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Acquisition adds ASA Motion Link technology to Microchip’s broad Ethernet and PCIe automotive networking portfolio to enable next-generation software-defined vehicles

Microchip Technology Inc. has announced the completed acquisition of Seoul, Korea-based VSI Co. Ltd., an industry pioneer in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for in-vehicle networking (IVN). The terms of the transaction are not disclosed.

The market size of automotive radar, camera and LiDAR modules is expected to grow by greater than two times between 2022 to 2028 to $27B in revenue, according to Yole Group[1]. This anticipated growth is driven by the increased adoption of Advanced Driver Assistance Systems (ADAS), in-cabin monitoring, safety and convenience features (e.g., 360-degree surround view, e-mirrors) and multi-screen digital cockpits for next-generation software-defined vehicles (SDV). These applications will require more highly asymmetric raw data and video links and higher bandwidths, making current, proprietary serializer/deserializer (SerDes) based solutions no longer adequate, both commercially and technically. In response to these developments, the Automotive SerDes Alliance (ASA) was formed in 2019 and released the first open-standard ASA Motion Link (ASA-ML)  specifications.

“This acquisition brings VSI’s knowledgeable team, their market traction and ASA Motion Link technologies and products to Microchip’s expansive automotive networking portfolio to better serve the ADAS megatrend we are focused on,” said Mitch Obolsky, senior vice president of Microchip’s automotive products, networking, and data centre business units. “As the industry converges around three primary IVN pillars – Ethernet, PCIe and ASA Motion Link, camera and display connectivity is one of the fastest growing and largest IVN markets. With VSI, Microchip can now offer products that span all three pillars and also provide automotive security, microcontrollers, motor control, touch and power management solutions to our customers to enable their next-generation software-defined vehicle architectures.”

Today, ASA has over 145 members, including Microchip who is a promoter member. With 11 automotive manufacturers including BMW, GM, Ford, Stellantis and Hyundai-Kia Motors Corporation, the Alliance also includes an ecosystem ranging from Tier 1 suppliers, semiconductor and imager vendors, to test and compliance houses. In addition to being an open standard, ASA-ML brings link layer security and scalability to support 2 Gbps to 16 Gbps line rates. Furthermore, the upcoming specification update will enable ASA-ML to support Ethernet-based architectures.

“Microchip Technology is an established and trusted market leader in automotive networking known for their automotive quality and robust supply chain, and our team is excited to join them to address the growing ADAS and digital cockpit connectivity market,” said Steve Kang, CEO of VSI Co. Ltd. “VSI is a leader in the development of ASA-ML products and was the first to introduce products to the market. Our standards-compliant chipsets are being evaluated by car manufacturers worldwide. We recently collaborated with BMW in a proof of concept to showcase ASA-ML and our product readiness. This acquisition brings together two organizations with a shared commitment to advancing technology through innovation. We look forward to successfully deploying our solutions in production vehicles for years to come.”

In March 2024, BMW Group announced at the Automotive Ethernet Congress in Munich they would shift to using standardized ASA-ML for the upcoming start of productions. BMW has always been at the forefront of in-vehicle networking innovation and strongly believes in leveraging standardized technologies in their vehicle architectures and now also their video architecture.

[1] Sources: LiDAR for Automotive – Radar for Automotive – Status of the Camera Industry – Yole Intelligence, 2023.

The post Microchip Acquires ADAS and Digital Cockpit Connectivity Pioneer VSI Co. Ltd. to Extend Automotive Networking Market Leadership appeared first on ELE Times.

It’s common for I2C systems to have both standard and fast devices on the same bus.

For I2C systems, the speed and power consumption both depend on the values of pullup resistors: the values of them should be low enough to secure the fast charge of the bus capacitance.

Wow the engineering world with your unique design: Design Ideas Submission Guide

But the low values increase power consumption, the low values can also present too heavy a load for the transmitter.

The variable topology of the bus can make the situation somewhat more complicated.

Hence when your system is power-restricted and you need to use several I2C chips at different I2C modes, you have to compromise between these chips. Or you can use the adaptable pullup, which is shown in Figure 1.

Figure 1: The adaptable pullup where a closed transistor connects additional resistors R5 and R6 in parallel to the main pullup resistors R1 and R2

The circuit is rather simple: a closed transistor connects additional resistors R5 and R6 in parallel to the main pullup resistors R1 and R2. 

The connection can be controlled by GPIO for example, as shown in Figure1, and should be done before the fast data exchange takes place.

Another solution is shown in Figure 2, which represents one-half of the whole circuit (the second half for SDA is omitted for brevity). The circuit uses an analog switch (for instance, TS5A3159 of TI) to disconnect the “fast” part of the bus. While it’s disconnected, the resistor R5 provides a high (idle) voltage level on the bus. Note that the capacitance of the switch, which can be large enough (20 to 100pF), should be taken into account.

Figure 2: Alternative adaptable pullup solution that uses an analog switch to disconnect the “fast” part of the bus.

—Peter Demchenko studied math at the University of Vilnius and has worked in software development.

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The post Adaptable pullup appeared first on EDN.

Featuring Compact 3.8 mm by 2.0 mm Footprint, Low 0.88 mm Profile, and Wettable Flanks, Space-Saving Devices Offer Operating Temperatures to +185 °C

Vishay Intertechnology, Inc. today introduced four new series of surface-mount industrial-grade TRANSZORB and automotive-grade PAR transient voltage suppressors (TVS) in the low profile DFN3820A package with wettable flanks. Providing space-saving solutions for automotive, computer, consumer, and industrial applications, the 6DFNxxA, 6DFNxxxCA, T6NxxA, and T6NxxxCA offer peak pulse power of 600 W at 10/1000 μs and low leakage current down to 1 μA.

The first package in Vishay’s new Power DFN family, the DFN3820A features a compact 3.8 mm by 2.0 mm footprint and an extremely low typical height of 0.88 mm, allowing the Vishay General Semiconductor TVS to make more efficient use of PCB space. Footprint-compatible with the SMP (DO-220AA) package, the DFN3820A is 85 % smaller than the SMB (DO-214AA) and 42 % smaller than the SlimSMAW (DO-221AD), but it keeps peak pulse power dissipation with a 10/1000 μs waveform at 600 W.

The devices released are designed to protect sensitive electronic equipment against voltage transients induced by inductive load switching and lightning. The 6DFNxxA and 6DFNxxxCA TRANSZORB TVS will be used for signal line protection in server power modules, digital media controllers, and AV signal extenders for computer and consumer applications, in addition to industrial robot control boards, process/flow control instruments, and automation systems.

AEC-Q101 qualified and offering high-temperature operation to +185 °C, the T6NxxA and T6NxxxCA PAR TVS are intended for automotive load dump protection. Typical applications will include advanced driver assistance (ADAS), battery management (BMS), electric power steering (EPS), and infotainment systems; central control units; on-board chargers (OBC); DC/DC converters and traction inverters; and electrical motor drives.

The TVS offer excellent clamping capability with a maximum clamping voltage from 16.7 V to 70.1 V for the 6DFNxxA and T6NxxA, and 16.7 V to 137 V for the 6DFNxxxCA and T6NxxxCA. The wettable flanks of their DFN3820A package allow for automatic optical inspection (AOI), eliminating the need for an X-ray inspection. Ideal for automated placement, the rectifiers offer an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of 260 °C. The devices are RoHS-compliant and halogen-free, and their matte tin-plated leads meet the JESD 201 class 2 whisker test.

Device Specification Table:

The post Vishay Intertechnology Industrial-Grade TRANSZORB and Automotive Grade PAR TVS Deliver Peak Pulse Power of 600 W in DFN3820A Package appeared first on ELE Times.

Ceremorphic is doing great business and quality development in the areas of supercomputing, datacentre, life sciences, automotive, robotics, and metaverse processing. As the world moves towards a highly advanced computing era, Ceremorphic is leading many channels in developing high-tech computing and engineering systems. Their technical excellence covers a vast portfolio including multi-thread processors, security processing, machine learning processors, analog computing, reliable circuits, 3D interconnects, graph neural processing, programmable logic, and low-power memory.

Rashi Bajpai, Sub-Editor at ELE Times interacted with Dr. Venkat Mattela, Founder & CEO, of Ceremorphic about the company’s vision and technical competence, and also touched upon topics of Make in India and ESG norms.

This is an excerpt from the conversation.

ELE Times: Please throw some light on Ceremorphic’s recent development of the ultra-low power supercomputer chip built in TSMC 5nm.

Venkat Mattela: Designing products with optimal energy consumption is a challenge we foresee for the semiconductor industry for the next few decades especially with the advent of carbon neutrality mandates. As supercomputing innovations burgeon and data centers consume ever more energy, within a decade they will consume a significant part of the total energy generation in the world. This was the catalyst behind our mission to design chips with ultra-low energy consumption. Our breakthrough innovation is not just in advanced nodes like 5nm and 3nm, but we are also broadening our reach to other paradigms to minimize task workloads alongside semiconductor technology optimizations. Having taped out our 5nm chip in October 2022 and validated key technologies for our upcoming 3nm device, we’re proud of how far we’ve come in addressing these challenges. Equipped with advanced features like multi-thread processing and custom connectivity interfaces, our chips cater to modern applications’ rigorous demands, from AI model training to drug discovery. We’re excited to continue pushing the boundaries of technology and remain committed to creating solutions that make a meaningful impact.

ELE Times: In the latest development under the “Make in India” policy, India is set to begin manufacturing equipment for semiconductor manufacturing. In this regard, what in your view, are India’s major contributions to the semiconductor industry besides cutting-edge R&D? Also help us understand the challenges with physical manufacturing.

Venkat Mattela: In addition to cutting-edge R&D, India’s contributions to the semiconductor industry extend across various domains, showcasing the nation’s growing significance in this field. Firstly, India serves as a hub for semiconductor design and engineering services, with numerous companies specializing in chip design, verification, and testing. These capabilities play a crucial role in the global semiconductor supply chain, contributing to the development of innovative semiconductor products.

We also boast a robust ecosystem for semiconductor software development, encompassing tools and platforms for chip design, simulation, and optimization. This is complemented by our vast pool of skilled engineers and technologists that form a rich talent pool sought after by semiconductor companies worldwide. Moreover, initiatives like the Skill India program aim to enhance the employability of Indian youth in high-growth sectors such as semiconductors, fostering a skilled workforce for the industry’s future needs.

However, despite these contributions, India faces several challenges in physical manufacturing. One key challenge is the need for robust infrastructure and logistical support. Semiconductor fabrication facilities require state-of-the-art equipment, cleanroom environments, and reliable power and water supply, which may be lacking in certain regions.

Additionally, establishing a consistent supply chain for raw materials, chemicals, and equipment components is crucial to reduce reliance on imported materials and prevent disruptions. To scale up manufacturing, it is crucial to present ourselves as an ideal candidate for manufacturing thereby attracting investments in research, infrastructure, and workforce development.

While initiatives like the “Make in India” policy aim to do this, sustained efforts are needed to overcome regulatory barriers, attract foreign investment, and push for innovation-driven growth in the sector.

ELE Times: What potential collaborations can be explored between the renewable energy sector and semiconductor fabrication plants to establish ESG norms and sustainable practices in manufacturing?

Venkat Mattela: Renewable energy should not be viewed as merely an option, but rather as a standard practice across all industries. Given the semiconductor industry’s substantial energy consumption, it is crucial for us to take the lead in adopting renewable energy sources. Collaborations between the renewable energy sector and semiconductor fabrication plants play a pivotal role in establishing robust ESG norms and sustainable manufacturing practices.

By integrating renewable energy sources such as solar, wind, and hydroelectric power into semiconductor fabrication plants we can significantly reduce carbon emissions and environmental impact. Research and development efforts aimed at enhancing energy efficiency in semiconductor fabrication, such as advanced cooling systems, energy-efficient equipment, and optimized manufacturing processes, can yield significant environmental benefits while also improving operational efficiency and cost-effectiveness. Additionally, encouraging partnerships between renewable energy providers and semiconductor companies can facilitate the development of innovative solutions for energy storage and management. Technologies like battery storage systems and smart grid integration enable semiconductor facilities to store excess renewable energy and optimize its usage based on demand, thereby maximizing energy efficiency and grid stability. By leveraging renewable energy sources, emphasizing innovation, and promoting sustainability across the supply chain, we can contribute to a more environmentally conscious and socially responsible semiconductor industry.

ELE Times: What would be your insights and recommendations for the policymakers navigating the challenges of establishing India as a semiconductor hub?

Venkat Mattela: We are making significant strides in positioning India as a global R&D hub, thanks to our supportive policies and initiatives that prioritize top-tier institutions and foster innovation, particularly in AI. However, transitioning into a semiconductor manufacturing hub requires additional effort and time. A crucial starting point would be to build a semiconductor manufacturing facility, which is doable and requires very dedicated engineering leadership to action. Fortunately, the current government’s policies are highly encouraging and provide India an ideal path to make substantial progress in this direction within the coming decade.

ELE Times: Looking at Ceremorphic’s technology portfolio, help us understand its role in addressing the crucial needs of the high-performance computing era.

Venkat Mattela: Generative AI has played a critical role in enabling various technological applications to efficiently adopt Artificial Intelligence (AI) and supercomputing is the catalyst in training these AI models. At Ceremorphic, we embarked on this journey six years ago with a primary objective of developing ultra-low-energy, low-power supercomputing solutions. While few companies prioritized low-energy supercomputing at the time, it has now become an industry standard. With a portfolio boasting over 200 patented core technologies in this field, we have certainly has played a part in driving this shift. Our efforts in advancing low-energy supercomputing have had far-reaching implications, especially in the life sciences and pharmaceutical space.

We recently introduced our new platform, BioCompDiscoverX, which promises to revolutionize drug development by significantly accelerating the process, reducing costs, and enhancing efficacy. Furthermore, reiterating our commitment to high-performance computing in an energy-efficient manner, our upcoming chip will be manufactured using TSMC’s cutting-edge 3nm node.

ELE Times: What extra efforts and measures are necessary on the grassroots level to further elevate and enhance skill development across various sectors and emerging technologies?

Venkat Mattela: Progress at the grassroot level hinges on the coming together of supportive policies and robust funding infrastructures. As we enter a pivotal decade of innovation, we are witnessing promising advancements in these areas within India. Positioned in our golden era, we have the privilege of seizing numerous opportunities to leave a significant impact on the upcoming technological era.

Advanced universities are already leading the way by implementing specialized curriculums tailored to new technologies. But, to ensure widespread skill development, we must distil key learnings and core concepts and integrate them into the lower education levels to establish a solid foundation for future generations. This approach must go beyond theoretical knowledge and touch upon practical demonstrations of concepts. By encouraging innovation ideation from an early stage, we can sustainably cultivate a culture of creativity that will propel us to the forefront of every emerging technology.

The post Ceremorphic Driving Vision to Develop Sustainable Product Portfolio Across Sectors appeared first on ELE Times.

Anritsu Company is proud to announce the launch of our new inline power sensor MA24103A which is designed to measure accurate Peak and True-RMS average power measurements from 25 MHz to 1 GHz and 2 mW to 150 W power range.

Several applications demand accurate peak and average power measurements well below the frequency range of 1 GHz. Agencies in Public Safety, Avionics (air traffic control and repair stations), and Railroads, etc. must maintain critical communications between the control centres and the vehicles. The slightest error in making measurements or maintaining a communication network in these markets could risk public safety or even have fatal consequences.

The advantage of lower frequencies is that they can propagate a longer distance and maintain communication with fast-moving vehicles. Normally, at lower frequencies, the power of the transmitting signal is in the range of watts, which makes the MA24103A more suited for these types of applications.

This highly accurate, Inline Peak Power Sensor communicates with a PC via USB or with an Anritsu handheld instrument equipped with the high-accuracy power meter option 19.

Some of the main markets that benefit from this low-frequency Inline Power Sensor include:

• Broadcast Network and Manufacturer: Lab performance accuracy and low insertion loss over a wide temperature range (0 ºC to 55 ºC), making it perfect for field applications.
• Railroads: to evaluate various systems like Positive Train Control Systems, End of Train (EOT) signals, automated train control systems, and FM voice base stations.
• Avionics: such as Civil and Military Airports for beacon testing, surveillance radar testing, localizer, and marker testing.

The post Anritsu Company Expands Inline Sensor Family appeared first on ELE Times.

Industry’s First-Ever Cloud-based System Development Tool Enables Rapid Prototypes and Co-Optimization of Software and Hardware

The post Renesas Expands Quick Connect Studio with Real-Time Code Customization, Remote Debugging and Broad Portfolio of Supported Devices appeared first on ELE Times.