Новини світу мікро- та наноелектроніки

Just a Cheap 8x8 smd led board. It will be a pain soldering all that leds on right position by hand. The IC seems to be a eeprom. The MF condenser fell of the table and I was able to find it (A miracle). submitted by /u/Don_Kozza [link] [comments]

submitted by /u/TheCommentator2019 [link] [comments]

Artificial intelligence (AI) algorithms and supporting hardware will be critical in heralding the next stages of automated and ultimately autonomous driving, and a collaboration between Infineon and ZF as part of the EEmotion project demonstrates the viability of this ambitious technology undertaking.

EEmotion successfully integrated AI into the safety-critical functions of the vehicle control system. Source: Infineon Technologies

The EEmotion project aimed to develop an AI algorithm-based control system for automated driving that ensures more precise trajectory control in various driving situations. The project ran from September 2021 to August 2024, was co-funded by the German Federal Ministry for Economic Affairs and Climate Action and had Infineon Technologies AG as the consortium coordinator.

It began by defining the requirements for AI-based functions while aiming to develop AI in control architectures for safety-critical applications. The project also worked on aspects like the development of secure AI-monitored communication, investigation of the simulative development, and taking validation of vehicle dynamics systems into account.

As part of this project, Infineon joined hands with ZF Group to create and implement AI algorithms to develop vehicle control software. These AI algorithms—proven in a test vehicle—controlled and optimized all actuators during automated driving according to the specified driving trajectory.

ZF added AI algorithms to its two existing software solutions cubiX and Eco Control 4 ACC. The cubiX software makes it possible to control all chassis components in passenger cars and commercial vehicles. Next, Eco Control 4 ACC, a predictive cruise control system, was upended using a computationally intensive optimization algorithm and model-predictive control to achieve as much as 8% more range under real driving conditions.

These software solutions with added AI content were implemented on Infineon’s AURIX TC4x microcontroller with integrated parallel processing unit (PPU). This MCU, offering ample computing power, is capable of supporting AI modelling, virtualization, functional safety, cybersecurity and networking functions.

The outcome of loading ZF’s software solutions with added AI algorithms on AURIX TC4x MCU was a demonstration of automated lane changes much more accurately and an energy efficiency boost in adaptive cruise control. This shows how such improvements in driving performance while using lower compute power devices like MCUs could pave the way for cost-efficient Level 2+ assistance systems.

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As part of the ‘Spark their imagination; power their future’ project funded by Innovate UK and run by Compound Semiconductor Applications (CSA) Catapult and the UK Electronics Skills Foundation (UKESF), a total of 24 Year 13 students from across Wales have been awarded bursaries to provide support while they complete electronics-related degrees and help them start careers in technology...

In cooperation with Dr Hermann Oppermann of the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Dr Norwin von Malm (senior director New Technologies) and Stefan Groetsch (who leads the corresponding team within System Solution Engineering) at ams OSRAM GmbH in Premstätten, Austria and Munich, Germany comprise one of three teams nominated as a finalist for the Deutscher Zukunftspreis 2024 (German Future Award), the Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), China-based Chengdu InSiGa Semiconductor Technologies Co Ltd and POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — have developed and are showcasing in a live demonstration the combination of POET’s 200Gx4 transmit optical engine using InSiGa’s 200G/lane EML driver ISG-D9616 for 800G and 1.6T modules...

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet sources. The platform offers three core services—design, packaging, and production—to improve the efficiency of assembling complex semiconductor designs.

In the chiplet era, advanced packaging capacity is increasingly constrained. Faraday’s platform tackles this issue by coordinating vendors for chiplets, high bandwidth memory (HBM), interposers, and 2.5D/3D packaging. It provides a one-stop solution with services including chiplet design, testing, production planning, procurement, inventory management, and advanced packaging. Tailored to diverse client needs, the platform ensures a reliable supply of critical components.

In addition, Faraday specializes in designing and implementing key chiplets, such as I/O dies, SoC/compute dies, and interposers. The company partners with UMC, Samsung, Intel, and OSAT providers to deliver advanced packaging solutions. These include system-level design, power and signal integrity analysis, and thermal dissipation optimization for technologies like Intel’s EMIB, Samsung’s I-Cube, and 2.5D packaging.

Faraday Technology is an ASIC design service and IP provider, certified to ISO 9001 for quality management and ISO 26262 for functional safety in automotive systems. Its silicon IP portfolio includes I/O, memory, ARM-compliant CPUs, and high-speed interfaces like USB, Ethernet, SATA, PCIe, and SerDes.

Faraday Technology 

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Thine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition in Frankfurt, Germany. By eliminating DSPs from optical communication systems in data centers, the chipset reduces power consumption by 60% and lowers latency by 90%.

Current advanced optical communication systems for PCIe often face challenges with high power consumption and signal processing delays, particularly with silicon-photonics lasers and DSP-equipped VCSEL drivers. To address these issues, THine’s chipset for PCIe 6.0 integrates a VCSEL driver and transimpedance amplifier into a DSP-free active optical cable (AOC) solution.

This optical PAM4 64-Gbps chipset leverages THine’s analog technology to eliminate DSPs from optical modules and end-point ASICs, achieving accurate signal recovery and improvements in power efficiency. The complany also plans to develop an advanced optical chipset for PCIe 7.0.

A datasheet for the PAM4 PCIe 6.0 chipset was not available at the time of this announcement.

THine Electronics

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Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and MEO satellites. Using the Compact Antenna Test Range (CATR) method, the chamber simulates long-distance communication conditions, such as those encountered in satellite communication, over a short physical distance. It is also capable of accommodating one of Japan’s largest antennas, with an aperture of up to 80 cm.

Designed with high-quality radio wave-absorbing materials on the ceiling, walls, and floor, and equipped with parabolic reflectors, the chamber suppresses unwanted reflections and measures performance over a short distance. While typical chambers require over 60 meters to test an 80-cm aperture antenna, Sharp’s CATR-based setup achieves accurate measurements over approximately 7 meters across a frequency range of 10 GHz to 40 GHz.

In addition to supporting Ku/Ka bands used for satellite communications, the anechoic chamber also accommodates measurements in the upper mid-band (FR3 6 GHz to 24 GHz), a potential frequency range for 6G deployment. The new chamber facility, launching this month, will enable testing and technical verification of various products, including next-generation smartphones.

Sharp

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Two Hall-effect switch families, the unipolar AH332xQ and omnipolar AH352xQ from Diodes, offer a range of operating sensitivity options. The automotive-compliant ICs are suitable for a wide range of contactless position and proximity detection applications, including seatbelt fastening, door and trunk latching, windshield wipers, and steering wheel locks.

The unipolar AH332xQ switches provide 10 sensitivity options, ranging from a highly sensitive 30 G BOP to a low-sensitivity 275 G BOP. The omnipolar AH352xQ series includes three high-sensitivity options from ±20 G BOP to ±40 G BOP. Both series feature tight operating and release thresholds with sufficient hysteresis for reliable operation, while a low temperature coefficient ensures stable switching points.

These devices support a wide input voltage range of 3 V to 28 V and are AEC-Q100 Grade 0 qualified, with an extended temperature range of -40°C to +150°C. They deliver ESD protection exceeding 8 kV HBM and 1 kV CDM, along with 40-V load-dump capability. Packaging options include SIP-3, SOT23 (Type S), and SC59.

The AH332xQ and AH352xQ Hall-effect switches cost $0.30 each in lots of 3000 units.

AH332xQ series product page

AH352xQ series product page

Diodes

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Infineon has introduced 300-mm power GaN wafer technology within a scalable, high-volume manufacturing environment. The company notes that 300-mm wafers offer significant technological and efficiency advantages over 200-mm wafers, producing 2.3 times more chips per wafer due to the larger diameter.

Infineon manufactured 300-mm GaN wafers on an integrated pilot line in its existing 300-mm silicon production facility in Villach, Austria. The company is drawing on its expertise in 300-mm silicon and 200-mm GaN production and plans to scale GaN capacity according to market demand.

A key advantage of 300-mm GaN technology is its compatibility with existing 300-mm silicon manufacturing equipment, as the production processes for gallium nitride and silicon are quite similar. Once fully scaled, 300-mm GaN production is expected to achieve cost parity with silicon at the RDS(on) level, enabling comparable costs between Si and GaN products.

Infineon will present its 300-mm GaN wafers at the electronica trade show in November 2024 in Munich, Germany.

Infineon Technologies 

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Should get the boards hot and crispy plenty fast with 70W of heating :) submitted by /u/katze1339 [link] [comments]

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — has announced a reorganization of its engineering team to streamline design, component engineering and new product introduction (NPI) activities globally, in response to active customer demand for 800G-and-higher products directed at the AI systems and hyperscale data-center markets...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — is showcasing live demonstrations of the following optical products designed for the rapidly accelerating AI systems and hyperscale data-center markets...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — says that its transmit and receive optical engines have been selected by Mentech Technology of Shenzhen, China(which supplies datacom and telecom components, including 200-800G optical modules for data-center networking infrastructure) for use in the development of 800G pluggable transceivers. The sample purchase orders are for initial builds and engineering development...

Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has partnered with distributor Flip Electronics of Alpharetta, Georgia, which will maintain inventories of its wafers for military applications, ensuring a consistent and reliable supply of critical components...

The highly anticipated Bluetooth 6.0 specification is here, and one of its most notable features is the addition of channel sounding, a two-way ranging technique between two Bluetooth Low Energy (LE) devices. While Bluetooth LE is known for its low power consumption and cost effectiveness, it isn’t an optimum solution for reliable and accurate ranging.

Bluetooth Channel Sounding addresses these shortcomings by improving reliability and accuracy with distance measurement capabilities. That will significantly enhance high-volume applications such as personal item tags and key fobs, where presence detection and proximity sensing are crucial. Channel Sounding can be integrated into Bluetooth devices using a single antenna without requiring significant hardware modifications.

What’s Bluetooth Channel Sounding

Bluetooth Channel Sounding—a new protocol stack designed to enable secure and precise distance measurement between two Bluetooth LE-connected devices—unlocks a world of possibilities for embedded developers. It enables Bluetooth received signal strength indicator (RSSI) to open the door for a new wave of applications in localization and proximity awareness.

Localization applications like pet and asset trackers utilize locator devices to find the exact position of a tracking device. Next, proximity awareness applications such as smart locks and keyless entry systems utilize enhanced security features to restrict and control access to secure spaces and systems.

Figure 1 Bluetooth Channel Sounding improves accuracy to the sub-meter level and can be used in consumer, commercial and industrial applications. Source: Silicon Labs

So far, Bluetooth RSSI has relied on estimations to determine location, which leads to issues like multipath and obstruction. That, in turn, significantly reduces accuracy. Bluetooth Channel Sounding addresses this by improving accuracy to the sub-meter level. “The Bluetooth SIG’s adoption of Channel Sounding significantly enhances the precision of previous Bluetooth distance measuring techniques and encourages innovation across the Bluetooth device ecosystem.,” said Øyvind Strøm, EVP of BU Short Range at Nordic Semiconductor.

Security is of utmost importance to ensure that no unauthorized user can access the network. Channel Sounding incorporates robust security features to protect against tampering and man-in-the-middle (MITM) attacks. That’s crucial in applications like smart door locks, home appliances, and Find My solutions. For instance, Channel Sounding ensures lock only opens when the authorized device is within a certain distance.

How it works

Bluetooth Channel Sounding uses two proven ranging methods—phase-based ranging (PBR) and round-trip time (RTT)—to deliver true distance awareness between Bluetooth-connected devices. The connected devices use PBR, RTT, or both to coordinate ranging data between up to 72 channels within the 2.4 GHz spectrum and use one to four antenna paths between the two connected devices.

PBR utilizes the difference between the phase of the transmitted and received signal to calculate the distance between the initiator and reflector devices. It compares the phase difference between these devices to accurately measure the distance between them. An initiator device sends a signal to a reflector device, which returns the signal, and this process is repeated across multiple frequencies.

Figure 2 PRB delivers precise distance measurements between two Bluetooth devices using the number of wave cycles needed for the signal to go from the transmitter to the receiver. Source: Bluetooth SIG

In RTT, the secondary ranging method, an initiator device sends cryptographically scrambled packets to a reflector device, which returns the packets. Next, the distance between the devices is calculated based on the time the packets traveled back and forth.

Figure 3 RTT uses time of flight (ToF) to estimate the distance between the initiator and the reflector and cross-check the PBR measurement. Source: Bluetooth SIG

RTT can be used to verify and cross-check the PBR measurements. This cross-verification process helps detect anomalies and ensure applications are secure. For instance, it serves as a countermeasure against sophisticated man-in-the-middle attacks.

True location awareness

Channel Sounding is expected to be widely adopted in mobile phones and a broad range of products such as Bluetooth mice, keyboards, and game controllers. Then there are Find My applications—Bluetooth tags attached to personal items such as keys, wallets, backpacks, and luggage—where developers can add true distance awareness to make it easier and quicker for users to locate lost items.

After Bluetooth SIG’s adoption of Channel Sounding as part of Bluetooth 6.0, Nordic Semiconductor has announced support for the technology in its forthcoming nRF54L and nRF54H Series RF chips. Silicon Labs has also announced the integration of this technology in its xG24 wireless chips and antenna hardware solutions.

Channel Sounding technology in Bluetooth 6.0 marks a significant step in the evolution of modern wireless, and its true wireless awareness is expected to unlock new use cases while optimizing existing ones. As Ross Sabolcik, senior VP of the Industrial and Commercial Business Unit at Silicon Labs, puts it, in a world where location awareness is critical, Channel Sounding revolutionizes proximity and location capabilities, propelling Bluetooth technology into a new era.

Related Content

• Bluetooth low energy (BLE) explained
• Inside Bluetooth low-energy technology
• The basics of Bluetooth Low Energy (BLE)
• Waking Up to Thrill of Bluetooth’s 3rd Innovation Wave
• Bluetooth Channel Sounding Improves Distance Estimation Accuracy

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The JEDEC Solid State Technology Association (which develops standards for the microelectronics industry) has published ‘JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices’. Developed jointly by the JC-70.1 Gallium Nitride and JC-70.2 Silicon Carbide Subcommittees of JEDEC’s JC-70 Wide Bandgap Power Conversion Semiconductor Committee (which was formed in October 2017 with 23 member companies, rising to over 80 now), JEP200 is available for free download from the JEDEC website...