Новини світу мікро- та наноелектроніки

Infineon Technologies AG of Munich, Germany has developed what it says is the first 300mm power gallium nitride (GaN) wafer technology to be applied in an existing and scalable high-volume manufacturing environment, helping to drive the market for GaN-based power semiconductors. Compared with 200mm-diameter wafers, 300mm wafers allow the production of 2.3 times more chips per wafer...

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Independent power electronics company Quantum Power Transformation (QPT) Ltd of Cambridge, UK — which was founded in 2019 and develops gallium nitride (GaN)-based motor drives — has appointed Dr Simon Hart as an advisor to its board. He is an Honorary Associate Professor and Entrepreneur-in-Residence at the University of Nottingham, and holds C-level roles at several technology companies...

At European Microwave Week (EuMW 2024) in Paris, France (24–26 September), Altum RF of Eindhoven, The Netherlands (which designs RF, microwave and millimeter-wave semiconductors for commercial and industrial applications) is showcasing its featured products and technical expertise in booth #815B at Paris Expo Porte de Versailles...

A European research and industry consortium led by engineered substrate manufacturer Soitec of Bernin, near Grenoble, France has begun work to develop a future generation of high-frequency semiconductors based on indium phosphide (InP)...

Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel has announced the production of Wi-Fi 7 RF front-end module (FEM) devices based on its 300mm radio frequency silicon-on-insulator (RFSOI) technology. Partnering with Broadcom Inc, Tower has enabled fully integrated Wi-Fi FEM devices on a single RFSOI die. The solution delivers superior performance and efficiency compared with existing non-SOI technologies...

The 14-bit scope combines architectural improvements and software support for higher resolution, real-time processing, and enhanced signal analysis.

GlobalFoundries (GF) of Malta, NY, USA has joined the semiconductor startup ecosystem of Silicon Valley-based Silicon Catalyst (the only incubator+accelerator focused exclusively on semiconductor solutions) as a Strategic Partner and an In-Kind Partner (IKP). The partnership will provide innovative start-ups with access to GF’s differentiated platforms to speed the development and commercialization of next-generation IoT, automotive and generative AI applications while anticipating future growth markets such as medical and quantum compute...

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Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has unveiled a silicon carbide module designed to transform the renewable energy, energy storage and high-capacity fast-charging sectors through improved efficiency, durability, reliability and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC bus applications were developed and launched utilizing Wolfspeed’s 200mm silicon carbide wafers...

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has unveiled a silicon carbide module designed to transform the renewable energy, energy storage and high-capacity fast-charging sectors through improved efficiency, durability, reliability and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC bus applications were developed and launched utilizing Wolfspeed’s 200mm silicon carbide wafers...

u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced the external GNSS antenna ANN-MB2 for wide coverage, multi-constellation high-precision applications. Optimized for the u-blox high-precision GNSS technology, ANN-MB2 is well-suited for industrial automation, surveying, autonomous vehicles, mobile robotics and other applications requiring centimeter-level position accuracy in challenging environments.

The u-blox ANN-MB2 is a compact, high-precision real-time kinematic (RTK) antenna that supports L1, L2, E6/B3, L5, L-band, and all major GNSS systems. This all-band antenna features a robust architectural design, superior multipath mitigation, and versatile mounting options. With its excellent price-to-performance ratio, ANN-MB2 is suitable for easy evaluation and fast design-in of wide-band high-precision positioning applications, paving the way for mass-market adoption.

ANN-MB2 engineering samples are available now, and production is planned for Q4 2024.

The post u-blox introduces new all-band GNSS antenna for high-precision applications appeared first on ELE Times.

A new UCIe IP operating at up to 40 Gbps enables more data to travel efficiently across heterogeneous and homogeneous dies—chiplets—in today’s artificial intelligence (AI)-centric data center systems. It supports organic substrates as well as high-density advanced packaging technologies, allowing designers to explore the packaging options that best fit their requirements.

The 40 G UCIe IP solution from Synopsys includes PHY, controller, and verification IP, which makes it a complete protocol stack. The PHY with a controller on top facilitates a seamless connection between two dies via on-chip interconnect protocols—including AXI, CHI C2C, CXS, PCIe, CXL, and streaming—to allow a die-to-die connection between fabrics. Verification IP comes with Synopsys 3DIC Compiler and all the required design collateral and documentation for automated routing flow, interposer studies, and signal integrity analysis.

The 40G UCIe IP is built on a silicon-proven architecture with interoperability to multiple foundry processes. Source: Synopsys

Synopsys claims its 40G UCIe IP supports 25% more bandwidth than the UCIe specification, enabling 12.9 Tbps/mm of data to travel between heterogeneous and homogeneous dies without impacting energy efficiency and silicon footprint. In other words, while complying with the latest UCIe 2.0 specification, the IP solution exceeds the standard with additional bandwidth efficiency.

“Heterogeneous integration with high-bandwidth die-to-die connectivity gives us the opportunity to deliver new memory chiplets with the efficiency needed for data-intensive AI applications,” said Jongwoo Lee, VP of system LSI IP development team at Samsung Electronics.

Key design features

The 40 G UCIe IP, while supporting both UCIe 1.1 and UCIe 2.0 standards, offers additional capabilities for designers to easily integrate die-to-die connectivity IP and simplify overall chiplet design. Start with a single clock reference that supports 100-MHz reference clocking for all UCIe PHYs, eliminating the need for additional high-frequency system PLLs.

The internal PLL generates all the high-speed peripheral clock (pclk) and lower local clock (lclk) frequencies needed during initialization and regular operation. Moreover, the lower local clock is shared with the controller to further simplify system integration. These capabilities simplify clocking architecture, optimize power, and speed up die-to-die link initialization without needing to load firmware.

Next, signal integrity monitors (SIMs) are integrated into the IP for diagnosis and analysis to ensure multi-die package reliability and quality. These test features embedded in the PHY allow high-coverage tests of the PHY at the wafer level for known good die (KGD) and after package assembly. Automotive chiplet designers can leverage the integrated SIM sensors and test and repair functions to build more reliable dies while addressing the demanding automotive requirements.

Then there are vendor-defined messages that enable the use of existing UCIe sideband channels to send low-speed, low-priority communication between dies without hampering the main data path. So, instead of interrupting the high-bandwidth path with this type of traffic, a die can use the UCIe sideband to send commands such as interrupts and telemetry to the other die.

Finally, hardware-based bring-up speeds initialization without needing to load heavy firmware on the remote chiplet. Otherwise, when a UCIe link bring-up uses heavy firmware to be loaded into the die, a separate path would be required to load the firmware. That’s wasteful and time consuming from a design standpoint.

Such capabilities and higher speeds bode well for the UCIe interconnect, a de facto standard for die-to-die connectivity. The support for advanced packaging can also make chiplets development more affordable.

Related Content

• Startup Tackles Chiplet Design Complexity
• How the Worlds of Chiplets and Packaging Intertwine
• Chiplets advancing one design breakthrough at a time
• Chiplets diary: Three anecdotes recount design progress
• Chiplets diary: Controller IP complies with UCIe 1.1 standard

The post New UCIe IP raises the chiplet bandwidth bar to 40 Gbps appeared first on EDN.

Announced today, NXP calls the Trimension SR250 the industry’s first single-chip solution that combines ultra-wideband radar sensing, secure UWB ranging, and on-chip processing.

AI (artificial intelligence) has been making significant strikes in myriad industries, and gaming is no exception. As AI technology evolves, its influence on gaming interfaces is becoming increasingly apparent, reshaping the way players interact with games and how games respond to players. To understand AI’s impact, look at the simple game of Ludo. When you play Ludo online, you witness rolling dice animation, quick transitions from one player turn to the next, and real-time multiplayer interaction.

In this article, we delve into the various ways AI is revolutionizing gaming interfaces.

• Adaptive user interfaces

The creation of adaptive user interfaces is one of the most significant impacts of AI on gaming interfaces. Unlike static interfaces, AUIs adapt and evolve according to the preferences, skill levels, and behavior of the players.

AI algorithms assess data in real-time to tailor the interface, offering a customized experience for each player.

For example, in complicated strategy games, the interface might simplify itself for beginners by highlighting important controls, while experienced players may see more detailed options. This adaptability helps to enhance the player experience and makes games much more accessible to a broader audience.

• NLP (natural language processing)

AI-powered NLP is another groundbreaking innovation that is transforming gaming interfaces. NLP allows players to interact with games more intuitively and naturally by enabling games to comprehend and respond to voice commands.

Take The Elder Scrolls V: Skyrim game, for instance. This game has incorporated voice commands for in-game actions. However, there’s still scope for so much more. Imagine being able to talk with NPCs (non-playable characters) as if they were real people.

The importance of voice interaction in gaming is growing at an exponential rate. It won’t be long before you can converse with NPCs for an immersive experience.

• AI-generated content

AI is playing an integral role in revolutionizing how game worlds are created and expanded. Procedural content generation, powered by AI algorithms, allows game developers to create intricate worlds without the need for manual design for every single element.

Take No Man’s Sky, for instance. This game used AI to generate an entire universe. If you play this game, you’ll be in awe of each planet, offering a unique ecosystem, landscape, and challenges.

Procedural generation is simply one aspect of AI’s impact on game development. Developers are also using AI to dynamically generate content that adapts to the actions of the players.

For instance, AI-powered design tools can assess the performance of players and accordingly adjust the difficulty level in real-time.

• Emotional AI

Another frontier where AI is transforming gaming interfaces is emotional AI. Through the assessment of the facial expressions, physiological responses, and voice tone of the players, emotional AI is able to adjust the game experience according to the emotional state of the players.

The technologies behind emotional AI in gaming are voice analysis, facial recognition, NLP, and biometric sensors.

• AI-driven accessibility

When it comes to making games more accessible to a broad audience, especially those with disabilities, AI plays an important role.

From sign language recognition to voice-controlled interfaces, AI technology is breaking down barriers that have traditionally excluded certain groups from the gaming community.

Take Microsoft’s Xbox Adaptive Controller, for example. This controller allows players with physical disabilities to create personalized control steps tailored to their specific needs.

• Real-time strategy games and AI

AI has been a constant factor in real-time strategy games. Developers use AI to control allies and non-playable opponents. Thanks to recent advancements, developers can now use AI to analyze the players’ strategies and adapt their tactics in real-time. It is also possible to learn from past games to augment performance.

• Smart game design and balancing gameplay mechanics

In the art of game development, a delicate balance exists in the form of balancing gameplay mechanics, player progression, and difficulty curves. AI-powered simulation tools and analytics can assess gameplay data and iteratively fine-tune game mechanics. This ensures the game remains challenging yet enjoyable for players of all skill levels.

Thanks to this data-driven approach, developers are in a better position to create more immersive gaming experiences.

• AI And VR gaming interfaces

VR is considered the future of gaming, and as this technology continues to grow, industry insiders opine that AI will also play a critical role in developing responsive and intuitive VR interfaces.

It is expected that AI will help create immersive environments through predictions of players’ movements. Also, the virtual environments will be adjusted in real-time.

Final thoughts

Don’t make the mistake of thinking AI is just another tool. It is much more than that. This technology is single-handedly revolutionizing and reshaping the gaming industry. It has fundamentally changed the way gaming interfaces are designed and experienced.

From NLP and adaptive user interfaces to AI-generated content and emotion recognition, AI technology is making games much more accessible, personalized, and immersive.

As AI technology continues to make huge strides in the industry, the line between games and players is expected to blur even further. For game developers, the real challenge is to harness the full potential of AI while making sure the game remains enjoyable and accessible for all.

The integration of AI into gaming interfaces is great news for players as it not only aims to enhance player satisfaction but introduces more varieties of games for enthusiasts.

What are your thoughts on AI revolutionizing gaming interfaces? What do you think is next for the industry?

The post A bird’s Eye View of how AI is Revolutionizing Gaming Interfaces appeared first on ELE Times.

The future of mobility will be shaped by automated and autonomous vehicles. With a steadily increasing number of driver assistance systems, a key question remains: How can we guarantee the continuous functionality of these ADAS/AD systems, thereby ensuring road safety throughout a vehicle’s lifetime? Ryme Worldwide and Rohde & Schwarz are answering this by introducing a new solution. It seamlessly integrates radar target simulation into existing workshop environments, enabling comprehensive ADAS and AD testing during periodic technical inspections (PTI).

Maintaining the functionality of advanced driver assistance systems (ADAS) and autonomous driving (AD) features is crucial for long-term vehicle safety and performance. Hence, autonomous vehicle manufacturers must secure approval from transport authorities. Furthermore, preserving ADAS/AD functionality over time demands extra precautions.

Radar target simulators are usually used in the development and production phases of a radar sensor, under controlled laboratory conditions. These simulators are often highly complex, expensive, and designed to operate in a radio frequency controlled laboratory environment. However, Rohde & Schwarz’s innovative approach allows for the first time, cost-effective, high-quality testing of radar sensors in a workshop setting.

A further benefit for PTI testing is that the RadEst can be integrated with the new generation analogue and digital headlight testers from Ryme Worldwide, the R-HLT20/R-HLT30. The column of the headlight tester carries both test systems and can be easily moved with the chassis on rollers. The system can be provided as analogue or digital headlight tester and the customer has the benefit to save the test results and transfer them using the integrated ASA interface. The headlight tester is fully adjustable to cover various headlight technologies, e.g. H7, Xenon, LED and Matrix. The digital headlight tester has an excellent user interface and supports the daily testing routines. One more benefit is to save space as the same occupied testing area can be used for the combined R&S and Ryme solution.

The R&S RadEsT radar target simulator, developed by Rohde & Schwarz, boasts exceptional resilience to external factors, ensuring reliable performance in workshop environments. Its capability to provide precise and repeatable measurements makes it a invaluable tool for accurate real-world assessments. Moreover, with its internal analysis capabilities, R&S RadEsT can directly measure essential radar sensor quality indicators such as EIRP (Equivalent Isotropic Radiated Power) and occupied bandwidth. Its compact and lightweight design allows for easy, flexible integration, all while maintaining a cost-effective price point.

Working in collaboration with Ryme Worldwide and utilizing the R&S RadEsT radar target simulator from Rohde & Schwarz, a foundation has been established to incorporate radar sensor checks in future PTI. This will help ensure the proper functioning of vehicles’ autonomous driving capabilities throughout their lifetime.

The post Ryme Worldwide and Rohde & Schwarz at Automechanika 2024: An innovative way to test radar sensors during PTI appeared first on ELE Times.

Bluetooth SIG promises centimeter-level accuracy when measuring the distance between connected Bluetooth devices.

According to its 2024 Sustainability Report, cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA has established new industry benchmarks including verifiable leadership in ultra-low-carbon solar technology, high-value recycling, respect for human rights, and transparent reporting. First Solar is the largest solar manufacturer in the Western Hemisphere and the world’s largest high-value solar panel recycler...

The M2003 series, with an Arm Cortex-M23 core, now offers 32-bit capabilities to improve system performance in a compact 20-pin package.

Japan-based power semiconductor device maker ROHM Semiconductor and China’s largest tier-1 automotive supplier United Automotive Electronic Systems Co Ltd (UAES, a joint venture established in 1995 by China’s Zhonglian Automotive Electronics Co Ltd and Germany’s Robert Bosch GmbH) have entered into a long-term supply agreement for SiC power devices...