Новини світу мікро- та наноелектроніки

The logic probe is powered from the device under test (DUT)—it may be any binary logic, which can be powered in the range +2 V to +6 V. This may be a microcontroller or 74/54 series logic chips, including HC/HCT chips.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The probe determines 3 conditions: 

• Logical 0
• Logical 1
• Undefined (this may be a Z-condition, or bad contact).

It also features a counter, which is very handy when you want to count impulses, to estimate the value of frequency or to test an interface. (This part is shown as a sketch.)

The probe in Figure 1 consists of two Schmitt triggers, the upper trigger on the figure determines the logical 0, and the lower trigger determines the logical 1.

Figure 1 The logic probe with two Schmitt triggers where the upper determines logical 0 and the lower determines logical 1.

Two different colors were selected: 

• Blue for logical 0
• Red for logical 1

Since the blue LED demands more than 2 V, a slightly modified “joule-thief” circuit on Q2 is used to increase the voltage. The transformer has 2 windings with an inductance ranging from 80 to 200 µH, if the windings are not equal, the greater one should be connected to the collector. (The author used a tiny transformer from an old ferrite memory, but any coil with an added winding over it can do.)

If you choose a green or red LED instead of blue, the “joule-thief” circuit can be eliminated, and the LED connected between the upper terminal of R5 and “+A”.

Due to the wide supply voltage range, the current through the LEDs can increase 100% or more. Since the LEDs are quite bright, some control of brightness is desirable. It’s performed by the circuit’s U3, Q3, and two diodes, which can decrease the LEDs supply by 1.4 V.

Note, the 74HC14 can be used instead of the 74HC132 almost everywhere in the circuit.

—Peter Demchenko studied math at the University of Vilnius and has worked in software development.

Related Content

• Whatever Happened to Logic Probes?
• Logic probe uses two comparators
• Logic probe uses six transistors
• Using an inductor to improve an existing design
• An LED display adapted for DIY projects

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Infineon Technologies and ASE Technology Holding Co., Ltd. have announced that definitive agreements were signed under which Infineon will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE, a leading provider of independent semiconductor manufacturing services in assembly and test. The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments.

Infineon’s manufacturing strategy, with a balanced operations footprint combining in-house and external manufacturing, is an important pillar of the company’s profitable growth path. By pooling manufacturing volumes in Cavite and Cheonan under a new owner and offering highest-quality manufacturing services to the overall industry, Infineon and ASE will be able to leverage mutual synergy potentials, thus generating attractive growth potentials for both companies.

“We have excellent, highly competent teams and a great track record of highest quality standards at both sites, Cavite and Cheonan,” said Alexander Gorski, EVP and Head of Backend Operations at Infineon. “ASE has been a trusted, strategic partner of Infineon for many years and will be an excellent new owner that will continue on this successful path and strengthen both fabs even further. The sale of our sites to ASE is in line with Infineon’s manufacturing strategy, provides mutual synergies and enables further growth while strengthening supply chain resilience”.

“Both the automotive and power management market segments are strategic focus areas for ASE,“ said Dr. Tien Wu, Chief Operating Officer of ASE. “This acquisition of Infineon’s facilities in Cavite and Cheonan marks ASE’s strong commitment to form a strategic long-term partnership with Infineon in developing backend manufacturing solutions matching future growth opportunities. Given Infineon’s market leadership in automotive and power semiconductors and ASE’s leading position in backend semiconductor manufacturing, this partnership creates a win-win solution for the entire ecosystem from product companies to the end consumer.”

Infineon Technologies Power Semitech is a backend manufacturing site with around 300 employees. The fab is located in Cheonan, South Korea, about 60 miles south of Seoul. Infineon Technologies Cavite, is a backend manufacturing site with more than 900 employees. It is located in one of the fastest growing and most industrialized provinces in the Philippines.

The transaction is expected to close towards the end of the second calendar quarter of 2024 when all pending closing conditions will have been fulfilled.

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For its fiscal third-quarter 2024 (to end-December 2023), Transphorm Inc of Goleta, near Santa Barbara, CA, USA — which designs and manufactures JEDEC- and AEC-Q101-qualified gallium nitride (GaN) field-effect transistors (FETs) for high-voltage power conversion — has reported revenue of $4. 67m, up 3.9% on $4.49m a year ago but down 6.8% on $5m last quarter...

ADC cards by Spectrum Instrumentation help to reveal the secrets of how lightning forms

The causes of a lightning flash are complex and still unclear. At Duke University, North Carolina, USA, the team of Prof. Cummer tries to resolve these secrets. Lightning often occurs entirely in opaque clouds which makes it impossible to see what is going on. However, a flash also produces radio waves in the UHF and VHF frequency range that can be captured and studied. The challenge is that a huge amount of data needs to be processed and recorded in the seconds before and during the lighting event. The scientists chose ADC cards by Spectrum Instrumentation to manage this challenge. The objective of the research is to understand how lightning forms, using this knowledge to better protect buildings from damage and also to understand if climate change will result in more or fewer lightning storms.

Two M4i.4451-x8 digitizers syncronized for lightning research

Steven A. Cummer, Professor of Electrical and Computer Engineering at the Duke University explains, “A few years ago, there was nothing that could capture and process the huge volume of data involved. During an active thunderstorm, we often need to be able to record over one TeraByte per hour. We selected the Spectrum M4i.4451-x8 digitizer card with four channels, and we use two of them in the recording equipment. They are connected via Spectrum’s Star-Hub to enable us to record simultaneously from eight antennas. Star-Hub ensures that everything is perfectly in sync which is vital as we are using the antennas to form an interferometer. From small time differences between the signals at different antennas, we are able to work out the location of each lightning event which can be up to 50 kilometres away. The cards have a sampling rate of 500 MegaSamples per second on each channel to gather the amount of data we need, and the 14-bit resolution ensures we capture all the small signals.”

The important second before the lightning event

Prof. Cummer in front of one of the eight antennas in the setup

The research of Prof. Cummer is partly focussed on the moments just before and just after the lighting starts. The structure of lightning once formed is understood – it is a conducting channel of hot ionised gas that can be hundreds of meters long. “A challenge is that we are trying to capture data before the lightning begins. This pre-event data is virtually impossible to obtain if you rely on optical data capture of the flash as there is no easy way to gather this from back in time”, he explained. “But now, with the Spectrum-based setup, we are able to get pre-lightning data. The cards constantly record data and then overwriting if it is not needed. The lightning event is the trigger to not only record data for the next second but also keep the previous fraction of a second before the event, as that is always in the card’s memory but just not stored unless triggered. With 2 GigaSamples of memory per card, there is more than enough storage to capture all the several hundred MegaSamples of signals per second we need, which is then written to an SDD. That done, the system quickly resets to record the next lightning event’s data. This is vital to capture data from a storm where lightning can occur every few seconds for several hours.”

Regarding the software of the 8-channel system, Prof. Cummer commented that he uses Spectrum’s measurement software SBench 6 to control and program the cards. “This was so easy and versatile to use that no time in this project was needed to create special software programs from scratch”, he reports.

Lightning Gamma Radiation

Another mystery that Prof. Cummer and his team are investigating is why some lightning events generate high-energy gamma radiation and others do not. The fact that this happens was discovered around 30 years ago. Gamma ray detectors on satellites picked up signals from Earth while scientists expected they should only come from deep space. The gamma rays in a thunderstorm are generated right at the beginning of a flash, so the pre-event data gathered on this project will enable physicists to understand this kind of gamma ray production.

An example of lightning analysis

The 8-channel system with its antennas could be moved around, but up to now it was operated in a fixed location at the Duke University in Durham. On April 12, 2019 at 21:24:40 UTC, the lightning flash analysed here was recorded. It is noteworthy that this entire flash took place inside a storm cloud, so only a diffusely illuminated cloud could be seen. But, with VHF radio measurements, the entire structure was captured which is shown in the diagram. With azimuth and elevation, every position in the sky is clearly defined. The timing sequence of this lightning can be seen in the linked 48 sec video that shows in slow motion the 1 second duration lightning flash. Each dot in the movie is a different detected and located radio source from the lightning flash. When all shown together, these dots make a very clear movie of the space and time structure of the lightning event.

The post Lightning research with 8-channel digitizer system appeared first on ELE Times.

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Built on Trench IGBT Technology, Half-Bridge Devices Offer Choice of Low VCE(ON) or Low Eoff for High-Current Inverter Stages

Vishay Intertechnology, Inc. has introduced five new half-bridge IGBT power modules in the newly redesigned INT-A-PAK package. Built on Vishay’s Trench IGBT technology, the VS-GT100TS065S, VS-GT150TS065S, VS-GT200TS065S, VS-GT100TS065N, and VS-GT200TS065N offer designers a choice of two best in class technologies — low VCE(ON) or low Eoff — to lower conduction or switching losses in high current inverter stages for transportation, energy, and industrial applications.

The half-bridge devices released today combine Trench IGBTs — which deliver improved power savings versus other devices on the market — with Gen IV FRED Pt anti-parallel diodes with ultra-soft reverse recovery characteristics. Offering a new gate pin orientation, the modules’ compact INT-A-PAK package is now 100 % compatible with the 34 mm industry-standard package to offer a mechanical drop-in replacement.

The industrial-level devices will be used in power supply inverters for railway equipment; energy generation, distribution, and storage systems; welding equipment; motor drives; and robotics. To reduce conduction losses in output stages for TIG welding machines, the VS-GT100TS065S, VS-GT150TS065S, and VS-GT200TS065S offer an industry-low collector to emitter voltage of ≤ 1.07 V at +125 °C and rated current. For high-frequency power applications, the VS-GT100TS065N and VS-GT200TS065N offer extremely low switching losses, with Eoff down to 1.0 mJ at +125 °C and rated current.

The RoHS-compliant modules feature 650 V collector-to-emitter voltages, continuous collector current from 100 A to 200 A, and very low junction-to-case thermal resistance. UL-approved file E78996, the devices can be directly mounted to heatsinks and offer low EMI to reduce snubbing requirements.

Key Specification Table:

Part #	VCES	IC	VCE(ON)	Eoff	Speed	Package
			@ IC and +125 °C
VS-GT100TS065S	650 V	100 A	1.02 V	6.5 mJ	DC to 1 kHz	INT-A-PAK
VS-GT150TS065S	650 V	150 A	1.05 V	10.3 mJ	DC to 1 kHz	INT-A-PAK
VS-GT200TS065S	650 V	200 A	1.07 V	13.7 mJ	DC to 1 kHz	INT-A-PAK
VS-GT100TS065N	650 V	100 A	2.12 V	1.0 mJ	8 kHz to 30 kHz	INT-A-PAK
VS-GT200TS065N	650 V	200 A	2.13 V	3.86 mJ	8 kHz to 30 kHz	INT-A-PAK

The post Vishay Intertechnology IGBT Power Modules in Redesigned INT-A-PAK Package Reduce Conduction and Switching Losses appeared first on ELE Times.

In a world of increasing connectivity and the growing popularity of the Internet of Things, it is important to simplify interoperability across connected devices and to enhance their security and reliability. The Matter standard was created precisely for this purpose. In order to facilitate integration of the Matter standard and security features into smart home and smart building devices, Infineon Technologies now introduces the OPTIGA Trust M MTR. The Matter-certified Secure Element is the latest configuration of Infineon’s OPTIGA Trust M, combined with a Matter provisioning service.

Matter: smooth interoperability of connected devices

According to ABI Research forecasts, the number of smart home devices will double by 2030, reaching about 1.7 billion worldwide. All these devices have to be able to connect securely and reliably with each other and with different smart home ecosystems. That’s where the Matter standard comes into play, facilitating smooth interoperability across connected devices even from different companies. The Matter protocol defines a set of principles that support uniform security and privacy measures for the smart home, since smart homes rely on smart devices to increase not only comfort but also efficiency and security.

“When we designed the Matter protocol in the Connectivity Standards Alliance, we were committed to building strong security,” said Steve Hanna, Distinguished Engineer at Infineon and leader of the standards teams that defined Matter’s security. “That’s why Matter brings new security features to the smart home, some of which were challenging for IoT product designers. Infineon’s OPTIGA Trust M MTR addresses those challenges head-on so that now it can be even easier to build a Matter product.”

OPTIGA Trust M MTR facilitates Matter and security integration

The tamper-resistant security controller can be easily integrated into a system to perform security-related functions and provide a high level of protection for sensitive data and cryptographic operations. As a discrete Secure Element, OPTIGA Trust M MTR can be integrated into any MCU-based design to enhance security and handle multiple product protocols simultaneously. This gives original equipment manufacturers greater flexibility and allows faster time to market.

According to the Matter protocol, every smart home device must have a Device Attestation Certificate (DAC), containing the Product ID (PID) and the Vendor ID (VID), to verify the authenticity and trustworthiness of each device commissioned in the Matter ecosystem. With OPTIGA Trust M MTR, the PID no longer needs to be defined in advance when the reel is ordered or manufactured. Instead, each device receives a personalized DAC injection at a later point right up until the start of device production. This gives device manufacturers more flexibility in creating multiple product variants of smart home devices.

OPTIGA Trust M MTR Secure Elements are pre-provisioned at a Common Criteria-certified Infineon facility. The batch of Secure Elements on a reel is shipped with an associated barcode. The customer claims ownership of these chips on the IoT portal of Infineon partner Kudelski IoT by scanning the barcode. Kudelski IoT is a trusted and established Product Attestation Authority (PAA) approved by the Connectivity Standards Alliance (CSA). Kudelski IoT will enable the download of production DACs corresponding to the vendor and the product. Finally, the personalized DAC is transferred to the OPTIGA Trust M MTR at the factory level (see graphic).

Please note: An Online Media Briefing will be held on 22 February 2024 (3:00 pm CET / 9:00 am EST), in which Distinguished Engineer Steve Hanna will present additional information about the new OPTIGA Trust M MTR.

About Matter: In order to enhance the security and reliability of smart devices, Infineon and more than 600 companies are collaborating in the Connectivity Standards Alliance (CSA) to simplify and harmonize the Internet of Things using technology standards such as Matter. Matter was created to keep devices and information protected and private, yet easy to use. The Matter standard provides guidance to device manufacturers, enabling them to select the appropriate platform security for their devices and corresponding use cases. Matter embeds privacy principles into all interactions between devices and software agents that handle personal data. Ultimately, it creates the foundation for connected things by supporting simplicity, interoperability, reliability and security.

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Rohde & Schwarz and SmartViser have partnered to develop a solution for testing compliance with a new regulation that will require Energy Efficiency Index (EEI) labelling for smartphones and tablets sold in the EU. At the core of the solution is the R&S CMX500, a radio communication tester that supports end-to-end testing of all signalling use cases, combined with SmartViser’s viSer test automation application – available for Android and iOS. Both companies will showcase the solution at the Mobile World Congress 2024.

Rohde & Schwarz, a leading provider of test and measurement solutions, has partnered with SmartViser, a provider of active test automation products, to develop a tailored solution for testing compliance with a new EU Energy Efficiency Index (EEI) label for smartphones and tablets.

The DELEGATED REGULATION (EU) 2023/1669, published in September 2023, mandates EEI labeling for smartphones and tablets sold in the European Union starting from June 20, 2025. Annex II of the regulation specifies the energy efficiency class and EEI requirements, while Annex IV outlines the measurement and calculation methods.

SmartViser has been actively involved in creating solutions to help customers ensure that their products comply with this regulation. The company is currently offering the first pilot application, which features a repeatable and reliable test procedure and can be installed on smartphones and tablets to perform a series of user actions such as calling, browsing and streaming.

To address future test requirements, SmartViser and Rohde & Schwarz have paired up and combined their solutions. The R&S CMX500 wireless communication tester supports the latest wireless technologies, including LTE, 5G NR and WLAN. Its energy efficiency test solution offers seamless power consumption measurements in parallel to RF measurements, protocol tests or application tests.

Alexander Pabst, Vice President of Wireless Communications at Rohde & Schwarz emphasizes the importance of energy-saving initiatives within the wireless communication industry: “We are excited that the R&S CMX500 has been selected to be part of the SmartViser test solution. Energy efficiency is a key issue in wireless communications, and we are confident that this collaborative effort with SmartViser will make it easier for mobile device manufacturers to test their products for compliance with this new regulation.”

Gilles Ricordel, CEO of SmartViser says: “We are excited to announce our collaboration with Rohde & Schwarz. At SmartViser, we believe that strategic collaborations are pivotal to driving technological advancements. By combining our automation experience with industry-leading Rohde & Schwarz technology, we empower our customers to offer market-leading products that ensure the highest standards of energy efficiency.”

Rohde & Schwarz and SmartViser will showcase a live demo of their joint test solution for EEI labeling at the Mobile World Congress 2024 at the Fira Gran Via in Barcelona in hall 5, booth 5A80. SmartViser can be found in hall 5 booth 5B41-4 French Tech Pavilion.

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AI is everywhere, and with the rise of machine learning and the Big Data revolution, it is a transformational field essential for building a smart and connected world.

STMicroelectronics is a prominent player in the semiconductor industry, offering a diverse range of solutions for various applications, including industrial, automotive, consumer and personal electronics. They are highly known for their comprehensive offerings including microcontrollers, sensors, analog chips, and embedded systems, which are integral to the development of AI-enabled devices operating at the edge.

Matteo MARAVITA, Senior Manager, AI Competence Center and Smartphone Competence Center, Asia Pacific Region, STMicroelectronics

Matteo MARAVITA, Senior Manager, AI Competence Center and Smartphone Competence Center, Asia Pacific Region, STMicroelectronics, presented before the media, their latest release – ST Edge AI Suite. The article is an excerpt from the online briefing.

 

 

 

 

In today’s interconnected world, edge AI is becoming increasingly essential for businesses looking to upgrade their products with intelligence and decision-making capabilities. By processing data locally at the edge, companies can reduce latency, improve privacy, and enhance overall efficiency. ST with its extensive portfolio of hardware solutions along with the capabilities of Edge AI Suite, is well positioned to facilitate this transition to a more intelligent edge. Companies can unlock a wide range of possibilities including real-time decision-making, customisable solutions pertaining to industry needs, scalability and future-proofing etc.

ST’s Automotive Edge AI Solutions

ST has partnered with HPE Group to create a virtual sensor that optimizes the operation and maintenance of EV motors. To explain, the AI algorithm works on their latest automotive controller, the Stellar family, which takes external data from sensors and uses it to extrapolate and estimate the internal rotor temp of the motor. On the side, the microcontroller not only runs several AI algorithms (also for predictive maintenance to identify anomalies) but also drives the motor itself.

ST’s Consumer Edge AI Solutions

Using AI algorithms and STM32 microcontroller at the helm of the solution, ST’s innovation has helped businesses experience 15-40% performance improvement for washing machines. To explain, two machine learning algorithms work towards creating a virtual sensor approach and in collecting data from a 6-axis motion sensor to enable drum collision avoidance. Through the algorithm input, the motor is driven using exactly the needed current, and the water and detergent requirement is adjusted, thus saving significant energy and water for a washing cycle. Both algorithms have been developed with NanoEdge AI and run on an STM32G0 MCU together with an ST 6-axis sensor.

ST’s Personal Electronics Edge AI Solutions

The HP engineering team collaborated with ST in developing and training AI models that recognize different user activities based on device and user motion. Different scenarios were addressed, including – the laptop is placed on a table, on the user’s lap, carried inside a bag, and taken out. The team worked on Smart context detection using smart sensor technology to optimize the power monitoring of the laptop by avoiding overheating and battery drain. All solutions for ultra-low power PC activity monitoring are based on ST’s 6-axis IMU MEMS sensors.

Implementation on edge AI- Tackling Software and Hardware Challenges

For developers to create a full-fledged edge AI solution, ST has put in years of R&D efforts to discover and evaluate various bottlenecks on both the hardware and software side of development. This included research on machine learning techniques, development of ML models, and testing the performance, security, and power efficiency of the connected devices with overall integration of the system.

Furthermore, ST Edge AI Suite addresses the needs and requirements of different profiles. It empowers embedded developers, data scientists, and product designers and creators with various aspects of ML model optimization and product redefining.

ST has announced the ST Edge AI Suite, a comprehensive and integrated set of software tools free to use with ST hardware. This offers developers and companies an ecosystem with a broad range of hardware with free software and tools, supported by partnerships with cloud services and AI toolchain providers. The ST Edge AI Suite is set to simplify the development of AI solutions exploiting ST’s range of hardware and related tools for embedded AI optimizations.

The ST Edge AI Suite is compatible with the external ecosystems for AI development, simulation tools like MATLAB, machine learning models trained using deep learning frameworks like TensorFlow Lite, Keras, PyTorch, etc., and a possibility of connection to cloud services like AWS and Azure.

Also, the tool works across multiple ST hardware platforms including STM32 general-purpose MCUs, STM32N6 and STM32 MPUs built for industrial applications, Stellar automotive microcontrollers, etc.

ST’s strategy on AI relies keenly on an innovative, unified optimizer of embedded AI solutions called ST Edge AI Core Technology. Looking at the ST Edge AI Core is a critical component that brings together all the software and tools engineers need at each step of their project. It is the core library with a unified common line interface that the customer could use to evaluate the model and further port it to the specific target device. The software tools can be used with the STM32 microcontroller and the MEMS sensors with the hardware accelerators (MLC or ISPU).

Also, the tools (ST Edge AI & Nano AI Studio) are completely free for unlimited quantities on any STM32.

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In this article, we cover the basic behavior of the MOSFET common-source amplifier with different types of load.

Total overkill, but I had a "raw" LCD sitting around in my parts bin and finally got around to learn how to use it, so I thought a clock and thermometer project was in order. When I started this a week ago, I honestly didn't know much about how LCDs worked, and definitely did NOT know that AC was needed to make a proper circuit. After wiring up a couple of test circuits, I jumped full in. The logic is controlled with the Seeeduino Xios (lower left), and the LCD is driven with the AY0438 driver chip (obviously the big IC you see wired with the ratsnest of yellow wiring. Time/temp is handled by the DS3231 module (next to the Seeeduino, no backup battery yet installed). The other components to the right of the switches is to control a backlight (represented right now with the yellow LED). Simply a 555 timer in monostable mode. Press the blue button and you get about 8 seconds of light. A proper backlight is on order. Slide switches from left to right: temp/time selection, 12/24 hour selection, F/C for the temperature. The momentary switches are to set the time: hold down the white button, and green/red to adjust down/up the time. I coded the Seeduino using C++ in Platform IO. I'm using 2 external libraries: One to read the real-time clock, and the other to drive the AY0438. The latter (https://github.com/supercrab/arduino-seven-segment) was interesting in that you need to define your "template" for your display. Since LCDs come in different flavors, you have to tell it whether yours has decimal points and/or colon. This one does (although my picture doesn't show either). The time setting routing was pretty interesting to code: First, if someone held down the red/green button, I wanted the time to change very quickly, but if they only clicked it once, I wanted the time to change by only 1 minute. The way it worked was to loop through the routine as long as the white button is held down. Then the logic essentially checked if a red or green button was pressed, and if so, was this the 2nd consecutive time through the loop that it was detected. If it was the first time, then only change the time by 1 minute, with a long delay (500ms) after detection, allowing the user time to release the button. If it was not the first time, then the button is determined to be being held down, and there's only a 20ms delay after incrementing/decrementing the time. That way you can quickly change the time when setting. I used all 10 I/Os on the Seeeduino, so if I add anything else, I'll have to think about next steps (perhaps multi-purpose roles for the push buttons depending on what mode it's in). Next step will be to draw this up in some Cad and route a board. I usually make the prototypes at home, but with all the pin connections to the LCD, I'm not sure how feasible that will be until I route it. Also not shown here is the battery supply. Using one 3.7v LIPO with a dedicated charging module (HW-373). Circuit draws ~20ma without the backlight. Probably not the most efficient thing around for what it does, but pretty happy with it. ​ https://preview.redd.it/7smmgz9lozjc1.png?width=1353&format=png&auto=webp&s=14419e7f2a2e4f072df2d46db68bfd699e0828ec submitted by /u/IndividualRites [link] [comments]

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced that its GaNFast power ICs drive Samsung’s 25W ‘Super-Fast Charging’ (SFC) for the new, AI-enhanced Galaxy S24 smartphone...

Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received new follow-on orders totaling $23m from existing customers for FOX wafer-level test & burn-in products to be used for production and engineering qualification needs for wafer-level burn-in and screening of their silicon carbide devices. Customer-requested shipping dates for these orders range from immediate shipment through the end of Aehr’s current fiscal year, which ends on 31 May...

The new hardware-assisted verification and validation system marks a first for the EDA industry.

6G is looking to achieve a broad range of goals in turn, requiring an extensive array of technologies. Like 5G, no single technology will define 6G. The groundwork laid out in the previous generation will serve as a starting point for the new one. As a distinct new generation though, 6G will also break free from previous ones, including 5G, by introducing new concepts. Among them, new spectrum technologies will help the industry achieve complete coverage for 6G.

Tapping into new spectrum

Looking back, every generation of cellular technology looks to leverage new spectrum. 6G won’t be an exception, with the emergence of new use cases and more demand for high-speed data. As a result, 6G needs to deliver much higher data throughputs than 5G, making millimeter-wave (mmWave) bands extremely attractive.

New frequency bands under consideration for 6G include 100 and 300 GHz, often called sub-terahertz (sub-THz) bands. There is also interest in the upper mid-band—the spectrum between 7 and 24 GHz—because of lower propagation loss compared to sub-THz bands, particularly between the 7 and 15 GHz frequencies.

This spectrum presents regulatory challenges though and is used by various entities including governments and satellite service providers. However, some bands could work for mobile communications with the implementation of more advanced spectrum sharing techniques. Figure 1 provides an overview of the frequencies allocated for mobile and wireless access in this spectrum.

Figure 1 An overview of frequency allocation for mobile and fixed wireless access in the upper mid-band. Source: Radio Regulations, International Telecommunication Union, 2020

While these frequencies have been used for a variety of applications outside of cellular, channel sounding is needed to characterize the use of this spectrum in 6G to ensure it provides the benefits for the targeted 6G application.

The 7 to 24 GHz spectrum is key area of focus for RAN Working Group 1 (RAN1) within the Third Generation Partnership Project (3GPP) for the purpose of Release 19, which will be finalized in late 2025 and facilitate the transition from 5G to 6G.

Scaling with ultra-massive MIMO

Over time, wireless standards have continued to evolve to maximize the bandwidth available in various frequency bands. Multiple-input multiple-output (MIMO) and massive MIMO technologies were major enhancements for radio systems with a significant impact for 5G. By combining multiple transmitters and receivers and using constructive and destructive interference to beamform information toward users, MIMO significantly enhanced performance.

6G can improve on this further. MIMO is expected to scale to thousands of antennas to provide greater data rates to users. Data rates are expected to grow from single gigabits per second to hundreds of gigabits per second. Ultra-massive MIMO will also enable hyper-localized coverage in dynamic environments. The target for localization precision in 6G is of 1 centimeter, a significant leap over 5G’s 1 meter.

Interacting with signals for better range and security

Reconfigurable intelligent surfaces (RIS) also represents a significant development for 6G. Currently, this technology is the focus of discussions at the 3GPP and the European Telecommunications Standard Institute (ETSI).

Using high-frequency spectrum is essential to achieve greater data throughputs but this spectrum is prone to interference. RIS technology will play a key role in addressing this challenge helping mmWave and sub-THz signals to overcome the high free space path loss and blockage of high-frequency spectrum.

RISs are flat, two-dimensional structures that consist of three or more layers. The top layer comprises multiple passive elements that reflect and refract incoming signals, enabling data packets to go around large physical obstacles like buildings, as illustrated in Figure 2.

Figure 2 RISs are two-dimensional multi-layer structures where the top layer consists of an array of passive elements that reflect/refract incoming signals, allowing the sub-THz signals used in 6G to successfully go around large objects. These elements can be programmed to control the phase-shift the signal to into a narrow beam directed at a specific location. Source: RIS TECH Alliance, March 2023

Engineers can program the elements in real time to control the phase shift enabling the RIS to reflect signals in a narrow beam to a specific location. With the ability to interact with the source signal, RISs can increase signal strength and reduce interference in dense multi-user environments or multi-cell networks, extending signal range and enhancing security.

Going full duplex

Wireless engineers have tried to enable simultaneous signal transmission and reception for years to drive a step-function increase in capacity for radio channels. Typically, radio systems employ just one antenna to transmit and receive signals, which requires the local transmitter to deactivate during reception or transmit on a different frequency to be able to receive a weak signal from a distant transmitter.

Duplex communication requires either two separate radio channels or splitting up the capacity of a single channel, but this is changing with the advent of in-band full duplex (IBFD) technology, which is currently under investigation in 3GPP Release 18. IBFD uses an array of techniques to avoid self-interference enabling the receiver to maintain a high level of sensitivity while the transmitter operates simultaneously on the same channel.

Introducing AI/ML-driven waveforms

New waveforms are another exciting development for 6G. Despite widespread use in cellular communications, the signal flatness of orthogonal frequency division multiplexing (OFDM) creates challenges with wider bandwidth signals in radio frequency amplifiers. Moreover, the integration of communication and sensing into a single system, known as joint communications and sensing (JCAS), also requires a waveform that can accommodate both types of signals effectively.

Recent developments in AI and machine learning (ML) offer the opportunity to reinvent the physical-layer (PHY) waveform that will be used for 6G. Integrating AI and ML into the physical layer could give rise to adaptive modulation, enhancing the power efficiency of communications systems while increasing security. Figure 3 shows how the physical layer could evolve to include ML for 6G.

Figure 3 The proposed migration to an ML-based physical layer for 6G to enhance both the power efficiency and security of the transmitter and receiver. Source: IEEE Communications Magazine, May 2021.

 Towards complete coverage

6G is poised to reshape the communications landscape pushing cellular technology to make a meaningful societal impact. Today, the 6G standard is in its infancy with the first release expected to be Release 20, but research on various fronts is in full swing. These efforts will drive the standard’s development.

Predicting the demands of future networks and which applications will prevail is a significant challenge, but the key areas the industry needs to focus on for 6G have emerged, new spectrum technologies being one of them. New spectrum bands, ultra-massive MIMO, reconfigurable intelligent surfaces, full duplex communication, and AI/ML-driven waveforms will help 6G deliver complete coverage to users.

Jessy Cavazos is part of Keysight’s Industry Solutions Marketing team.

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The post Making waves: Engineering a spectrum revolution for 6G appeared first on EDN.

The NEPCON JAPAN 2024 Exhibition was successfully held between 24-26 January 2024 at Tokyo Big Sight, Japan. With over 30 glorious years of fostering Japanese & Asian electronics industries, NEPCON JAPAN, consisting of seven shows, specialised in essential areas for electronics manufacturing, R&D, and Packaging Technology and increased its value as an exhibition representing Asia’s leading one-stop venue for all those involved in the electronics industry.

NEPCON JAPAN consists of seven specialised Shows i.e. Internepcon Japan, Electrostate Japan, IC & Packaging Expo, Electronic Components & materials expo, PWB Expo, Fine Process technology Expo, Power Device and Module expo. Other Concurrent Shows organised by RX Japan Ltd during the time are 15thAUTOMOTIVE WORLD, Factory Innovation Week 2023, 2ndSMART LOGISTICS Expo and 9thWEARABLE EXPO.

With over 1688 exhibitors and 77744 visitors, the exhibition was a massive hit that showcased the latest and futuristic technologies in the respective areas.

The expo saw participation from 25 countries, which showcased trends in the domains of IC & Packaging, Electronic Components and materials, Fine Process technology, Power Device and Module Electric Vehicle and Automotive Technologies, Factory Automation, Smart Logistics and Wearables.

Australia, Austria, Canada, China, Finland, France, Germany, Hong Kong, India, Israel, Italy, Japan, Madagascar, Mexico, Netherlands, Norway, Philippines, Poland, Singapore, South Korea, Sweden, Switzerland, Taiwan, United Kingdom and United States participated with large delegations and demonstrated cutting-edge solutions and breakthrough technologies from their respective nations.

The dedicated zones offering insights into how the related industries will adopt technology, sustainability and innovation. These dedicated zones showcased solutions in EV Charging, EV Mobility, IoT based technologies, ADAS, AI Vision, Driver Monitoring System, Super Heat Resistant Glass Ceramic, Design and development of Vehicle, Semiconductor, Sensor, machine Learning, Software defined vehicle, Image recognition System and Testing providing an engaging platform for visitors to experience smart solutions.

The expo has truly been an amazing experience to the visitors. Visitors and exhibitors from overseas returned with a great degree of satisfaction, and the show concluded with a great success. The exhibition was a marvel of state-of-the-art technologies from around the world. Some of the technology display is worth mentioning as below:

EVR Motors, Israel: EVR Motors, developed a unique Trapezoidal Stator topology that disrupts the incremental trajectory of electric motor development. The Trapezoidal Stator: The patented topology allows the company to design radial flux motors that are less than half in size and weight than current advanced RFPM motors – without compromising of power or performance. The air-cooled 17kw Peak Power Motor, which weighs only 9 kg, offers more power per kg and torque per liter than motor performances made public by other manufacturers. EVR offers double the power and torque density.

Responding to the aspiration of many OEMs to reduce or eliminate the reliance on rare earth materials, EVR Motors offers a rare earth-free solution based on ferrite magnets. The solution retains acceptable power and torque density, at a lower cost to manufacturers and the environment.

Contact for more information: Email: noak@evr-motors.com

Foretellix: Foretellix is the leading provider of safety-driven verification and validation solutions for Automated Driving Systems and ADAS.  For Automated Driving Systems and ADAS Foretellix’s hyperscale V&V solutions are trusted worldwide to tame the infinite range of scenarios critical for the development and safe deployment of ADAS and AVs. The Foretify Safety-Driven V&V platform helps Automotive OEMs, Tier-1 suppliers, and AV developers to ensure safety, reduce development costs, and accelerate time-to-market of ADAS and Automated Driving Systems (ADS).

Contact for more information: Email: Nathalie.koskas@foretellix.com

StoreDot: StoreDot is the innovator of proven EV batteries that recharge faster, are safer and more sustainable, running on patented organic nanomaterials fully optimized by AI, and packed into high-energy cells. StoreDot’s current technology supports a charge of 100 miles (or 160 km) per 5 minute of charging, and is working on improved technology that will allow to reduce the charging time for 100 miles, or 160 km, to 3 minutes, within few years. To secure EV battery safety and stability, StoreDot battery architecture features a multi-layered safety-protection structure, it runs on patented bio-inspired nanomaterials designed for longevity, with near-zero carbon.

Optimizing pack-level energy density: Cell-to-pack involves directly connecting individual battery cells to form a larger battery pack; cell-to-chassis involves mounting the cells onto a structural chassis, which also serves as a heat sink dissipating heat generated by the cells during operation, and a support structure for the cells.

The benefit of using these approaches is that they provide the necessary support and protection for the battery cells. In a cell-to-pack system, the cells are tightly packed together and secured within a protective casing, which reduces the risk of damage from vibration, impact, or thermal expansion. StoreDot’s I-BEAM XFC cell-to-pack configuration also simplifies the manufacturing process, minimizes part count and reduces the weight and volume of the battery pack.

D-TEG: D-TEG provides new values for the vehicle CCTV system and cloud-based video telematics.

By applying AI Solution to Edge device, it automatically detects the road surface and surrounding conditions, transmits and analyse the detected data to the service platform, and deliver risk information to customer through the Edge Device.  AI SOLUTION: The company offers development of artificial intelligence solution using image-based object detection AI model.

Creative Synergies Group: The company accelerate electrification through expertise in system integration and controls, power electronics and battery system engineering. It leverage proven track record in NextGen technologies to innovate in autonomous navigation, connectivity and shared mobility. The company empowers very demanding customers to achieve business outcomes through domain expertise from concept to production.

Autocrypt: Secures mobility for the autonomous revolution. AUTOCRYPT is an automotive cybersecurity provider dedicated to the safety of connected, autonomous, and software-defined mobility. AUTOCRYPT secures the rapidly evolving architecture of software-defined vehicles and smart mobility, using custom solutions built for ISO/SAE 21434 and UN R155/156. Backed by decades of industry experience, our solutions can be customized and adapted to any vehicular and infrastructure environment.

Eatron Technologies: Intelligent Software Layer: It Unlocks the full potential of battery with Intelligent Software Layer for Battery Management. Maximum battery performance is achieved with unique algorithms that offer best-in-class accuracy and robustness in battery state estimation and control. It Extends battery lifetime by accurately predicting the remaining useful life of the battery in the real world – right from beginning of its life. It Improves safety and reduces downtime by enabling early detection of cell degradation and safety critical failures.

Auroralabs: Vehicle Software Intelligence: Solving the Challenges of Automotive Software Development with AI. AUTO VALIDATE SYSTEM COMPATIBILITY & SBOM: Validate effects of software updates on interrelated functions, systems and ECUs providing evidence for integration and certification. AUTO DETECT: AI-DRIVEN SW GLITCH CATCHER. Detects faults in software behavior

and predicts downtime events. AUTO UPDATE: ML-DRIVEN OTA UPDATES Over-The-Air Update solution for any and all ECUs using standard protocols without reprogramming, with or without A/B Memory.

Sonatus: SOFTWARE DEFINED COMPONENT SOLUTION delivers vehicles that intelligently adapt. Achieve the full promise of Software-Defined Vehicles with components that can be dynamically tuned for peak performance in any driving condition. Continuously improve performance of vehicle components: Ensure electronically controlled vehicle components are continuously tuned to deliver optimal performance in all driving conditions. Leverage precise real-world data to improve vehicle performance: Collect real-world vehicle and driving data in diverse driving conditions, enabling more efficient and accurate AI/ML analysis in the cloud. Dynamically tune components in real-time Ensure motors, sensors, and actuators operate at peak performance under diverse driving conditions by automatically tuning their Electronic Control Units (ECUs) in real-time.

Software Defined Component: The full promise of Software-Defined Vehicles is realized when all electronic components in vehicles can be continuously updated and improved throughout their lifetimes. The Sonatus Software-Defined Component Solution, consisting of the Sonatus Collector and Automator products, lets OEMs and their suppliers establish a closed-loop process to apply real-world, data-driven analysis and automated updates to tune vehicle ECUs, ensuring maximum component performance under any driving and vehicle conditions.

SRM Tech: Software Integration & Solution Engineering: The company’s Product Engineering Services start from Conceptualization, Development, Prototype, Launch, Manufacture and Distribution. The company has expertise spans product ideation, hardware, firmware and middleware, application development, complemented by testing, validation, verification and product sustenance. Dedicated teams are at work delivering critical solutions for various OEMs & Tier 1 suppliers. Engineers work across a wide range of Software Integration technology segments such as powertrains, body, interiors, infotainment, telematics, electronics, ADAS Systems (Vision-based, RADAR-based & LIDAR-based) and mobility.

Fukuda: Air leak tester for EV: FLZ-0630 series: In EV battery case leak tests, this air leak tester can reduce noise and enable stable measurements for workpieces that are characterized by large volumes and are likely to expand due to pressure. The product features a fitting correction function and a newly developed smoothing function that are used together to reduce both the noise caused by the large size and the noise caused by expansion and deformation. In addition, in order to achieve low pressure control that is difficult to control and increase flow rate for large volumes, a bypass BOX (CBU-600) is included.

Transtouch: The touch panel solution provided on automotive equipment allows users to operate on the CID screen and control various basic functions. It is paired with a high-brightness touch screen that supports multi-touch. Related applications include entertainment systems, satellite positioning systems (GPS), real-time driving prompts, reversing radars, and anti-collision systems, etc., all of which require good functions and user-friendly human-machine interfaces. Touch screens have become a necessary consideration for global car manufacturers to develop new cars.

Magna: Although market trends show a clear shift towards electrified vehicles, the share of conventional powertrain systems will still be globally significant during the next decade. Therefore, Magna continues to work intensively on efficiency improvement of all conventional and mild hybrid drivetrain solutions. Being a long-term premium supplier for the global automotive industry, Magna has broad experience and a unique market position. With this expertise, the innovations contribute to the overall performance of the vehicle with any type of powertrain, always pushing to the next level of CO2 emissions reduction.

With the purpose of tailoring to global market needs, Magna supports this development with innovative, efficient, and cost effective advanced all-wheel drive (AWD) and four-wheel drive systems (4WD), in addition to disconnect systems, manual transmissions (MT), dual-clutch transmissions (DCT), and mild hybrid solutions (HDT 48V).

The field-tested mild hybrid systems provide an answer to multiple existing challenges, like legislation driven CO2 reduction and high-cost pressures. Such systems support high-volume applications of electrified drivelines as well as fleet average targets at reasonable costs. Mild hybrid systems also achieve improved driving dynamics through electric torque vectoring and traction support. These systems even enable functions like autonomous electric parking.

The post NEPCON JAPAN 2024: Showcasing new technologies from R&D to manufacturing appeared first on ELE Times.

Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

The embedded industry is seeing an increased demand for open-source RISC-V-based processor architectures, but there are still limited options when it comes to commercially available silicon or hardware. To fill this gap and help empower innovation, Microchip Technology has launched the PolarFire SoC Discovery Kit. By offering a user-friendly, feature-rich development kit for embedded processing and compute acceleration, Microchip is making emerging technology more accessible to engineers at all levels. The open-source development kit features a quad-core, RISC-V application-class processor that supports Linux and real-time applications, a rich set of peripherals and 95K of low-power, high-performance FPGA logic elements. This full-featured, yet low-cost kit allows rapid testing of application concepts, developing firmware applications, programming, and debugging user code.

“We are dedicated to helping support the growth of embedded systems that require low-power, high-performance FPGA fabrics. The PolarFire SoC Discovery Kit is a pivotal step in our journey towards creating more accessible, smart, secure and high-performing computing solutions for a wide range of applications,” said Shakeel Peera, vice president of marketing for Microchip’s FPGA business unit. “With the new Discovery Kit, experienced and new design engineers, as well as university students, will have access to a low-cost RISC-V and FPGA development platform for learning and rapid innovation.”

In addition to traditional sales channels, PolarFire SoC Discovery Kits are being made available through a pilot project as part of the Microchip Academic Program in the second half of 2024. By offering the Discovery Kit at a reduced price to universities, Microchip is ensuring that the future generation of engineers have direct access to state-of-the-art technology. This approach not only enhances the practical learning experience for students but also aligns academic studies with the latest industry trends. Microchip’s academic program offers resources for educators, researchers, and students worldwide and helps universities incorporate advanced technology into their curriculum.

“Preparing students for the work world, a capstone project is a unique opportunity for students to develop practical applications. Several ASU students are using the PolarFire SoC Discovery Kit in their projects this year and it’s been an invaluable experience for them to have access not only to development boards but also the amazing mentorship provided through Microchip’s academic program,” said Steven Osburn, professor at the Ira A. Fulton Schools of Engineering at Arizona State University. “The students are getting hands-on experience working with new technology to complete real-world engineering projects, finding innovative solutions to real-world problems.”

The Discovery Kit is built around the PolarFire MPFS095T SoC FPGA that features an embedded microprocessor subsystem consisting of a quad-core, 64-bit CPU cluster based on the RISC-V Instruction Set Architecture (ISA). A large L2 memory subsystem can be configured for performance or deterministic operation and supports an asymmetric multi-processing (AMP) mode. The board includes support for Microchip’s Mi-V ecosystem, a MikroBUS expansion header for Click Boards and a 40-pin Raspberry Pi connector, as well as a MIPI video connector. The expansion boards can be controlled using protocols like I2C and SPI. An embedded FP5 programmer is included for FPGA fabric programming and debugging, and firmware applications development.

The post Microchip’s Low-Cost PolarFire SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers appeared first on ELE Times.

Quectel Wireless Solutions, a global IoT solutions provider, and Rohde & Schwarz have successfully validated Quectel’s innovative 5G eCall module, part of the AG56xN series of automotive modules. For the test, the R&S CMX500 wideband radio communication tester has been used. The test setup will be shown at the Mobile World Congress 2024.

eCall, the automatic emergency call system for vehicles sold within the European Union, was introduced in 2015 and has been a mandatory requirement for all new cars in the EU since 2018. eCall systems currently make use of 2G/3G circuit-switched cellular networks. As these networks will be phased out in just a few years, emergency call systems (in-vehicle systems and infrastructure) will be adapted to the newest 4G/5G packet-switched cellular networks.

The European Commission’s initiative to update the eCall standards and legislation to transition eCall to 4G and 5G networks is ongoing. The automotive industry will need NGeCall test solutions to deliver eCall modules that include the new NGeCall functions. In future years it is expected that an upcoming Chinese eCall standard will also require 4G/5G packet-switched cellular networks.

The AG56xN series represents a cutting-edge line of 5G NR modules, leveraging the MediaTek MT2735 chipset to provide exceptional connectivity solutions. These modules support 5G Rel-15, delivering impressive data rates up to 4.0 Gbps downlink and 480 Mbps uplink within a 200 MHz bandwidth, showcasing a significant leap in wireless communication speeds. They are equipped with a comprehensive array of interfaces, including cellular (4 × 4 MIMO) and GNSS antenna interfaces, USB 3.0, PCIe (Gen3), RGMII, SGMII, multiple UARTs, SPI, I2C, I2S (PCM), SDIO, ADCs, and GPIOs, ensuring versatile connectivity options for various applications.

“We are very pleased to have Rohde and Schwarz validate the AG56xN series of automotive modules with the next generation of eCall features,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “This sets a new benchmark for the future of intelligent transportation.”

With computing capabilities up to 15K DMIPS and SGMII/RGMII throughput reaching 2.5 Gbps, these modules are designed to meet high-performance requirements. Additionally, they have achieved eCall/NG eCall certifications, underscoring their reliability and safety for automotive applications. The AG56xN series modules are also compatible with automotive-grade Wi-Fi and Bluetooth modules, offering a proven combination that enhances connectivity solutions for the automotive industry and beyond.

The test setup for testing the 5G/LTE automotive module from Quectel included the R&S CMX500 communication tester along with the R&S CMX-KA098 5G eCall test option simulating a NG eCall Public Safety Answering Point (PSAP) and a R&S SMBV100B vector signal generator for GNSS simulation. The test confirmed the successful establishment of a 5G emergency call between the Quectel module and the PSAP. The transmission of the Minimum Set of Data (MSD) was successfully achieved without any data loss and the simulated GNSS position was accurately transmitted. Additionally, voice communication was established with clear audio quality.

As a highly versatile tool, the R&S CMX500 with the R&S CMX-KA098 software option can be effectively used for NGeCall testing under reliable and configurable 5G network conditions. To accelerate the deployment of this technology, cooperation between companies within the industry becomes increasingly important. The Rohde & Schwarz and Quectel cooperation helps to mutually validate their solutions, reducing effort and accelerating time to market for our mutual customers.

Juergen Meyer, Vice President of Market Segment Automotive at Rohde & Schwarz says: “This is an important milestone in the rollout of the next generation eCall system, which will have a significant impact on road safety. With our test equipment and Quectel’s 5G eCall module, we successfully established an entire eCall process and verified this new key feature. We are very grateful to Quectel for this excellent collaboration which provides an important checkpoint from which the automotive industry can proceed with greater speed and confidence.”

The test setup will be shown at the Mobile World Congress in Barcelona, from February 26 to 29, 2024, at the Fira Gran Via, in hall 5, booth 5A80.

The post Rohde & Schwarz first to test 5G eCall interoperability of Quectel’s 5G module with its wideband radio communication tester appeared first on ELE Times.

There’s a lot of talk and excitement about chiplets these days, but there’s also a lot of confusion. What is available today? What should I expect in terms of interoperability? Is the promise of an emerging ecosystem real? More fundamentally, developers of high-end systems-on-chip (SoCs) need to consider a central question: “What’s in it for me?” The answer, unsurprisingly, varies depending on the type of application and the target market for these devices.

For the last few years, I have been closely monitoring the multi-die market, and I’ve been talking to a wide variety of players ranging from chip designers to chip manufacturers to end users of our system IP product offering. Although commentators and stakeholders accurately describe key benefits of chiplet technology, I’ve observed that these descriptions are rarely comprehensive and often lack structure.

Here is an outline of chiplet driving factors and size of opportunity per vertical Source: Arteris

As a result, I felt the need to identify common themes, reflect on their importance for future deployment and map them on the key industry verticals. This blog aims to summarize these insights in a diagram (see figure above), with the hope that it is useful to you.

1. Scalability: The key to meeting diverse computing demands

Scalability stands at the forefront of the chiplet revolution. Traditional monolithic chip designs face physical and economic limits as they approach the boundaries of Moore’s Law. Chiplets, however, offer a modular approach. By combining smaller, discrete components or “chiplets,” manufacturers can create larger, more powerful processors.

This modular design allows for the easy scaling of performance and functionality to meet the specific needs of various applications. This is what drove the early adoption of the technology by pioneering companies in the enterprise compute vertical. Today, it also attracts players in the communications and automotive industries, which also crave higher computing power, particularly for AI applications.

2. Cost efficiency: Lowering expenses and increasing competitiveness

Cost efficiency is another critical factor driving the adoption of chiplets. Traditional chip fabrication, especially at the cutting edge, is exceedingly expensive, with costs escalating as transistors shrink. The chiplet approach mitigates these costs in several ways.

First, it allows for the use of older, more cost-effective manufacturing processes for certain components. Second, by constructing a processor from multiple smaller chiplets, manufacturers can significantly reduce the yield loss associated with defects in large monolithic chips.

If part of a chiplet is defective, it doesn’t render the entire chip unusable, as would be the case with a traditional design. This translates directly into cost savings, making high-performance computing more accessible. This aspect is especially critical for cost-sensitive sectors such as wireless communications, consumer electronics, and industrial applications.

3. Ecosystem development: Fostering collaboration and innovation

The shift to chiplets also encourages the development of a more collaborative and innovative ecosystem in the semiconductor industry. With chiplets, different companies can specialize in various types of computing hosts and accelerators, contributing their expertise to a larger whole.

This openness can lead to a more vibrant ecosystem, as smaller players can innovate in specific areas without the overhead of designing entire chips. Such collaboration could accelerate technological advancements, benefiting newcomers in the automotive and consumer electronics vertical, for instance, and leading to more rapid iterations and improvements in technology.

4. Portfolio management: A strategic approach to product development

Finally, the transition to chiplets allows companies to manage their product portfolios more effectively. With the ability to mix and match different chiplets, a company can more quickly and efficiently adapt its product offerings to meet market demands. This flexibility enables faster response times to the emerging trends and customer needs, providing a competitive edge.

Additionally, the ability to reuse chiplets across multiple products can streamline research and development, reducing time-to-market and R&D expenses. The flexibility to mix and match chiplets for different configurations makes it easier to tailor chips to specific market segments and is particularly suited to the needs of the consumer and automotive markets.

Overall, the chiplet architecture is poised to revolutionize the semiconductor industry, with each sector finding unique value in its capabilities. This tailored approach ensures that chiplets will play a critical role in driving forward the technological advancements of each industry vertical.

Guillaume Boillet, senior director of product management and strategic marketing at Arteris, drives the product lifecycle of the interconnect IP and SoC integration automation portfolios.

 

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• How the Worlds of Chiplets and Packaging Intertwine
• Off-the-Shelf Chiplets Open New Market Opportunities

The post The chiplet universe is coming: What’s in it for you? appeared first on EDN.

Dallas-based Texas Instruments (TI) has introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing what is claimed to be the highest power density at a lower cost. TI’s new 100V integrated gallium nitride (GaN) power stages feature thermally enhanced dual-side-cooled package technology to simplify thermal designs and achieve the highest power density in mid-voltage applications at more than 1.5kW/in3. The firm’s new 1.5W isolated DC/DC modules with integrated transformers are claimed to be the industry's smallest and most power-dense, helping engineers to shrink the isolated bias power-supply size in automotive and industrial systems by over 89%...