopt the latest semiconductor technologies and design concepts that are tailored to industrial applications.

Mr. Yu Daihui, Senior Vice President and Head of Industrial & Infrastructure of Infineon Technologies Greater China said, “As an industry leader in power semiconductors, we are proud to work closely with FOXESS. We will continue to drive decarbonization by enabling higher power density and more reliable systems for PV-ES applications.”

Mr. Zhu Jingcheng, Chairman of FOXESS, said, “Thanks to the support of Infineon’s advanced components, FOXESS’ products have been significantly improved in terms of reliability and efficiency. This has been an important driving force for FOXESS’ growth. Infineon’s technical support and product quality have not only strengthened our competitiveness, but also expanded our presence in the market. We are confident about the future and look forward to further cooperation with Infineon to jointly promote the development of the industry and create greater value for our customers.”

With a high power density, Infineon’s CoolSiC MOSFETs 1200 V can reduce losses by 50 percent and provide ~2 percent additional energy without increasing the battery size, which is especially beneficial for high-performance, lightweight, and compact energy storage solutions. FOXESS’ H3PRO 15 kW-30 kW energy storage series uses Infineon’s CoolSiC MOSFETs 1200 V for all models. Thanks to Infineon’s excellent performance, the H3PRO series has achieved an efficiency of up to 98.1 percent and excellent EMC performance; with superior performance and reliability, the H3PRO series has seen rapid sales growth in the global market.

Infineon’s TRENCHSTOP IGBT7 H7 650 V / 1200 V series has lower losses and helps improve the overall efficiency and power density of inverters. In high-power inverter projects, high-current mold packaged discrete devices with current handling capability above 100 A can reduce the number of IGBTs in parallel and replace the IGBT module solution, further improving system reliability and reducing costs; in addition, the H7 series has become an industry benchmark for its high-quality performance and greater resistance to humidity. At present, FOXESS’ main industrial and commercial model, the R Series 75-110 kW, redefines the overall design of the 100 kW model by using IGBT7 H7 series discretes, and the efficiency of the whole machine can reach up to 98.6 percent. Thanks to the low power loss and high power density of the IGBT7 H7 series in discrete packages, technical problems such as current sharing in the paralleling process can be simplified and optimized.

Every power device needs a driver, and the right driver can make the design a lot easier. Infineon offers more than 500 EiceDRIVER gate drivers with typical output currents of 0.1 A~18 A and comprehensive protection functions including fast short-circuit protection (DESAT), active Miller clamp, shoot-through protection, fault reporting, shutdown, and overcurrent protection, suitable for all power devices including CoolSiC and IGBTs.

The post Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications appeared first on ELE Times.

Microchip introduces configurable family of companion driver boards using its Hybrid Power Drive modules available in silicon carbide (SiC) or silicon (Si) technology

The aviation industry’s requirements for the latest, most efficient and lowest-emission aircraft is propelled by an overarching goal towards sustainability and decarbonization. To satisfy these goals, aviation power systems developers are transitioning to electric actuation systems as the trend towards More Electric Aircraft (MEA) continues to grow. To provide the aviation industry with a comprehensive electric actuation solution, Microchip Technology (Nasdaq: MCHP) today announces a new integrated actuation power solution that combines companion gate driver boards with our expansive Hybrid Power Drive (HPD) modules in silicon carbide or silicon technology with a power range of 5 kVA to 20 kVA.

The new integrated actuation power solution maintains the same footprint regardless of the power output. The companion gate driver boards are designed to be integrated with Microchip’s HPD modules to provide an all-in-one motor drive solution for the electrification of systems such as flight controls, braking and landing gear. Microchip’s power solutions are designed to scale based on the requirements of the end application, from smaller actuation systems for drones to high-power actuation systems for Electric Vertical Take-Off and Landing (eVTOL) aircraft, MEA and all-electric aircraft.

“We developed the companion gate driver boards to be used with our existing HPD modules to bring to market a plug-and-play power solution for MEA,” said Leon Gross, vice president of Microchip’s discrete product group. “With this solution, customers no longer need to design and develop their own drive circuitry, which can reduce design time, resources and cost.”

These high-reliability devices are tested to conditions outlined in DO-160, “Environmental Conditions and Test Procedures for Airborne Equipment.” There are multiple protection features including shoot-through detection, short circuit protection, desaturation protection, Under Voltage Lock Out (UVLO) and active miller clamping.

The gate driver boards are designed to be driven with external PWM signals based on Low Voltage Differential Signaling (LVDS) compliant with TIA/EIA-644 for low Electromagnetic Interference (EMI) and good noise immunity. The gate driver board provides differential outputs for telemetry signals like DC bus current, phase current and solenoid current by taking feedback from shunts present in the HPD module and DC bus voltage. It also provides direct output of two PT1000 temperature sensors available in the HPD power module.

The companion gate driver boards are low-weight, low-profile and compact solutions to optimize size and power efficiency of actuation systems. The gate drivers are designed to operate throughout the temperature range of −55°C to +110°C, which is critical for aviation applications that are often exposed to harsh environments.

The isolated companion gate driver boards only require a single 15V DC input for the control and drive circuit; all additional voltages needed are generated on the card. This significantly reduces the number of system components and simplifies system cabling.

Microchip provides comprehensive solutions for MEA by integrating power products with FPGAs, microcontrollers, security, memory and timing. Microchip’s solutions are designed to help customers speed up their development, reduce costs and get to market faster.

Support and Resources

The companion gate driver boards are supported with detailed data sheets and device models.

Pricing and Availability

The companion gate driver boards and accompanying HPD modules are available in production quantities. For additional information, contact a Microchip sales representative.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: http://www.flickr.com/photos/microchiptechnology/53415024168/sizes/l

The post Integrated Actuation Power Solution Aims to Simplify Aviation Industry’s Transition to More Electric Aircraft appeared first on ELE Times.

КПІ реалізовуватиме спільні проєкти з МВС та СБУ medialab сб, 04/20/2024 - 11:15

III Міжнародна конференція "Стратегії розвитку бібліотек: від ідеї до втілення" Інформація КП сб, 04/20/2024 - 10:38

SMD Devices Provide High Luminous Intensity to 2300 mcd, Offer Wavelengths of 525 nm and 465 nm for Heart Rate Monitoring and Smoke Detection

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package. Measuring 2.2 mm by 1.3 mm by 1.4 mm, the Vishay Semiconductors VLMB2332T1U2-08 and VLMTG2332ABCA-08 utilize the latest ultrabright InGaN chip technology to achieve typical luminous intensity of 440 mcd and 2300 mcd, respectively, which is up to four times higher than previous-generation solutions in PLCC-2 packages.

With their high brightness and small size, the LEDs released today are the perfect choice for small scale, high power products that are expected to work reliably in arduous environments. Typical applications will include medical light treatment; signal lights for agricultural equipment and energy generation systems; indicators and backlighting for office, entertainment, and telecommunications equipment; LCD switches; and symbols for general use.

In addition, with a typical wavelength of 525 nm at 20 mA, the VLMTG2332ABCA-08 is ideal for heart rate monitoring applications in fitness trackers and other devices that rely on variations in green light absorption. Offering a typical wavelength of 465 nm at 20 mA, the VLMB2332T1U2-08 is optimized for smoke detectors that utilize short wavelength blue light for the detection of small particles.

The LEDs’ MiniLED package features a lead-frame embedded in a white thermoplast. The devices offer a ± 60° angle of half-intensity, a wide viewing angle of 120° for homogenous illumination and backlighting, and forward voltage of 2.9 V typical. The VLMB2332T1U2-08 and VLMTG2332ABCA-08 are categorized, per packaging unit, for luminous intensity and color.

RoHS-compliant, halogen-free, and Vishay Green, the LEDs are available in 8 mm tape, offer an ESD-withstand voltage up to 2 kV in accordance with JESD22-A114-B, and are compatible with preconditioning according to JEDEC Level 2a, IR reflow soldering according to J-STD-020, and automatic placement equipment.

Device Specification Table: 

Part number		VLMB2332T1U2-08	VLMTG2332ABCA-08
Color		Blue	True green
Luminous intensity (mcd) at 20 mA	Min.	280	1400
	Typ.	440	2300
	Max.	710	3550
Wavelength (nm) at 20 mA	Min.	458	515
	Typ.	465	525
	Max.	472	541
Forward voltage (V) at 20 mA	Min.	2.6
	Typ.	2.9
	Max.	3.4
Technology		InGaN / sapphire

Samples and production quantities of the VLMB2332T1U2-08 and VLMTG2332ABCA-08 are available now, with lead times of 12 weeks.

The post Vishay Intertechnology Blue and True Green LEDs in MiniLED Package Deliver High Brightness in a Small Size appeared first on ELE Times.

Hey guys, trying to fix my buddy's Rock Band guitar because they go for like 500 on ebay. So there are two AAs in the battery holder, both are tested good at 1.5 volts. With the batteries installed, between the contact circled in red and both pins in the connector circled in blue, I get +1.5v. I would assume I should have +1.5v on one and -1.5v on the other. I also have 0v across the pins circled in yellow, and I would think I should have 3v. Does it sound like there's a short in the battery holder, or am I missing something here? submitted by /u/jgollsneid [link] [comments]