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Візит делегації компанії NZIA Connect Inc. kpi пн, 02/17/2025 - 19:58

A blast from the past

Older folks may recall the famous Tektronix 576 and 577 curve tracers from half a century ago. A few of these have survived the decades and ended up in some lucky engineer’s home/work lab.

Wow the engineering world with your unique design: Design Ideas Submission Guide

We were able to acquire a Tek 577 curve tracer with a Tek 177 standard test fixture from a local surplus house that had been used at Sandia Labs, but it was not functional. Even being non-functional, these old relics still command a high price, which set us back $500!! With the help of an on-line service manual and some detailed troubleshooting, the old 577 was revived by replacing all the power supply’s electrolytic capacitors and a few op-amps, plus removing the modifications Sandia had installed.

Once operational we went looking for the various Tek device under test (DUT) adapters for the Tek 177 standard test fixture, these adapters are indeed rare and likewise expensive which sent us on the DIY journey!

The DIY journey

Observing a similar path to Jay_Diddy_B1 [1], we set out to develop a DIY adapter to replace the rare and expensive Tek versions. Like the popular T7 multi-function component tester, which employs a small ZIF socket for leaded-component attachment that works very well; we decided to do the same for the custom Tek adapter using the right and left sides of the ZIF socket to facilitate DUT comparisons with the Tek 177 standard test fixture. This can be seen in Figure 1.

Figure 1 Custom ZIF-based Tek 577 adapter where the right and left sides of the ZIF socket facilitate DUT comparisons with the Tek 177 standard test fixture.

As shown in Figure 2, a low-cost PCB was developed with SMD ferrites added to the nominal “Collector” and “Base” 577 terminals to help suppress any parasitic DUT oscillations. Connectors were also added to allow for external cables if desired (something we have never used). The general idea was to use the 6 banana jacks as support for holding the PCB in place with the ZIF on top of the PCB where one can directly attach various DUTs.

This approach has worked well and allows easy attachment of various leaded-components including the T0-126 and T0-220 power devices.

Figure 2 The custom adapter installed on the Tek 177 standard test fixture.

Applying the curve tracer to an SMD DUT

However, this still leaves the SMD types in need of a simple means to apply with the Tek 577 curve tracer with the 177 fixture; we set out to investigate this.

After studying the methods Tektronix utilized, we discovered some low-cost toggle clamps (found on AliExpress and elsewhere) which are used for clamping planar objects to a surface for machining. Figure 3 shows the custom toggle clamps used on a custom SMD DUT along with the custom adapter installed on the Tek 177 standard text fixture.

Figure 3 Custom toggle-type SMD adapter for the Tek 577 where using the pair of toggle arms allows both the right and left sides of the Tek 177 fixture to be utilized for direct SMD component comparisons.

These clamps could be repurposed to act as a clamp to hold a SMD DUT in place, which resulted in a custom PCB being developed to mount directly on top of the ZIF-based PCB previously discussed (Figure 4).

Figure 4 The custom SMD PCB that can be used with toggle clamps. This can be installed on the Tek 177 fixture for the Tek 577.

The toggle arms allow slight pressure to be applied to the SMD DUT where the leads make contact with the PCB’s exposed surfaces. Using a pair of toggle arms allows both the right and left sides of the Tek 177 fixture to be utilized for direct SMD component comparisons.

A connector on the rear of the PCB is mounted on the bottom side and mates with another connector on the ZIF type PCB, which allows connection to the 6 banana jacks that plug into the Tek 177 Fixture. Four nylon standoffs provide mechanical support and hold the two PCBs together. This setup allows easy SMD component installation and removal with little effort. Figure 5 shows both adapters for the Tek 577 with 177 standard test fixture.

Figure 5 Both adapters for the Tek 577 with 177 standard test fixture.

Both the ZIF and the SMD Adapters have served well and allow most components to be easily evaluated with the old Tektronix 576 and 577 curve tracers. Figure 6 shows the custom toggle-type SMD adapter in action with pair of DUTs.

Figure 6 Custom toggle-type SMD adapter in operation with pair of DUTs.

A word of caution

Just a word of caution when using these and any adapters, fixtures, or leads with the Tek 576 and 577 curve tracers: these instruments can produce lethal voltages across the exposed terminals. The Tek 177 standard test fixtures were originally supplied with plastic protective covers and sensor switches which removed the DUT stimulus when the plastic cover was open. In the old Tek service manuals, there was a modification method to defeat the Tek 177 sensor switch which many engineers employed, and many also removed the plastic protective covers.

Anyway, I hope some folks lucky enough to have an old Tek 576 or 577 curve tracer with Tek 177 standard test fixture find these custom DIY adapters useful if they don’t already have the old Tek OEM elusive adapters!

Michael A Wyatt is a life member with IEEE and has continued to enjoy electronics ever since his childhood. Mike has a long career spanning Honeywell, Northrop Grumman, Insyte/ITT/Ex-elis/Harris, ViaSat and retiring (semi) with Wyatt Labs. During his career he accumulated 32 US Patents and in the past published a few EDN Articles including Best Idea of the Year in 1989. All posts by Mike Wyatt below:

References

1. “EEVblog Electronics Community Forum.” SMD Test Fixture for the Tektronix 576 Curve Tracer – Page 1, www.eevblog.com/forum/projects/smd-test-fixture-for-the-tektronix-576-curve-tracer/.

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The post DIY custom Tektronix 576 & 577 curve tracer adapters appeared first on EDN.

In recent years, the proliferation of unmanned aerial vehicles (UAVs) has necessitated the development of robust counter-drone technologies to address security concerns. India, recognizing this imperative, has seen a surge in companies specializing in anti-drone systems.

This article highlights ten leading Indian manufacturers at the forefront of this critical sector, detailing their technological innovations and contributions.

1. Zen Technologies

Established in 1993, Zen Technologies has been a pioneer in defense training solutions and has expanded into anti-drone technologies. Their comprehensive anti-drone system encompasses detection, tracking, and neutralization capabilities. Utilizing radar, radio frequency (RF) sensors, and electro-optical systems, Zen’s solution can detect and track multiple drones simultaneously. For neutralization, they offer both ‘soft kill’ options, such as RF jamming to disrupt drone communications, and ‘hard kill’ measures, including kinetic systems to physically eliminate threats. Notably, Zen Technologies provides a net-based drone capture mechanism, deploying a dedicated drone equipped with a hanging net to intercept and secure rogue UAVs safely.

2. Bharat Electronics Limited (BEL)

A state-owned enterprise, BEL has collaborated with the Defence Research and Development Organisation (DRDO) to produce an advanced anti-drone system. This system is capable of real-time detection, tracking, and neutralization of micro and small UAVs. It integrates radar, RF detectors, and electro-optical sensors to provide comprehensive situational awareness. The neutralization suite includes both ‘soft kill’ options, like jamming the drone’s communication and navigation signals, and ‘hard kill’ solutions, such as laser-based directed energy weapons to destroy the target.

3. Alpha Design Technologies

Specializing in electronic warfare systems, Alpha Design Technologies has developed advanced solutions to counter UAV threats. Their anti-drone systems are designed to detect, track, and neutralize unauthorized drones using a combination of radar, RF monitoring, and electro-optical tracking. The neutralization methods include jamming and spoofing techniques to disrupt the drone’s control and navigation systems, effectively mitigating potential threats.

4. Adani Defence & Aerospace

A significant player in India’s defense sector, Adani Defence & Aerospace is actively engaged in developing counter-drone technologies. Their approach focuses on creating integrated systems that combine detection and neutralization capabilities. Utilizing radar and RF sensors for detection, their systems can identify and track multiple drone threats. For neutralization, they employ electronic countermeasures to disrupt drone operations, ensuring the protection of critical infrastructure and airspace.

5. Indo Wings Private Limited

As one of India’s fastest-growing drone and anti-drone manufacturers, Indo Wings specializes in advanced UAVs and counter-UAV systems. Their anti-drone solutions are equipped with sophisticated detection technologies, including radar and RF sensors, to identify and track unauthorized drones. Neutralization is achieved through electronic jamming and other countermeasures, effectively addressing potential threats in various environments.

6. Hindustan Aeronautics Limited (HAL)

A state-owned aerospace and defense company, HAL is developing artificial intelligence-driven advanced drones and counter-drone systems for strategic missions. Their focus includes creating solutions capable of operating in high-altitude areas, addressing security challenges along India’s frontiers. HAL’s anti-drone technologies aim to detect and neutralize UAV threats, enhancing the country’s defense capabilities.

7. Paras Aerospace

A subsidiary of Paras Defence and Space Technologies, Paras Aerospace offers a range of UAVs and counter-drone solutions. Their anti-drone systems are designed to detect and neutralize rogue drones using advanced sensor technologies and electronic countermeasures. These systems are suitable for protecting critical infrastructure, public events, and sensitive areas from unauthorized drone activities.

8. Kadet Defence Systems

Specializing in defense technologies, Kadet Defence Systems has developed anti-drone solutions focusing on detection and neutralization. Their systems utilize radar and RF sensors to detect unauthorized drones and employ jamming technologies to disrupt their operations. These solutions are designed to protect military installations, government facilities, and other critical assets from potential drone threats.

9. Throttle Aerospace Systems

Throttle Aerospace Systems has developed the ‘Defender,’ an innovative anti-drone platform that employs vision-based techniques and artificial intelligence. The Defender is capable of actively tracking and neutralizing rogue drones weighing up to 5 kg. This system enhances security by providing an effective solution to counter unauthorized UAVs in various environments.

10. DSE Technologies Pvt. Ltd.

DSE Technologies has secured projects for high-end tactical drone detection and neutralization systems. Their solutions offer both ‘soft-kill’ and ‘hard-kill’ options, emphasizing their expertise in security solutions for Indian forces and national security agencies. These systems are designed to detect, track, and neutralize unauthorized drones, ensuring the protection of critical assets and airspace.

 

India’s anti-drone industry is rapidly evolving, with these companies leading the charge in developing advanced technologies to counter the growing threat of unauthorized UAVs. Through continuous innovation and collaboration, they are enhancing the nation’s security infrastructure and contributing to global counter-drone capabilities.

The post Top 10 Anti Drone Manufacturers in India appeared first on ELE Times.

The drone industry in the United States has witnessed remarkable growth, driven by startups pioneering advancements across various sectors. From defense and agriculture to public safety and logistics, these companies are redefining the capabilities of unmanned aerial systems (UAS).

This article highlights ten leading U.S.-based drone startups, delving into their innovative technologies and contributions to the industry.

1. Anduril Industries

Founded in 2017, Anduril Industries specializes in AI-driven surveillance and reconnaissance solutions for the defense sector. Their flagship product, the Lattice platform, integrates sensor fusion, machine learning, and mesh networking to provide autonomous monitoring and control of defense assets. Additionally, Anduril has developed the Ghost drone, an autonomous single-rotor UAV controllable via web platforms or mobile applications, enhancing situational awareness in complex environments.

2. Skydio

Established in 2014, Skydio is renowned for its autonomous drones equipped with advanced AI and computer vision. Their drones, such as the Skydio 2+, utilize six 4K navigation cameras to construct a 3D map of their surroundings, enabling obstacle avoidance and autonomous navigation even in GPS-denied environments. Skydio’s technology serves various applications, including infrastructure inspection, public safety, and cinematic content creation.

3. Shield AI

Founded in 2015 by former Navy SEAL Brandon Tseng and his brother Ryan, Shield AI focuses on developing AI-powered drones for military applications. Their V-BAT drone is notable for its vertical takeoff and landing (VTOL) capabilities and autonomous navigation without reliance on GPS or remote control. The V-BAT has demonstrated resilience in electronic warfare environments, successfully identifying and aiding in the neutralization of hostile assets.

4. DroneDeploy

Since its inception in 2013, DroneDeploy has become a leading provider of drone software solutions, enabling users to create detailed aerial maps and 3D models. Their platform supports various industries, including agriculture, construction, and mining, by offering tools for real-time data analysis, progress tracking, and resource management. DroneDeploy’s software is compatible with a wide range of drone hardware, providing flexibility for enterprise applications.

5. Epirus

Epirus, established in 2018, specializes in directed energy systems designed to counter unmanned aerial threats. Their flagship product, the Leonidas system, employs high-power microwave technology to disable swarms of drones instantaneously. This compact and mobile system offers a scalable solution for defense against evolving aerial threats, providing protection for critical infrastructure and military assets.

6. Zipline

Founded in 2014, Zipline has revolutionized logistics through autonomous drone delivery services. Initially focusing on medical supply deliveries in remote regions, Zipline has expanded its operations to include commercial partnerships, such as delivering retail products in urban areas. Their drones are designed for long-range missions, capable of operating in diverse weather conditions to ensure timely deliveries.

7. Corvus Robotics

A participant in Y Combinator’s 2018 cohort, Corvus Robotics develops autonomous indoor drones for warehouse inventory management. Their drones navigate complex indoor environments to perform automated inventory scans, reducing the need for manual counts and increasing operational efficiency. Equipped with advanced sensors and AI algorithms, these drones can operate in GPS-denied spaces, providing real-time data to warehouse management systems.

8. Rotor Technologies

Established in 2021, Rotor Technologies focuses on converting traditional helicopters into unmanned aerial systems. Their Sprayhawk model, based on the Robinson R44 platform, is designed for agricultural applications, featuring a 120-gallon spray tank and autonomous flight capabilities. This approach leverages existing aircraft designs, retrofitting them with advanced avionics and control systems to perform tasks such as crop spraying and cargo transport autonomously.

9. BRINC Drones

Founded in 2018, BRINC Drones develops UAVs tailored for public safety and emergency response. Their drones are designed for both indoor and outdoor operations, featuring two-way communication systems, the ability to breach barriers, and payload delivery capabilities. These features enable first responders to assess situations remotely, communicate with individuals in hazardous environments, and deliver essential supplies during emergencies.

10. Unusual Machines

Unusual Machines, based in Florida, specializes in the manufacturing of drone components and systems. In November 2024, the company garnered attention by appointing Donald Trump Jr. to its advisory board, aiming to repatriate drone manufacturing to the United States. This strategic move aligns with broader efforts to reduce dependence on foreign technology and strengthen domestic production capabilities in the drone industry.

 

These startups exemplify the dynamic and rapidly evolving landscape of the U.S. drone industry. Through innovative technologies and applications, they are expanding the horizons of what unmanned aerial systems can achieve across various sectors.

The post Top 10 Drone Startups in USA appeared first on ELE Times.

У співпраці з НАЕК "Енергоатом" Інформація КП пн, 02/17/2025 - 13:00

SPEAG and Rohde & Schwarz expand their long-term collaboration with the combination of the CMX500 wideband radio communication tester with the DASY8-3D utilising the enhanced DASY8 Application Programming Interface. This combination allows manufacturers of wireless devices to perform Specific Absorption Rate tests of 5G FR1 devices using the future-proof CMX500 multi-technology, multi-channel one-box signaling tester.

SPEAG, a global leader of dosimetric test systems, has combined the CMX500 OBT from Rohde & Schwarz with its advanced specific absorption rate (SAR) measurement system, DASY83D. The CMX500 OBT emulates a 5G new radio (NR) FR1 base station, fulfilling the requirements for SAR testing of 5G NR devices and providing ease of use for the test engineer. The CMX500 radio communication tester supports cellular technologies such as LTE, 5G NR, as well as non-cellular technologies like Wi-Fi, all in a single instrument. The latest test feature sets, including state-of-the-art wireless technologies like NR-NTN, 5G RedCap, and Wi-Fi 7, provides a long-term, future-proof callbox platform.

The evolution of wireless technology has enabled the creation of an increasing number of wireless products that function close to the human body. These products range from cell phones and smart watches to AR/XR goggles, all of which need to ensure their SAR values meet the essential regulatory requirements imposed by many countries. For instance, the Federal Communications Commission (FCC) in the USA, Innovation, Science and Economic Development (ISED) in Canada, and the European Union have all established stringent SAR regulations and continuously developed safety standards for decades. Several other countries, including China, Vietnam, and India, have gradually adopted similar market access regulation requirements regarding the SAR of radio equipment in recent years. Globally, numerous regulatory test labs and market surveillance test labs are equipped with SPEAG systems for SAR testing.

The successful collaboration between SPEAG and Rohde & Schwarz is testimony to the long-term strategy of both companies for leadership and innovation in test and measurement applications for the wireless industry.

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What’s going on at Intel, the largest beneficiary of the U.S. push to onshore chip manufacturing? While the semiconductor industry was still reeling from a Bloomberg report about TSMC in talks for a controlling stake in Intel Foundry at the Trump administration’s request, The Wall Street Journal threw another stunner about Broadcom considering a bid for Intel’s CPU business.

Figure 1 Despite its financial woes, Intel has the largest and most advanced chip manufacturing operation owned by a U.S. company.

Intel, once a paragon of semiconductor technology excellence, has been on a losing streak for nearly a decade. Pat Gelsinger, the company’s overly ambitious former CEO, made an expensive bid to take Intel into the chip contract manufacturing business, which eventually became a liability for the Santa Clara, California-based semiconductor giant.

Meanwhile, it continued to lose market share in its bread-and-butter CPU business to archrival AMD and largely ceded the artificial intelligence (AI) chips boom to Nvidia. In this backdrop, according to Bloomberg, the previous U.S. administration considered Intel Foundry’s merger with GlobalFoundries (GF), which produces older generation chips and abandoned cutting-edge process nodes years ago.

While that was a non-starter, the present U.S. administration seems to have taken a more pragmatic approach by engaging TSMC to take partial ownership of Intel’s fabs, thus throwing a financial lifeline to money-losing Intel. Moreover, TSMC, in full control of its chip manufacturing operations, is expected to bring stability with its highly successful fabrication process recipes.

However, as the Bloomberg report points out, these talks are in an early stage and it’s not clear what’s in it for TSMC. While Taiwanese super fab expressed its lack of interest in Intel’s foundries a few months ago, its about-face on this matter seems to be linked to the current geopolitical turmoil. More details on this matter are expected to emerge in the coming days.

Broadcom eying Intel’s CPU business

The case for Broadcom potentially acquiring Intel’s CPU and related design businesses is less mysterious. The WSJ story claims that Broadcom is studying the possibility of acquiring Intel’s chip design business. If this matures alongside TSMC’s potential takeover of Intel Foundry, it’ll be the end of the road for the Intel brand as we know it.

However, the report clarifies that, like the TSMC matter, Broadcom’s talks regarding Intel are preliminary and largely informal. Furthermore, Broadcom will only proceed if Intel finds a manufacturing partner; here, it’s important to note that Broadcom and TSMC are working separately.

Figure 2 Despite losing market share to AMD and Nvidia, Intel owns a rich array of semiconductor design resources and patents.

The semiconductor industry rumor mill is in full swing, and we are likely witnessing the fall of an American corporate icon in real-time. This is a stark remainder of the semiconductor industry’s hyper competitive nature, which doesn’t spare missteps of even storied companies like Intel.

Intel’s woes are clearly beyond the reflection phase, and the damage done during Gelsinger’s tenure seems irreparable. However, the U.S. administration also sees Intel as an entity critical to national security. Will that be a blessing in disguise or a catalyst for its quick demise? Time will tell.

Related Content

• EU Chips Act: After Theory, Practice
• Intel Will Rely on TSMC for its Rebound
• Intel: Gelsinger’s foundry gamble enters crunch
• Intel Foundry: Leveraging Process Edge for Profit
• Intel Halts Products, Slows Roadmap in Years-Long Turnaround

The post Intel: The disintegration of a semiconductor giant? appeared first on EDN.

The electronics industry is experiencing a significant shift towards more compact and powerful systems. To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

These diverse product families, with top- and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and offer significantly improved performance, reliability, and ease of use. The product families target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.

The TOLL package offers outstanding Thermal Cycling on Board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.

The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve excellent robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95 percent, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.

The post New industrial CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL packages offer improved power density appeared first on ELE Times.

For fiscal second-quarter 2025 (for continuing operations, to 29 December 2024), Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has reported revenue of $180.5m, down 7% on $194.7m last quarter and 13% on $208.4m a year ago, but slightly above the midpoint of the $160–200m guidance range...

By: STMicroelectronics

Zonal platform. Domain architecture. Those are words people almost never hear in the context of the car they will drive in the next decade. When most people think of the future, they imagine an electric vehicle with a high level of driver assistance or autonomous driving capabilities – and all the latest digital media capabilities built in. While we might wonder what such a car would look like and how it would drive, we rarely think about what would need to take place in the unseen parts of the vehicle to make this reality. Yet, it’s exactly what is driving a hidden revolution: the move to zonal architecture and software-defined vehicles.

Let’s take a step back. A few years ago, most industry pundits foresaw the growing popularity of EVs (electric vehicles), and governments set ambitious goals, such as phasing out fossil fuel vehicles in the European Union by 2035. Many of these objectives are still in effect. And while some consumer adoption has slowed, the hype curve forecasts that the industry is about to pick up steam. Certain analysts simply think that consumers are waiting for longer-range, more reliable and extensive charging networks, as well as more affordable options.

Why is everyone talking about architecture? Understanding what’s unseen The premium platform electric (PPE) of the Q6 e-tron from Audi at the ST Booth at electronica 2024

So why is the car of tomorrow not here already? Because building the kind of vehicles consumers are clamoring for requires the industry to rethink how cars are designed. OEMs, Tier 1 suppliers, and others have realized that one of their best solutions was to create new platforms to enable greater efficiency and more quickly introduce technological advancements. For instance, in May 2024, Audi revealed its Premium Platform Electric (PPE). Developed jointly with Porsche, the platform makes its Q6 e-tron series significantly more efficient and capable.

Yet, despite a renewed emphasis on the car architecture, almost no one ever gets to see this “platform.” It’s for this reason that the ST Booth at electronica 2024 in Munich, Germany, will give attendees the unique opportunity to see one of the most hidden aspects of modern vehicles: an electronic/electrical (E/E) architecture. The exhibit shows the wiring harness of an actual car currently on the market, peeling back the curtain to expose the quiet revolution happening in the automotive industry.

What is a car architecture and how has it evolved? A car architecture with ECUs (blue boxes) and a battery (yellow box)

The first electronic system to make its way into mainstream vehicles was the electronic fuel injector (EFI) in the 70s, which replaced the carburetor. It used an Electronic Control Unit (ECU) to inject fuel into the engine, improving performance and reducing air pollution. As more ECUs brought electric windows or seats, for instance, engineers moved to a distributed architecture where one central gateway talked to multiple ECUs around the car. It enabled the prioritization of ECUs, ensuring that safety features, such as steering or braking, took precedence.

Afterward, as advanced driver assistance systems and new functionalities were invented and the industry maxed out the number of ECUs it could on a single platform, the industry moved to the domain architecture. This structure categorizes ECUs into domains, such as advanced driver-assistance systems (ADAS), powertrain, chassis, safety, infotainment, and more. Each domain has a gateway that talks to ECUs that control numerous devices and sensors. Many car makers have adopted this architecture today, for good reasons, optimizing it with each new iteration to make it more efficient. In the same vein, other car makers with the same goal in mind are exploring zonal architectures.

What is a zonal architecture? Moving to a zonal architecture enables predictive maintenance and other AI features

The zonal architecture organizes ECUs by their physical location inside the vehicle. It leverages a new generation of ECUs with powerful processing functions and a central High-Performance Computing Unit (HPCU) that supports fast communication protocols like Ethernet. Consequently, it simplifies platform design by reducing cable lengths and gauges, among other things. A central HPCU can also deal with the amount of data, computational throughput, and power required by high-performance ADAS functions, as well as new applications, such as AI.

This helps car makers move toward software-defined vehicles – an important step in speeding up innovation and allowing smartphone-like upgrades over time, thanks to over-the-air updates. This explains why S&P Global Mobility predicts that nearly 40% of the new cars manufactured in 2034 will feature a zonal architecture.

Seeing what is hidden: the Q6 e-tron onboard network exhibit

The Q6 e-tron onboard network exhibit on the ST booth at electronica is a great example of a car maker optimizing its architecture. The domain platform features 1,500 cables totaling over 3,500 meters (about 3,900 yards) and weighing nearly 60 kilograms (130 lb). It also includes over 400 connectors that can interconnect around 100 ECUs. It’s rare to see this harness laid out in public. The exhibit exemplifies the expertise it takes to ensure that all ECUs and connectors serve to optimize the platform rather than weighing it down. It’s a new way of thinking that demands highly specialized know-how and extensive knowledge of the overall product.

The move to a zonal architecture demonstrates this point even more. Conservatively, a vehicle switching to a zonal architecture would see its overall harness weight shrink by around 20%, increasing the battery’s range or gas mileage. A lighter car takes less energy to travel a set distance, thus improving its efficiency and reducing operating costs since consumers can drive more for less. Hence, it is fascinating that while the lighter and simpler harness is entirely hidden from the user, its impact is very visible.

What are the innovations needed for the hidden revolution? Software is taking the wheel Software is driving vehicles

Another way the hidden architecture makes itself known to users is through the many software features consumers want to use and see improved throughout the life of their vehicle. Not many realize how applications govern cars, but they still demand features like 360º camera vision as well as connected and cloud-based systems that provide entertainment, over-the-air updates, and other smartphone-like capabilities. Most drivers don’t know that the harness is directly responsible for enabling a new generation of software-defined vehicles, but they expect predictive maintenance applications for a better experience. And car makers know that instead of a recall, a software update can help save a lot of time, significantly reduce costs, and improve brand appreciation.

Today, software increasingly controls every aspect of the car, thanks in part to the rise of real-time virtualization, which improves the use of hardware resources by ensuring developers can do more with the same components. It’s all about decoupling the code from what it runs on. Thanks to containers and hypervisors, it is possible to run multiple software modules on one hardware ecosystem and still enjoy proper segregation to protect against interference. The technology is already popular in servers and data centers to create secure, safe, and efficient systems. It’s no wonder car makers are bringing it to their new vehicles.

Another advantage of this software paradigm is that it is responsible for the explosion of data generation and the centralization of processing capabilities for improved analysis and decision-making. New architectures have enabled car makers to install hundreds of sensors when they were limited to a few dozen in previous platforms. And more importantly, thanks to the more powerful ECUs and HPCUs, OEMs can future-proof systems and run powerful algorithms but still enjoy a more straightforward development experience. If one software platform can run more applications, it will enable car makers to offer more and richer features while keeping costs down, and ensure consumers get more value out of their vehicles.

Hardware metamorphosis

As we alluded to, the advent of software-defined vehicles and the decoupling of the hardware from the application is only possible if car makers choose microcontrollers and microprocessors that can meet their safety requirements while also offering the computational power and hardware IPs necessary to make this a reality. Engineers must find devices that can support real-time virtualization, numerous I/Os, and a large, embedded, and fast memory that facilitates over-the-air updates. MCUs must be designed and certified for automotive use with specialized safe redundancy built-in, especially as ECUs handle more and more safety applications.

It’s easy to see that this new evolution in car architecture represents a unique electrical challenge, as engineers must create robust, safe, and efficient power distribution mechanisms. It’s the reason why many are adopting smart switches. Unlike the classic melting fuses and mechanical relays, these new electronic switches are faster. As a result, they can offer far greater protection against an adverse electrical event because they respond much quicker than classical components. Their electronic nature also makes them vastly more accurate and flexible. Indeed, they come with monitoring features to enable real-time load management and control. Moreover, they are resettable, which saves from having to replace them manually.

The traditional fuse box that car makers can do away with when using smart fuses.

Another critical benefit of smart fuses is their tiny size compared to traditional switches and relays. Because eFuses are so small and electronically controlled, car makers can use shorter harnesses since, among other things, they no longer need to route cables to a large fuse box that must be user accessible. Moreover, the significantly higher accuracy means that the harness can be thinner, thus further contributing to weight reduction. A smaller design with fewer components that are more robust and accurate also helps improve overall reliability. Hence, while some engineers are still evaluating the cost of eFuses, the overall savings over the architecture’s lifetime explain their increasing popularity.

Taking a step back, we see that power distribution is also a much more critical engineering challenge because vehicles are dealing with far greater loads. Most architectures must handle 12 V, but the industry is moving to 48 V. EV chargers must also be able to handle very high voltages and power levels (up to 3,500 kW today). Hence, one of the most popular solutions is to use wide bandgap devices, such as silicon carbide (SiC). The fast switching frequencies of SiC MOSFETs and diodes mean they can handle a lot more power without the energy losses of previous devices, enabling smaller traction inverters, faster charging modules, and more efficient compressors, among other things.

The evolving role of semiconductor companies Engineers working on a car architecture

The domain and zonal car architectures emerging today testify to a new reality: everything is connected, and all roads (harnesses, in this case) lead to close cooperation between the key actors of the industry – car makers, Tier 1s, and semiconductor companies. Companies like ST understand how to support platform designers in their quest to decouple the hardware from the software and improve efficiency, safety, and robustness. Together, they create the innovations essential to the future of vehicles that will drive demand for the next generation of cars. It’s for this reason that existing carmakers and new startups are creating ever more intimate partnerships with semiconductor makers and why the market is going through such a disruption.

ST’s ability to grasp new engineering challenges is evidenced through its products. The Stellar family of devices has unique virtualization capabilities to future-proof the software-driven vehicles of tomorrow while its software ecosystem helps reduce development times and meet regulatory requirements. Similarly, STi²Fuse can shrink the overall harness, reduce the bill of materials, and optimize the overall power distribution. Additionally, silicon carbide power devices continue to bring new levels of efficiency. In essence, it’s by offering a wide range of solutions that semiconductor companies can be the close partners that car makers need them to be as they drive the new architectures that will meet the hopes and expectations of their customers.

The post The hidden car revolution: zonal architecture appeared first on ELE Times.

The automotive industry is facing significant technological challenges in developing new and innovative features and services. When defining their products, vehicle manufacturers must anticipate future technical advancements in microelectronic platforms, sensors, and semiconductor technologies. At the same time, suppliers and semiconductor manufacturers need early insights into the requirements for upcoming features and services to be able to invest in technology development with confidence.

As part of the “GENIAL!” project funded by the Federal Ministry of Education and Research (BMBF), eleven partners collaborated to develop concepts and methods that help companies in the automotive industry work together more effectively and prepare for the future. The project specifically focused on optimizing the collaboration between automotive manufacturers and their component and technology suppliers to accelerate innovation across the automotive value chain.

The prototypical automotive microelectronics roadmap developed in GENIAL! provides a strategic framework for identifying future market needs, use cases, system models, and technical requirements in the field of automotive microelectronics. This roadmap establishes a shared understanding of the microelectronics requirements of future highly innovative vehicles across the entire value chain. The results enable all market participants, as well as research institutions and policymakers, to manage investments and research activities more effectively. In turn, this facilitates the implementation of significantly shorter and more reliable development processes, allowing new, innovative automotive components to be realized more quickly.

The project was based on a model-based system development approach that utilizes the Systems Modeling Language (SysML) as a modeling language, now integrated into SysML v2. This approach is supported by the AGILA database and further enhanced by the IRIS (Interactive Roadmapping of Innovative Systems) tool, both developed within the project. AGILA serves as a centralized database for capturing the essential information and providing documentation, consistency checks, and version control.

The IRIS tool enables collaborative modeling, exploration, planning, and evaluation of solution alternatives. It also supports non-technical information, allowing considerations such as security of supply, and enables visualizations for roadmapping. To encourage widespread adoption, the project participants will release tools such as AGILA and IRIS as open-source solutions, making them accessible for anyone interested in creating and maintaining roadmaps.

The innovation modeling methodology “IMoG” (Innovation Modelling Grid) defines activities, roles, and process models for the collaborative creation of roadmaps. This spans from the initial comparison of models in the problem and solution space to the practical application of the AGILA and IRIS tools. Documentation of the methodology, along with several training videos, is available for free download.

The post Project “Genial”: Joint electronics roadmap for innovations in the automotive value chain appeared first on ELE Times.

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The Convergence of Quantum and Classical Technologies

The field of computing is undergoing a transformative shift with the advent of quantum computing. While classical electronics have been the backbone of digital technology for decades, quantum computing promises to unlock unprecedented computational capabilities. However, these two paradigms are not mutually exclusive; rather, they can complement each other, leading to more efficient and powerful computing architectures. This article explores the latest developments in integrating quantum computing with classical electronics, detailing the technical challenges, innovative solutions, and future implications.

The Foundations: Understanding Classical and Quantum Computing Classical Electronics: The Workhorse of Modern Computing

Classical computing is built on the foundation of semiconductor-based electronics, primarily leveraging transistors, integrated circuits, and Boolean logic. It operates on bits, which can either be in the state of 0 or 1, and relies on deterministic algorithms to process information.

Quantum Computing: The Next Frontier

Quantum computing introduces a fundamentally different approach, utilizing qubits instead of bits. Qubits can exist in superposition, meaning they can represent both 0 and 1 simultaneously, and leverage entanglement for highly efficient parallel computations. This enables quantum systems to solve problems that are infeasible for classical computers, such as complex optimizations, cryptographic analysis, and molecular simulations.

Bridging the Gap: Integrating Quantum and Classical Systems

Quantum processors (QPUs) do not operate in isolation; they require classical electronics for control, measurement, and data processing. The integration of these two domains is critical to making quantum computing practical and scalable.

Classical Control of Quantum Systems

• Cryogenic CMOS Electronics: Since qubits operate at extremely low temperatures (near absolute zero), classical control electronics must function reliably at cryogenic conditions. Innovations in cryogenic CMOS technology enable signal processing and qubit manipulation without excessive thermal noise.
• High-Speed Digital-to-Analog and Analog-to-Digital Converters (DAC/ADC): These components are crucial for translating classical instructions into precise qubit operations and reading quantum state measurements.
• Low-Latency Error Correction: Quantum error correction requires real-time classical processing to mitigate decoherence and maintain computational accuracy. Specialized classical processors are being developed to handle these operations efficiently.

Quantum-Classical Hybrid Algorithms

Many quantum algorithms require classical pre- and post-processing. Examples include:

• Variational Quantum Eigensolver (VQE): Used in quantum chemistry, where a classical optimizer adjusts quantum circuit parameters to minimize energy states.
• Quantum Approximate Optimization Algorithm (QAOA): A hybrid approach that leverages quantum computation for complex combinatorial problems while using classical methods for optimization refinement.

Challenges in Quantum-Classical Integration Scalability Issues

As quantum processors scale up, the overhead on classical electronics increases significantly. The interconnect complexity, power consumption, and latency must be optimized to handle thousands of qubits efficiently.

Heat Dissipation

Operating classical electronics near quantum processors requires careful thermal management to prevent interference with qubit coherence. New materials and low-power circuit designs are being explored to address this issue.

Data Transfer Bottlenecks

Quantum computations generate vast amounts of data that must be efficiently transferred to classical processors for analysis. Advanced data compression and high-speed interconnects are being developed to enhance performance.

Emerging Solutions and Innovations Photonic Interconnects

Optical communication is being explored to connect classical and quantum systems with minimal signal degradation. Photonic links enable faster and more reliable transmission of control signals and readout data.

Neuromorphic Computing for Quantum Error Correction

Neuromorphic processors, which mimic the human brain’s neural networks, are being investigated to handle real-time quantum error correction more efficiently than traditional digital processors.

AI-Assisted Quantum Control

Machine learning algorithms are being integrated into quantum control systems to optimize pulse sequences, error correction strategies, and system calibrations dynamically.

Future Directions: Towards a Quantum-Classical Hybrid Era

The future of computing lies in a seamless fusion of quantum and classical technologies. Research is progressing towards developing quantum-classical hybrid architectures that harness the best of both worlds. Potential advancements include:

• On-Chip Integration: Embedding quantum and classical components onto the same chip to reduce latency and improve scalability.
• Fault-Tolerant Quantum Systems: Advancements in quantum error correction that minimize the need for excessive classical post-processing.
• Cloud-Based Quantum Computing: Platforms where classical systems offload computationally intensive tasks to quantum processors over high-speed networks.

Conclusion: The Road Ahead

The integration of quantum computing with classical electronics represents a monumental leap in computational capabilities. By overcoming current technical challenges, researchers are paving the way for a new era of computing where quantum and classical systems work in unison to solve the most complex problems. The convergence of these technologies will not only drive breakthroughs in artificial intelligence, materials science, and cryptography but also redefine the limits of human knowledge and innovation.

The post Quantum Computing Meets Classical Electronics: Bridging Two Worlds for Next-Generation Computing appeared first on ELE Times.

Achieves equivalent rated power in a smaller size with guaranteed stable long-term supply

ROHM has expanded its portfolio of general-purpose chip resistors with the MCRx family. It is designed to achieve greater miniaturization and enhanced performance across a variety of applications. The new lineup includes the high-power MCRS series and low-resistance, high-power MCRL series.

In today’s era of advancing functionality and electrification, the increased miniaturization and improved performance of electronic components have become critical issues. This is especially evident in the automotive market, where the proliferation of electric vehicles (xEVs) is accelerating the use of electronic components. Similarly, the industrial equipment market is experiencing growing demand for compact, high performance electronic components as machinery becomes more functional and efficient. ROHM addresses both of these needs with the MCRx family of compact, high-performance resistors.

The MCRS series improves rated power and TCR (Temperature Coefficient of Resistance) characteristics by optimizing the internal structure and incorporating new materials, enabling use in a smaller size compared to conventional products. A broad lineup in sizes ranging from 0402-size (0.04inch × 0.02inch) / 1005-size (1.0mm × 0.5mm) to 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) is available, making it possible to select the ideal product based on mounting space requirements. This leads to a compact, efficient circuit design, significantly increasing design flexibility. Meanwhile, the MCRL series, a low-resistance variant of the MCRS series, is offered in sizes ranging from 0805-size (0.08inch × 0.05inch) / 2012-size (2.0mm × 1.2mm) to 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) ideal for current detection applications.

The MCRx family adopts a redesigned internal structure, improving production efficiency, quality, and product reliability across all sizes. Compliant with the AEC-Q200 automotive reliability standard, this series meets the increasing demand for electric vehicles (xEVs) while contributing to market expansion in communications infrastructure such as base stations and servers as well as factory automation equipment. In addition, the products are designated for long-term stable supply, supporting continuous use in long-life applications such as industrial equipment.

The MCRS series will be expanded to include compact 0201-size (0.024inch × 0.012inch) / 0603-size (0.6mm × 0.3mm) products capable of withstanding temperatures up to +155°C. At the same time, the MCRE series will soon offer completely lead-free 01005-size (0.016inch × 0.008inch) / 0402-size (0.4mm × 0.2mm) products. These additions will allow ROHM to respond to the demand for further miniaturization while complying with environmentally-driven voluntary regulations and export restrictions.

Going forward, ROHM is focused on developing and manufacturing products that cater to the diverse needs of customers worldwide. In particular, ROHM will continue to expand its lineup of resistors (its founding products) that improve miniaturization and reliability while ensuring long-term stable supply. By consistently delivering new value through technological innovation, ROHM seeks to solidify its market position and drive the evolution of electronic components.

Product Lineup MCRS Series <High-Power Type>

MCRL Series <Ultra-Low Ohmic ・ High Power Type>

MCRE Series <Completely Lead-Free Type>

Application Examples

Suitable for a wide range of applications (excluding medical, military, aerospace, and nuclear control equipment)

Automotive

• Electric vehicles (xEVs): Battery Management Systems (BMS), powertrain control, Advanced Driver Assistance Systems (ADAS)
• In-vehicle electronics: Engine Control Units (ECUs), infotainment systems, and more

Industrial Equipment

• Robotics: Control systems for industrial robots
• Factory Automation (FA): Automated product line control systems
• Power conversion equipment： Inverters, converters, and more

Consumer Devices

• Smart devices: Smartphones, tablets, wearables
• Home appliances: TVs, refrigerators, washing machines

Communication Equipment

• Network equipment: Routers, switching hubs, communication equipment for data centers, etc.

The post ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization appeared first on ELE Times.

The new nRF54L chipset-based wireless modules reduce current consumption and double processing capacity, catering to diverse mass market segments.

u-blox a global leader in positioning and short-range communication technologies for automotive, industrial, and consumer markets has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.

The new additions keep delivering on NORA-B2 promises, providing multiple operational benefits. The wireless modules combine ultra-lower power consumption and high processing efficiency, consuming up to 50% less current than previous-generation devices while doubling process capacity. They also offer outstanding security features, which makes them ideal for a wide range of IoT applications, such as smart home devices, industrial automation, or healthcare.

The entire NORA-B2 series comprises four variants that differ in memory sizes, design architectures and price levels to match almost any device manufacturer’s requirements.

• NORA-B20 uses ultra-low power nRF54L15 SoC and integrates a 128 MHz Arm Cortex-M33 processor, a RISC-V co-processor, and an ultra-low power multiprotocol 2.4 GHz radio. It comes with 1.5 MB of Non-Volatile Memory (NVM) and 256 KB RAM.
• NORA-B21, based on ultra-low power nRF54L10 SoC, is designed for mid-range applications. It has 1.0 MB of NVM and 192 KB of RAM and can handle multiple wireless protocols simultaneously, including Bluetooth LE, Bluetooth Mesh, Thread, Matter, Zigbee, and Amazon Sidewalk.
• NORA-B22 is designed for cost-sensitive applications but still provides access to up to 31 GPIOs. It offers 0.5 MB of NVM and 96 KB of RAM.
• NORA-B26 is designed for customers using the Network Co-Processor architecture and comes pre-flashed with the u-blox u-connectXpress software, allowing customers to easily integrate Bluetooth connectivity into their products with no prior knowledge of Bluetooth LE or wireless security.

All NORA-B2 modules are designed for PSA Certified Level 3 security. They incorporate features such as secure boot and updates, tamper detection, and secure firmware over-the-air (FOTA) updates. These security measures ensure that IoT devices remain protected against any potential threats, safeguarding both data and functionality. NORA-B2 modules are also qualified against Bluetooth Core 6.0 that includes Channel Sounding, enabling endless cost-effective possibilities in tracking and locating use cases.

NORA-B2 variants either come with an antenna pin for connecting an external antenna of choice or are designed with a patented PCB antenna providing best-in-class RF performance. All module versions come with global certification allowing device manufacturers to launch their products worldwide with minimal effort.

“We are excited to see Nordic’s entire nRF54L Series of SoCs seamlessly integrated into the NORA-B2 module series. The market demand for energy-efficient solutions at a competitive cost is growing rapidly, and this product category is well-positioned to meet that need. u-blox’s commitment to staying ahead of industry and market trends reinforces our confidence in this valuable partnership,” says Thomas Holmberg, Regional Sales Director at Nordic Semiconductor.

Samples of NORA-B20 are now available. Early samples of NORA-B21 and NORA-B22 are available for evaluation in limited quantities. The pre-release version of u-connectXpress software for NORA-B26 is also available for early adopters. For more information on the NORA-B2 series and how it can benefit your IoT projects, visit the u-blox website or contact your local u-blox salesperson or distribution partner.

The post u-blox expands its NORA-B2 Bluetooth LE modules series using the nRF54L chipsets to address all mass market segments appeared first on ELE Times.

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