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A new process design kit (PDK) from imec aims to provide broad access to a 2-nm gate-all-around (GAA) process node and associated backside connectivity for design pathfinding, system research, and training. This foundry PDK features the necessary infrastructure for digital design based on a set of digital standard cell libraries and SRAM IP macros.

The design PDK—enabling virtual digital designs in imec’s N2 chip manufacturing process technology—comes embedded with EDA tool suites from Cadence Design Systems and Synopsys. And it aims to train the semiconductor experts of tomorrow and enable the industry to transition to next-generation process technologies through meaningful design pathfinding.

Source: imec

Foundry PDKs—which provide chip designers access to a library of tested and proven components—are usually available once process technology reaches a critical level of manufacturability. And here comes the catch: there is restricted access and the need for non-disclosure agreements (NDAs). That, in turn, creates a high threshold for academia and industry to access advanced technology nodes like 2-nm during their development.

What imec’s N2 PDK is trying to do is provide young semiconductor engineers in academia and industry with early access to the infrastructure needed to develop design skills on advanced technology nodes such as 2 nm. “The design pathfinding PDK will help companies to transition their designs to future technology nodes and pre-empt scaling bottlenecks for their products,” said Julien Ryckaert, VP of Logic Technologies.

Next, the accompanying training courses will acquaint engineers with the most recent technology disruptions such as nanosheet devices and wafer backside technology. The training program, starting in the second quarter of 2014, will teach subscribers the specificities of the N2 technology node while offering hands-on training on digital design platforms using the Cadence and Synopsys EDA software.

Yoon Kim, VP of Cadence Academic Network, acknowledged that imec’s design pathfinding PDK represents a major milestone for training the next generation of silicon designers. “Imec used Cadence’s AI-driven digital and custom/analog full flows to create and validate the design pathfinding PDK.”

Likewise, Brandon Wang, VP of technical strategy & strategic partnerships at Synopsys, quoted pathfinding PDK as an example of how industry partnerships can broaden access to advanced process technology for the current and next generation of designers. “Our collaboration with imec to deliver a certified, AI-driven EDA digital design flow for its N2 PDK enables design teams to prototype and accelerate the transition to next-generation technologies using a virtual PDK-based design environment.”

According to imec, the design pathfinding PDK platform will extend to more advanced nodes like 1.4 nm.

Related Content

• IBM Unveils World’s First 2 nm Chip
• TSMC adds two variants to 2-nm node, will Intel catch up?
• Samsung unveils plans for 2-nm and 1.4-nm process nodes
• Europe Needs 2-nm Manufacturing Process by 2030, says Soitec’s CEO
• EU Signs €145bn Declaration to Develop Next Gen Processors and 2nm Technology

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Infineon Technologies has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module is the most cost-effective in its class, offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart homes, asset tracking, beacons and sensors, and medical devices.

According to a recent report by ABI Research 1, future use cases will demand additional
improvements across almost all metrics. These include industrial IoT applications such as
sensing, robotics, beacons, smart home, and asset tracking. In response, Infineon’s
CYW20822-P4TAI040 Bluetooth module delivers unparalleled connectivity and
performance, enabling customers to create innovative products in the IoT and consumer
electronics space.

With extensive experience in delivering certified Bluetooth and Bluetooth LE modules,
Infineon’s regulatory testing (FCC, ISED, MIC, CE) and certification process with the
Bluetooth SIG is precise and rigorous. Its pre-certified modules are optimized for cost, size,
power, and range.

“Infineon is thrilled to expand its Bluetooth portfolio with the introduction of the CYW20822-P4TAI040 Bluetooth module to help designers get to market faster,” said Anurag Chauhan, Director of Marketing for the Bluetooth product line at Infineon Technologies. “As a leader in the IoT area in delivering innovative new Bluetooth LE solutions, this new module is a testament to our customer commitment. This new module delivers low power, long range, and excellent RF performance to meet our customers evolving needs.”

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Device Offers High Power Density and Improved Thermal Performance in 3.3 mm x 3.3 mm PowerPAK 1212 F Package With Center Gate Design

Vishay Intertechnology, Inc. has introduced a versatile new 30 V n-channel TrenchFET Gen V power MOSFET that delivers increased power density and enhanced thermal performance for industrial, computer, consumer, and telecom applications. Featuring source flip technology in the 3.3 mm by 3.3 mm PowerPAK 1212-F package, the Vishay Siliconix SiSD5300DN provides best-in-class on-resistance of 0.71 mΩ at 10 V and on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 42 mΩ*nC.

Occupying the same footprint as the PowerPAK 1212-8S, the device released today offers 18 % lower on-resistance to increase power density, while its source flip technology reduces thermal resistance by 63°C/W to 56 °C/W. In addition, the SiSD5300DN’s FOM represents a 35 % improvement over previous-generation devices, which translates into reduced conduction and switching losses to save energy in power conversion applications.

PowerPAK 1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation. At the same time, the PowerPAK 1212-F minimizes the extent of the switching area, which helps to reduce the impact of trace noise. In the PowerPAK 1212-F package specifically, the source pad dimension increases by a factor of 10, from 0.36 mm² to 4.13 mm², enabling a commensurate improvement in thermal performance. The PowerPAK 1212-F’s center gate design also simplifies the parallelization of multiple devices on a single-layer PCB.

The source flip PowerPAK 1212-F package of the SiSD5300DN is especially suitable for applications such as secondary rectification, active clamp battery management systems (BMS), buck and BLDC converters, OR-ing FETs, motor drives, and load switches. Typical end products include welding equipment and power tools; servers, edge devices, supercomputers, and tablets; lawnmowers and cleaning robots; and radio base stations.

The device is 100 % RG- and UIS-tested, RoHS-compliant, and halogen-free.

Key Specification Table:

PowerPAK 1212-F	PowerPAK 1212-8S
Package size: 3.3 mm x 3.3 mm	Package size: 3.3 mm x 3.3 mm
Source pad dimension: 4.13 mm²	Source pad dimension: 0.36 mm²
Thermal resistance: 56 °C/W	Thermal resistance: 63 °C/W
Lowest available on-resistance in Gen V technology: SiSD5300DN: 0.87 mΩ (maximum)	Lowest available on-resistance in Gen V technology: SiSS54DN: 1.06 mΩ (maximum)

 

The post Vishay Intertechnology 30 V N-Channel MOSFET With Source Flip Technology Delivers Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK 1212-F appeared first on ELE Times.

In collaboration with Sony, Rohde & Schwarz has successfully validated and verified Sony’s Altair device for its NTN NB-IoT capability. Using the advanced R&S CMW500 mobile radio tester platform from Rohde & Schwarz, Sony was able to verify all 3GPP-defined RF parameters on their chipset in an interactive testing mode, in both geostationary orbit (GEO) and geosynchronous orbit (GSO). The company also validated the released protocol conformance test cases (PCT) for compliance, demonstrating exceptional performance and reliability of the Sony device. Additionally, both companies have committed to completing Skylo’s certified test plan on the R&S CMW500 as part of the carrier acceptance program.

In addition, the R&S TS8980 conformance test system from Rohde & Schwarz was used to perform RF tests in compliance with the requirements of the Global Certification Forum (GCF) for NTN NB-IoT, making it the first RF performance verification of an NTN NB-IoT chipset. With this achievement, Rohde & Schwarz marks a significant milestone in mobile device certification.

Skylo, the pioneer in non-terrestrial networks (NTN), has worked closely with both Rohde & Schwarz and Sony to ensure test plans satisfy industry standards. Sony’s Altair ALT1250 can now be upgraded for NTN connectivity and can be immediately embedded into devices for dual-mode operations. The validation of PCT demonstrates the companies’ collective commitment to ensuring that the NTN NB-IoT technology is not only market-ready but also meets the high standards of reliability and performance that Skylo’s test plans and its Standards Plus require.

The successful validation of Sony’s device for NTN NB-IoT underscores the commitment of Rohde & Schwarz to driving market readiness for the emerging requirements of the internet of Things via non-terrestrial networks. The technology is bringing wireless connectivity to remote areas that do not have access to terrestrial networks for use cases like SOS messaging or remote monitoring.

At the Mobile World Congress Barcelona 2024, Rohde & Schwarz will exhibit in hall 5, booth 5A80, its cutting-edge test solution for 3GPP NTN NB-IoT based on the R&S CMW500, verifying Sony’s Altair device. The R&S CMW500 covers testing needs from R&D to conformance and operator testing for NTN NB-IoT, not only supporting protocol, RRM and RF conformance testing in line with 3GPP, but also the Skylo test plan, which is required to operate on the Skylo Network – all in a single box.

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Infineon Technologies, a global leader in power systems and IoT, detailed its plans to highlight the industry’s broadest range of power electronic devices during the 2024 Applied Power Electronics Conference (APEC), 25–29 February. Infineon’s wide-bandgap solutions offer the highest efficiency and power density, providing a key element to addressing climate change and accelerating decarbonization efforts. Infineon’s best-in-class portfolio includes power devices for leading applications on silicon, silicon carbide (SiC) and gallium nitride (GaN) materials.

Infineon’s exhibits will span two booths, #1013 and #1319 (Infineon + GaN Systems), and
feature demonstrations of a broad range of applications. Booth #1013 will be organized in
six application zones, including:

• USB-C/Charging. See Infineon’s latest AC/DC and DC/DC USB-C PD chargers,
along with system power solutions for next-generation applications such as laptops
and notebooks.
• Motor controls. The company’s latest BLDC motor drive solutions for tomorrow’s
power tools and robotic applications will be on display. Rad hard reaction wheel
motor drives for satellites and space applications will also be demonstrated.
• Data centers. Infineon demonstrations will include a complete artificial intelligence
(AI) server solution, a digital power hot-swap solution, and a liquid-cooled high
density power supply optimized for next-generation applications. Also, see Infineon’s
latest high-density dual-phase power modules that reduce the total cost of
ownership in generative AI data centres.
• Electric vehicles (EVs). See Infineon’s latest 50 kW and 22 kW EV chargers, along
with SiC- and GaN-based on-board charging solutions, and the company’s latest
Hybrid PAK-based inverter for next-generation EVs.
• Renewables & energy storage. Highlighting critical energy applications, this
demonstration area will feature the company’s latest solar DC/DC maximizers, along
with DC-to-AC inverters, a bi-directional PFC/inverter, and DC-to-DC converters.
• Industrial control. The company’s growing portfolio of solid-state relays and circuit
breakers used to replace electromechanical switches will be highlighted.

Infineon’s second booth (#1319) will showcase the company’s expanded portfolio of GaN
solutions, such as class D audio amplifiers, data centre power supplies, and consumer
reference designs.

In addition to exhibits in booths #1013 and #1319, Infineon will play a significant role as a
contributor to the conference program, participating in more than 30 industry and technical
sessions.

The post Infineon drives decarbonization and digitalization with the broadest power solutions portfolio in the industry at APEC 2024 appeared first on ELE Times.

For fourth-quarter 2023, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $173.9m, down 2% on $177.4m last quarter but up 13% on $153.8m a year ago. It is also near the top of the guidance range (which had been raised in mid-January from $155–175m to $165–175m), driven by growth in semiconductor applications...

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Renesas increasingly looks like Cisco of the 1990s, when the router pioneer became an acquisition force and transformed itself into a networking giant within a decade. Renesas, the semiconductor industry’s serial acquirer, has announced to snap PCB design toolmaker Altium nearly a month after announcing the purchase of gallium nitride (GaN) design house Transphorm.

Renesas has worked closely with Altium—headquartered in Las Jolla, California, and listed in Australia—for the past couple of years to standardize its PCB design and evaluation boards on the cloud-based Altium 365 platform. While implementing Altium’s uniform PCB design tool, the Japanese chipmaker aimed to streamline its reference designs and product kits in order to reduce design complexity and speed time to market.

In other words, by employing Altium’s cloud-based PCB design platform, Renesas wanted to harmonize the development workflow around its 400-plus evaluation board designs. Eventually, Renesas figured that it needed to own a design platform that’s efficient and easier to use. Moreover, owning a design software platform could become a competitive advantage in its bid to become a solutions provider instead of merely a chip vendor.

So, Renesas, which has been at the forefront of dealmaking in past years, decided to buy Altium for $5.9 billion in a cash deal. “This acquisition is different from our past acquisitions in many ways,” said Renesas CEO Hidetoshi Shibata.

Figure 1 Renesas acquires PCB tool developer Altium after using its cloud-based solutions for nearly two years.

First and foremost, it will diversify Renesas offerings into the software realm. That, in turn, will help design engineers easily integrate semiconductors into complex electronic designs while streamlining the overall design process. It’s worth mentioning here that Altium rejected a $3.9 billion takeover bid from software company Autodesk as too low back in 2021.

Altium’s origin can be traced to a startup, Protel, which was founded in 1985 by a University of Tasmania staffer, Nick Martin, who wanted to develop software for reducing PCB design complexity. The company was eventually renamed Altium and relocated to California.

Figure 2 Altium provides tools for designing circuit boards.

While Renesas has been acquiring semiconductor companies for nearly a decade, this deal tells a different story. It’s about a chip hardware outfit buying a design software firm to bolster its merits of being a solution provider and thus address pressures to lower design complexity and shorten time to market.

That makes sense because Renesas has been assimilating semiconductors from a multitude of suppliers: Intersil, IDT, Dialog, Sequans, and Transphorm. So, it’s crucial that design engineers using Renesas chips can better organize design kits, libraries, and other components effectively.

All this happens mostly at the board level, and Altium’s acquisition aims to facilitate that stage in the system design cycle. And Renesas has vetted these PCB design tools as their user for nearly two years.

Related Content

• Renesas Mulls Bid for IDT
• Renesas to Acquire Sequans for $249M
• Renesas goes all out for NFC with acquisition of Panthronics
• Renesas Targets IoT, Mixed Signal Expansion with Dialog Purchase
• Renesas’ Transphorm acquisition points to GaN writing on the wall

The post What does Renesas’ acquisition of PCB toolmaker Altium mean? appeared first on EDN.

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BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has signed a memorandum of understanding (MoU) to collaborate on its GaN distributed feedback (DFB) lasers being used by US-based advanced defence and dual-use photonics company Applied Energetics Inc in its advanced systems development for next-generation military and commercial applications...

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In the evolving landscape of 5G networks, leveraging frequency ranges FR1 (0.41 to 7.125 GHz) and FR2 (24.25 to 71 GHz) has been pivotal. As the era of 5G-Advanced and 6G unfolds, a third frequency range is being discussed in global regulatory and industry consortiums worldwide. FR3, which is also known as upper-midband, spanning 7.125 to 24.25 GHz, will open a new frontier for mobile communication technology. Rohde & Schwarz technology plays a key role in enabling Qualcomm Technologies to show the readiness and effectiveness of the latest RF modem technology for FR3.

At the most recent World Radio Conference 2023, held in November and December 2023 in Dubai, organized and hosted by the International Telecommunication Union (ITU), a consensus emerged among regulatory bodies and industry leaders to explore additional spectra for the next generation of mobile communication, officially labeled IMT-2030, also known as 6G. Notably, the 14.8 to 15.35 GHz frequency range has been earmarked for global study. In addition, local agencies like the Federal Communications Commission (FCC) in the United States are also eyeing the upper 12 GHz band (12.7 to 13.25 GHz) for future wireless applications.

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Time-of-flight optical sensing enables world’s first accurate personal air quality monitor and smoke detector for smartphone

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Mobile Physics, a software-development startup specialized in environmental physics, have revealed an exclusive collaboration that enables smartphones and other devices to measure household and ambient air quality with a built-in optical sensor.

Developed exclusively for ST’s multizone ranging sensors, which are widely used for features like camera autofocus and presence detection, this solution measures particulates in the surrounding air. With accuracy comparable to purpose-designed air-quality monitors, Mobile Physics’ EnviroMeter app acts as a personal, portable environment monitor and smoke detector to safeguard health – and enhance fire safety. Manufactured using ST’s low-power technology, it can operate ‘always on’ to provide constant awareness with minimal impact on battery life.

Each year, 3.2 million people die prematurely from illnesses attributable to household air pollution. The combined effects of ambient air pollution and household air pollution are associated with 6.7 million premature deaths annually (1). Monitoring air quality has become a real necessity and a public health issue. Leveraging ST’s market positioning to accelerate integration, the two companies have integrated Mobile Physics’ software and ST’s VL53L8 direct time-of-flight (dToF) sensor on Qualcomm’s Snapdragon 8 Gen 3 smartphone platform. As showcased at the Qualcomm Snapdragon Summit 2023, this project creates the world’s first smartphone with always-on air-quality sensing and smoke detection.

“Personal environment monitoring can give everyone greater control over their own health and safety, using their smartphones. The customer will also have the option to opt in to access wider environmental data covering their local area,” said Erez Weinroth, CEO, Mobile Physics. “ST’s direct ToF sensors enabled us to deliver a solution with accuracy close to that of high-end dedicated environment monitors but at lower cost and in a smaller package.”

“The team at Mobile Physics has made ingenious use of the data from our dToF sensor to produce this groundbreaking yet economical and elegant environment monitor,” said Alex Balmefrezol, General Manager, Imaging Sub-Group at STMicroelectronics.  “We are delighted to enable this new, wellness-enhancing feature that complements the established ToF use cases providing even more value to our customers.“

The air-quality sensing solution developed with ST is included in Mobile Physics’ EnviroMeter Software Development Kit (SDK), which also provides data on temperature, wind, precipitation, humidity, light-intensity, UV, and noise-level monitoring. Sensing can detect particles smaller than 2.5 micron and thus empower users to protect their health. The solution does not require any additional equipment; a standard dToF sensor and the Mobile Physics software is all that is needed.

To learn more about this solution, come to the ST booth (7A61) at Mobile World Congress 2024 where we will showcase the air-quality monitoring demonstration.

Technical Notes to Editors:
The VL53L8 is used in diverse electronic products including smart speakers, projectors, laptops, robots and home appliances, and door-entry systems, as well as IoT devices such as occupancy sensors. Any of these products can now deliver extra value by providing air-quality indication and fire protection with no extra hardware components required. The sensor’s small size, measuring just 6.4mm x 3.0mm x 1.75mm, eases integration anywhere a small form factor is required.

Engineers can accelerate projects including proximity and presence detectors using the development ecosystem available from ST. This includes the X-Nucleo-53L8A1 development board, the P-Nucleo-53L8A1 evaluation pack that also contains a microcontroller development board, and SATEL-VL53L8 breakout boards. The VL53L8 is in production now. Pricing information and sample requests are available at local ST sales offices.

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. As an integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.

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Microchip’s TimeProvider 4500 (TP4500) is an IEEE 1588 PTP grandmaster clock that furnishes high-speed network interfaces up to 25 Gbps. The hardware timekeeping platform not only offers 1-Gbps, 10-Gbps, and 25-Gbps Ethernet options, but also achieves timing accuracy below 1 ns.

TP4500 gives infrastructure operators a terrestrial alternative for distributing precise time that is not dependent on GNSS. Highly scalable, the platform serves thousands of PTP endpoints for customers deploying C-band gNodeBs. Hardware-assist enhancements, including the latest digital synthesis technology and PolarFire SoC FPGA, allow the system to deliver sub-ns timing accuracy.

Oscillator options for the TP4500 include OCXO, super OCXO, and rubidium. The unit also incorporates a 72-channel GNSS receiver with active thermal compensation. TimePictra synchronization management software allows operators to monitor and track real-time faults and threats with visibility across their entire network.

The TimeProvider 4500 is available now for purchase. Contact a Microchip sales representative or authorized distributor.

TimeProvider 4500 product page

Microchip Technology 

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The E7515W UXM wireless test platform from Keysight offers network emulation with Wi-Fi 7 signaling RF and throughput testing of Wi-Fi 7 devices. It performs Wi-Fi to application and Wi-Fi to cellular internetworking testing of both Wi-Fi clients (STAs) and Access Points (APs) from 380 MHz to 7.125 GHz.

As a turnkey system, the E7515W simplifies Wi-Fi 7 testing and provides insights for both the physical (PHY) and media access control (MAC) layers. The system emulates hundreds of clients at once through traffic simulation without the need for additional equipment. According to Keysight, this capacity exceeds existing market solutions by threefold.

Analysis software for the E7515W provides PHY/MAC level information, such as rate versus range, as well as enhanced Rx sensitivity, Wi-Fi 6/6E/7 radio unit sweep analysis, and full-rate throughput. Based on the same hardware architecture as the E7515B UXM 5G test platform, the E7515W tests more complex devices with 5G and LTE capabilities. It also performs fixed wireless access (FWA) testing for customer premise equipment (CPE).

Request a price quote for the E7515W Wi-Fi 7 test system using the link to the product page below.

E7515W UXM product page

Keysight Technologies 

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Joining Samsung’s lineup of consumer SSDs, the 990 EVO delivers a sequential read speed of up to 5000 Mbytes/s, 43% faster than the 970 EVO Plus model. The company also reports that the 990 EVO offers up to a 70% improvement in power efficiency compared to its predecessor.

Available with storage capacities of 1 terabyte and 2 terabytes, the internal NVMe SSD enhances everyday computing experiences like gaming and video/photo editing. In addition to its fast sequential read rate, the drive’s sequential write speed reaches 4200 Mbytes/s. Random read and write operations also get a boost, with speeds of up to 700k and 800k input/output operations/s (IOPS), respectively.

Improved power efficiency allows battery-powered PCs to operate longer between charges. The 990 EVO supports Windows Modern Standby, which enables instant on/off with uninterrupted internet connectivity and seamless notification reception, even in low-power states. What’s more, the SSD’s heat spreader label effectively regulates the thermal condition of the NAND chip.

The 990 EVO supports both PCIe 4.0 x4 and PCIe 5.0 x2 interfaces. Samsung’s Magician software is a set of optimization tools to ensure the best SSD performance. It also streamlines the data migration process for SSD upgrades. Magician protects valuable data, monitors drive health, and provides notification of firmware updates.

The 990 EVO SSD will be available in Malaysia starting next month.

990 EVO product page

Samsung

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Built with an Arm Cortex-M33 core, NXP’s MCX A14x and A15x series of general-purpose MCUs operate at 48 MHz and 96 MHz, respectively. The devices target a broad range of applications, including motor control, industrial sensing, smart metering, automation, and smart home devices.

Both series offer high levels of integration with scalable device options. Peripherals include timers that generate three complementary PWM pairs with deadband insertion and a 4-Msample/s, 12-bit ADC with hardware windowing and averaging. Along with UART, SPI, and I2C interfaces, the MCUs provide an I3C communication interface. I3C improves on the performance and power use of I2C, while maintaining backward compatibility for most devices.

MCX A microcontrollers employ a capless LDO power subsystem that operates from 1.7 V to 3.6 V. Devices consume 59 µA/MHz (3 V, 25°C) in active mode running Coremark from internal flash. In deep sleep mode, current consumption drops to 6.5 µA with 10-µs wake-up and full SRAM retention (3 V, 25°C). Deep power down mode trims consumption to less than 400 nA with 2.78-ms wake.

Packaging options for the MCX A parts include 32-pin QFN, 48-pin QFN, and 64-pin LQDP. MCUs are I/O and pin-compatible across package types, simplifying migration and upgrades. MCX A14x/15x devices are available now through NXP’s distributor network.

MCX A14x/15x product page

NXP Semiconductors 

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