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Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced its artificial intelligence (AI) data center technology roadmap for to up to 3x power increase to support similar exponential growth in AI power demands expected in just the next 12–18 months...

In this roundup, we highlight three new solutions that target wireless connectivity—be it cellular IoT, 5G, or Wi-Fi 6—from the ground up.

Third-quarter 2023 saw a significant rebound in global smartphone production, marking the end of an eight-quarter slump, according to market research firm TrendForce. In a strategic year-end surge, brands amped up production to capture more market share, propelling fourth-quarter smartphone output up 12.1% to 337 million units. Despite this final-quarter growth, 2023 rounded off with a slight 2.1% dip in annual production — totaling 1.166 billion units...

I’ve torn down a lot of streaming multimedia receiver devices over the years, most recently both HD (1080p) and 4K variants of Google’s Chromecast with Google TV. The list of victims also includes a bunch of Rokus in both “box” and “stick” form factors, Amazon’s Fire TV Stick, and an Apple TV (plus a few others with proprietary operating systems, including Google’s own prior-generation Chromecasts). But until today, I’m pretty sure I’ve only taken apart one other “pure” Android TV-based player, that one being the grandfather of them all, Google’s Nexus Player.

What do I mean by “pure”? Consider, for example, that Amazon’s Fire TV devices run (at least for the moment) the Android-derived Fire OS. Google TV, similarly, has an Android TV foundation, on top of which the company has (simplistically speaking) notably revamped the user interface and feature set, innately integrating (for example) Google Home facilities for smart home control purposes, along with making Live TV support front-and-center. But the Nexus Player’s Android TV UI obviously hearkened back to its Android roots; in fact, it originally ran Android 5. And the UI of today’s teardown victim, TiVo’s RA2400 Stream 4K (which, going forward I’ll refer to as “RA2400” for short)  is similarly Android TV-ish in its characteristics.

Why do Android TV-based products like the RA2400 still exist, if Google TV is supposedly a superior successor? Some of the answer, I suspect, has to do with longevity; Android TV has been around for a few months shy of a decade now, whereas the first Google TV-based Chromecast only started shipping in late 2020. And some of it, I also suspect, has to do with higher licensing fees that Google may charge for Google TV versus Android TV, as well as a more restrictive list of licensees. Whatever the reason(s), plenty of Android TV-based devices are still available for sale, which isn’t necessarily a good thing from a consumer standpoint.

Why? Android’s maturity and ubiquity, along with its open-source foundation, make it straightforward to develop apps that run on top of the O/S. This software might unfortunately also include malware and other undesirable code, enabled by unpatched vulnerabilities in out-of-date software stacks (if, say, the manufacturer goes out of business or maybe just decides to redirect its support attention to more lucrative newer products). At minimum, that no-name Android TV box you bought on eBay or elsewhere might be doing bitcoin mining on the side, piggybacking on your network connection and sucking up your electricity in the process. More critically, it might directly act as an attack vector for infecting other devices on your LAN and/or, by opening firewall holes via UPnP or other more malicious means, expose the entire LAN to WAN-based attacks, too.

That’s why, if you’re going to bring an Android TV-based device into your residence, it’s best to go with a “brand name” supplier like, say…well, TiVo, for example. I was admittedly surprised to find out in researching the RA2400 that it’s still available for sale, given that it was introduced in May 2020. Four years is forever in the consumer electronics industry, particularly for a product whose initial reviews called out its sluggish performance. Applications generally get more resource-intensive over time, not less, which would tend to increasingly hamper performance over time. But for whatever reason, the RA2400 is still alive and kicking; its advanced-at-the-time 4K resolution support doesn’t hurt.

My unit was a seller-refurbished device sold by VIP Outlet on eBay, which I bought two years (and a few weeks) ago promotion-priced at $21.25 plus tax ($25 minus 15%) solely with a future teardown in mind. That might sound like a good deal, and in fact it is in at least some sense, given that the RA2400 originally was priced at $50. Then again, however, as I wrote these words, new units were selling for $24.99 at both Amazon and Best Buy (in both cases marked down from the usual $39.99, which is what it’s selling for on TiVo’s website right now).

It obviously took a while for the RA2400 to rise to the top of my teardown pile! And in finally cracking open the box a few weeks ago, I found several surprising omissions (hold that thought). The packaging on my refurb, as you can see, was quite spartan.

I’ll save you five more photos’ worth of plain white box panels, instead focusing on the sticker affixed to one side:

Opening the box lid provides our first look at our “patient”:

Underneath, in a bubble wrap baggie, are a male-to-male HDMI-to-mini HDMI cable (which doesn’t seem to come with new units, or to serve a useful purpose for that matter, so I’m guessing this was a VIP Outlet mix-up) and a USB-A to micro-USB power cable (but no wall wart, although it looks from the documentation that one comes with new units, so this was apparently just another “seller refurbished” miss).

And speaking of omissions, can you tell yet what else isn’t in the box that should be? For a clue, take another look at that online documentation, either in HTML or (if you prefer) PDF format. Now take a look at the “stock” photo I showed you earlier. See the remote control there? See it here? No? Exactly. Sigh.

Onward. Freed from its cardboard and clear-plastic constraints, the RA2400 (with dimensions of 77 x 53 x 16 mm) comes into full view, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

On one end is the aforementioned micro-USB power input:

Coming out the other end is the beefy HDMI jack:

Along one side, and admittedly only barely visible in this shot, is a small button which, when held down for a few seconds, enables manual pairing with the remote control (assuming one exists…did I mention that mine was missing its remote control?), and when pressed a bit longer, initiates a factory reset:

(Full disclosure: I’m being a bit harsh about the missing remote control and wall wart, because I never intended to actually use the RA2400, only to take it apart. Frankly, considering all my fancy-pants video gear, the HDMI to mini-HDMI cable I got in exchange was a net sum gain. On the other hand, if I was a normal consumer hoping to use the RA2400, I’d be pretty bummed…)

And along the other side is another interesting advanced feature (for a 2020-era product, at least), a USB-C connection (with USB 2.0-only bandwidth, by the way):

This is not, TiVo’s documentation makes clear, an alternative power input path, nor is it an alternative video output option. It is, instead, a means of hardware-expanding (along with associated software support, dependent in some cases on third-party Android TV drivers and the like) the RA2400 to handle, for example, a wired Ethernet adapter, a game controller, a keyboard or mouse, a storage device, or multiples of these via a USB-C hub intermediary.

Last but not least, here’s a top view:

And a bottom view:

With a closeup of the label revealing, among other things the FCC ID (2AOVU-IPA1104HDW):

Before diving in, one more thing. The penny in the prior photos obscured, I suspect, just how funky the RA2400’s enclosure is. Check out the unique asymmetry!

Oh well. I was impressed. You all probably just want me to get to the getting-inside.

Peeling off the label from the bottom:

unfortunately didn’t expose any convenient screw heads to view:

but it did draw my attention to something I’d previously overlooked; the thin seam running along the underside periphery:

Betcha know what comes next, yes?

Bingo!

The PCB now also pops right out of the other half of the case:

I’m quite certain you’ve already noticed the Faraday cages on both sides of the PCB. And anyone who’s read one of my teardowns before definitely knows what comes next. Let’s flip the PCB back over to its backside first (as I’ve mentioned before, since these things are designed to dangle from the back of a TV there really is no consistent “top” or “bottom”, but my convention is that “top” is associated with the TiVo logo impression side of the now-removed case, with “bottom” in proximity to the now-removed label side of the now-removed case…phew):

Note how pristine both the cage and PCB still are. Are you proud of my atypical disassembly-force restraint and deft technique?

The shiny IC in the right section, labeled AP6398S, is a SIP module implementing both Bluetooth and Wi-Fi functions, based on Broadcom’s BCM43598. I suspect that at least some of you have already noticed the PCB-embedded antennae in the upper right and lower right-and-left quadrants of the PCB, yes? And in the sorta-center section are, at top, Amlogic’s S905Y2 application processor (can I just say for the record that rarely do I see a system’s “guts” documented so thoroughly in a consumer-intended product page? Here’s even more detail), comprised of, among other things, a quad-core 1.8 GHz Arm Cortex-A53 CPU core and an Arm Mali-G31 MP2 GPU core, and below it, a Nanya NT5AD512M16A4 1 GByte DDR4-2666 SDRAM.

Flip the PCB back over, deftly pop the top off its Faraday Cage too:

and we can inventory the remainder of the notable (IMHO, at least) bill of materials:

Along the left side are the USB-C connector and, below it, a 37.4 (MHz, I’m assuming) crystal oscillator. Along the right is the pairing-and-reset switch. And in the middle are a very faintly marked Samsung KLM8G1GETF-B041 8GByte eMMC flash memory module and, below it, another Nanya NT5AD512M16A4 1 GByte DDR4-2666 SDRAM.

To get a better look at the sides-located components, as well as to gain another perspective on that shiny “box” at the top of both sides of the PCB, out of which the HDMI cable juts, I’ll share some side views now. PCB top-up first:

Now bottom-up:

Those metal blobs on the sides of the “box” are not, I’m pretty confident, solder; those are welding remnants. The reinforcement necessity is understandable when you consider, reiterating what I mentioned earlier, that “these things are designed to dangle from the back of a TV” (not to mention that they’re likely predominantly disconnected from the TV by grabbing the main body and yanking). I was pretty sure there was nothing underneath but solder joints (with the “box” intended to mute high-frequency signal emissions). I even got a chuckle when I checked out the FCC certification report’s internal photo set and noticed they didn’t bother trying to tackle breaking apart the welds, either. However, I still got the tops pried away enough to peek underneath:

See what I told you? Solder. Along with strong adhesive, of course. Fini! Let me know about anything else that caught your eye in the comments.

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Google’s Chromecast with Google TV: Dissecting the HD edition
• Google’s Chromecast with Google TV: Car accessory similarity, and a post-teardown resurrection opportunity?
• The Google Chromecast with Google TV: Realizing a resurrection opportunity
• Teardown: Nexus Player set-top box

The post The TiVo RA2400 Stream 4K: A decent idea, plagued by usage delay appeared first on EDN.

The Optical Internetworking Forum (OIF) says that its record-breaking, multi-vendor interoperability demonstrations at the Optical Fiber Communication Conference & Exposition (OFC 2024) in San Diego, CA, USA (24–28 March) will spotlight interoperable solutions in 800ZR, 400ZR and OpenZR+ optics; Energy Efficient Interfaces (EEI) & Co-Packaging; 112G and 224G Common Electrical I/O (CEI); and Common Management Interface Specification (CMIS) implementations...

The strengthened collaboration between Hera Group and Panasonic Industry aims to improve safety and sustainability with NexMeter technology for Italian and European utilities.

The Italian-based Hera Group and Panasonic Industry Europe announce the renewal of our longstanding collaboration. This entails a new commercial agreement designed to extend the reach of the innovative NexMeter meter within the Italian gas distribution market. The NexMeter, initially launched in 2019 as a smart gas meter 4.0, has evolved over time, incorporating advanced safety features and, since 2021, utilizing recycled plastic components.

Boasting compatibility with green gas mixtures like hydrogen and biomethane, NexMeter has already garnered interest from several utilities, with potential future partnerships on the horizon. The collaboration with Hera and Panasonic Industry aims to enhance NexMeter’s capabilities, surpassing national standards and offering Italian operators a meter that not only prioritizes safety and sustainability but also enhances efficiency, reduces costs, and contributes to the decarbonization goals of the sector.

“We are thrilled to embark on this transformative journey with one of the largest Italian multiutilities in Italy,” said Johannes Spatz, President of Panasonic Industry Europe. “This partnership represents not only a collaboration to provide our Japanese-developed know-how and technology, enhancing safety in gas installations across Italy and Europe, but also marks a significant step in our commitment to innovation. The agreement with Hera Group opens new avenues for introducing NexMeter to other utility providers, revolutionizing gas distribution infrastructure with advanced metering technology. For the Panasonic Industry, this collaboration is the beginning of new developments, extending NexMeter’s performance to new functionalities, aiming to be a technological reference for the future’s second generation of smart gas meters. Our strong ambition is to position ourselves as a key partner in the Italian and European markets, providing cutting-edge solutions for gas distribution and integrating advanced technology with an IoT software platform for continuous field monitoring. This partnership with Hera Group also offers the prospect of joint initiatives and projects, aligning with our shared objectives in environmental sustainability, carbon dioxide emissions reduction, and the principles of the circular economy, all integral components of Panasonic’s GREEN IMPACT plan.”

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Frankfurt am Main, 08 March 2024. The modern building is intelligent, connected and as a result saves energy. In combination with alternative energy sources and efficient lighting solutions, emissions in the building sector can be drastically reduced. This makes a significant contribution to achieving climate targets. 2,169 exhibitors presented the latest developments in building technology and trends in innovative lighting design at Light + Building in Frankfurt am Main from 3 to 8 March 2024. Over 151,000 visitors travelled to the world’s leading trade fair for lighting and building-services technology.

“The atmosphere at the exhibitors’ booths, in the halls and throughout the exhibition grounds was simply fantastic. We are extremely pleased that so many exhibitors and visitors, as well as our long-standing partners, have continued the success story of the world’s leading trade fair for lighting and building-services technology in 2024,” summarises Wolfgang Marzin, President and Chief Executive Officer of Messe Frankfurt. He adds: “With the switch to renewable energy sources, greater efficiency and sustainability in buildings, the industry has key goals on its agenda. That’s why they used the platform intensively, especially in the first few days, to present and discover innovations and drive forward key topics. After all, if we want to achieve the climate protection goals, the building sector is an essential milestone. It is unfortunate that the rail and air transport strikes have already affected Messe Frankfurt’s third leading international event since the beginning of the year.”

Buildings of tomorrow and inspiring lighting solutions

Key topics are the electrification and digitalisation of homes and buildings in order to reduce emissions and reuse raw materials. At Light + Building, the industry presented the digital and electrotechnical infrastructure for this and, on this basis, showcased solutions for dynamic power control, energy storage systems and applications for connected security. One growing area is the range of e-mobility and charging infrastructure as well as innovations and products for decentralised energy supply systems and components.

Light plays an important role in the architecture of tomorrow. At Light + Building 2024, 65 per cent of exhibitors belonged to this sector. They presented high-quality lighting solutions for indoor and outdoor areas as well as dynamic room concepts. Modern LED installations ensure contemporary efficiency and either blend harmoniously into the architecture or emphasise the design elements. Lighting is to provide maximum visual comfort in all living and working environments. Thanks to the materials used, Acoustic Lighting combines a pleasant lighting atmosphere with sound-absorbing functions. Sustainability plays an essential role in both the materials used and the manufacturing processes. Many manufacturers design luminaires in a way that the raw materials used can be recycled at the end of their useful life.

Light + Building 2024 in figures

The high-quality, extensive and international portfolio of lighting and building-services technology impressed the visitors. 95 per cent of them were extremely satisfied with what was on display and stated that they had achieved 93 per cent of their trade fair attendance targets. The most came to the innovation meeting point from Germany, China, Italy, the Netherlands, France, Switzerland, Belgium, Austria, the UK, Spain and Poland. They came from a total of 146 countries – including, for example, India, the USA, the United Arab Emirates, Australia, Brazil and Singapore. The degree of internationality was thus 51 per cent. The level of internationality among the 2,169 exhibitors was also high at 76 per cent.

Meeting place for the social media community

The social media community also found its home at Light + Building. On 3 and 4 March, the leading content creators in the lighting and building-services technology sector gathered for the Power Creator Days. In addition to live podcasts, expert talks and case studies, visitors had the chance to pedal for a good cause and work together towards a high energy target. A total of 1,510 minutes were cycled on the six fitness bikes. The sponsors will convert the result into a cash donation for the Leberecht Foundation, which Messe Frankfurt will double. The exact amount will be announced on social media further to Light + Building.

The next Light + Building will take place from 8 to 13 March 2026 in Frankfurt am Main.

www.light-building.messefrankfurt.com

Voices from the industry Alexander Neuhäuser, General Manager ZVEH (Central Association of the German Electrical and Information Technology Trades)

“Light + Building demonstrates how sector coupling can succeed through the necessary connectivity. The electrical trades integrate photovoltaics, storage, electromobility and heat pumps. They show how the energy industry requirements for controllable consumption devices (SteuVE) can be met and thus take account of the current transformation process. The good atmosphere at this year’s Light + Building 2024 was also noticeable at the joint stand of the electrical trades, which was very busy on all days of the event. The traditional partners’ evening was also a complete success, bringing together the partners of the electrical trades and the industry leaders. We were particularly pleased that so many young people once again took the opportunity to visit the E-House and the workshop street and gain an impression of what is feasible with smart and intelligently connected building automation.”

Wolfgang Weber, CEO, ZVEI (Electro and Digital Industry Association):

“In the context of climate goals and the economic situation of urgently creating more affordable living space in Germany, technologies are increasingly coming into focus. The exhibiting companies at Light + Building have impressively demonstrated how easily well-designed climate protection can even lead to greater economic efficiency in the operation of houses, buildings and entire neighbourhoods. This requires the right solutions, especially from the electrical and digital industry, such as heat pumps, controllable lighting, charging points and an energy management system. This is relevant – not just in Germany and Europe, but worldwide. Light + Building is the right place to present innovative, climate-friendly technologies and solutions and to engage in dialogue with trade visitors from Germany and abroad.”

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Optica (formerly the Optical Society of America, OSA) says that Dr Radhakrishnan Nagarajan has been selected as the 2024 recipient of the David Richardson Medal. Nagarajan is honored for the successful manufacturing and commercialization of indium phosphide (InP)- and silicon (Si)-based photonic integrated circuits for use as optical interconnects with a wide range of applications. Described as an insightful engineer and outstanding innovator and mentor, Nagarajan’s ability to move from concept to commercialization and deployment continues to have a profound impact on our industry, says Optica...

Optica (formerly the Optical Society of America, OSA) has named Kenichi Iga, Professor Emeritus and former president of Tokyo Institute of Technology, as recipient of the 2024 Frederic Ives Medal/Jarus W. Quinn Prize for his “pioneering contributions and visionary leadership in the field of semiconductor lasers and optoelectronics and a dedication to training and educating future generations”...

The Center will enable early pilots, talent, and capability development for the upcoming India Collaborative Engineering Center

Applied Materials has announced the commissioning of the ‘India Validation Center’ (IVC) at Applied Materials India, Bangalore by the Hon’ble Union Cabinet Minister for Railways, Communications, Electronics & Information Technology, Govt. of India, Shri Ashwini Vaishnaw. The Center marks the next step in the company’s journey of enabling the semiconductor ecosystem in India.

Built with the highest safety standards, the Center enables early pilots, talent, and capability development for the upcoming India Collaborative Engineering Center including validation, process engineering, lab management, and collaboration with academia and suppliers. It adds new capabilities to enable end-to-end design, characterization, and qualification of semiconductor equipment. In this lab, Applied Materials demonstrated the capability to process 300-mm wafers in IVC; a first for private industry in India.

“Under the leadership of Prime Minister Narendra Modi, India’s semiconductor ecosystem has achieved significant growth over the past few years,” said Hon’ble Union Cabinet Minister, Ashwini Vaishnaw. He added “The envisaged semiconductor ecosystem is going to play a huge part in making India a developed nation. The India Validation Center is a testament to the dedication and effectiveness of our approach to build India’s resiliency in chip manufacturing and Applied Materials has been a trusted partner in enabling the Indian Semiconductor dream. Almost every consumer tech product that runs on a chip today has Applied Materials engineering imprinted in them. This Center will further help develop manufacturing capabilities in the sector and exemplify the trust that global companies have placed in India.”

“We believe this is India’s time to shine, and Applied Materials’ India Validation Center is one of the many milestones in our innovation journey,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. He added, “We will continue to develop our capabilities in India to support customers and work with supply chain partners to strengthen the local ecosystem and help India’s semiconductor industry succeed.”

“It is an exciting time to be part of the semiconductor value chain in India, and we are committed to developing the country’s semiconductor ecosystem,” said Satheesh Kuppurao, Vice President of Business Development and Country President of Applied Materials India. “The commissioning of our India Validation Center will enable us to coach, train, and demonstrate higher-level applications development work that is needed to support the growing semiconductor ecosystem in India.”

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Author: Bipin Pande, Technical Marketing Manager, STMicroelectronics Pvt Ltd

STMicroelectronics’ L99LDLH32 linear current regulator delivers a convenient, integrated solution for dynamic automotive lighting controlled using CAN-FD Light protocol. Ideal for use with OLED lamps that provide bright, homogeneous, and high-contrast lighting from a small surface area, the new driver lets designers produce complex light patterns and effects that enhance safety and styling.

Monolithically integrated using ST’s BCD9sL process, the L99LDLH32 is AEC-Q100 qualified. It is available as 7mm x 7mm QFN48 package with wettable flanks and an exposed thermal pad to aid dissipation. With 32 regulated current sources, independently programmable from 1mA to 15mA, the L99LDLH32 can drive individual pixels in external and interior lighting applications. Global dimming is also provided, with 8-bit resolution. While powered at the vehicle battery voltage, the driver produces outputs of up to 35V to cover a wide light emitter forward-voltage spread.

The integrated CAN FD Light protocol handler and transceiver simplify connection to the vehicle’s communication infrastructure and controlling domain ECU (electronic control unit). Based on proven industry standards, CAN FD Light’s synchronized commander/responder communication, conceived for controlling simple devices like lights and sensors, saves costly external components such as timing crystals. On the other hand, the data bandwidth of 1Mbit/s enables designers to create complex animated light patterns and permits smoothly modulated transitions and dimming.

In addition, on-chip non-volatile memory allows programming of parameters such as current level and PWM dimming for stand-alone operation, to provide a failsafe mode to cover malfunctioning of the communication bus or controller. Targeting roles including safety-critical lighting such as taillights, stoplights, and turn indicators, the L99LDLH32 provides features for a high level of functional safety. These include a fault-status pin, voltage and temperature monitors, a programmable timeout watchdog, and short-circuit and open-load detection. In addition, frequency dithering optimizes and minimizes electromagnetic emissions.

L99LDLH32 Eval board provides an easy way to connect L99LDLH32 into existing systems.

Device and Eval boards and ready to order. Please contact local ST sales office for pricing options and sample requests.

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Step-down converters’ switch-node voltage waveform defines the electromagnetic compatibility (EMC) behavior for automotive CISPR 25 Class 5 measurements. The ringing frequency in the switch-node waveform is an important signal on the EMC receiver, where a higher ringing amplitude on the switch node often causes EMC issues. Understanding the switch-node waveform enables predicting the converter’s EMC characteristics as well as optimizing EMC filter design at an early design stage.

This article compares three automotive step-down converters to provide practical advice on using switch-node waveforms to predict EMC characteristics for automotive CISPR 25 Class 5 measurements. This is helpful to optimize EMC filter design and PCB layout to meet CISPR 25 Class 5 standards.

Switch-node measurements

Switch-node waveforms are used to compare the EMC characteristics among three automotive step-down converters. Figure 1 shows the switch-node measurement on an evaluation board using an active voltage probe.

Figure 1 Use an active voltage probe for the switch-node measurement on the evaluation board. Source: Monolithic Power Systems

The switch-node voltage waveform typically has a rising time and falling time between 700 ps and 2 ns. This requires a minimum oscilloscope bandwidth of about 1 GHz on the voltage probe tip, where the voltage can be measured with an active probe or a passive probe that has the necessary bandwidth.

For both variants, the ground connection to the PCB must be as short as possible to ensure that the measured ringing on the switch node does not include the additional ringing from the long probe ground connection.

Figure 2 shows the correct voltage probe tip position for the switch-node measurement on the evaluation board. Connect the GND tip as close as possible to the IC’s PGND pin and connect the probe input tip as close as possible to the IC’s switch-node pin. Solder the active probe tip with a 0.7-pF input capacitance directly to the component pads via removable gold-plated measuring tips.

Figure 2 Position the probe tip correctly for the switch-node measurement on the evaluation board. Source: Monolithic Power Systems

Histogram and time trend

Figure 3 shows a step-down converter’s switch-node voltage (yellow trace), fSW histogram (pink trace), and time trend (orange trace).

Figure 3 The dual frequency spread spectrum of the MPQ4371-AEC1 includes the switch-node voltage, fSW histogram, and time trend. Source: Monolithic Power Systems

The oscilloscope measures the switch-node voltage for each trigger event across a period of 400 µs and calculates the frequency of each switching cycle. Each calculated frequency is accumulated in the histogram. The total duration of this test is about 10 minutes. For the last trigger event, the measured frequencies are represented as time trend fSW vs. time.

The measured frequencies in Figure 3 verify the fSW vs. time relationship from the MPQ4371-AEC1 datasheet. The time trend waveform confirms the specified dual frequency spread spectrum modulation frequencies of 15 kHz and 120 kHz. By verifying proper IC operation, these frequencies provide an overview of the expected fSW values for CISPR 25 Class 5 measurements.

Voltage waveform

Step down converter’s switch-node voltage waveform is measured with an active probe. Figure 4 shows the rising and the falling edges of MPQ4371-AEC1, in which both waveforms are overlaid on the oscilloscope by an alternating rising and falling trigger. The rising edge has a rising time of 922 ps and a step response with a 273 MHz resonance frequency and a 3.2 V peak-to-peak voltage.

Figure 4 The switch-node voltage waveform for MPQ4371-AEC1 has rising and falling edges. Source: Monolithic Power Systems

The MPQ4371-AEC1 step-down converter’s Quiet-FET technology enables combining fast slewing edges without excessive ringing. Quiet-FET technology does not significantly degrade efficiency like a snubber or bootstrap resistor (RBST), and instead uses a minimum two-step sequential switching action to turn on the internal MOSFETs.

The resonance frequency is determined by the parasitic hot-loop inductances and capacitances. The equivalent hot-loop series inductances (ESL) are defined by the following:

• ESL of the 100 nF, 0603-sized MLCC (about 800 pH)
• ESL of the high-side MOSFET (HS-FET) and low-side MOSFET (LS-FET)
• ESL of the package lead frame
• ESL of the PCB traces between the MLCC and IC’s VIN and PGND pins (about 700 pH/mm)

The switch-node waveform can also be predicted using a simulation of the PCB hot-loop network.

Frequency domain

Figure 5 shows a fast Fourier transformation (FFT) of step-down converter’s switch-node waveform. The average fSW of 420 kHz is distributed between 384 kHz and 456 kHz (green markers) and corresponds to the measured histogram from Figure 3. The switch-node resonance frequency at 273 MHz is distributed between 250 MHz and 300 MHz (red markers) due to dual frequency spread spectrum modulation and corresponds to Figure 4.

Figure 5 A fast Fourier transformation is applied to the MPQ4371-AEC1’s switch-node waveform. Source: Monolithic Power Systems

Radiated emissions (RE) antenna for CISPR 25 Class 5

The vertical monopole, biconical, and log periodic antenna measurements in CISPR 25 Class 5 can be analyzed. Figure 6 shows the radiating switching inductance at peak CISPR 25 (blue) and average CISPR 25 (yellow), where the analyzer resolution bandwidth (RBW) = 9 kHz, fSW = 420 kHz, input voltage (VIN) = 13.5 V, output voltage (VOUT) = 3.3 V, and load current (ILOAD) = 2.5 A. The dual FSS modulation is helpful to maintain RE below the limits.

Figure 6 The vertical monopole antenna measurement of MPQ4371-AEC1 passes CISPR 25 Class 5. Source: Monolithic Power Systems

Figure 7 shows the radiating objects (for example, the harness or radiating traces on the PCB) at peak CISPR 25 (blue) and average CISPR 25 (yellow), where RBW = 120 kHz, fSW = 420 kHz, VIN = 13.5 V, VOUT = 3.3 V, and ILOAD = 2.5 A.

Figure 7 The biconical antenna measurement of MPQ4371-AEC1 passes CISPR 25 Class 5. Source: Monolithic Power Systems

Figure 8 shows the switch-node resonance frequencies between 250 MHz and 300 MHz (corresponding to Figure 4 and Figure 5) at peak CISPR 25 (blue) and average CISPR 25 (yellow), where RBW = 120 kHz, fSW = 420 kHz, VIN = 13.5 V, VOUT = 3.3 V, and ILOAD = 2.5 A. There is no RE that exceeds the 250 MHz to 300 MHz resonance frequency range.

Figure 8 The log periodic antenna measurement of the MPQ4371-AEC1 passes CISPR 25 Class 5. Source: Monolithic Power Systems

Figure 9 shows the 1.2 GHz switch-node resonance frequency within RE at peak CISPR 25 (blue), average CISPR 25 (yellow), and the noise level (gray), where RBW = 120 kHz, fSW = 2.2 MHz, VIN = 13.5 V, VOUT = 3.3 V, and ILOAD = 2.5 A.

Figure 9 The log periodic antenna measurement of the MPQ4323M-AEC1 step-down converter passes CISPR 25 Class 5. Source: Monolithic Power Systems

Switch-node waveform for MPQ4323M-AEC1

The MPQ4323M-AEC1’s integrated, 100 nF, hot-loop MLCCs reduce the internal parasitic inductances, which shifts the resonance frequency to higher values and reduces the resonance amplitude. Figure 10 shows an example of a fast slewing, switching converter combined with low internal parasitic inductances. This improves the switch-node waveform and reduces RE.

Figure 10 A fast-slewing switching converter combined with low parasitic inductances improves the switch-node waveform of the MPQ4323M-AEC1 step-down converter. Source: Monolithic Power Systems

Switch-node example on a 2-layer PCB

Figure 11 shows two different step-down converters soldered on the same 2-layer PCB. The left curve shows the MPQ4326-AEC1 with frequency spread spectrum modulation on a 2-layer PCB, with a switch-node resonance at 450 MHz. The right curve shows a step-down converter in a suboptimal set-up without FSS modulation and a 320 MHz resonance. The two converters are compared on the same PCB and with the same external components.

Figure 11 Two step-down converters are compared in a switch-node example on a 2-layer PCB. Source: Monolithic Power Systems

The step-down converter with the suboptimal set-up indicates undesirable resonance on the rising edge (red arrow), meaning there is a timing difference between the HS-FET and LS-FET. This resonance is caused by using a 2-layer PCB instead of a 4-layer PCB. Compared to a 4-layer PCB, a 2-layer PCB layout has higher parasitic inductances within the hot loop, which increases the resonance amplitude and changes the location of the switch-node resonance.

The increased amplitude is observed with both converters. In addition, the 2-layer PCB does not have the important solid ground layer directly under the top layer, resulting in a larger resonance amplitude and stronger RE.

FFT of step-down converters on a 2-layer PCB

Figure 12 shows the FFT of the switch-node voltage waveforms for the MPQ4326-AEC1 (with FSS modulation) and step-down converter with the suboptimal set-up (without FSS modulation) from Figure 11.

Figure 12 A fast Fourier transformation is applied to the switch-node voltage waveforms for the MPQ4326-AEC1 (with FSS modulation) and step-down converter with a suboptimal set-up (without FSS modulation). Source: Monolithic Power Systems

MPQ4326-AEC1 uses frequency spread spectrum modulation, while the step-down converter with the suboptimal set-up is set to a constant fSW. Typically, FSS modulation results in lower fundamentals and harmonics. Whether FSS modulation or a constant frequency is more advantageous depends on the requirements of the application. However, FFT shows the differences between the two methods.

MPQ4326-AEC1’s FFT shows the switch-node resonance at 450 MHz, and the step-down converter with the suboptimal set-up shows the switch-node resonance at 320 MHz. These switch-node resonance frequencies can be found in the CISPR 25 Class 5 measurements.

Understand switch-node waveform

This article analyzed the relationship between the switch-node voltage waveform and the frequency domain, using MPQ4323M-AEC1, MPQ4326-AEC1, and MPQ4371-AEC1 automotive step-down converters as examples. Understanding the switch-node waveform enables predicting PCB behavior for CISPR 25 Class 5 measurements. The measured resonance frequency shows up in RE measurements, enabling improved EMC filter design for suppressing the resonance frequency.

Furthermore, it is possible to assess expected frequency range interferences at an early stage by understanding the switch-node waveform. This helps find a suitable step-down converter according to the application specifications, shorten development times, and reduce costs by simplifying component selection for the EMC filter.

Ralf Ohmberger is a staff applications engineer at Monolithic Power Systems (MPS).

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