Feed aggregator

Фемінітиви: що воно таке, звідки взялося й навіщо потрібне

Новини - Mon, 03/17/2025 - 15:26
Фемінітиви: що воно таке, звідки взялося й навіщо потрібне
Image
kpi пн, 03/17/2025 - 15:26
Текст

У плані дій з імплементації принципів гендерної рівності сформульовано низку стратегічних цілей гендерної політики університету, які він має досягти до 2027 року. Серед останніх – і освітні заходи із застосування в листуванні та діловому спілкуванні фемінітивів. Що ж таке ці фемінітиви, звідки вони взялися і навіщо потрібні? Коротко розповідаємо про це.

Візит міністра Кабінету Міністрів України та голова Держспецзв'язку до ІСЗЗІ

Новини - Mon, 03/17/2025 - 15:05
Візит міністра Кабінету Міністрів України та голова Держспецзв'язку до ІСЗЗІ
Image
kpi пн, 03/17/2025 - 15:05
Текст

Міністр Кабінету Міністрів України Олег Немчінов та голова Держспецзв'язку Олександр Потій завітали до Інституту спеціального зв'язку та захисту інформації КПІ ім. Ігоря Сікорського.

Understanding Metal Soldering: Definition, Process, Working, Uses & Advantages

ELE Times - Mon, 03/17/2025 - 14:23

Metal soldering is a process used to join two or more metal surfaces by melting a filler metal, known as solder, without melting the base metals. The solder, which has a lower melting point than the metals being joined, flows into the joint through capillary action and solidifies upon cooling, creating a strong bond. Unlike welding, where the base metals are melted, soldering relies on a low-heat process, making it ideal for delicate components and applications where excessive heat can cause damage.

Soldering is widely used in electronics, plumbing, automotive repairs, jewellery making, and industrial metalworking. It is favoured for its precision, conductivity, and versatility, allowing for secure, reliable connections between different metal components. With recent advancements, lead-free solder alloys and improved flux formulations have made soldering safer and more environmentally friendly.

How Metal Soldering Works?

Metal soldering works by applying heat to a joint and introducing a solder alloy, which melts and adheres to the metal surfaces, forming a secure connection. The process involves several key elements, including a heat source, such as a soldering iron, torch, or induction heater, flux to clean and prepare the metal surface, and solder wire or paste to create the bond.

The key principle behind soldering is capillary action, where the molten solder flows into the tiny gaps between metal surfaces. This ensures that the joint is uniform, strong, and conductive. Proper temperature control is crucial because overheating can damage components or weaken the bond, while insufficient heat may result in a poor connection.

Different types of soldering are used based on the temperature and strength required, including soft soldering, hard soldering (silver soldering), and brazing. Each method serves different industrial needs, ranging from electronic circuit board assembly to high-strength mechanical joints in automotive and aerospace applications.

Metal Soldering Process

The metal soldering process follows a step-by-step approach to ensure a strong, reliable joint.

1. Surface Preparation

Before soldering, the metal surfaces must be thoroughly cleaned to remove any oxidation, oil, or dirt that could interfere with solder adhesion. This is done using abrasive pads, sandpaper, chemical cleaners, or specialized fluxes that dissolve impurities. Flux is particularly important because it prevents oxidation during the heating process, ensuring a smooth flow of solder.

2. Heating the Joint

The joint is then heated using a soldering iron, gas torch, or induction heater, depending on the type of soldering being performed. The temperature must be carefully controlled to prevent excessive heating, which can weaken the joint or damage heat-sensitive components. The goal is to heat the metal surfaces just enough to allow the solder to flow and bond properly.

3. Applying the Solder

Once the joint reaches the correct temperature, solder wire, paste, or pre-formed solder pieces are introduced. The solder melts upon contact with the heated surface and flows into the joint through capillary action, ensuring an even distribution. The use of flux helps the solder adhere properly by removing any remaining oxides and improving wetting.

4. Cooling and Solidification

After the solder has flowed into the joint, the heat source is removed, and the connection is allowed to cool naturally. Rapid cooling should be avoided, as it can create thermal stress and weak bonds. The solder solidifies as it cools, forming a strong electrical and mechanical connection.

5. Cleaning the Joint

Once cooled, the joint is inspected for smoothness, strength, and uniformity. Any excess flux residue is cleaned using isopropyl alcohol (IPA) or water, as leftover flux can cause corrosion over time. In electronics soldering, a multimeter may be used to check electrical continuity and ensure a reliable connection.

Types of Metal Soldering 1. Soft Soldering (Low-Temperature Soldering)

Soft soldering is the most commonly used method, particularly in electronics and plumbing. It uses a low-melting-point solder alloy, typically containing tin and lead (Sn-Pb) or a lead-free alternative (Sn-Ag-Cu). The temperatures in soft soldering typically range from 180°C to 300°C. Since soft soldering does not require extremely high temperatures, it is ideal for delicate applications such as circuit board assembly and small metal components.

2. Hard Soldering (Silver Soldering)

Hard soldering, also known as silver soldering, uses a higher-melting-point solder, often containing silver or other strong alloys. This technique requires temperatures between 450°C and 800°C and is commonly used in jewellery making, refrigeration systems, and aerospace applications. Hard soldering produces stronger and more heat-resistant joints than soft soldering, making it suitable for high-stress environments.

3. Brazing (High-Temperature Soldering)

Brazing is similar to soldering but uses a filler metal with a melting point above 800°C. The process involves heating the metal surfaces and allowing brass or bronze-based solder to flow into the joint. Brazing is widely used in automotive manufacturing, HVAC systems, and heavy-duty industrial applications where high-strength, heat-resistant joints are required.

Uses & Applications of Metal Soldering 1. Electronics & PCB Manufacturing

Soldering is an essential process in electronics assembly, used to join circuit board components, connectors, and microchips. It ensures electrical conductivity and mechanical stability, making it crucial for manufacturing computers, smartphones, and consumer electronics. With the rise of lead-free soldering due to environmental regulations (RoHS compliance), manufacturers now use tin-silver-copper (SAC) alloys for improved safety and durability.

2. Plumbing & Pipe Fittings

Soft soldering is widely used in plumbing systems to create leak-proof seals in copper pipes and water lines. It provides durable, corrosion-resistant joints that withstand water pressure and temperature fluctuations.

3. Automotive & Aerospace Industries

Soldering is used in wiring, sensors, and heat-sensitive components in automotive and aerospace engineering. Hard soldering and brazing are preferred for fuel lines, air-conditioning systems, and exhaust components, ensuring high-strength, heat-resistant bonds.

4. Jewellery & Metalwork

In the jewellery industry, silver soldering is used to join gold, silver, and platinum pieces with minimal heat damage. It ensures seamless, durable joints without affecting intricate designs.

Advantages of Metal Soldering

One of the key benefits of metal soldering is its low-temperature operation, which prevents the base metals from melting or warping. It also allows for precise, clean joints, making it ideal for electronics and fine metalwork. The process provides strong, conductive bonds, ensuring reliable electrical connections in circuit boards. Additionally, soldering is cost-effective, energy-efficient, and versatile, working with a wide range of metals.

Disadvantages of Metal Soldering

Despite its benefits, soldering has some limitations. It produces joints that are not as strong as welded connections, making it unsuitable for high-load applications. Heat-sensitive materials can be damaged if temperature control is poor, and flux residues can lead to corrosion if not cleaned properly. Additionally, soft soldering has temperature limitations, as joints may fail under extreme heat or stress.

Conclusion

Metal soldering remains a critical process in modern manufacturing and repair work, offering a precise, low-temperature, and cost-effective method for joining metals. With the rise of lead-free alloys, automation, and advanced flux formulations, soldering continues to evolve, making it safer and more efficient. Whether in electronics, plumbing, automotive, or jewellery making, soldering provides reliable, durable connections that drive innovation in multiple industries.

The post Understanding Metal Soldering: Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

Stealth Technology: Definition, Types, Working & Applications

ELE Times - Mon, 03/17/2025 - 13:55

Stealth technology, also known as low observable technology, is a collection of advanced techniques designed to reduce the visibility of military vehicles, aircraft, ships, and missiles to enemy detection systems. These systems include radar, infrared sensors, sonar, and electromagnetic surveillance tools. The primary objective of stealth technology is to increase the survivability of military assets by making them harder to detect, track, and target.

The concept of stealth technology is not new, but it has evolved significantly with advancements in material science, aerodynamics, and electronic warfare. Early efforts in stealth technology focused on reducing the radar cross-section (RCS) of aircraft through unique shaping techniques. Over time, innovations in radar-absorbing materials (RAM), infrared suppression systems, and acoustic noise reduction have led to highly sophisticated stealth platforms. Today, stealth technology is a crucial element in modern warfare, providing a significant strategic advantage in aerial, naval, and ground operations.

Types of Stealth Technology

Stealth technology can be classified into several types based on the method used to reduce detectability. Each type focuses on minimizing a specific form of detection, ensuring that military assets remain hidden from enemy sensors.

Radar Stealth (Low Radar Cross Section – RCS)

Radar stealth technology primarily aims to minimize the amount of radar waves reflected back to enemy detection systems. The radar cross-section (RCS) of an object is a measure of how much radar energy it reflects, and stealth technology works by reducing this reflection. One of the key techniques used in radar stealth is designing aircraft and naval vessels with faceted surfaces or smooth curves that scatter incoming radar waves rather than reflecting them directly back to the source.

Additionally, specialized radar-absorbing materials (RAM) are used to coat stealth vehicles. These materials absorb a significant portion of the radar energy, converting it into heat rather than allowing it to be reflected. Aircraft like the F-22 Raptor and B-2 Spirit bomber use a combination of these techniques to achieve low radar detectability.

Infrared (IR) Stealth

Infrared stealth focuses on reducing an object’s heat signature to avoid detection by thermal imaging systems. Military aircraft, ships, and land vehicles generate significant heat due to engine operations, friction with the air, and exhaust emissions. Advanced stealth technology incorporates several techniques to minimize this infrared signature.

One method involves using heat-dissipating exhaust systems that spread the hot gases over a larger area, thereby lowering their temperature before they escape into the atmosphere. Additionally, stealth aircraft often use low-emissivity materials on their surfaces to prevent excessive heat buildup. These techniques make it harder for enemy infrared sensors to detect and lock onto stealth platforms, increasing their survivability in combat zones.

Acoustic Stealth

Acoustic stealth technology is essential for submarines and naval vessels, where sound waves are used to detect objects underwater. Noise generated by propellers, engines, and onboard systems can be detected by sonar, making it crucial to minimize acoustic emissions.

To achieve acoustic stealth, submarines and stealth ships use quiet propulsion systems that reduce cavitation—the formation of air bubbles around propeller blades that create noise. Additionally, sound-absorbing materials are used to coat the hulls of submarines, dampening vibrations and reducing noise transmission. These techniques allow stealth submarines, such as the Virginia-class and Scorpène-class, to operate undetected in enemy waters.

Visual Stealth

Visual stealth technology aims to reduce the visibility of military assets using advanced camouflage techniques. Traditional methods involve painting vehicles with camouflage patterns that help them blend into their surroundings. However, modern stealth technology has taken this a step further with the development of electrochromic materials and adaptive coatings that can change colour based on environmental conditions.

Some experimental visual stealth systems use metamaterials and active cloaking technologies that manipulate light waves, making an object appear nearly invisible to the naked eye. While full optical invisibility remains a challenge, ongoing research continues to push the boundaries of visual stealth.

Electromagnetic Stealth

In addition to reducing radar and infrared signatures, stealth technology also minimizes electromagnetic emissions from military platforms. Electronic devices, including communication and navigation systems, emit detectable signals that can be intercepted by enemy intelligence operations. To prevent detection, stealth aircraft, and naval vessels use electromagnetic shielding to contain these emissions.

Moreover, emission control (EMCON) procedures are employed to limit unnecessary electronic transmissions, reducing the risk of detection by enemy surveillance systems. By managing their electromagnetic footprint, stealth platforms can operate more securely in hostile environments.

How Does Stealth Technology Work?

Stealth technology works by integrating multiple techniques to reduce the chances of detection across various sensory domains. One of the most important aspects is the reduction of radar cross-section (RCS), which is achieved through specialized aircraft shaping and radar-absorbing coatings. By ensuring that radar waves are either absorbed or deflected away from enemy sensors, stealth aircraft like the F-35 Lightning II can remain undetected for longer durations.

Infrared suppression techniques help control heat emissions, making it difficult for heat-seeking missiles to lock onto stealth assets. Noise reduction strategies ensure that submarines and naval vessels can move through water without alerting enemy sonar systems. Additionally, electromagnetic stealth reduces radio frequency emissions, preventing enemy forces from pinpointing the location of stealth aircraft, ships, or drones.

Applications of Stealth Technology

Stealth technology has a wide range of applications in modern military operations.

Stealth Aircraft

Stealth aircraft play a crucial role in modern aerial warfare by conducting deep penetration strikes, surveillance missions, and air superiority operations. Notable examples include the F-22 Raptor, a highly maneuverable stealth fighter designed for air dominance, and the B-2 Spirit, a stealth bomber capable of delivering nuclear and conventional payloads with minimal risk of detection.

Stealth Naval Vessels

Naval stealth technology enhances the survivability of warships by reducing their radar and acoustic signatures. The USS Zumwalt (DDG-1000) is an advanced destroyer with a stealthy design that minimizes its radar cross-section. Similarly, the Type 055 destroyer, developed by China, incorporates stealth shaping to improve operational effectiveness in naval engagements.

Stealth Submarines

Submarines rely heavily on stealth to avoid detection while patrolling enemy waters. The Virginia-class submarines used by the U.S. Navy feature anechoic coatings and quiet propulsion systems that make them nearly undetectable by sonar. The Scorpène-class submarines, developed by France, are also known for their stealth capabilities and operational flexibility.

Stealth Missiles and Drones

Stealth technology is increasingly being integrated into unmanned systems and precision-guided missiles. The BGM-109 Tomahawk cruise missile is designed to have a low radar cross-section, allowing it to evade enemy air defenses. Similarly, the RQ-170 Sentinel is a stealth reconnaissance drone used for intelligence-gathering missions.

Advantages of Stealth Technology

Stealth technology provides several advantages in military operations. By reducing an asset’s detectability, it enhances survivability, allowing forces to carry out missions with lower risk. Stealth platforms also improve operational effectiveness by enabling surprise attacks and reconnaissance missions without alerting enemy defenses. Additionally, stealth technology provides a strategic advantage by forcing adversaries to invest in more advanced detection and countermeasure systems.

Conclusion

Stealth technology has revolutionized modern warfare by enabling military forces to operate with greater security and effectiveness. From radar-absorbing materials to infrared suppression and electromagnetic shielding, stealth innovations continue to evolve, shaping the future of aerial, naval, and ground combat. As research advances, stealth technology may find applications beyond the military, influencing commercial aviation and security technologies in the coming decades.

The post Stealth Technology: Definition, Types, Working & Applications appeared first on ELE Times.

BluGlass establishes Industry Advisory Board led by Steven DenBaars and Richard Craig

Semiconductor today - Mon, 03/17/2025 - 13:16
BluGlass Ltd of Silverwater, Australia has established an Industry Advisory Board led by professor Steven DenBaars and Dr Richard Craig to accelerate its technical roadmap and commercial advancement of its gallium nitride (GaN) laser portfolio for the global quantum, defence and biotech markets...

UK’s Universities of Cambridge and Southampton join PIXEurope pilot line consortium

Semiconductor today - Mon, 03/17/2025 - 11:40
The UK’s University of Cambridge and University of Southampton have been named as participants in the PIXEurope consortium, a collaboration between research organizations from across Europe that is developing and manufacturing prototypes of their products based on photonic chips...

Aeluma showcasing next-gen sensor and silicon photonic solutions at SPIE Defense + Commercial Sensing

Semiconductor today - Mon, 03/17/2025 - 11:28
Aeluma Inc of Goleta, CA, USA — which develops compound semiconductor materials on large-diameter substrates — is showcasing its latest advances in AI-driven photonics, quantum computing, and advanced sensing solutions at SPIE Defense + Commercial Sensing 2025 at the Gaylord Palms Resort & Convention Center in Orlando, Florida (13–17 April)...

Wise-integration showcasing next-gen GaN power solutions at APEC

Semiconductor today - Mon, 03/17/2025 - 10:59
At the IEEE Applied Power Electronics Conference & Exposition (APEC 2025) in the Georgia World Congress Center, Atlanta, GA, USA (16–20 March), fabless company Wise-integration of Hyeres, France — which was spun off from CEA-Leti in 2020 and designs and develops digital-control of gallium nitride (GaN) and GaN integrated circuits for power conversion — is unveiling its latest WiseGan and WiseWare advances, featuring two technical presentations and demonstration boards, including a new 1.5kW totem-pole power factor correction (PFC) module designed specifically for server and industrial applications...

Keysight adds wide-bandgap power semiconductor bare chip dynamic measurement to double-pulse test portfolio

Semiconductor today - Mon, 03/17/2025 - 10:48
Keysight Technologies Inc of Santa Rosa, CA, USA has enhanced its double-pulse test portfolio, enabling customers to benefit from accurate and easy measurement of the dynamic characteristics of wide-bandgap (WBG) power semiconductor bare chips. The technologies implemented in the measurement fixture minimize parasitics and do not require soldering to the bare chip. The fixtures are compatible with both versions of Keysight’s double-pulse testers...

Weekly discussion, complaint, and rant thread

Reddit:Electronics - Sat, 03/15/2025 - 17:00

Open to anything, including discussions, complaints, and rants.

Sub rules do not apply, so don't bother reporting incivility, off-topic, or spam.

Reddit-wide rules do apply.

To see the newest posts, sort the comments by "new" (instead of "best" or "top").

submitted by /u/AutoModerator
[link] [comments]

Smartphone production grows 9.2% in Q4/2024 to 334.5 million units

Semiconductor today - Fri, 03/14/2025 - 18:39
Market research firm TrendForce reports that global smartphone production grew 9.2% quarter-to-quarter to 334.5 million units in fourth-quarter 2024, driven by Apple’s peak production season and consumer subsidies from local Chinese governments. While Apple expanded production with the launch of new models, Samsung faced production declines due to intensified competition in emerging markets...

Navitas production-releases first 650V bi-directional GaNFast ICs and isolated gate-drivers

Semiconductor today - Fri, 03/14/2025 - 16:37
Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced the first production-released 650V bi-directional GaNFast ICs and high-speed isolated gate-drivers, creating a paradigm shift in power with single-stage BDS converters, which enables the transition from two-stage to single-stage topologies. Targeted applications range widely and opens up multi-billion dollar market opportunities across electric vehicle (EV) charging (on-board chargers (OBC) and roadside), solar inverters, energy storage and motor drives...

Infineon’s CoolSiC Schottky diode 2000V made available in TO-247-2 package

Semiconductor today - Fri, 03/14/2025 - 16:26
Many industrial applications are transitioning to higher power levels with minimized power losses, which can be achieved by increasing the DC link voltage. Infineon Technologies AG of Munich, Germany is hence addressing this market trend with the CoolSiC Schottky diode 2000V G5 product family, which are claimed to be the first discrete silicon carbide diodes with a breakdown voltage of 2000V, introduced in September 2024...

OIF advances interoperability at OFC with live demos, expert insights and cross-industry collaboration

Semiconductor today - Fri, 03/14/2025 - 11:37
As network demands grow more complex, Optical Internetworking Forum (OIF) is to showcase interoperability breakthroughs with live demonstrations and expert discussions at the Optical Fiber Communication Conference & Exposition (OFC 2025) in San Francisco, CA, USA (1–3 April)...

Зустріч представників КПІ ім. Ігоря Сікорського з Нобелевськими лауреатами

Новини - Fri, 03/14/2025 - 11:07
Зустріч представників КПІ ім. Ігоря Сікорського з Нобелевськими лауреатами
Image
kpi пт, 03/14/2025 - 11:07
Текст

UNESCO оголосило 2025 рік Міжнародним роком квантової фізики і технологій. На відзначення цього, на початку березня 2025 року відбулася подія у КНУ ім. Т. Г. Шевченка, на яку були запрошені студенти та викладачі Фізико-математичного факультету (ФМФ) та Навчально-наукового фізико-технічного інституту (НН ФТІ), керівництво КПІ ім. Ігоря Сікорського.

Pages

Subscribe to Кафедра Електронної Інженерії aggregator