Feed aggregator

submitted by /u/Blytical [link] [comments]

Поглиблюємо наукові та дослідницькі звʼязки з провідними компаніями Туреччини kpi ср, 03/12/2025 - 20:43

submitted by /u/SIrawit [link] [comments]

Famous analog designer and author Jim Williams published an awesome design in 1986 for a 100-MHz voltage to frequency converter. He named this high-climber (picture it on the roof of the Empire State building swatting biplanes out of the air) King Kong! He followed Kong in 2005 with a significantly updated successor, “1-Hz to 100-MHz VFC features 160-dB dynamic range.”

I was fascinated by both of these impressive designs because they were way faster than any other VFC I’d ever seen! Another two decades passed before I decided to try for a 9-digit VFC of my own.  

Wow the engineering world with your unique design: Design Ideas Submission Guide

Here’s the result (Figure 1).

Figure 1 This simple VFC borrows some of Williams’ pioneering speed ideas and combines them with a few tricks of my own to reach the high altitude of a 100-MHz full scale frequency.

The Q1, D1, and Schmitt trigger U1 make a sloppy but tight and speedy VFC which is then accurized by the feedback loop comprising prescaler U3, take-back-half (TBH) charge pump D1-D4, and integrator A1. The preaccumulator U2 interfaces the 100 MHz count rate to moderate speed (~6.25 MHz) counter timer peripherals without losing resolution.

The core of Figure 1’s circuit is a very simple Q1, U1, D5 ramp-reset oscillator. Q1’s collector current discharges the few picofarads of stray capacitance provided by its own collector, Schmitt trigger U1’s input, D5, and their interconnections (as short and direct as possible, please!). U1’s sub-five-nanosecond propagation delay allows the oscillation to run from a dead stop (possible due to leakage draining R4) to beyond 100 MHz. 

During each cycle, when Q1 ramps U1 pin1 down to its trigger level, U1 responds with a ~5 ns ramp reset feedback pulse through Schottky D5. This pulls pin 1 back above the positive trigger level and starts the next oscillation cycle. Because the ramp-down rate is (more or less) proportional to Q1’s base current, which is approximately proportional to integrator A1’s output voltage, oscillation frequency is likewise. The caveat is “approximately”.

The feedback through the TBH pump, summation with the R1 input at integrator A1’s noninverting input, the output to Q1 and thence to U1 pin 1 converts “approximately” to “accurately”. One item that lets this VFC work in Kong’s frequency domain but with a considerably simpler parts count is the self-compensating TBH diode charge pump described in an earlier design idea (DI): “Take-back-half precision diode charge pump.”

So, what’s U3 doing?

The TBH pump’s self-compensation allows it to accurately dispense charge at 25 MHz or so but 100 MHz would definitely be asking too much. U3’s two-bit prescaler addresses this problem. U3 also provides an opportunity (note jumper J1) to substitute a high quality 5.000v reference for the likely lesser accuracy of the generic 5v rail. 

Figure 2 shows a 250-kHz diode charge pump boosting the 5v rail to about 8v which is then regulated down to a precision 5.000 by U4. U3 current demand, including pump drive, is about 23 mA at 100 MHz; U4 isn’t rated for quite that heavy a load, so buddy resistor R6 takes up the slack.

Figure 2 A 250-kHz diode charge pump Rail booster bringing rail to 8V which is then regulated down to a precision 5.000 V reference by U4.

The 16x preaccumulator U2 allows use of moderate performance counter-timer peripherals as slow as 6.25 MHz to acquire the full-scale 100-MHz VFC output. That idea is described in an earlier DI: “Preaccumulator handles VFC outputs that are too fast for a naked CTP to swallow.”

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• 1-Hz to 100-MHz VFC features 160-dB dynamic range
• Take-Back-Half precision diode charge pump
• Preaccumulator handles VFC outputs that are too fast for a naked CTP to swallow
• 80 MHz VFC with prescaler and preaccumulator
• 20MHz VFC with take-back-half charge pump

The post 100-MHz VFC with TBH current pump appeared first on EDN.

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has released its Phase 17 Reliability Report, further solidifying GaN’s position as a highly reliable technology for power electronics, automotive, AI, space and industrial applications...

I recently designed a PCB for a buck converter. First I tried doing hand soldering (left side). It works but the quality is not what I expected and it took lot of time to do. Then I bought a solder plaster syringe. Oh boo I was so easy to make solder. Just apply it and blow hot air. Done. submitted by /u/arudhranpk [link] [comments]

The 3D printing industry in India has witnessed remarkable growth over the past decade, evolving from a niche technology to a significant player in the manufacturing ecosystem. As of 2023, India’s 3D printing market was valued at approximately USD 61.4 million and is projected to reach USD 314.0 million by 2030, reflecting a compound annual growth rate (CAGR) of 26.3%. This rapid expansion indicates the increasing adoption of additive manufacturing across various industries, fueled by advancements in technology, governmental initiatives, and rising awareness of its economic and environmental benefits.

Government Initiatives and Policy Support

Recognizing the transformative potential of 3D printing, the Government of India has introduced a national strategy aimed at fostering a robust additive manufacturing ecosystem. This strategy seeks to establish India as a global hub for design, development, and deployment of 3D printing technologies. Among the key objectives of this initiative is the promotion of 100 new startups in the 3D printing sector by 2025, alongside the development of 50 new technologies to enhance additive manufacturing capabilities. Additionally, the government aims to create approximately 100,000 new jobs and facilitate the production of 500 new products using 3D printing technology. These policies not only support innovation and investment but also encourage the integration of 3D printing into mainstream manufacturing processes.

Industrial Applications of 3D Printing in India

3D printing technology is being adopted across multiple sectors in India, revolutionizing traditional manufacturing methods. In healthcare, 3D printing is used for creating patient-specific implants, prosthetics, and anatomical models. These innovations enhance surgical precision and patient outcomes while reducing medical costs. The automotive industry benefits from 3D printing through rapid prototyping, tooling, and lightweight component production, which reduces production cycles and improves vehicle efficiency.

In aerospace, the use of additive manufacturing allows for the creation of complex, lightweight parts that meet stringent performance standards, leading to improved fuel efficiency and reduced emissions. Similarly, the jewelry industry leverages 3D printing to produce intricate designs with high precision, enabling mass customization and reduced production time. Furthermore, construction firms in India are experimenting with 3D printing to build affordable housing units, addressing the demand for sustainable and cost-effective infrastructure solutions.

Market Growth and Driving Factors

The Indian 3D printing market is experiencing substantial growth, driven by several key factors. Technological advancements have significantly improved printing speed, material compatibility, and efficiency, making 3D printing more accessible to businesses of all sizes. Additionally, cost efficiency plays a crucial role in the widespread adoption of additive manufacturing, as it minimizes material wastage and accelerates production timelines, leading to substantial cost savings for industries such as automotive, healthcare, and consumer goods.

Another driving force behind the growth of 3D printing in India is the increasing demand for customization. Consumers today prefer personalized products, whether in the form of customized medical implants, unique jewellery designs, or tailored industrial components. The ability of 3D printing to deliver high levels of customization at scale makes it an attractive solution for businesses looking to differentiate themselves in competitive markets.

According to market research, India’s 3D printing sector is expected to grow at a CAGR of 20-25% in the coming years. The growing need for faster, cost-effective, and tailor-made solutions across industries will further propel this expansion.

Entrepreneurial Opportunities in 3D Printing

The rapid expansion of 3D printing in India presents numerous business opportunities for entrepreneurs and investors. One of the most promising avenues is offering 3D design services, where businesses can provide 3D modelling and customization solutions for industries such as architecture, healthcare, and manufacturing. Another lucrative opportunity is establishing 3D printing service bureaus, which provide on-demand printing for sectors including education, consumer goods, and automotive.

Educational workshops and training programs are also in high demand as the adoption of 3D printing grows. Conducting certified courses on 3D modelling, printing technologies, and post-processing techniques can help bridge the skill gap in the industry. Furthermore, businesses can develop and sell unique 3D-printed products, ranging from customized home decor to industrial-grade machinery components, taking advantage of the versatility and precision of additive manufacturing.

Challenges in the Indian 3D Printing Industry

Despite its promising future, the 3D printing industry in India faces several challenges. High initial investment costs pose a barrier to entry for many startups and small-scale manufacturers. Advanced 3D printers and high-quality printing materials are expensive, limiting access to the technology for businesses operating on tight budgets.

Another significant challenge is the lack of a skilled workforce. Operating 3D printers, understanding additive manufacturing processes, and mastering post-processing techniques require specialized skills, which are currently in short supply. To address this issue, government and private institutions must invest in training and educational initiatives that equip professionals with the necessary expertise.

Additionally, the absence of standardized regulations and quality control measures in the industry creates uncertainties for businesses looking to adopt 3D printing. Establishing industry-wide standards and certification protocols will be crucial in ensuring product reliability and consumer trust.

Future Outlook of 3D Printing in India

Looking ahead, 3D printing is set to revolutionize manufacturing processes in India. With continuous advancements in material science, software development, and automation, 3D printing will become an integral part of the supply chain for industries such as healthcare, automotive, aerospace, and consumer electronics. Additionally, government initiatives, coupled with increased private sector investment, will further accelerate the adoption of additive manufacturing.

As businesses, educational institutions, and policymakers work together to address current challenges, the 3D printing sector will continue to thrive, contributing significantly to India’s industrial growth, job creation, and technological innovation. The next decade promises exciting developments in additive manufacturing, solidifying India’s position as a global leader in 3D printing technology.

In conclusion, while challenges remain, the opportunities in the Indian 3D printing industry far outweigh the obstacles. With strategic investments, skill development initiatives, and supportive government policies, 3D printing will play a pivotal role in India’s transition towards a more innovative, sustainable, and competitive manufacturing ecosystem.

The post The 3D Printing Industry in India: Growth, Opportunities, and Challenges appeared first on ELE Times.

Automated test solutions provider Teradyne Inc of North Reading, MA, USA has entered into a definitive agreement to acquire privately held Quantifi Photonics Ltd of Auckland, New Zealand, which provides test solutions for scalable and cost-effective high-volume manufacturing of photonic integrated circuits (PICs), co-packaged optics and pluggable optics. The acquisition is expected to close in second-quarter 2025, subject to customary closing conditions and regulatory approval...

The integration of drone technology into agriculture has revolutionized farming practices in India, offering precision, efficiency, and sustainability. Agricultural drones assist in tasks such as crop monitoring, spraying, and mapping, enabling farmers to optimize resources and enhance yields. Several Indian companies have emerged as leaders in this domain, providing innovative drone solutions tailored to the unique challenges of Indian agriculture. Here are the top 10 agricultural drone manufacturers in India:

1. ideaForge

Founded in 2007, ideaForge is a pioneer in the Indian UAV industry, known for its rugged and reliable drones. Their drones are equipped with advanced sensors and imaging capabilities, facilitating tasks like crop health monitoring and field mapping. The company’s emphasis on indigenous design and manufacturing ensures that their drones are well-suited for Indian agricultural conditions.

2. Asteria Aerospace

Asteria Aerospace specializes in end-to-end drone solutions for various sectors, including agriculture. Their drones offer high-resolution aerial imagery and data analytics, aiding farmers in precision agriculture practices. By providing insights into crop health, soil conditions, and irrigation needs, Asteria’s drones enable informed decision-making.

3. Garuda Aerospace

Garuda Aerospace focuses on creating low-cost, efficient drone solutions for agricultural applications. Their drones are used for pesticide spraying, crop monitoring, and soil analysis. By automating these processes, Garuda Aerospace helps reduce labour costs and increase operational efficiency for farmers.

4. Skylark Drones

Skylark Drones offers comprehensive drone-based solutions for agriculture, including surveying, mapping, and analytics. Their platforms provide actionable insights into crop health and field variability, enabling precision farming. By leveraging their technology, farmers can optimize input usage and improve crop yields.

5. Johnnette Technologies

Johnnette Technologies designs and manufactures drones specifically for agricultural applications. Their UAVs assist in crop health monitoring, precision spraying, and aerial seeding. The company’s focus on innovation ensures that their drones are equipped with the latest technology to meet the evolving needs of farmers.

6. Dhaksha Unmanned Systems

Dhaksha Unmanned Systems provides drones tailored for agricultural spraying and monitoring. Their solutions help reduce the manual effort involved in pesticide application and ensure uniform spraying, leading to better pest and disease control.

7. General Aeronautics

General Aeronautics offers drone solutions for precision agriculture, including crop health monitoring and targeted spraying. Their drones are designed to operate in diverse agricultural landscapes, providing farmers with accurate data to make informed decisions.

8. Thanos Technologies

Thanos Technologies specializes in developing drones for agricultural applications such as crop monitoring and spraying. Their UAVs are equipped with advanced sensors that help assess crop health and optimize input usage, thereby enhancing productivity.

9. Rucha Yantra

Rucha Yantra’s AGROJET-16 is an agricultural drone designed for spraying applications. The drone aims to improve the efficiency and effectiveness of pesticide application, reducing the reliance on manual labor and ensuring precise coverage.

10. Paras Aerospace

Paras Aerospace provides drone solutions for agriculture, focusing on crop health analysis and precision spraying. Their drones are designed to assist farmers in monitoring large fields and applying inputs accurately, leading to better resource management.

Impact of Agricultural Drones on Indian Farming

The adoption of drones in Indian agriculture has led to significant improvements in various aspects:

• Precision Agriculture: Drones enable precise monitoring of crop health, soil conditions, and irrigation needs. This precision allows farmers to apply fertilizers and pesticides only where necessary, reducing costs and environmental impact.
• Resource Optimization: By providing detailed aerial imagery and data analytics, drones help in the efficient use of resources such as water, seeds, and agrochemicals. This optimization leads to increased productivity and sustainability.
• Labour Efficiency: Drones automate labour-intensive tasks like spraying and monitoring, addressing labour shortages and reducing the physical strain on farmers.
• Data-Driven Decisions: The data collected by drones empowers farmers to make informed decisions regarding crop management, leading to better yields and profitability.

Challenges and the Road Ahead

While the benefits are substantial, several challenges hinder the widespread adoption of drones in Indian agriculture:

• Cost: The initial investment in drone technology can be prohibitive for small-scale farmers.
• Regulatory Hurdles: Navigating the regulatory landscape for drone operations requires awareness and compliance, which can be daunting for individual farmers.
• Technical Expertise: Operating and maintaining drones necessitates technical skills that many farmers may lack.

To overcome these challenges, collaborative efforts between the government, private sector, and educational institutions are essential. Subsidies, training programs, and awareness campaigns can play a pivotal role in making drone technology accessible to all farmers.

Conclusion

The integration of drones into Indian agriculture signifies a transformative shift towards modernization and efficiency. Companies like ideaForge, Asteria Aerospace, and Garuda Aerospace are at the forefront of this revolution, developing innovative solutions that cater to the unique needs of Indian farmers. As technology becomes more accessible and affordable, the widespread adoption of agricultural drones is poised to enhance productivity, sustainability, and profitability in India’s farming sector.

The post Top 10 Agriculture Drone Manufacturers in India appeared first on ELE Times.

While DRAM designers strive for incremental improvements in performance, power, bit density, and capacity with each successive node, AI-driven data centers are putting a lot of pressure on memory makers to make further advances in power efficiency. Gary Hilson provides a sneak peek of how Micron—one of the three big DRAM producers—is reducing power consumption by employing high-K metal gate CMOS technology paired with design optimizations.

Read the full story at EDN’s sister publication, EE Times.

Related Content

• LPDDR5 DRAM ready for Level 5 autonomy
• DRAM: the field for material and process innovation
• Emerging Memories May Never Go Beyond Niche Applications
• DRAM for energy- and area-efficient analog in-memory computing
• DRAM basics and its quest for thermal stability by optimizing peripheral transistors

The post How to tackle DRAM’s power conundrum appeared first on EDN.

Міжнародні акредитації освітніх програм КПІ ім. Ігоря Сікорського 01/2025 kpi ср, 03/12/2025 - 11:28

Проректор Сергій Стіренко про результати науково-інноваційної діяльності університету в 2024 році та перспективи розвитку на рік 2025 kpi ср, 03/12/2025 - 06:00

submitted by /u/MECACELL [link] [comments]

CAT cables are the best way to get good circuit building wire :) submitted by /u/_xgg [link] [comments]

submitted by /u/picky-trash-panda [link] [comments]

submitted by /u/4b686f61 [link] [comments]

Editor’s Note: This DI is a two-part series.

Part 1 shows how to make an oscillator with a pitch that is proportional to a control voltage.

Part 2 shows how to modify the circuit for use with higher supply voltages, implement it using discrete parts, and modify it to closely approximate a sine wave.

In Part 1, we saw how to make an oscillator whose pitch, as opposed to frequency, can be made proportional to a control voltage. In this second part, we’ll look at some alternative ways of arranging things for other possible applications.

Wow the engineering world with your unique design: Design Ideas Submission Guide

To start with, Figure 1 shows a revised version of the basic circuit, built with B-series CMOS to allow rail voltages of up to 18 or 20 V rather than the nominal 5 V of the original.

Figure 1 A variant on Part 1’s Figure 2, allowing operation with a supply of up to 20 V.

Apart from U2’s change from a 74HC74 to a CD/HEF4013B, the main difference is in U1. With a 12 V rail, TL062/072/082s and even LM358s and MC1458s all worked well, as did an LM393 comparator with an output pull-up resistor. The control voltage’s span increases with supply voltage, but remains at ~±20% of Vs. Note that because we’re only sensing within that central portion, the restricted input ranges of those devices was not a problem.

Something that was a problem, even with the original 5-V MCP6002, was a frequent inability to begin oscillating. Unlike the 74HC74, a 4013 has active-high R and S inputs, so U1a’s polarity must be flipped. It tends to start up with its output high, which effectively locks U2a into an all-1s condition, forcing Q1 permanently on. That explains the need for R5/C5/Q2. If (when!) the sticky condition occurs, Q2 will turn on, shorting C2 so that Q1 can turn off and oscillation commence. A reverse diode across R5 proved unnecessary at the low frequencies involved.

This could also be built using the extra constant-current sink, shown in Part 1’s Figure 4, but then U1 would need to have rail-to-rail inputs.

A version that lacks any logic

This is an extension of the first version that I tried, which was built without logic ICs. It’s neat and works, but U1a could only output pulses, which needed stretching to be useful. (Using a flip-flop guaranteed the duty cycle, while the spare section, used as a monostable, generated much better-defined reset pulses.) The circuit shown in Figure 2 works around this and can be built for pretty much any rail voltage you choose, as long as U1 and the MOSFETS are chosen appropriately.

Figure 2 This all-discrete version (apart from the op-amps) uses a second section to produce an output having a duty cycle close to 50%.

U1b’s circuitry is a duplicate of U1a’s but with half the time-constant. It’s reset in the same way and its control voltage is the same, so its output pulses have half the width of a full cycle, giving a square wave (or nearly so). Ideally, Q1 and Q3 should be matched, with C3 exactly half of C1 rather than the practical 47n shown. R7 is only necessary if the rail voltage exceeds the gate-source limits for Q1/3. (ZVP3306As are rated at 20 V max.)

Purity comes from overclocking a twisted ring

The final variation—see Figure 3—goes back to using logic and has a reasonably sinusoidal output, should you need that.

Figure 3 Here the oscillator runs 16 times faster than the output frequency. Dividing the pulse rate down using a twisted-ring counter with resistors on its 8 outputs gives a stepped approximation to a sine wave.

The oscillator itself runs at 16 times the output frequency. The pulse-generating monostable multivibrator (MSMV) now uses a pair of cross-coupled gates, and not only feeds Q1 but also clocks an 8-bit shift register (implemented here as two 4-bit ones), whose final output is inverted and fed back to its D input. That’s known as a twisted-ring or Johnson counter and is a sort of digital Möbius band. As the signal is shifted past each Q output, it has 8 high bits followed by 8 low ones, repeated indefinitely. U2c not only performs the inversion but also delivers a brief, solid high to U3a’s D input at start-up to initialize the register.

U2 and U3 are shown as high-voltage CMOS parts to allow for operation at much more than 5 V. Again, U1 would then need changing, perhaps to a rail-to-rail input (RRI) part if the extra current source is added. 74HC132s and 74HC4015s (or ’HC164s) work fine at ~5 V.

The Q outputs feed a common point through resistors selected to give an output which, though stepped, is close to a sine wave, as Figure 4 should make clear. R4 sets the output level and C4 provides some filtering. (Different sets of resistors can give different tone colors. For example, if they are all equal, the output (if stepped) will be a good triangle wave.)

Figure 4 Waveforms illustrating the operation of Figure 3’s circuit when it’s delivering ~500 Hz.

The steps correspond to the 15th and 17th harmonics, which, though somewhat filtered by C4/R4, are still at ~-45 dB. To reduce them, add a simple two-pole Sallen–Key filter, like that in Figure 5, which also shows the filtered spectrum for an output of around 500 Hz.

Figure 5 A suitable output filter for adding to Figure 3, and the resulting spectrum.

The 2nd and 3rd harmonics are still at around -60 dB, but the others are now well below -70 dB, so we can claim around -57 dB or 0.16% THD, which will be worse at 250 Hz and better at 2 kHz. This approach won’t work too well if you want the full 4–5-octave span (extra current sink) unless the filter is made tunable: perhaps a couple of resistive opto-isolators combined with R14/15, driven by another voltage-controlled current source?

All that is interesting, but rather pointless. After all, the main purpose of this design idea was to make useful audible tones, not precision sine waves, which sound boring anyway. But a secondary purpose should be to push things as far as possible, while having fun experimenting!

A musical coda

Given a pitch-linear tone source, it seemed silly not to try make some kind of musical thingy using a tappable linear resistance. A couple of feet, or about 10kΩ’s-worth, of Teledeltos chart paper (which I always knew would come in handy, as the saying goes) wrapped round a length of plastic pipe with a smooth, shiny croc clip for the tap or slider (plus a 330k pull-down) worked quite well, allowing tunes to be picked out as on a Stylophone or an air guitar. Electro-punk lives! Though it’s not so much “Eat your heart out, Jimi Hendrix” as “Get those earplugs in”.

—Nick Cornford built his first crystal set at 10, and since then has designed professional audio equipment, many datacomm products, and technical security kit. He has at last retired. Mostly. Sort of.

Related Content

• A pitch-linear VCO, part 1: Getting it going
• VCO using the TL431 reference
• Ultra-low distortion oscillator, part 1: how not to do it.
• How to control your impulses—part 1
• Squashed triangles: sines, but with teeth?
• Simple 5-component oscillator works below 0.8V
• A two transistor sine wave oscillator

The post A pitch-linear VCO, part 2: taking it further appeared first on EDN.

Bomber jets play a crucial role in modern warfare, offering strategic deterrence, precision strike capabilities, and unparalleled aerial dominance. With advancements in stealth technology, electronic warfare, and long-range missile systems, the world’s leading air forces operate some of the most advanced bomber aircraft ever built. This article highlights the top 10 bomber jets based on speed, payload capacity, stealth, and combat effectiveness.

1. Northrop Grumman B-21 Raider (USA)

Overview:

The B-21 Raider is the newest strategic stealth bomber under development for the U.S. Air Force. Designed to replace the B-2 Spirit, it is expected to be the backbone of America’s bomber fleet.

Key Features:

• Stealth Technology: Advanced radar-evading capabilities
• Payload Capacity: Estimated 15,000-20,000 kg
• Range: Over 9,000 km
• Multi-role Capabilities: Can carry nuclear and conventional weapons
• AI and Network-Centric Warfare Integration

2. Northrop Grumman B-2 Spirit (USA)

Overview:

The B-2 Spirit is the world’s first operational stealth bomber, designed for deep penetration missions in heavily defended airspace.

Key Features:

• Radar Absorbent Materials: Minimizes radar cross-section
• Payload Capacity: 23,000 kg
• Range: 11,000 km without refueling
• Precision Strike Capability: Advanced targeting systems

3. Tupolev Tu-160M (Russia)

Overview:

Known as the “White Swan,” the Tu-160M is the fastest and heaviest supersonic bomber in the world. The modernized Tu-160M variant features new avionics and weapons systems.

Key Features:

• Speed: Mach 2.05
• Payload Capacity: 40,000 kg
• Range: 12,300 km
• Modernization: Equipped with new digital avionics and hypersonic missile capabilities

4. Rockwell B-1B Lancer (USA)

Overview:

The B-1B Lancer is a variable-sweep wing bomber designed for supersonic speeds and low-altitude penetration.

Key Features:

• Speed: Mach 1.25
• Payload Capacity: 34,000 kg
• Range: 9,400 km
• Electronic Warfare Suite: Advanced countermeasures for survival in contested airspace

5. Xian H-20 (China)

Overview:

China’s upcoming H-20 stealth bomber aims to rival the B-2 Spirit, with cutting-edge stealth technology and long-range capabilities.

Key Features:

• Stealth Design: Similar to B-2 and B-21
• Range: Estimated 8,500 km
• Payload Capacity: Expected 20,000-25,000 kg
• Strategic Nuclear and Conventional Strike Capabilities

6. Tupolev Tu-95MS (Russia)

Overview:

Nicknamed the “Bear,” the Tu-95MS is a long-range, turboprop-powered strategic bomber known for its efficiency and extended operational life.

Key Features:

• Speed: 925 km/h (Mach 0.8)
• Range: 15,000 km with aerial refueling
• Payload Capacity: 15,000 kg
• Nuclear Cruise Missile Delivery Platform

7. Sukhoi Su-34 Fullback (Russia)

Overview:

The Su-34 is a tactical bomber with significant air-to-ground strike capabilities, often referred to as a “fighter-bomber.”

Key Features:

• Speed: Mach 1.8
• Payload Capacity: 12,000 kg
• Range: 4,500 km
• Maneuverability: Fighter-like agility with bomber-level strike power

8. Boeing B-52H Stratofortress (USA)

Overview:

The legendary B-52H remains in service for over 70 years, known for its endurance and heavy payload capacity.

Key Features:

• Speed: Mach 0.85
• Range: 14,000 km without refueling
• Payload Capacity: 31,500 kg
• Versatility: Capable of carrying nuclear and conventional weapons

9. Dassault Mirage 2000D (France)

Overview:

A French multirole fighter-bomber, the Mirage 2000D specializes in precision strike missions.

Key Features:

• Speed: Mach 2.2
• Payload Capacity: 9,000 kg
• Range: 3,300 km
• Advanced Targeting Systems: Precision-guided munitions capabilities

10. Shenyang JH-7 Flying Leopard (China)

Overview:

A Chinese fighter-bomber designed for ground attack and anti-ship missions.

Key Features:

• Speed: Mach 1.75
• Payload Capacity: 9,000 kg
• Range: 3,900 km
• Naval Strike Capability: Equipped with anti-ship missiles

Conclusion

The evolution of bomber jets reflects the technological advancements in stealth, speed, payload capacity, and mission versatility. The upcoming B-21 Raider, China’s H-20, and modernized versions of legacy bombers continue to push the boundaries of aerial warfare. As nations invest in next-generation air combat capabilities, these bomber jets remain the backbone of strategic deterrence and global power projection.

The post Top 10 Bomber Jets in the World: The Ultimate Aerial Dominators appeared first on ELE Times.

With the increasing integration of electronics in critical applications such as automotive, healthcare, industrial automation, and consumer devices, security concerns have become paramount. “Security by Design” is a proactive approach that ensures cybersecurity is embedded into electronic systems from the conceptual stage rather than being patched later. This article explores the latest industry trends, best practices, and challenges in implementing Security by Design in electronics.

Why Security by Design Matters

Traditional security models often rely on reactive measures, addressing vulnerabilities only after they are exploited. This approach is no longer sufficient as cyber threats become more sophisticated and widespread. Security by Design ensures that electronic systems are built with security features ingrained, reducing risks and enhancing resilience.

• Reduced Attack Surface: By incorporating security measures from the design phase, the potential vulnerabilities are minimized, making it harder for attackers to exploit weaknesses in hardware and software.
• Regulatory Compliance: Various industries are enforcing strict cybersecurity regulations, including ISO/SAE 21434 for automotive cybersecurity and IEC 62443 for industrial control systems, necessitating security integration at every development stage.
• Cost Efficiency: Fixing security flaws after deployment is significantly more expensive than incorporating security at the design level. Security by Design minimizes costly recalls, patching, and reputation damage.
• Enhanced Trust and Reliability: As users become more security-conscious, products that incorporate robust cybersecurity measures build higher trust and long-term adoption.

Key Principles of Security by Design

1. Hardware Root of Trust (RoT)

A secure foundation starts with hardware. Modern electronic devices incorporate Root of Trust (RoT) mechanisms to provide immutable trust anchors. These security elements ensure that the device only executes authenticated firmware and software components.

• Secure Boot: This process ensures that only digitally signed and verified firmware is executed, preventing boot-level malware injections. Secure Boot is implemented using cryptographic techniques such as RSA-2048 or ECC-based signing.
• Trusted Platform Module (TPM): TPM chips provide a secure vault for cryptographic keys, ensuring that sensitive credentials, digital certificates, and passwords are protected against tampering or extraction.
• Physical Unclonable Functions (PUF): PUF technology leverages the inherent variations in silicon manufacturing to generate unique, unclonable cryptographic identities for devices, making hardware-level authentication robust.

2. Secure Firmware Development

Firmware is the bridge between hardware and software, making it a prime target for attackers. Implementing security best practices in firmware development mitigates risks.

• Secure Coding Standards: Adopting standards such as MISRA C (automotive) and CERT C (embedded systems) reduces common vulnerabilities like buffer overflows and memory corruption.
• Firmware Signing and Authentication: Digitally signed firmware ensures that unauthorized modifications or tampered firmware are rejected by the device, maintaining integrity.
• Over-the-Air (OTA) Secure Updates: Secure update mechanisms use cryptographic verification (e.g., ECDSA signatures) to prevent rollback attacks and unauthorized firmware injections.

3. Zero Trust Architecture (ZTA)

Zero Trust is a cybersecurity model that assumes no implicit trust within a system and requires continuous verification.

• Continuous Authentication: Devices and users must authenticate at every stage, employing multi-factor authentication (MFA) and cryptographic validation.
• Micro-Segmentation: Network segmentation isolates sensitive components from untrusted environments, limiting the potential spread of malware and unauthorized access.
• Real-Time Anomaly Detection: AI-powered security analytics continuously monitor system behavior to detect deviations from normal operation, triggering alerts for potential breaches.

4. End-to-End Encryption

Data security is crucial in modern electronics, especially for IoT and cloud-connected devices. Encryption ensures confidentiality and integrity in data transmission and storage.

• TLS 1.3 for Secure Communication: This cryptographic protocol eliminates weak encryption algorithms, enforcing strong cipher suites for protecting data-in-transit.
• AES-256 Encryption for Data-at-Rest: Sensitive device information is protected using hardware-based encryption modules to mitigate unauthorized data extraction.
• Quantum-Safe Cryptography: With quantum computing on the horizon, post-quantum cryptographic algorithms like CRYSTALS-Kyber and CRYSTALS-Dilithium are being integrated into security frameworks to future-proof devices.

5. Supply Chain Security

A secure product is only as strong as its weakest component. Supply chain attacks have increased, necessitating rigorous vetting of components and firmware sources.

• Supplier Security Audits: Regular assessment of component suppliers ensures that they adhere to security best practices.
• Secure Hardware Provenance: Implementing blockchain-based tracking of hardware components provides verifiable authenticity and prevents counterfeiting.
• Regular Risk Assessments: Threat modeling of supply chain processes ensures early detection of vulnerabilities and risk mitigation strategies.

Industry Trends in Security by Design

1. Automotive Security

The rise of software-defined vehicles (SDVs) and autonomous driving has made automotive security a top priority. OEMs are adopting standards like ISO/SAE 21434 and UNECE WP.29 to enforce cybersecurity in connected vehicles.

• Intrusion Detection and Prevention Systems (IDPS): These systems actively monitor in-vehicle networks for anomalous activities and unauthorized access attempts.
• Secure CAN Bus Communication: Implementing MACsec encryption protects automotive communication from malicious interference and spoofing.
• AI-Powered Anomaly Detection: Machine learning algorithms analyze driving patterns and vehicle behaviors to detect cybersecurity threats.

2. Industrial IoT (IIoT) Security

Industry 4.0 has led to an increased attack surface for industrial control systems, necessitating strong security measures.

• Secure OT-IT Convergence: Segregating operational technology (OT) from traditional IT networks prevents industrial cyber-espionage and ransomware attacks.
• Firmware Integrity Attestation: Hardware-level security checks validate firmware integrity before execution to prevent tampering.
• AI-Driven Predictive Threat Analytics: AI models analyze historical attack data to predict and prevent cyber threats before they occur.

3. Chip-Level Security Advancements

Semiconductor companies are embedding advanced security features into SoCs and microcontrollers to enhance device security.

• Arm TrustZone & RISC-V PMP: These security architectures enable hardware isolation for secure execution environments.
• Intel SGX & AMD SEV: Secure enclave technologies protect sensitive computations from OS-level threats.
• Post-Quantum Cryptographic Accelerators: Hardware-integrated PQC support ensures future resilience against quantum computing threats.

Challenges in Implementing Security by Design

• Balancing Security and Performance: Stronger security measures often introduce computational overhead. Leveraging cryptographic hardware accelerators helps maintain efficiency.
• Cost Constraints: Security implementations can increase development costs. However, long-term savings from preventing security breaches outweigh initial expenses.
• Evolving Threat Landscape: Cyber threats constantly evolve, requiring continuous security updates and patching. AI-driven security analytics improve proactive threat detection.
• Compliance and Regulatory Challenges: Adhering to global security standards requires robust security frameworks, structured security testing, and lifecycle management strategies.

Future of Security by Design in Electronics

1. AI-Driven Security

AI is transforming cybersecurity by enabling real-time anomaly detection and automated threat mitigation.

• Adaptive Authentication: AI models analyze user behavior to detect suspicious access attempts.
• Behavioral Anomaly Detection: ML algorithms detect deviations from normal device operations to identify cyber threats.
• Automated Security Patch Deployment: AI-driven updates help close vulnerabilities without manual intervention.

2. Blockchain for IoT Security

Blockchain enhances trust and traceability in device security frameworks.

• Decentralized Identity Management: Prevents unauthorized device authentication.
• Secure Firmware Provenance Tracking: Ensures software authenticity and tamper-proof updates.
• Tamper-Proof Transaction Logs: Protects against log manipulation and fraud.

Conclusion

Security by Design is no longer optional—it is imperative for safeguarding electronic systems in an era of increasing cyber threats. As cyberattacks grow in complexity, integrating security from the outset ensures resilience, regulatory compliance, and trustworthiness. Future trends like AI-driven security, quantum-resistant cryptography, and blockchain-based trust mechanisms will further strengthen the security landscape, making it crucial for industries to adopt proactive cybersecurity strategies today.

The post Security by Design in Electronics: A Proactive Approach to Cybersecurity appeared first on ELE Times.