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Back in mid-July 2021 I purchased a safe to securely store a handgun in a nightstand drawer next to the bed. Based both on abundant and predominantly positive reviews, along with an attractive price, I went with one from a company called awesafe (alternatively, in some places, Awesafe). The product page on Amazon’s website no longer exists (more on why shortly), but thanks to the Internet Archive’s Wayback Machine you can still see what it looked like, and via it I was able to find the ‘stock’ images of it still stored on Amazon’s website:

When the gun safe arrived, I quickly glanced at the instructions stamped on the outer packaging, programmed a custom four-digit code and my fingerprint, confirmed that both worked correctly, and thought nothing more of it…until late February of this year, when the following ominous email arrived in my inbox, sent by the Amazon Product Safety Team:

Dear Amazon Customer,

We write to notify you of a potential safety concern with a product that you purchased on Amazon.com.

Please review the Recalls and Product Safety Alerts page for further details : https://www.amazon.com/your-product-safety-alerts

Product: awesafe Gun Safe, Biometric Gun Safe for Pistols, Quick Access Pistol Safe Fingerprint Handgun Safe with Keys and Keypad (Biometric Fingerprint Lock-L)
[ORDER ID DELETED FOR PRIVACY]

The U.S. Consumer Product Safety Commission (CPSC) has informed us that the product listed may not meet current mandatory or voluntary safety standards.

If you still have this product, we urge you to stop using it immediately.

More details, including what you should do and where you can seek assistance, can be found in the following notification: https://www.cpsc.gov/Recalls/2024/Biometric-Gun-Safes-Recalled-Due-to-Serious-Injury-Hazard-and-Risk-of-Death-Imported-by-Awesafe.

If you made this purchase for someone else, please notify the recipient immediately and provide them with the information.

The safety and satisfaction of our customers is our highest priority. We regret any inconvenience this may cause you.

Thanks for shopping at Amazon.

Sincerely,
Customer Service
Amazon.com
www.amazon.com

The referenced Consumer Product Safety Commission (CPSC) website page had more information, an excerpt of which follows:

Biometric Gun Safes Recalled Due to Serious Injury Hazard and Risk of Death; Imported by Awesafe

Name of Product:
Awesafe Biometric Gun Safes

Hazard:
The biometric lock on the safes can fail and be opened by unauthorized users, posing a serious injury hazard and risk of death.

Remedy:
Replace

Recall Date:
February 22, 2024

Units:
About 60,000

Consumer Contact:
Awesafe by email at Recall@awesafeus.com or online at http://awesafeus.com/RECALL or http://awesafeus.com/ and click on “RECALL INFORMATION” at the top of the page for more information.

Recall Details

Description:
This recall involves certain Awesafe biometric gun safes. The recalled gun safes are black, can fit two pistols, and have the brand name “Awesafe” on the front.

Remedy:
Consumers should immediately stop using the biometric feature, remove the batteries, and only use the key for the recalled safes to store firearms until they get the free replacement safe. Contact Awesafe to receive instructions on disabling the biometric feature and to receive a free replacement safe. Consumers will be asked to disable the biometric reader and email a photo of the disabled biometric reader to Recall@awesafeus.com in order to receive a replacement safe. The instructions on how to safely disable the biometric reader are also located at http://awesafeus.com/RECALL. Once they receive their replacement safe, consumers should discard the recalled safe in accordance with local laws.

Incidents/Injuries:
The firm has received reports of 71 incidents of the recalled gun safes being opened by unauthorized users when the biometric lock failed to secure the safe. No injuries have been reported.

Sold At:
Walmart stores nationwide and online at Amazon.com and Walmart.com from August 2019 until December 7, 2022, for about $130.

Importer(s):
Shenghaina Technology Co. Ltd., d/b/a Awesafe, of China

Manufactured In:
China

Recall number:
24-127

Finally, here’s an excerpt from awesafe’s website’s recall page:

IMPORTANT RECALL NOTICE – AWESAFE BIOMETRIC GUN SAFES

Dear Customer:
Awesafe is conducting a recall of all Awesafe biometric gun safes that were sold before December 7, 2022, in cooperation with the U.S. Consumer Product Safety Commission (CPSC). The safes contain a biometric reader that allows unpaired fingerprints to open the safe until a fingerprint is programmed, allowing unauthorized persons, including children, to access hazardous contents, including firearms.

You should immediately stop using the biometric reader included with the recalled gun safes, remove the batteries, and follow the instructions below to receive a free replacement safe.

While you wait for your replacement, only use the key for the recalled safe to store your firearms.

All units sold prior to December 7, 2022 are affected.

Units sold after December 7, 2022 are not affected. Safes without biometric readers are not affected

And how would one go about getting a replacement gun safe? Glad you asked:

Determine whether you are covered in this recall. You need to first locate your awesafe biometric gun safe to participate in this recall. Then, fill out the form https://forms.gle/vxQoEMPXqovKxnA18 or email us at Recall@awesafeus.com, and we will help you determine whether you are covered in the recall. After confirming that your product is affected by this recall, please follow the following steps.

1. To receive a replacement biometric safe, please disable the biometric reader by puncturing the reader using a screwdriver and emailing a photo of the disabled reader to Awesafe at recall@awesafeus.com.
2. To disable the biometric reader, follow these instructions:
   • Wear safety glasses.
   • Puncture the reader by hitting the reader with a screwdriver – strike the screwdriver with a hammer.
   • The following is a link showing how to disable your unit: https://www.youtube.com/shorts/is-ZLujBujk?feature=share
3. Once Awesafe receives the photo of the disabled safe, we will send you an equivalent Awesafe biometric gun safe.
4. After you receive your replacement safe, please dispose of your disabled recalled safe.

Here’s the aforementioned video. Enjoy!(?)

I filled out the Google Forms-formatted online form as soon as I got the email from Amazon, and less than two weeks later I got an email from awesafe requesting a screenshot of the original Amazon order information to confirm my validity for a replacement, which I also promptly supplied via an email reply. Three weeks (and two days) after that, I received another email from awesafe reiterating that I after I destroyed the fingerprint reader (potentially rendering the safe more generally nonfunctional) and sent them pictorial proof of the damage done, they’d send me a replacement safe posthaste. But in-between that email and my earlier one to them, I’d done a bit of research. First off, here’s an excerpt from the FAQ page (which more generally augments the recall page with additional background and other information):

The problem is that all biometric safes sold prior to December 7, 2022 were programmed to ‘default to open.’ This means that the biometric safe will open to any contact with the reader before consumers follow instructions to register fingerprints. Consumers may think that their fingerprint has been registered while the biometric safe is, in fact, still in factory default mode. This will cause the biometric safe to open to any fingerprint. Since Awesafe’s biometric safes are designed to store fire arms, this can create a serious injury hazard and risk of death. We have reprogrammed the safe to ‘default to close’ since December 7, 2022.

So just a simple (albeit impactful) firmware programming error, one that wasn’t capable of being rectified by a cable- or wireless-tether delivered update executed by the end user? Not exactly. Take a look at these snapshots I took of the outer packaging:

and the sliver of documentation found inside the safe (along with a spare key, etc.):

They upfront and clearly document that the “all fingerprints open safe by default” characteristic was intentional. Wise? No. But by design? Yes. If you revisit my earlier provided Internet Archive Wayback Machine mid-2022 snapshot of the original version’s product page on Amazon, you’ll see that multiple comments posters also found the default behavior “odd” (I’m being charitable) but like me, were easily able to get around it by programming at least one user fingerprint.

I’m hardwired to avoid throwing perfectly good hardware into the landfill whenever possible, as long-time readers already know, so I write awesafe back and inquired into the situation, admitting that I was reluctant to do permanent (and seemingly unnecessary) damage to my existing gun safe. Surprisingly, here’s what I got back:

I will arrange a new replacement for you first.

And less than a week after that, a gratis, brand-new gun safe showed up at my door. It looks just like its predecessor and presumably is identical, save for updated firmware running inside it. I’m guessing it’s this product on awesafe’s website (also here on Amazon’s site). So now I have two…

But here’s the thing. The outer packaging is now instruction-less, and the folded black-and-white instruction manual inside has been replaced with a larger single-sheet color version:

awesafe takes great pains to point out that:

In order to make your safe safer, under the factory setting status, you cannot open the safe with any fingerprint. Only after you have input your fingerprint can you unlock it with the fingerprint that has been input.

But whereas, with the original version, “the numeric password does not have a default password set”, this time the instructions note:

In the factory setting state, you can unlock the safe with the initial password “1234”.

So, better than before? But still seemingly not ideal? Reader thoughts are welcomed!

In closing, I’m still a bit stuck on the “recall” wording chosen by both the CPSC and manufacturer. Maybe my interpretation of that particular word is just flawed, but when I see “recall” I construe that what’s being described is a “design flaw” (aka, a “defect”)…a vehicle braking system that doesn’t work as intended, for example…versus a “flawed design”…something that was designed to the manufacturer’s intention and documented as such to consumers, but developed based on a seemingly flawed product definition and specification. In either case, however, I agree that it’s a “product safety concern”. Am I just being overly pedantic, readers, or do you also see and agree with my point?

Sound off with your thoughts in the comments. Thanks as always in advance!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Poorly defined design vs defect: A product-recall case study dissect(ion) appeared first on EDN.

In 2023, Emerson acquired NI and introduced its new Test & Measurement business group. Both NI and Emerson are committed to continuous innovation, operational excellence, and sustainability. Together, they are building on their legacy and leadership in software-connected, automated test and measurement systems. The team is dedicated to investing in industry-leading innovations, delivering differentiated solutions to global customers, and assisting engineers in solving the world’s toughest challenges. Their test automation technology is renowned for delivering exceptional accuracy, throughput, and reliability, from the laboratory to the manufacturing floor and beyond. With the industry’s most comprehensive software portfolio, modular hardware, systems, and services, NI’s software-connected approach revolutionizes how enterprises utilize test insights.

Baskar Ceri, MD, NI India

Rashi Bajpai, Sub-Editor at ELE Times spoke with Baskar Ceri, MD, NI India on completing 25 years in India.

This is an excerpt from the conversation.

 

 

 

1. Having worked with National Instruments in diverse departments and roles, how has the journey been so far? Please throw some light on NI’s journey in India, and what according to you has been paramount in building a strong foothold in the country?

National Instruments (NI) has been instrumental in my career and it has been a fulfilling journey of growth and opportunity. I started my career at NI in Austin, USA and was part of the 3-member team that started NI operations in India growing the team and the revenue to multi-million dollars in India.

Since its establishment in India in 1999, NI has experienced significant expansion, now boasting a team of over 400 individuals spanning across its R&D and sales functions. Our journey has been guided by a strategic commitment to innovation, customer satisfaction, and adaptability. Paramount to our success has been our ability to understand and cater to the unique needs of the Indian market while contributing to global product development. This approach has enabled us to build a strong foothold in the country’s technology landscape.

2. What is NI’s vision for the Indian market at a time when the Indian vision is that of self-reliability and sustainability attaining momentum through policies like “Make in India”?

National Instruments (NI) envisions playing a pivotal role in India’s journey towards self-reliability and sustainability, our aim for the Indian market involves empowering local industries with cutting-edge test and measurement technology solutions that enhance manufacturing efficiency, product quality, and innovation. By leveraging our expertise in automation, standardization, and digital transformation, NI aims to support India’s ambition to become a global manufacturing hub, not only for electronics but also for semiconductors. We seek to enable Indian industries to produce world-class products while reducing dependency on imports and fostering economic growth. Through strategic partnerships, knowledge sharing, and investment in local talent, NI is committed to contributing to India’s vision of self-reliance and sustainability, driving progress and prosperity for the nation.

3. Tell us about your customer base in India and your product line that runs in the country.

In India, National Instruments (NI) serves a diverse customer base across various industries, including defense, aerospace, automotive, electronics, semiconductor, and energy sectors. Our products and solutions play a critical role in testing and measurement applications, ensuring the quality, reliability, and performance of a wide range of products.

Some of our notable customers in India include the Defense Research and Development Organization (DRDO), the Indian Space Research Organisation (ISRO), and various automotive and semiconductor companies. Our products are utilized in testing cellphones, satellites, missiles, automotive components, electronic devices, and more.

NI’s product line in India includes a comprehensive range of hardware, software, and systems for automated testing and measurement. This includes data acquisition systems, modular instruments, software platforms like LabVIEW, and integrated test systems tailored to specific industry needs. Our solutions enable customers to streamline testing processes, improve efficiency, and accelerate product development cycles, ultimately driving innovation and competitiveness in the Indian market.

4. Help us understand NI’s vision and goals for the next 25 years, and if you have a Plan of Action ready to implement

NI’s strategic vision is to be the global leader in software-connected automated electronic test and measurement systems. Since its establishment, NI has been at the forefront of innovation, offering a wide range of hardware, software, systems and services that enable engineers and researchers to design, prototype, and deploy cutting-edge technologies efficiently. NI’s mission is to equip engineers and enterprises with systems that accelerate productivity, innovation, and discovery.

NI embarked on its journey in India in 1999 with just three employees, quickly establishing its first R&D centre. Over the years, our team has expanded to over 400 employees, focusing on both R&D and sales, with headquarters in Bangalore and separate offices for sales and R&D.

Looking ahead to the next 25 years, after Emerson acquired NI and introduced its new Test & Measurement business group. NI and Emerson share commitments to continuous innovation, operational excellence, and sustainability. In this new chapter, we’re building on our legacy and leadership in software-connected, automated test and measurement systems. We remain focused on investing in industry-leading innovations, delivering differentiated solutions to our customers around the globe, and helping engineers solve the world’s toughest challenges.

The post National Instruments Celebrates 25 years of Technological Brilliance in India appeared first on ELE Times.

E-Fill Electric (EFEVChargingSolutionsPvtLtd.) proudly announces its prestigious recognition as the “Star EV Charging Station Manufacturer of the Year” at the India EV 2024 Expo and conference held at Chennai Trade Centre from June 29th to 30th, 2024. This award celebrates E-Fill Electric’s commitment to excellence and sustainability in the electric vehicle (EV) charging industry.

The India EV 2024 show and conference is a prominent platform that recognizes the outstanding contributions of industry leaders and trailblazers in advancing EV technology and infrastructure. E-Fill Electric’s dedication to innovation and quality in EV charging solutions has earned them this esteemed accolade, highlighting their significant impact on the EV ecosystem.

Mayank Jain, CEO, E-Fill Electric, expressed his gratitude and remarked, “Receiving the ‘Star EV Charging Station Manufacturer of the Year’ award is a testament to our team’s relentless efforts and dedication to revolutionizing sustainable transportation. We are honored to be recognized for our commitment to delivering cutting-edge EV charging solutions that meet the evolving needs of our customers and the EV Industry.”

Established in 2019, E-Fill Electric has emerged as a pioneer in EV charging solutions, catering to diverse stakeholders including individuals, businesses, CPOs, OEMs, and fleet operators. Their comprehensive range of AC and DC chargers, with power outputs ranging from 3.3kW to 240kW, ensures accessibility and efficiency across various applications.

Beyond manufacturing excellence, E-Fill Electric has established a robust franchise network spanning over 25 states and districts in India, empowering local entrepreneurs to participate in the EV charging infrastructure expansion. The company’s innovative approach extends to producing lithium-ion battery-powered electric three-wheelers, further solidifying their commitment to sustainable mobility solutions.

E-Fill Electric’s dedication to innovation is evident through their robust R&D efforts, which have resulted in securing over 7 patents. Their commitment to advancing electric vehicle (EV) technology underscores their leadership in driving the EV revolution forward.

For more information about E-Fill Electric and their award-winning EV charging solutions, please visit www.efillelectric.com.

The post E-Fill Electric Honored as “Star EV Charging Station Manufacturer of the Year” at India EV 2024 Show & Conference appeared first on ELE Times.

REYAX Technology, a leading innovator in the IoT industry, is proud to announce the launch of its latest product, RYRR30D. This cutting-edge solution sets a new standard for connectivity, security, and convenience in the realm of NFC/RFID.

The RYRR30D is certified by Apple Wallet VAS & Google SmartTap pass, ensuring top-tier compatibility and security. Enjoy the convenience of NFC technology, superior to traditional RFID cards, with the added benefit of Apple ECP V1.0 compliance and OTA (Over-the-Air) programming for seamless updates.

The RYRR30D offers unparalleled versatility with support for UART and USB 2.0 interfaces. Configure IDs and Keys effortlessly and decrypt NFC pass data with ease. Plus, the RYRR30D supports ISO15693, ISO14443A, ISO14443B, and FeliCa, offering comprehensive RFID TAG reading functionality.

In comparison to traditional RFID cards, the NFC technology utilized in RYRR30D offers unparalleled convenience and heightened security. Its seamless integration with mobile platforms, coupled with enhanced connectivity and encryption, makes it the ideal choice for a wide range of applications: EV Charger Authentication, Concert or Event Ticket Validation, Digital Member Cards, Access authentication, Digital Coupons, Loyalty Cards, and Library Card, etc.

The post Revolutionizing NFC & RFID Reading Technology, the ultimate solution for seamless NFC & RFID data reading from your Android or iPhone devices. appeared first on ELE Times.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, will exhibit at electronica China 2024(Booth E4.4600) on 8-10 July. Under the theme of “Our technology starts with You”, ST will showcase a comprehensive portfolio of innovative solutions across Automotive, Industrial, Personal Electronics and Cloud Infrastructure, featuring over 50 interactive demos and advanced solutions, each tailored to meet the evolving needs of our customers and the market.

Automotive: With over 30 years’ experience in automotive electronics, ST is a reliable and innovative partner for building the future of smart e-mobility. ST’s comprehensive solutions span the e-mobility value chain. From electric powertrains to digital vehicle platforms, ST technologies make electric transportation safer, cleaner, and more advanced. At electronica China, ST will demonstrate its complete automotive solutions by showcasing two electric-vehicle models. Visitors can explore ST’s wide range of applications for car electrification and digitalization, from Powertrain for Electric Vehicles (EV), Chassis and Safety, Body and Convenience, to Telematics and Infotainment.

Electrification is a major development trend in China’s automotive market, with prosperous growth in the NEV (new energy vehicle) market segment, accompanied by an increasing demand for convenient NEV charging solutions. ST’s latest automotive-charging solution integrates On Board Charger (OBC) and DC-DC converter built with STPOWER products enabling compatibility with different power levels like 6.6kW, 11kW, or even 22kW. It features ST’s Stellar E1 40nm microcontroller technology based on the ARM architecture, delivering high efficiency and reliability through high and flexible power computing cores with rich analog components and the highest functional safety level.

Another innovation ST will showcase at electronica China is the ADAS – Intelligent Front View Camera Solution, developed in collaboration with ST’s partners. This solution incorporates a range of ST’s technologies, including the SPC58NN automotive MCU and the L9396 System Basis Chip (SBC). The combination of an MCU and an SBC enables customers to meet the stringent safety requirements of ASIL-D when creating advanced ADAS products.

Industrial: With increasing concerns around climate change and energy costs, stakeholders, such as states, companies, and individuals, globally are prioritizing green-energy sustainable practices. ST is at the forefront of driving a greener future by developing sustainable solutions in a sustainable way. At electronica China, visitors are invited to witness a one-of-a-kind “energy-wall” that shows a comprehensive hybrid energy system. It illustrates the entire energy-conversion chain, from generation and storage to distribution and consumption, through various components and devices including PV solar panels, inverters, a Battery Management System (BMS), a bi-directional energy-storage system, and EV charging systems.

Reliable and efficient power is critical for datacenters supporting AI/cloud workloads. Using its cutting-edge technologies such as STPOWER Gen3 SiC MOSFETs and silicon transistors (i.e. high voltage MOSFETs and IGBTs), galvanic isolation gate drivers, high precision op amps, current sensing amplifiers, and high-performance MCUs, ST showcases solutions that aim to boost energy efficiency while cutting consumption and carbon emissions.

Arc Fault Circuit Interrupter (AFCI) has been widely applied in new energy industries such as photovoltaics and energy storage. At electronica China, ST will present its AFCI solution, which leverages edge-AI algorithms based on the STM32H7 and STM32G4 MCUs to detect arc faults in real time. Compared to traditional mechanistic algorithms, the AI algorithm integrated with the STM32 technology offers significantly higher accuracy and reduced false-alarm rates. The data training from a customer on-site and the upgrading of the STM32 AFCI 2.0 algorithm can lead to higher accuracy in the inference results.

 
Personal Electronics and Cloud Infrastructure: With the widespread adoption of NFC functionality in smartphones in recent years, an increasing number of brands are leveraging NFC to enhance consumer interaction and brand loyalty. High-end brands, high-value products, including luxury goods and artworks, require more secure NFC tag solutions to prevent counterfeiting. At this exhibition, ST also introduces its latest ST25TA-E NFC tag chip with state-of-the-art security features bringing innovation to the market with its on-chip ECDSA (Elliptic Curve Digital Signature Algorithm) capabilities and compatibility with Blockchain standards. Building on the Edge TruST25 digital-signature feature, the ST25TA-E includes an ECC cryptographic engine, providing a more secure digital-signature solution that can offer significant assistance in product-identity verification and digital twinning.

Showcased at electronica China, ST’s new third-generation duel full-scale MEMS pressure sensor comes in a sealed, cylindrical, surface-mountable package. The sensor is demoed in a solution that combines high precision and low power consumption to accurately measure water depth and altitude for IoT, sports, and wearable-device applications. It features a ceramic substrate that provides high resistance to liquid permeability and a robust potting gel, proven in automotive applications, to protect the internal circuitry.

Improving user experience is key to driving ST’s continuous innovation. Powered by ST FlightSense Time-of-Flight technology, a smart-cup detection shown at electronica China can detect and measure cups of various sizes, shapes, and materials, as well as their positions and the liquid level inside, thanks to the Compact Normalized Histograms feature. With this technology, users can use cups of any size and shape without worrying about spills due to poor fit.

A binocular 3D camera will be on show using one of our ST BrightSense global-shutter image sensors, which have just been launched on the open-market, to make this unique technology available to all, after having delivered > 1Bu image sensors to selected partners.

Presentations:
In addition to exciting demonstrations, ST’s experts will take the stage at electronica China to deliver 6 insightful presentations. These sessions will span a wide array of cutting-edge topics, offering deep dives into the latest trends and innovations that are shaping the future of technology:

• ST’s Edge AI Solutions
• ST’s Silicon Carbide MOSFET Technology Roadmap and Market Strategy in China
• ST motor control development ecosystem and system solution introduction
• The Solution of Intelligent Driving
• STM32 Solution in Digital Power and ESS
• Bluetooth LE Audio – Auracast with STM32WBA55

For an in-depth exploration of these captivating demonstrations, please visit ST’s booth (Booth E4.4600)at electronica China 2024.

The post STMicroelectronics at electronica China 2024 :Cutting-edge technologies and innovative solutions for Automotive, Industrial, Personal Electronics and Cloud Infrastructure appeared first on ELE Times.

In preliminary results for second-quarter 2024, deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany is reporting strong order intake of about €176m (down only slightly on €177.9m a year ago). The largest shares of equipment orders comes from silicon carbide (SiC) power electronics (~58%) and gallium nitride (GaN) power electronics (~29%)...

The stability and safety of lithium batteries require treating them with careful consideration. If lithium-ion battery cells do not operate within a constrained state-of-charge (SOC) range, their capacity can be reduced. If they are pushed beyond their SOC limits, these batteries can be damaged, leading to unstable and unsafe behavior. Therefore, to ensure the safety, lifetime, and capacity of lithium-ion battery cells, their SOC must be carefully limited.

To maximize each battery cell’s useful capacity and life, degradation must be minimized while operating all cells across a full SOC range. Simply keeping cells within a constrained SOC without intervention will avoid degradation but slowly decrease the usable capacity by the amount of SOC mismatch. That is because charging or discharging must stop when one cell reaches the upper or lower SOC limit, even though the other cells have remaining capacity (Figure 1).

Figure 1 The useful capacity of a battery pack is decreased by mismatched SOC. Source: Monolithic Power Systems

Most battery management systems (BMS) today include passive balancing to periodically bring all cells in series to a common SOC value. Passive balancing does this by connecting a resistor across each individual cell as necessary to dissipate energy and lower the SOC of the cell.

As an alternative to passive balancing, active balancing uses power conversion to redistribute charge among the cells in a battery pack. This enables a higher balancing current, lower heat generation, faster balancing time, higher energy efficiency, and longer operating range.

This article describes a few common active balancing methods and explains how these methods work.

Cell balancing

Cells in a pack develop capacity variation over time, even if they are initially well-matched. For example, cells at different physical locations in a pack can experience different temperatures or pressures that effect capacity. In addition, slight manufacturing differences can be amplified over time and create differences in capacity. Understanding capacity differences is critical to understanding the source of SOC imbalance.

Changes in battery cell SOC are primarily dictated by cell capacity and the current in, or out of, a cell. For example, a 4-Ahr cell receiving 1 A for 1 hr will experience a 25% SOC change, while a similar 2-Ahr cell will experience a 50% SOC change.

Maintaining SOC balance requires adjusting each cell’s charge/discharge current according to its capacity. Cells that are connected in parallel automatically do this, since current will flow from high-SOC cells to low-SOC cells. In contrast, cells in series experience the same current between cells, which creates an imbalance if there are capacity differences. This is important since most battery packs have series cell connections, even if they also include parallel connections.

SOC adjustment is possible for both passive and active balancing.

Passive balancing reduces cell SOC by placing a resistive load across individual cells (most commonly using BJT or MOSFET transistors). But active balancing takes a switch-mode approach to redistribute energy between cells in a battery pack.

The added complexity and cost of implementation has traditionally limited active balancing to battery systems with higher power levels and/or large capacity cells, such as batteries in power stations, commercial energy storage systems (ESS), home ESS, and battery backup units. New solutions are now available with significantly lower cost and complexity, enabling a growing range of applications to leverage the advantages of active balancing.

Passive balancing is typically limited to 0.25 A of current, while active balancing can support up to 6 A. A higher balancing current allows faster balancing, which supports larger-capacity battery cells, such as those used in ESS. In addition, a higher balancing current supports systems operating on fast cycles where balancing must be completed quickly.

Passive balancing simply dissipates energy; active balancing, however, redistributes energy with a significant improvement in energy efficiency. Passive balancing is only practical during the charge cycle, since operation during discharge hastens energy depletion from the pack. Conversely, active balancing can be implemented during charging or discharging.

The ability to actively balance during discharge provides more balancing time and allows charge to be transferred from the strong cells to the weak cells, thereby extending battery pack runtime (Figure 2). In summary, active balancing is advantageous for applications that require faster balancing, limited thermal load, improved energy efficiency, and increased system runtime.

Figure 2 Active balancing equalizes the SOC during charge and discharge. Source: Monolithic Power Systems

Active balancing methods

Commonly used active balancing topologies include direct transformer-based, switch matrix plus transformer, and bidirectional buck-boost balancing.

1. Transformer-based (bidirectional flyback) active balancer

A bidirectional flyback converter allows charge to be transferred in both directions. The bidirectional flyback is designed to operate as a boundary mode flyback converter. Each battery cell in the stack requires a bidirectional flyback, including a flyback transformer (Figure 3).

Figure 3 A transformer-based bidirectional active balancer transfers charge in both directions and can use a 24-V rail. Source: Monolithic Power Systems

When using different transformer designs, there are several possible energy transfer paths. For example, energy can be transferred from one cell to a sub-group of cells within the battery stack. Energy can be transferred from any cell to the top of the battery stack—connected to the battery pack terminals—which requires a large, high-voltage flyback transformer. Energy can also be transferred to or from an auxiliary power rail, such as a 24-V system shown in Figure 3.

Many transformers are often required when using the transformer-based active balancing approach, which results in large, costly solutions for battery packs with a high string count.

2. Switch matrix plus transformer active balancer

The switch matrix plus transformer method uses an array of switches to connect a transformer to and from individual cells; this reduces the number of transformers to one. Within a switch matrix, there are two categories of switches: cell switches and polarity switches.

The cell switches are back-to-back MOSFETs connected directly to the battery cells. They can block the current flowing in both charge and discharge directions. Conversely, the polarity switches block the current flowing in one direction only, and they are connected directly to the secondary side of a single, bidirectional flyback converter or a bidirectional forward converter (Figure 4).

Figure 4 A switch matrix-based bidirectional DC/DC active balancer uses an array of switches. Source: Monolithic Power Systems

The primary side of the bidirectional flyback converter or the forward converter is connected to the battery pack or an auxiliary power rail. In this arrangement, every cell can exchange the energy (during charge or discharge) with the battery pack or an auxiliary power rail. As noted, the primary advantage of the switch matrix plus transformer is that only one transformer is required.

3. Bidirectional buck-boost active balancer

A buck-boost active balancer takes a simpler approach by leveraging commonly used buck and boost battery charger technology. Rather than moving charge to various locations along a battery stack or to a separate power rail, buck-boost active balancing moves charge to directly adjacent cells. This greatly simplifies the balancing circuitry and leverages the simultaneous operation of many balancers to distribute charge across the entire stack.

A 2-channel buck-boost balancer provides bidirectional charge movement between two adjacent cells by operating in buck-balance mode or boost-balance mode. By placing a 2-channel buck-boost balancer on every pair of cells, charge can be moved throughout an entire pack (Figure 5).

Figure 5 A bidirectional “buck” and “boost” active balancer moves charges to directly adjacent cells. Source: Monolithic Power Systems

Compared to the two previous active balancers, a 2-channel buck-boost active balancer follows a simple process:

• In buck-balancing mode, the active balancer transfers energy from the upper cell (CU) to the lower cell (CL).
• In boost-balancing mode, the active balancer transfers energy from the CL to the CU.

Among the three types of active balancers, the bidirectional buck-boost active balancer is the simplest and most reliable. Table 1 compares all three active balancing methods.

Table 1 The above data highlights capabilities of three active balancing methods. Source: Monolithic Power Systems

Why active balancing is more viable

With a growing demand for safer, more energy efficient, and longer lasting lithium-ion battery systems, there is a growing demand for better cell balancing. Passive balancing, which is limited to small currents that simply dissipates energy, is no longer sufficient to meet these demands.

As a result, active balancing solutions are increasingly being adopted for their high-current, fast cell balancing advantages. In particular, bidirectional buck-boost active balancers offer simplicity and reliability.

Kelly Kong is battery management application manager at Monolithic Power Systems.

Greg Zimmer is business development manager at Monolithic Power Systems.

Related Content

• A primer on battery management system (BMS) for EVs
• Providing active balancing for series-connected batteries
• Cell balancing maximizes the capacity of multi-cell batteries
• Active balancing solutions for series-connected batteries
• Increasing Large Li-Ion Battery Pack Energy Delivery with Active Cell Balancing

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PolyITAN — єдиний український наносупутник формату кубсат, що досі перебуває в космос medialab сб, 07/06/2024 - 16:28

Запрошуємо взяти участь у програмі академічної онлайн-мобільності DILLUGIS 24: Digital Labs & Lectures for Ukrainian, German & International Students medialab пт, 07/05/2024 - 14:45

Artificial Intelligence (AI) applications typically involve handling large datasets, necessitating multiple distributed CPUs and GPUs communicating in real time. This setup is a hallmark of high-performance computing (HPC) architectures. Routing high-speed digital signals between processing elements necessitates chip-to-board and board-to-board connectivity. To meet high-speed requirements, communication protocols and physical standards have been developed based on signal integrity standards, which also ensure interoperability among suppliers. Occasionally, non-standard connectors are used due to specific form-factor requirements or other mechanical constraints. In these cases, their suitability can be assessed by comparing their specifications with industry-standard parts.

AI Data Bandwidth in Signal Integrity

When considering signal integrity, bandwidth and impedance are crucial electrical characteristics. Pin count, materials used, and mounting methods are significant mechanical considerations that impact performance and reliability. As HPC systems consume more power, contact resistance becomes increasingly important for improving data centre power efficiency.

For CPU connectivity, solderless interfaces often take the form of land grid array (LGA) or pin grid array (PGA) packages. Intel pioneered the LGA, using it for almost all its CPUs. Processors not designed to be user-replaceable might use a ball grid array (BGA), which connects components to the printed circuit board using solder balls. This is common for GPUs and some CPUs. The rate of data transfer between memory and a processor is a key factor in system performance. The latest development in random access memory (RAM) is the shift from DDR4 to DDR5, with DDR4 supporting data rates up to 25.6 Gbps and DDR5 up to 38.4 Gbps.

This evolution influences chip interface design. The latest LGA 4677 IC sockets offer link bandwidth up to 128 Gbps, typically supporting 8-channel DDR5 memory. These tightly spaced connection points can carry up to 0.5 A, reflecting the power demands of modern high-performance processors. Dual inline memory modules (DIMM) DDR5 memory sockets now support up to 6.4 Gbps bandwidth, with mechanical designs that save space and improve airflow around components on the printed circuit board.

Connecting AI Beyond the Board

PCI Express

Most processor boards feature several PCI Express (PCIe) slots for connectors, with slot types ranging from x1 to x16. The largest slots are typically used for high-speed GPU connectivity. The PCIe protocol standard allows up to 32 bidirectional, low latency, serial communications “lanes,” each consisting of differential pairs for transmitting and receiving data. PCIe 6.0, announced in January 2022, doubles the bandwidth of its predecessor to 256 Gbps, operating at 32 GHz, although hardware availability is currently limited.

InfiniBand

InfiniBand, common in HPC clusters, offers high speed and low latency, with maximum link performance of 400 Gbps and support for many thousands of nodes in a subnet. It can use board form factor connections and supports both active and passive copper cabling, active optical cabling, and optical transceivers. InfiniBand is complementary to Fibre Channel and Ethernet protocols but offers higher performance and better I/O efficiency. Common connector types for high-speed applications include QSFP+, zQSFP+, microQSFP, and CXP.

Ethernet

High-speed Gigabit Ethernet is increasingly common in HPC, with main connector types including CFP, CFP2, CFP4, and CFP8. CFP stands for C-form factor pluggable, with CFP2/CFP4 offering up to 28 Gbps per lane and supporting 40 Gbps and 100 Gbps Ethernet CFP-compliant optical transceivers. CFP8 connectors support up to 400 Gbps connectivity with 16, and 25 Gbps lanes.

Fibre Channel

Fibre Channel, specific to storage area networks (SANs), is widely deployed in HPC environments, supporting both fibre and copper media. It offers low latency, high bandwidth, and high throughput, with current support of up to 128 Gbps and a roadmap to 1 Terabit Fiber Channel (TFC). Connector types range from traditional LC to zQSFP+ for the highest bandwidth connections.

SATA and SAS

Serial Attached Technology Attachment (SATA) and Serial Attached SCSI (SAS) are protocols designed for high-speed data transfer, primarily used to connect hard drives and solid-state storage devices within HPC clusters. Both have dedicated connector formats with internal and external variants. SAS is generally preferred for HPC due to its higher speed (up to 12 Gbps) but is more expensive than SATA. Often, the operating speed of the storage device limits data transfer rates.

Passive Components and Powering AI Processors

As processing speed and data transfer rates increase, so do the demands on passive components. Powering AI processors in data centres require ferrite-cored inductors for EMI filtering in decentralized power architectures to carry tens of amps. Low DC resistance and low core losses are essential. Innovations like single-turn, flat wire ferrite inductors, designed for point-of-load power converters, are rated up to 53 A with maximum DC resistance ratings of just 0.32 mOhms, minimizing losses and heat dissipation.

High-performance processing necessitates high current and power rails with good voltage regulation and fast response to transients. Designers must consider frequency-dependent characteristics beyond capacitance and voltage ratings. Aluminium electrolytic capacitors, traditionally used for high capacitance values, are now often replaced by polymer dielectric and hybrid capacitors for their lower equivalent series resistance (ESR) and longer operating life.

The high power consumption of data centres has increased the voltage used in rack architectures from 12 V to 48 V for improved power efficiency. 48 V-rated aluminium polymer capacitors designed for high ripple current capabilities (up to 26 A) are available in values up to 1,100 µF, with some manufacturers offering rectangular shapes suitable for stacking into modules.

Multilayer ceramic capacitors (MLCCs) are widely used in power supply filtering and decoupling due to their low ESR and ESL. Continuous improvements in volumetric efficiency have resulted in components like the 1608M (1.6 mm x 0.8 mm) size MLCC with a 1 µF/100 V rating, saving significant volume and surface area compared to previous models.

Recent developments in MLCC packaging technology have enabled bonding without metal frames, maintaining low ESR, ESL, and thermal resistance. Ceramic capacitors with dielectric materials that exhibit minimal capacitance shift with voltage and predictable, linear capacitance changes with temperature are preferred for filtering and decoupling applications.

Conclusion

The need for high processor performance in AI systems imposes specific demands on passive and electromechanical components. These components must be selected with a focus on high-speed data transfer, efficient power delivery, thermal management, reliability, signal integrity, size constraints, and the specific requirements of AI applications, ensuring the electronic system meets the demands of AI workloads effectively and reliably.

Story Credit: Avnet

The post AI to Transform Passive and Interconnect Design appeared first on ELE Times.

КПІ та ООН — нові перспективи міжнародної співпраці medialab пт, 07/05/2024 - 13:52

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month...

Політехніки перемогли в конкурсі "Молодий вчений року 2023" Інформація КП пт, 07/05/2024 - 13:00

📋 Газета "Київський політехнік" № 25-26 за 2024 (.pdf) kpi пт, 07/05/2024 - 12:03

Амбасадорки КПІ на "Perspektywy Women in Tech Summit 2024" Інформація КП пт, 07/05/2024 - 10:35

To maximize the performance of analog input modules in programmable logic controllers (PLCs) used in factory automation, it is essential to focus on several key design considerations. These modules, which convert real-world signals into digital signals, vary based on voltage and current inputs, channel count, and configuration (single-ended or differential). Below are some important factors for consideration:

1. System Accuracy and Reproducibility:

• Precision in analog-to-digital converters (ADCs) and the analog front-end is crucial for accurate and reproducible measurements.

2. Component Selection:

• Low-Offset-Drift Amplifiers: Help maintain an adequate error budget.
• Low-Noise Operational Amplifiers (Op Amps): Achieve a higher effective number of bits or noise-free resolution.
• Instrumentation Amplifiers: Enhance precision in measurements.

3. Power Consumption and Data Acquisition Speed:

• Balance between power usage and the speed at which data is acquired and processed.
• Process Technology: Choose technology that offers an acceptable speed-to-power ratio.

4. Converter Topology:

• Successive Approximation Register (SAR) Converters: Preferred for efficiency without compromising performance.
• Bipolar Technology: Offers high efficiency with a good speed-to-power ratio, but be mindful of input bias current and input impedance.

Using Op Amps in Multiplexed Systems

In systems where a multiplexer allows one measurement at a time, issues such as large differential voltages at the op-amp input can arise, especially when switching between measurements (e.g., pressure and temperature). This can forward-bias input protection diodes, causing leakage currents that affect the amplifier’s settling time and digitization accuracy.

Multiplexer-Friendly Op Amps:

• Employ different protection schemes to avoid the issues caused by internal diodes, improving overall settling time.

Field Transmitter Interfacing

When interfacing with field transmitters that have high impedances (greater than 1 MΩ):

• MOSFET Input Op Amps: Suitable for high-impedance applications.
• Junction FET (JFET) Input Amplifiers: Offer very high input impedance but have a narrower common-mode input voltage range.
• Bipolar Op Amps: Provide the best speed-to-power ratio without compromising noise performance but have trade-offs like higher input bias current or lower input impedance.

Super Beta Topology:

This approach in bipolar designs can enhance both DC precision and AC performance, making it versatile for various analog input modules within PLCs.

Diagrams and Calculations

Figure 1: Signal Path Feeding to a High-Resolution Converter – Ensures minimal loss and distortion.

This is how a multiplexed system with level shifting drives a high-resolution ADC. Source: Texas Instruments

Figure 2: Precision Analog Front-End- Maintains linearity in the converter.

A single-channel module front-end is shown with a high-resolution differential input SAR ADC. Source: Texas Instruments

Figure 3: Noise Contributions- Analyzes the impact of amplifiers, voltage reference, and data converter.

Simulated noise for the signal chain and ADC are shown for the setup in Figure 2. Source: Texas Instruments

Figure 4: Settling Time: Critical for accurate digitization, calculated as LSB = (4.096 × 2)/2^18, yielding 31.25 mV. Multiplying by 0.5 gives 15.625 mV, representing half an LSB.

Simulation results for the settling time show an error well below one-half LSB. Source: Texas Instruments Optimization Considerations

The choice of components will depend on whether the goal is to optimize for settling time or noise performance. A bipolar op amp with integrated overvoltage protection can enhance efficiency without sacrificing settling time. In multiplexed systems, multiplexer-friendly op amps are essential to avoid performance issues.

By carefully selecting and configuring the appropriate components, you can achieve an optimal balance between DC and AC parameters, maximizing the performance of analog input modules in PLCs.

Story Credit: Texas Instruments

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release second-quarter 2024 earnings before the opening of trading on the European Stock Exchanges on July 25, 2024.

The press release will be available immediately after the release on the Company’s website at www.st.com.

STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its second quarter 2024 financial results and current business outlook on July 25, 2024 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET).

A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until August 9, 2024.

The post STMicroelectronics Announces Timing for Second Quarter 2024 Earnings Release and Conference Call appeared first on ELE Times.