Новини світу мікро- та наноелектроніки

A great deal of engineering effort and a great deal of political effort are being put forth to bring electric vehicles (EVs) into the modern world. EV advantages are asserted and re-asserted and re-re-asserted all over mass media, but I myself have grave doubts about those assertions. Frankly, I see many negative attributes of EVs, some of which have been written up as “debunked”, but I do not agree with those authors. I hold that there are real issues involved about which I’ve read and still do read from time to time.

Please consider the following and where shown, a related link:

1. Zero CO2 emissions are claimed as a desirable EV trait but their electrical energy often comes from power plants that burn fossil fuels which put out the CO2  emissions anyway.
2. EVs are extremely heavy which leads to faster tire wear. Roadway accumulations of tire dust from EVs are worse than from conventional vehicles and are a worsened source of particulate air pollution.
3. The acceleration and deceleration traits of EVs are different from those of conventional vehicles. Those EV movement traits have been reported to induce vehicle occupants into car sickness.
4. EV batteries have finite service lives and must then be replaced at costs that can be in the multi-thousands of dollars. Some buyers of used EVs have discovered to their horror that their EV battery was close to end-of-life and did indeed fail after only a short while after purchase. Also, disposal issues for old EV batteries (landfills, recycling) seem to not yet have been successfully addressed.
5. EVs can be costly to repair. There are several reasons for high repair costs as cited in this article. For example, in the interest of cutting costs of manufacture, some EVs are assembled using single-piece steel body. In such cars, one cannot just replace a damaged fender. Any bodywork such as from a “fender bender” can require metal repair work costing multi-thousands of dollars.
6. EV charging stations are vulnerable to vandalism. Charging cables are reputed (true or not) to contain enough copper to make cutting and stealing those cables profitable, thus leaving some charging stations inoperable and leaving some drivers stranded.
7. EV batteries have erupted in uncontrollable (rapid and intense) fires, sometimes even in parked vehicles. Such fires have been observed to re-ignite even when they appear to have been quelled. Such fires tend to erupt with great rapidity thus inhibiting vehicle escape and making occupant survival less likely. Although the likelihood of an EV fire is said to be less than the likelihood of a conventional car fire, the consequence of an EV fire when it does occur seems to be very much worse.

To me, the battery and battery fire issues are especially troubling. As shown in the screenshot from my cell phone below (Figure 1), in just one afternoon I came across all of these headlines and one particularly distressing image (Figure 2)

Figure 1 A screenshot of headlines found in a single afternoon related to EVs.

Figure 2 Screenshot image of an EV battery car fire.

The underlying truth is that present day EV and EV battery technologies have many shortcomings. While each of those headlines suggests that great efforts are being made toward overcoming those shortcomings, we ain’t there yet.

Maybe if I someday become personally convinced that success has been achieved and all of the above issues have been resolved, if I become convinced that my family will not be riding in danger of immolation, I might consider the purchase of an EV, but under present day circumstances, ab-so-lute-ly not.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The SARA-S528NM10, powered by the UBX-S52 cellular/satellite chipset and M10 GNSS platform for low-power and concurrent positioning, expands the company’s cellular portfolio for the satellite IoT market based on the 3GPP Rel 17 specification for global connectivity.

u-blox, a global provider of leading positioning and wireless communication technologies and services, has launched its first combined 3GPP-compliant terrestrial network (TN) and non-terrestrial network (NTN) IoT module, the SARA-S528NM10. This standards-based module is a game changer for the satellite IoT market as it supports global coverage with accurate, low-power and concurrent positioning – an essential attribute for use cases requiring continuous or cyclic asset tracking and monitoring. Other IoT use cases include aftermarket telematics, industrial monitoring and control, smart metering and utilities, and fleet management.

With cellular networks covering a mere ten percent of the globe, the demand for guaranteed global reach is escalating, particularly for IoT applications such as asset tracking in remote or maritime environments. Satellite IoT bridges this gap; adoption has been partially limited by the high cost of the satellite terminals, high power consumption and the high cost of satellite airtime. Even so, ABI Research, a leading technology intelligence firm, predicts the satellite IoT market will exceed USD 4 billion by 2030*.

Current satellite connectivity solutions require proprietary hardware and software, which lock the terminal to a specific satellite operator – the user would need to replace their satellite terminals to move to a different satellite operator. The u-blox solution, on the other hand, is based on global 3GPP standards, and can be certified as interoperable with multiple satellite providers supporting the standard, maximizing customer choice.

“The new u-blox satellite IoT-NTN cellular module is designed to maintain connectivity in areas without cellular coverage,” explained Stephan Zizala, u-blox CEO. “The integrated u-blox GNSS solution consumes less than 15mW of power in continuous tracking mode and has high RF sensitivity that reduces the time required to establish a position fix. It provides concurrent location data without interrupting the cellular or satellite connection, which further helps to minimize power consumption due to the shortened active time of the device.”

Powered by the u-blox UBX-S52 cellular/satellite chipset and GNSS M10 platform, the module complies with the 3GPP Rel 17 NB-NTN specification. This standards-based approach guarantees extended connectivity via LTE-M and NB-IoT on terrestrial cellular networks and NB-IoT on geostationary orbit (GEO) satellite constellations compliant with 3GPP Rel 17, including readiness for low-Earth orbit (LEO) satellites. The UBX-S52 cellular/satellite chipset is currently undergoing certification with Skylo, a global NTN service provider, for its satellite network. The certification enables seamless support for both cellular and Skylo satellite connectivity, creating an enhanced and reliable experience that efficiently utilizes resources.

The SARA-S528NM10 module supports all three new NTN bands – n23 (United States), n255 (L-band global), and n256 (S-band Europe) – enhancing and future-proofing its technological credentials. It is pin-compatible with other u-blox cellular-only modules in the SARA form factor, enabling engineers to easily scale up their IoT products using legacy technology without costly redesigns.

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The 2024 edition electronica India, productronica India and SEMICON India 2024 concluded with a historic success as Southeast Asia’s largest platform for electronics industry. The three-day trade fair was a hive of activity as visitors eagerly explored the latest products and technologies from leading suppliers. 839 companies from 29 countries showcased their innovations, while the trade fairs drew 45,532 trade visitors and facilitated over 2,000 buyer-seller meetings.

Hosted at the India Expo Mart Ltd. (IEML), this milestone event played a pivotal role in advancing India‘s electronics industry by providing a crucial platform for stakeholders across the electronics value chain to connect, collaborate, and innovate.

The presence of the Honourable Prime Minister, Shri Narendra Modi, emphasized the increasing global importance of India‘s electronics and semiconductor sectors.

The event was further elevated by the participation of Shri Yogi Adityanath, Hon’ble Chief Minister of Uttar Pradesh. Additionally, the presence of Shri Ashwini Vaishnaw, Minister of Railways, Minister of Information and Broadcasting, and Minister of Electronics and Information Technology, along with Shri Jitin Prasada, Minister of State in the Ministry of Commerce and Industry, and Minister of State in the Ministry of Electronics and Information Technology, underscored the government’s commitment to fostering a robust and innovative electronics sector in India. The participation of Shri Priyank Kharge, Minister of IT & BT, Karnataka, further highlighted the collaborative efforts across states to drive technological growth and innovation.

Reflecting on the success of the trade fairs, Bhupinder Singh, CEO of Messe Muenchen India, states, “electronica India and productronica India 2024 have been a tremendous success, reflecting the dynamic growth of India’s electronics industry. The impressive turnout and innovative showcases, along with our collaboration with SEMICON India, underscore the event’s leading role in developing the electronics ecosystem in India. The new features, including the ‘e-Future conference’ and ‘Embedded NEXT,’ have further elevated the experience, providing vital opportunities for industry leaders to connect and explore emerging trends.”

Dr Reinhard Pfeiffer, CEO, Messe München, echoed this sentiment. He said, “The impressive outcomes of electronica India, productronica India, and SEMICON India 2024 highlight the vitality of the Indian electronics manufacturing sector. The substantial increase in exhibitor and visitor participation emphasizes the sector’s growing significance. The co-location with SEMICON India, MatDispens, and IPCA Expo has cemented the event’s status as India’s premier electronics industry platform.”

“electronica India and productronica India 2024 has been a good platform for Renesas in showcasing our latest innovations to a highly engaged and diverse audience. The scale of the event and the quality of the visitors exceeded our expectations. We were able to establish meaningful connections with potential partners and customers. The networking opportunities allowed us to discuss the future of the electronics industry, while the buyer-seller forums created a direct path to tangible business growth,” Malini Narayanamoorthi, India Country Head, Renesas.

“Participating in electronica India this year was a remarkable experience for us. The event provided unmatched opportunities to connect with decision-makers throughout the electronics supply chain. The volume of visitors and the meaningful discussions we had with industry professionals, government officials, and technical experts were truly invaluable. The energy and enthusiasm within the halls reaffirmed India‘s growing importance in the global electronics and semiconductor ecosystem,” Daphne Tien, Vice President – APAC Marketing and Business Development, Mouser Electronics, Inc.

This edition featured a diverse array of cutting-edge technology solutions and hosted several key conferences on critical aspects of the electronics industry. Highlights included the CEO Forum on MSME-led component manufacturing, the SEMICON India Conference on semiconductor challenges, and the India Display Manufacturing Conference on digital displays. Additionally, the India PCB Tech Conference focused on PCB manufacturing strategies, the Conference on e- Mobility outlined India‘s electric vehicle vision, and the Innovation Forum and e-Future conference showcased groundbreaking advancements and future trends in electronics.

The Buyer-Seller Forum facilitated over 2,000 B2B meetings, creating invaluable opportunities for buyers and sellers to forge new connections and drive business growth. Some of the leading participants in the forum were Maruti Suzuki, Ashok Leyland, Hella, Bosch, Samsung, Hitachi, JIO, AMETEK, Ather, Tata motors, Ultraviolette, Continental and Noise.

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Battery management system (BMS) hardware and software continue to evolve as electric vehicles (EVs) transition to 800-V Li-ion battery systems comprising around 200 individual cells connected in series. Cell measurement accuracy and lifetime design robustness enhance BMS performance to maximize the usable capacity and safety of EV batteries and other energy storage systems.

BMS—essential for managing safe and healthy battery usage—employs battery-related data such as current, voltage, and temperature to ensure optimal performance. Yole Intelligence estimates that the BMS market is poised to surge from US$5 billion in 2022 to almost US$12 billion in 2028.

Figure 1 New BMS designs increasingly incorporate system-level semiconduction solutions while adding software-centric features and capabilities. Source: NXP

Below is a sneak peek at some noticeable developments in BMS hardware and software, respectively. It demonstrates how the BMS solutions are advancing to help extend a vehicle’s battery life.

Battery junction box

The new battery management ICs increasingly aim to offer system-level solutions to more accurately perform voltage measurements for state-of-charge (SOC) and state-of-health (SOH) calculations. Take the case of NXP’s MC33777 battery management IC, which integrates sense, think and act capabilities on a single chip.

While conventional pack-level monitoring solutions require multiple discrete components, external actuators and processing support, this new BMS chip integrates everything needed to monitor a battery pack and react quickly to safety-critical events into a single device. NXP plans to launch this BMS chip at Electronica 2024.

MC33777, which NXP calls battery junction box IC, integrates critical pack-level functions into a single device, reducing design complexity, qualification and software development effort, and cost for OEMs and Tier 1s. NXP claims the MC33777 chip reduces the component count by up to 80%.

Figure 2 MC33777 claims to be the first BMS chip to integrate critical pack-level functions into a single IC. Source: NXP

The battery pack monitoring IC aims to better protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds. According to NXP, MC33777 detects and reacts to a wide matrix of configurable events up to 10 times faster than conventional ICs without waiting for specific current thresholds to be exceeded.

The faster reaction times help to provide additional safety capabilities, like reducing the risk of electric shocks to passengers in case of a crash. Then, there is fuse-emulation capability, which removes expensive and low-reliability melting fuses from the system. That, in turn, leads to significant cost savings for OEMs and Tier 1s and enhances safety for the vehicle occupants.

AI algorithms in BMS

On the software front, while BMS chips like MC33777 claim to reduce software development effort due to hardware implementations, EV battery outfits like LG Energy Solution are employing artificial intelligence (AI) algorithms to bolster BMS capabilities. They are doing this by partnering with chipmakers to improve BMS diagnostics.

Presently, BMS software mostly operates on dedicated hardware, and battery diagnostic technologies are developed based on virtual conditions rather than real-world battery data. Moreover, traditional BMS solutions cannot measure the exact temperature inside an individual battery cell in real time.

LG Energy Solution is teaming up with Qualcomm to bolster its battery diagnostic software with AI hardware and software solutions featured on Snapdragon Digital Chassis, Qualcomm’s BMS solution. The enhanced BMS solution could perform real-time battery health diagnosis by employing sophisticated battery algorithms while utilizing the computing power of semiconductor platforms like Snapdragon Digital Chassis.

Figure 3 ADI and LG Energy Solution are co-developing solutions for precisely measuring battery cells’ internal temperature.

LG Energy Solution is also joining hands with Analog Devices Inc. to co-develop algorithms that could precisely measure the internal temperatures of EV battery cells. The two companies will employ electrochemical impedance spectroscopy (EIS) technology to precisely estimate the internal temperature of individual battery cells without needing a separate temperature measuring device.

That will open the door to improving charging speeds. The EIS technology, primarily used to analyze defects in used batteries, has yet to be commercialized. The success of this joint effort could thrust this promising technology into the commercial mainstream.

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The post New design frontiers in BMS hardware and software appeared first on EDN.

For about two decades now, I’ve owned (and occasionally used) an early 24-element solar cell from SunPower. It’s kept my deep cycle secondary “coach” battery topped up through two generations of Volkswagen camper vans and a multitude of multi-day music festivals and other extended “disconnected” situations. Here’s what I wrote about it back in mid-2005:

We didn’t have access to AC power at our campsite this time, so we brought along the SunPower 24-element solar cell array for some more testing. The refrigerator in Bertha, our ’81 VW Adventurewagen, is an ancient and inefficient Norcold unit. When I exposed the SunPower panel to direct sunlight, it cranked out around 5 amps peak (per the display on the Morningstar regulator), which seemed to be enough to power the fridge and prevent Bertha’s dual-6V ‘house’ marine battery pack from draining (and even, when the current output was especially strong, to simultaneously charge up Bertha’s battery pack, and the one in my laptop, a bit). Direct sunlight, however, is an impermanent phenomenon; the SunPower array (as is the case with any solar cell) is very sensitive to position versus the sun’s orientation. Even if I only slightly tilted the solar cell towards or away from an optimum vertical angle, or adjusted its ‘compass heading’ by just a few degrees, its current output would increase or decrease by several amps.

Here’s what it looks like (after hosing it off to remove the accumulated dust, spider webs, etc.); it has protective frame-inclusive dimensions of 40 ¾” x 20 ¾” (so probably 40”x20” standalone) and weighs around 14.5 lbs.:

And here’s the accompanying Morningstar ProStar PS-15M solar charge controller, which adds another ~2.5 lbs. to the total kit payload:

The solar cell array-to-charge controller intermediary connection looks like this (there’s another mating pair on the other end of the cable that then goes to the PS-15M):

And the controller then tethers to the battery via an in-between connector pair like this one:

The setup has served me long and well, but it’s obviously quite bulky and heavy. Plus, it’s intended pretty much exclusively for bulk battery-charging purposes; there aren’t direct USB outputs for topping off a smartphone, tablet, laptop or other portable piece of equipment, for example. So, shortly after purchasing my solar recharge-compatible portable power station, I came across an $80.57 (inclusive of tax, shipping and insurance) promotion on a 100W (150W peak, supposedly) mobile solar array. I decided to pull the “purchase” trigger, among other motivations as a means of assessing how far solar technology has progressed from efficiency, cost, and other metrics in the past 20-or-so years.

Here’s what it looks like, first using a “stock” photo:

And now from a personal smartphone snap:

Fully unfolded, it’s a bit larger than its predecessor, at ~43” x 23”. But it’s quite a bit thinner:

And quite a bit lighter, too, at ~8 lbs. total. Regarding size, you’ve likely already noticed that it folds to a quarter of its fully unfurled length, where it then fits neatly in an included carry case:

Here’s the electronics module in its entirety, complete with both conventional and QC 3.0 enhanced-power USB-A outputs, along with a USB-C connection, and an 18-V DC output implemented using a recessed 5521 male plug (one of the many things I learned in researching this piece was that “55” refers to the 5.5 mm outer contact diameter while “21” is the 2.1 mm inner contact diameter, with both specs key for successful cabling mating …and of course, polarity is also key for connected-equipment compatibility purposes…):

And here’s what the backside looks like, accompanied by the remainder of the kit:

Although labeled as coming from a company called Foursun (the model F-SP100, to be precise), my research suggests that this solar cell was also (previously?) sold as the iMars SP-B100. Both companies, unsurprisingly, are based in China, reflective of that country’s increasing dominance (albeit with unclear-at-best profitability) as a supplier of solar cells and products based on them.

The F-SP100, as the earlier photo shows, comes with two DC connection cable options. The first, roughly 5 feet long (AWG unknown), has a female 5521 connector on one end and dual terminal clamps on the other, for direct connection to a battery. And as such, you might think that that’s how I connect it to my portable power station, which has battery terminals on its backside too:

But recharging the internal battery is not what those terminals are for! Instead, they’re intended to daisy-chain the portable power station to an external in-parallel battery for longer effective aggregate runtime. For solar recharging purposes, conversely, you leverage (referring again back to the most recent “stock” photo) the “Anderson” connectors (two polarity-appropriate-colored Anderson Powerpole PP15-45s, to be exact):

So how did I get from a male 5521 DC connector to a pair of Andersons? In-between them, in order to physically separate the solar cell from the portable power station (in the hopes of keeping the latter in the shade) is the other included-in-kit DC extension cable, this one also ~5 ft. long (although the specs claim only 1 m in length…mebbe I got a gratis bonus?), AWG again unknown, and with female 5521 connectors on both ends. One end goes to the solar cell (duh). The other mates to a nifty inexpensive 2 ft 14 AWG adapter cable I found on Amazon:

with a recessed male 5521 on one end and dual also-polarity-appropriate-colored Anderson connectors on the other…which plug into the portable power station. Voila!

I admittedly haven’t spent much time yet with the setup, but so far it looks like it’ll address my needs nicely. Yeah, the solar cell only outputs 100 W or so, but as you already know from my previous coverage, that’s all the juice the portable power station will accept as intake anyway (and I’m being generous in even saying that). Its portability is key considering that, as with its predecessor, I’ll need to regularly reorient it for proper sun orientation and peak consequent efficiency. And I still can’t wrap my head around the fact that it only cost me $80 and change at retail. Let me know your thoughts in the comments, please!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Experimenting with a modern solar cell appeared first on EDN.

The United States of America is the third largest manufacturer of the lithium-ion batteries in the world. It occupies this coveted position after China and Poland.

Being the world leader in the manufacturing of lithium-ion batteries, the People’s Republic of China manufactures around 77% of the lithium-ion batteries manufactured in the world. Ranked second is Poland, which manufactures slightly above 6% of the total lithium-ion batteries manufactured in the world. The third rank is occupied by the United States of America, which manufactures around 6% of the total lithium-ion batteries in the world. Hence, Poland is only marginally ahead of the United States of America.

It was only in 2022 that Poland surged ahead of the United States of America to occupy the coveted position of being the second largest manufacturer of lithium-ion batteries in the world.

As far as the domestic market of lithium-ion batteries in the USA is concerned, there exists a huge demand for lithium-ion batteries. It is expected to increase further owing to the increase in the aggregate demand.

It will be so because of the rise in its demand from a multitude of sectors. For instance, rise in the use of electric vehicles, applications in the renewable energy integration projects, boom in the application of consumer electronics, energy storage projects, etc.

In 2023, the lithium-ion battery’s market size in the USA was worth US$ 13.7 billion. By 2032, its market size is expected to be worth US$ 71.6 billion. During the period from 2023 to 2032, it will experience a Compound Annual Growth Rate of 20.1%.

1. Tesla, Inc.

It is an American multi-national company. It manufacturers batteries for cars and home power storage, solar panels, and electric automobiles.

It was incorporated in July, 2003, as Tesla Motors. It was named so after a Serbian-American inventor, Nikola Tesla.

Its head-office is in Austin, Texas.

It invests hugely in developing new lithium-ion technologies. For instance, in 2016, it had set-up a five-year research and development collaboration with Dalhousie University.

It has also acquired many battery manufacturing companies in the past. For instance, Maxwell Technologies, Hibar Systems, and Springpower International.

Its lithium-ion batteries are known for using majorly two types of cathodes. First, nickel-cobalt-aluminium (NCA) cathodes. And second, lithium-iron-phosphate (LFP) cathodes.

Its lithium-ion batteries are known world-over for their high quality and durability.

For the purpose of production of lithium-ion batteries, it has established its Gigafactory across the world. They are situated in Austin, New York, Nevada, Fremont, Shanghai, and Berlin-Brandenburg. Besides these, it is also establishing a new Gigafactory at Neuvo Leon, Mexico.

2. Panasonic Holdings Corporation

It is a Japanese multinational electronics company. It was established in 1918.

Back then, it was called Matsushita Electric Housewares Manufacturing Works. It was established at Fukushima, Osaka. It was renamed as Matsushita Electric Industrial Co., Ltd. in 1935. Similarly, it was renamed as Panasonic Corporation in 2008. In 2022, it became a holding company and was renamed as Panasonic Holdings Corporation.

Its head-office is at Kadoma, Osaka, Japan.

The lithium-ion batteries are manufactured by its constituent company, Panasonic Energy Co., Ltd. It was incorporated in April, 2022. It is also based out of Osaka, Japan.

It manufactures a wide range of lithium-ion batteries. Its cylindrical lithium-ion batteries are used in automotive. Besides, they are used as primary batteries and in storage battery modules.

3. Microvast Holdings, Inc.

It is a battery manufacturing and battery-developing company in the world. It is based out of Stafford, Texas. Besides, it has established its R&D centre in Florida.

It accomplishes all processes involved in the development of lithium-ion batteries, starting from the design, development and the large-scale manufacturing of lithium-ion batteries and its various components.

It has established its manufacturing plants in three countries- the United States of America, China, and Germany.

Its lithium-ion batteries are used in electric vehicles and the utility-scale energy storage systems (ESS).

The special feature of this company is that it manufactures lithium-ion batteries that are customised to the needs of every customer. It customises the manufacturing of lithium-ion batteries after taking into consideration factors such as superior safety, energy density, ultra-fast charging capabilities, and long lifespans. This allows it to produce highly efficient and durable lithium-ion batteries.

Besides, it operates the world’s first ultra-fast charging station. Its lithium-ion batteries are heavily used in this charging station.

4. Wanxiang A123 Systems Corporation

It is a constituent company of the famous Wanxiang Group.

It commenced its operations in 2013. Earlier it operated under the name A123 Systems Corporation, which was operational from 2001 to 2013.

It operates across four countries of the world- the United States of America, Germany, Czech Republic, and the People’s Republic of China.

It owns world-wide patents for super-nano lithium iron phosphate and original seven-series ternary material technology. It owns around 715 patents for battery technology, and more than 546 original invention patents.

It has established a world-renowned research and development system.

It supplies lithium-ion batteries to all the famous automotive companies, spanning from Volkswagen, Renault, General Motors, BMW, Audi, Daimler Benz, Volvo, Porsche, Jaguar Land Rover, and other top overseas OEMs such as Vertiv, Sonnen, etc. Besides, many famous energy storage users, both industrial and household, are its customers.

5. EnerSys

It is among the leading lithium-ion battery manufacturers in the world. It supplies lithium-ion batteries to customers in more than 100 countries of the world.

Its manufacturing process is certified as per the ISO 9000, ISO 9001-2015, ISO 14001-2015, ISO 13485-2016, AS9100D, and IATF 16949.

It is headquartered in Reading, Pennsylvania, United States of America. Besides, it has two regional headquarters. One in Zug, Switzerland. And the other in Singapore.

It manufacturers the famous NexSys® iON series of lithium-ion batteries. They are produced using Nickel-Manganese-Cobalt (NMC) chemistry.

The speciality of these batteries is that they are ideal for applications in heavy-duty operations. Besides, they recharge at a very fast pace, are very durable and have low-upkeep. These qualities lower down the operational costs and make the entire production process very economical.

Owing to all these qualities, its lithium-ion batteries are used in appliances that find applications in grids, telecommunications, medical safety, and climate change. Besides, it is a major producer of lithium-ion batteries for energy storage solutions.

6. Arcadium Lithium

It was established in January, 2024, after the merger of two companies- Livent and Allkem Limited.

The merged company, Arcadium Lithium, has a global footprint. It provides end-to-end services for the manufacturing of lithium-ion batteries.

It is both a miner and processor of lithium. It has vertically integrated the lithium-ion production process, starting from the source to providing product solution. It is capable of applying the latest lithium extraction processes, such as hard-rock mining, conventional brine extraction, and direct lithium extraction.

It has established state-of-the-art research and development facilities, which is used for improving energy storage.

The special feature of its lithium-ion batteries is that they recharge at a very fast pace.

7. Duracell, Inc.

It is a wholly-owned subsidiary of Berkshire Hathaway since 2016.

It manufacturers lithium-ion batteries in a range of sizes. A few such models are known as CR2, 123, 245, and 1/3N. Besides, it manufacturers lithium coin button batteries in a range of products- 2016, 2025, 2032, and lithium-ion button batteries such as LR44, 364, 362/361, 371/370, 377. Also, it manufacturers special lithium-ion batteries such as MN21, CR2, 123, 223, 245, 1/3N, AAAA.

It manufacturers ultra-light lithium ion batteries in three ranges- 28L, 223, and 245.

One of its premium and most famous products is the Duracell High Power Lithium 123 batteries. Its special feature is that they are made up of high-purity lithium. They have long guarantee and lasting power for a range of devices. For instance, sensors, smoke detectors, photo flash, keyless locks, flashlights, electronic dog collars, and bike accessories.

8. LG Energy Solution, Ltd.

It is a lithium-ion battery manufacturing company headquartered in Seoul, South Korea.

It was founded in December, 2020, when LG Chem Energy Solution Business Division, which had started its operations in 1992 shut down its operations in 2020, and transformed into a new company- LG Energy Solution, Ltd.

Its specialisation is the production of lithium-ion batteries for electric vehicles.

9. Samsung SDI America, Inc.

It is an American subsidiary company of Samsung SDI Co., Ltd. The global headquarters of Samsung SDI Co., Ltd., is based out of Yongin, South Korea. Whereas the headquarters of Samsung SDI America, Inc. is situated at Auburn Hills, Michigan, USA.

It manufactures a brand of batteries called PRIMX, also referred as the Prime Battery for Maximum Experience. It is known worldwide for its quality, outstanding performance, and numerous competitive operational advantages. They find their applications in electric vehicles, energy storage system, micro mobility, power devices, and IT devices.

10. East Penn Manufacturing Company

It started its operations in 1946 when DeLight Breidegam Jr., a young Air Force veteran, and his father, DeLight Sr., started a business to manufacture batteries. Their business was located at Bowers, Pennsylvania, USA.

It manufactures the famous deka ready power lithium-ion battery. This battery delivers high intensity performance and is almost maintenance-free.

The post 10 Major Lithium-ion Battery Manufacturers in USA in 2024 appeared first on ELE Times.

In recent EDN design ideas, we’ve seen thermostat designs that meld the functions of sensor and heater into a single device: FET, BJT, or even a simple length of fine gauge copper wire. A virtue inherent in thermostat designs that use a transistor as combined sensor and heater is that independent of whether it’s operated in linear or pulse mode, high efficiency is virtually guaranteed. 

This happens simply because when the power pass device and heater are combined, power dissipated isn’t wasted. Instead, by definition, it’s simply more heat. Result: near 100% efficiency is inevitable! Sadly, life isn’t so simple for a hotwire thermostat. While it too melds sensor and heater, they remain separate from the pass device. The power that it dissipates by operating in linear mode therefore contributes nothing to heating. It’s totally wasted, thus eroding efficiency. The potential for avoiding this inefficiency makes switch mode an interesting possibility.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 shows a design idea that achieves it.

Figure 1 A switch mode thermostat efficiently heats melded copper wire sensor/heater.

Figure 1 shares much in common with a linear sibling: “Hotwire thermostat: Using fine copper wire as integrated sensor and heater for temperature control” whose schematic is found in Figure 2.

Figure 2 Linear mode hot wire thermostat that uses the tempco and I2R heating of 40 AWG copper wire as a melded sensor/heater.

Their respective interfaces with a copper wire melded heater/sensor are essentially identical. Where they differ is the way op-amp A1a controls Q1.

In Figure 2, temperature dependent voltage differences between R1 and R5+R6 are linearly amplified by A1a and applied to Q1’s gate to linearly force hotwire heating to match the setpoint dialed in on R5. The result is good temperature control, but also up to 10 W of dissipation on Q1.

In Figure 1, by contrast, positive feedback around A1a via R7 forces the amplifier to latch Q1 fully ON or OFF in response to the same error signals. This simple difference improves heating efficiency enough that, unlike Figure 2, Figure 1’s Q1 needs no heatsink and the overall circuit runs from only half the supply voltage. 

Heating efficiency depends on hotwire length, and ranges from 83% for 5 feet, to 94% for 15. These numbers compare well to the linear version, that maxes out at about 50%.

Meanwhile, the calibration sequence remains the same for both switcher and linear:

1. Before first power up, allow sensor/heater to fully equilibrate to room temperature.
2. Set R4 and R5 fully counter-clockwise (CCW).
3. Push and hold the CAL NC pushbutton.
4. Turn power on.
5. Slowly turn R4 clockwise until LED first flickers on.
6. Release CAL.

Thanks for the suggestion, Konstantin Kim!

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• Using a MOSFET as a thermostatic heater
• Hotwire thermostat: Using fine copper wire as integrated sensor and heater for temperature control
• Self-heated ∆Vbe transistor thermostat needs no calibration
• Take-back-half thermostat uses ∆Vbe transistor sensor
• Square-root function improves thermostat
• Fixing a fundamental flaw of self-sensing transistor thermostats
• ∆Vbe differential thermometer needs no calibration

The post Switch mode hotwire thermostat appeared first on EDN.

Rohde & Schwarz has successfully passed its re-certification of its EU eCall test solution conducted by the independent test house cetecom advanced. This achievement underscores the commitment of both companies to providing standards- compliant,  Next Generation eCall test solutions and reinforces their position as industry leaders.

The new eCall Delegated Regulation (EU) 2024/1180, which took effect on May 9, 2024, includes updates for 2G and 3G circuit switched (CS) eCall. In response, Rohde & Schwarz has updated its R&S CMW-KA094 eCall end-to-end (E2E) conformance test solution to ensure compliance with the latest eCall regulations and standards such as EN 16454:2023. This update enables manufacturers and suppliers to meet the new requirements and ensures seamless integration of eCall in-vehicle systems (IVS).

The re-certification by cetecom advanced confirms that the R&S CMW-KA094 eCall test software, which simulates a public safety answering point (PSAP), meets the requirements for handling eCalls, receiving emergency data and interacting with in-vehicle eCall systems. This puts manufacturers and suppliers, who use the Rohde & Schwarz solution, in a favourable position for acceptance tests of their emergency call systems and highlights Rohde & Schwarz’s commitment to providing comprehensive and reliable eCall test solutions.

Rohde & Schwarz and cetecom advanced also agreed to continue their cooperation and jointly bring up a standard compliant test solution for Next Generation eCall using 4G and 5G network infrastructure for lab testing. cetecom advanced, a designated technical service for eCall, supports the current revisions of the relevant NG eCall standards from CEN (e.g. EN 17240, EN 17184 and EN 16072) and has a long history in the area of eCall testing, certification and standardization. The test solution is based on the R&S CMX500, an all-in-one 4G/5G radio communication tester, which has been selected by cetecom advanced for their lab as test platform for NG eCall conformance tests. The R&S CMX500 exhibits features such as internal IMS server with MSD via SIP support, VoLTE/VoNR testing for eCall service, and furthermore unique IP and application test capabilities.

With the joint verification of the R&S CMX-KA098 NG eCall test software from Rohde & Schwarz in cooperation with cetecom advanced, customers receive a test solution that complies with the latest CEN standards for NG eCall, thereby enabling the industry to adopt Next Generation eCall which will be mandatory for all vehicle suppliers supplying the European market from 2026.

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To provide its customers worldwide with quick and easy access to service and sales, NORD DRIVESYSTEMS equips their products with QR codes. The paper-free alternative saves time and resources. Furthermore, this digital service allows for direct contact and competent advice by the suitable contact person.

“Almost all NORD production plants now pair our drive components with a QR code”, says Jörg Niermann, Marketing Manager. “Only Brazil is still on its way. With this, all important information is immediately and digitally available.” By using the QR codes, NORD customers worldwide reach their direct contact persons in their respective country organisations. The consultants speak their mother tongue and all data on the particular drive solution is directly displayed on their screen. In case of contact by telephone, the serial number of the drive component must still be provided.

“By scanning the QR code with their mobile phone, customers enter the “Digital Services” selection menu and, apart from direct contact to our service department, get further options,” Niermann adds. For example, with the serial number of their drive components, they can navigate to the drive-specific documentation and gain access to more life cycle services and information on latest products or firmware. “The paper-free and correct drive identification and documentation saves resources. Upon customer request or for your ATEX products, we will of course continue to send the documents.”

The digital service furthermore provides the customer with a list of potential spare parts for their individual drive solution. They cannot only contact their responsible technical support or sales department but also gain direct access to the myNORD customer portal. The drive component’s serial number will always be pre-set and all further actions are linked to it. The parameter data is stored via the NORDCON APP with NORDAC ACCESS BT.

For the future, the company plans to further expand the digital service and to inform on updates, for example for its frequency inverters.

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RS, a trading brand of RS Group plc, a global provider of product and service solutions for industrial customers, proudly marks its 30th anniversary in India, celebrating three decades of excellence, innovation, and commitment in the country. Since its inception in March 1994 with a modest team of eight, RS India has grown into a leading distributor in the industrial sector, with a robust team of 125 professionals and ambitious plans for further expansion.

Over the years, the company has seen remarkable growth, expanding from an initial annual revenue of INR 1.02 crore in 1994-95 to an impressive INR 125 crore in 2024. This success reflects its unwavering commitment to providing high-quality electronic and industrial components, solidifying its position as the preferred choice for numerous businesses across the nation.

Shiv Bhambri, CEO at RS India, reflecting on his 20-year tenure, said, “RS India has been a key player in reshaping the industrial landscape over the past 30 years. We’ve transitioned from traditional offline purchases to implementing global procurement strategies like vendor consolidation and B2B eCommerce. Our commitment to supporting the academic community, especially during COVID-19, highlights our dedication to making a positive impact.”

RS India is deeply committed to sustainability and social responsibility. Our purpose of making amazing happen for a better world reflects our focus on delivering results for people, planet, and profit. Our 2030 ESG action plan, ‘For a Better World’, is designed to deliver long-term value for all our stakeholders. This commitment has earned RS a place among the Top 100 ESG companies worldwide. We also engage in student projects at various engineering colleges & universities including the IIT’s and CSR activities, highlighting our dedication to educational growth and community development.

Keith Rice, Vice President RS Emerging Markets, RS Group said, “As we celebrate this milestone, we extend our gratitude to our customers, partners, and employees for their continued support. Our focus remains on driving Continuous Improvement (CI) and enhancing customer satisfaction, demonstrated by our improved Net Promoter Score (NPS). We are equally committed to sustainability, with green initiatives across the supply chain reinforcing our goal to make a positive impact. We eagerly anticipate a future filled with further innovation and success.”

As we enter the next phase of growth, our commitment is to double the customer base, support the Make in India initiative, drive innovation in industrial procurement, and promote inclusivity and diversity. By embracing new technologies such as Big Data, AI, Blockchain, and System Architecture, Our aim is to remain at the forefront of the industry. The goal is to integrate ESG objectives with supply chain optimization, utilizing AI and digitalization to streamline and standardize sustainability practices.

RS India continues to evolve with the launch of the RS Mobile App, the cutting-edge tool is designed to streamline operations for businesses exporting goods from the UK around the world, offering instant access to a vast catalogue of over 750,000 electronic, electrical, mechanical, test & measurement and PPE products. With real-time stock and price information, the newly launched RS Mobile app embodies our ongoing commitment to efficiency, customer satisfaction, and technological advancement.

As we look to the future, the vision is to continue its double-digit growth through digital transformation in the B2B industrial space while ensuring high levels of customer satisfaction.

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 VIAVI Solutions Inc. introduced the VIAVI Automation Management and Orchestration System (VAMOS), an intelligent automation platform that incorporates AI/ML capabilities to enable wireless and cloud service providers, network equipment manufacturers and their ecosystems to reduce operational expenses and accelerate time-to-market.

The complexity of network architectures continues to increase, as operators and equipment manufacturers investigate the next generation of technology, migrate to the cloud, and leverage AI and ML. Continuous Testing (CT) becomes ever more prevalent to provide a unifying perspective on real-world performance. Yet labs are confronting the dual challenges of more tests and limited headcount. Automation has become a crucial way for them to manage the complexity, scheduling and manpower demands of CT, allowing technicians to efficiently power through hundreds of test cases, and to focus on higher-order analysis and problem solving.

VIAVI has developed VAMOS as part of its industry-leading NITRO Wireless portfolio to automate test campaigns and their execution in one centralized cloud-based, Lab-as-a-Service platform. Built-in AI and ML capabilities enable test optimization and faster response times.

VAMOS’s customizable workspaces and configurations streamline the testing process across organizations and lab locations. Shared tool testbeds and individual sandboxes accommodate multiple test needs while the platform’s robust analytics and reporting help maximize test resource utilization and boost test accuracy.

“As VIAVI works with leading labs around the globe to integrate wireless, cloud and AI, the need for automation and orchestration has never been clearer,” said Ian Langley, Senior Vice President, Wireless Business Unit, VIAVI. “In initial implementations at major labs, VAMOS has already demonstrated significant reductions in cost per test-hour and increases in hardware utilization.”

In addition to providing a standalone solution to schedule and run test campaigns based on VIAVI’s NITRO Wireless portfolio, VAMOS can be integrated with a third-party automation framework, allowing it to interact with a wider range of products and existing test environments. Connection is available via both software and hardware.

VAMOS will be integrated into the VIAVI Automated Lab-as-a-Service for Open RAN (VALOR) for the lab’s on-demand, cloud-based testing. VALOR is designed to manage and support 5G and Open RAN deployments that would benefit from access to tools and expert staff with a minimal ramp-up time. The project is funded by the Public Wireless Supply Chain Innovation Fund.

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element14 Global, a fast and reliable distributor of products and technology for electronic and industrial system design, maintenance, and repair, has announced the launch of its latest data acquisition solution.

This new offering combines NI CompactDAQ hardware with the newly available FlexLogger Lite software at no additional cost. Designed to enhance and accelerate sensor measurement processes, this solution is set to offer engineers a more efficient way to capture sensor data.

The NI CompactDAQ system, renowned for its robust chassis and modular design, is now paired with FlexLogger Lite, a software solution that eliminates the need for programming. This integration allows for faster and more straightforward data collection for voltage and sensor measurements. The streamlined setup and execution are expected to improve overall efficiency in data acquisition tasks, benefiting engineers who require quick and reliable data analysis.

• Speedy Data Access: Quickly get data to your design team, keeping projects on track. With the software it is possible to configure channels, drag-and-drop graphs, and log to Excel in minutes.
• Flexible Customization: Easily adjust the system with a drag-and-drop interface, open file formats, and over 70 compatible measurement modules.
• Scalable Solutions: Start with free logging software and seamlessly scale up to full, automated test executives as your needs evolve.
• Ideal for Engineers and Technicians: Perfect for those measuring voltage, current, or sensor data with a computer.

“We’re excited to roll out this new solution that truly puts our customers at the centre of what we do.’’  said Christelle Mazella, Senior Manager Test & Measurement at element14 “By combining NI CompactDAQ hardware with the intuitive FlexLogger Lite software, we’re making it easier for engineers to capture and analyze data efficiently. This solution is designed to meet our customers’ needs for simplicity and speed, helping them achieve their goals with greater ease.”

This free software is part of NI’s comprehensive software catalog, which includes the LabVIEW+ Suite. It is available for download from https://www.ni.com/en/shop/data-acquisition-and-control/flexlogger.html. Customers who purchase a CompactDAQ system from element14, Newark, or element14 can access this software at no additional cost. There is no need for a separate order or proof of purchase for the FlexLogger Lite package. The software is compatible with both individual modules and bundled systems. Engineers can start with FlexLogger Lite today and easily scale up to the full LV+ suite as their needs grow. element14 also offers comprehensive support and technical resources to optimize your data acquisition capabilities.

The NI CompactDAQ hardware with free FlexLogger Lite software is now available for immediate delivery from Farnell in EMEA, element14 in APAC, and Newark in North America.

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Author: STMicroelectronics

What’s the difference between a microcontroller (MCU) and a microprocessor (MPU)? In simplistic terms, both are the brains of an embedded system. A few years ago, the distinction between the two was significantly starker because they offered vastly different capabilities and demanded widely different engineering skills. Today, the two terms remain, but innovations keep blurring the dividing lines. At ST, we see that integrators who previously only used MCUs now find it easier to grab an MPU. In fact, for some, microprocessors have become a secret weapon because they enable them to offer new applications or enter new markets thanks to their inherent capabilities or their ability to run Embedded Linux. Hence, let’s delve into this new trend.

When the industry came up with the first microcontrollers in the 1970s, it was to find an alternative to overly power-hungry and complex MPUs. MCUs had much less computational throughput but incorporated the memory, processor, peripherals, and clock under one roof. Additionally, they could run a real-time operating system. Consequently, engineers could build deterministic systems with just one device, making them tremendously popular in automotive and motor control applications. Today, MCUs are everywhere, from smartphones to medical or household appliances. Conversely, MPUs dedicated their silicon space to computational units at the expense of power consumption or integration. That made them very attractive when trying to run multiple threads or a more complex OS like Embedded Linux.

An exhaustive exposition of the decision matrix that leads engineers to choose an MPU or an MCU would be overwhelming. However, there are recurring themes, such as computing needs. If an application requires a powerful neural processing unit or a myriad of computing cores and big GPUs, or if it performs contextual computing with lots of memory requirements, an MPU is an obvious choice. Conversely, a tiny software that wakes up occasionally to check a sensor’s value or that needs a deterministic response time of a few nanoseconds will use a microcontroller. Hence, in many instances, the “end justifies the means”. Put simply, an engineer will choose one device over another based on the application it will run.

Another factor could be the graphical needs of a system. Traditionally, human-machine interfaces (HMIs) with complex 3D animations, high-resolution displays, and extensive applications running alongside the UI will gravitate toward the GPU and memory controller of a microprocessor. Alternatively, HMIs that require much simpler animations and graphics are increasingly relying on MCUs. Frameworks like TouchGFX and hardware IPs like NeoChrom GPU continue to optimize what’s possible on a smaller microcontroller. Similarly, MPU for embedded systems also supports higher resolutions thanks to beefier GPUs. Hence, while each type of device is doing more, the demarkation remains pretty straightforward.

Besides computational throughput, developers look at other key metrics like power consumption, volatile and non-volatile memory needs, peripherals required, and number of pins needed. As engineers wrestle with cost constraints, these criteria become critically important because they impact the overall PCB design and bill of materials (BOM). For instance, a lot of flash and additional components will require multiple PCB layers, which increase lead time and costs. Hence, for the longest time, the equation was relatively straightforward. Integrators that focused primarily on cost or low power consumption chose a microcontroller.

Since the early 2000s, MPUs have undergone significant changes. One of the most disruptive innovations in the world of MPUs has been the democratization of System-on-Modules (SoM) and System-in-Packages (SiP) for microprocessors. In years past, integrators had to design the entire system around the microprocessor, which meant dealing with more complex power management systems and a fiddly external memory, among other things. Indeed, using large external DDR memory requires a lot of fine-tuning and unique expertise, which could be a significant barrier to using an MPU. However, SoMs and SiPs remove all this complexity by securely and comprehensively incorporating all necessary components under one package or module.

Additionally, some of the latest ST microprocessors have come a lot closer to the power consumption of a microcontroller. Furthermore, microprocessors can now run a real-time operating system, further blurring the line between MPUs and MCUs. Previously, applications that required real-time execution, like motor control applications, had to run on a microcontroller. Today, engineers have started adopting MPUs to benefit from more computing power and access to larger memory capacity without compromising execution time. Put simply, some integrators are leveraging innovations in MPUs to turn them into a new secret weapon while competitors use MCUs.

The last few years have significantly blurred the lines between high-performance MCUs and entry-level MPUs, making devices like the STM32MP13 a new darling for embedded system developers. Just like an STM32H7, the STM32MP13 supports Eclipse ThreadX on its own. Hence, developers who have never touched a microprocessor suddenly get a familiar environment, and applications that call FileX, NetDuoX, or USBX will run on both. Hence, it’s possible to enjoy a lot more performance without retraining teams or tremendously increasing BoM costs.

Furthermore, STM32 engineers have an additional advantage since the STM32Cube ecosystem of tools works with both our MCUs and MPUs, further lowering the barrier to entry. For instance, initializing the pin-out configuration and clock tree happens on STM32CubeMX. Developers looking to implement secure secret provisioning on their STM32 MPU will use STM32CubeProgrammer, the same application responsible for making secure firmware installs (SFI) more accessible. Consequently, users of our ecosystem have an additional incentive to explore MPUs as a secret weapon that can support new applications because they are already familiar with many of the development tools and concepts that drive all our devices.

The question for many embedded systems developers is no longer whether to venture into the MPU kingdom but how far they will delve into it and where to begin. Since many members of the ST Partner Program have launched SiPs and SoMs with an STM32MP13, the device is a great starting point in the decision-making process of any team looking to make an MPU their secret weapon. The device has one Cortex-A7 running at 1 GHz, which will attract those seeking a simple yet powerful device. The absence of multiple cores also means a low power consumption of 27 µW and the ability to integrate the STM32MP13 into a simple four-layer PCB.

Those wishing for more power will turn to the STM32MP15. The device comes with two Cortex-A7 cores and a Cortex-M4, thus still blurring the lines between MCUs and MPUs while pushing developers further into the land of MPUs. For instance, it’s possible to turn off the Cortex-A7 and use the Cortex-M4 as a traditional MCU to record sensor data while using significantly less power. Moreover, its 3D GPU is OpenGL-compliant, allowing developers to run vastly superior UIs than on a device without a GPU. It also comes with a lot more display interfaces and peripherals. The STM32MP15 can thus help integrator scale their system.

Let’s take the example of a company working on an industrial application, such as a programmable logic controller. Using the STM32MP13 allows them to design a headless yet powerful model. Afterward, developers can take the original design and upgrade the PLC with a display and a human-machine interface (HMI) using a resolution of 1080 x 720, thanks to the STM32MP15. Because the company started with an STM32 MPU, they can use the same Embedded Linux distribution and easily port their application from one MPU to the next. The operating system also runs remarkable UI frameworks, such as Qt or Crank , known for their portability.

Another example is smart thermostats, where the interface is an integral part of the experience. Makers have been differentiating themselves by using various levels UIs and screen sizes to attract a broader range of customers. By moving from an STM32MP15 to an STM32MP13, it becomes possible to run the same underlying application but with different bells and whistles to create a portfolio that covers more needs and price points.

Developers are increasingly concerned about creating products with a longer lifespan and leveraging machine learning at the edge. The latest advances in MPUs have helped them answer those needs by providing greater memory flexibility, which explains why many often adopt an STM32 MPU to stay ahead of the competition. For instance, the new STM32MP25 is our first MPU to support DDR4 and LPDDR4 on top of DDR3. Its 64-bit architecture also means it can address more memory for applications like audio processing and network appliances or run multiple software simultaneously to save resources, thus improving efficiency.

Because most industrial applications will use the same memory interface for a decade or more, it is critical for a microprocessor to offer a memory controller with more flexibility than what is usually found in consumer markets. That’s why ST MPUs always support multiple interfaces, and we ensure the widest compatibility, as demonstrated with the STM32MP25. It makes supporting a system more efficient while also facilitating the creation of design updates and upgrades.

Similarly, many are looking to benefit from machine learning at the edge. Consequently, the STM32MP25 is the first STM32 device to house support a 64-bit architecture thanks to its two Cortex-A35, which are the most efficient Arm core ever released. As a result, it can run more powerful applications while keeping the power consumption down. It also features a neural processing unit (NPU) capable of 1.35 TOPS, and its Vulkan-compatible GPU provides enough power to run a modern UI comfortably on a full HD display. Our new MPUs thus open the door to some of the most demanding applications, like smart cameras capable of people counting or object detection, and new systems like spatial computing.

ST is committing to release more STM32MP2 MPUs to help developers tailor their applications. Indeed, while there are a lot of microcontroller variants of the same series, microprocessors aren’t as varied because they are harder to make. However, as ST optimized its manufacturing capabilities, we plan to release more versions faster and make many of them pin-to-pin compatible. We already announced the STM32MP21 and STM32MP23. The STM32MP21 will provide a Cortex-A35 and a Cortex-M33, two Ethernet controllers, and a camera interface to serve cost-effective computer vision applications at the edge. As for the STM32MP23, it sits between the STM32MP25 and STM32MP21 thanks to its dual Cortex-A35 to enable a rich UI while prioritizing costs.

The post What is an STM32 MPU? Understanding the new realities of microprocessors in embedded systems appeared first on ELE Times.

Infineon Technologies AG is introduced its new StrongIRFET 2 power MOSFET 30 V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30 V solutions in the mass market segment. Optimized for high robustness and ease-of-use, the new power MOSFETs were specifically designed to meet the requirements of a wide range of mass market applications, enabling high design flexibility. Amongst these applications are industrial switched-mode power supplies (SMPS), motor drives, battery-powered applications, battery management systems, and uninterruptible power supplies (UPS)

The StrongIRFET 2 30 V technology offers up to a 40 percent RDS(on) improvement and up to a 60 percent reduction in QG compared to the previous generation of StrongIRFET devices. This translates into higher power efficiency for improved overall system performance while providing an excellent robustness. The new power MOSFETs also ensure an easy design-in and provide simplified product services. The product family’s excellent price/performance ratio makes it an ideal choice for designers looking for convenient selection and purchasing.

The post Infineon announces StrongIRFETTM 2 power MOSFET 30 V portfolio for mass market applications appeared first on ELE Times.

Compact electronics present a unique challenge when it comes to cooling. While thermal management is becoming a growing concern amid increased chip functionality, smaller devices mean there’s less room for conventional heatsinks. And recent breakthroughs in microchannel liquid cooling could change that.

Fluids are 50 to 1,000 times more efficient than air at transferring heat, but the necessary infrastructure is often too large for small Internet of Things (IoT) gadgets. So, advances in precision manufacturing mean liquid heatsinks are smaller than ever before. Some cold plates are as small as 2 cm x 2 cm while dissipating up to 1,000 watts per square centimeter.

Microchannel liquid cooling facilitates more compact device form factors. Source: Sinda Thermal Technology

Such performance comes from a combination of innovative materials and a network of microchannels—fluid channels just a few microns across—that enable small-scale liquid cooling. On-chip cooling takes this potential further. Manufacturers can etch microchannels directly onto the semiconductor substrate, bringing thermal fluids as close as possible to the chip. The design minimizes losses from radiated heat and enables more compact device form factors.

Research shows on-chip liquid heatsinks exhibit 50 times greater cooling performance than conventional microchannels. Such designs also use water as the fluid. Consequently, device manufacturers could see even greater improvements using on-chip microchannels with chemical coolants.

Stacked components

The advent of on-chip microchannel liquid cooling paves the way for other optimizations. Component stacking is among the most promising of these. Removing the need for bulkier cooling infrastructure makes it possible to stack components instead of placing them next to each other without risking excessive heat.

This packaging technique reduces signal latency to improve performance and enables even more compact circuit designs. Manufacturers could use it to their advantage to overcome conventional barriers related to dark silicon.

Future challenges and considerations

A few remaining obstacles may hinder progress for microchannel liquid cooling. Manufacturing costs and complexity are the most prevalent. As effective as these solutions are, etching microscopic channels into sensitive components is inherently risky and difficult. Moreover, doing so at scale may require factories to upgrade to newer micromachining equipment, which could impact the cost-effectiveness of new devices.

However, as this technology matures, its expenses will fall. In the meantime, device manufacturers can take matters into their own hands instead of looking for a semiconductor fab that offers such cooling systems. Studies have found it’s possible to achieve a 44.4% reduction in thermal resistance by etching channels into off-the-shelf consumer-grade chips.

As microchannels enable higher functionality at lower temperatures, the industry may eventually face another challenge. Once thermal constraints no longer hold chip performance back, power delivery might. So, manufacturers could come to the point of designing chips so powerful that powering them is no longer cost-effective.

Such a conflict is likely far away, and new energy delivery technologies could emerge to address it in the meantime. However, the possibility deserves attention. Electronics manufacturers should consider these long-term implications and seek potential solutions as they capitalize on microchannel liquid cooling.

As gadgets keep getting smaller, cooling techniques will have to evolve. Here, etching microchannels directly onto the substrate is a promising solution, especially when combined with component stacking. While some challenges remain, electronics manufacturers can gain a lot by considering these methods and learning to implement them.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

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• Dutch Liquid Cooling Startup ‘Turbocharges’ Gigabyte Servers
• Temperature-Monitoring Systems Optimize Cooling in Power Designs

The post How microchannel liquid cooling trims electronic designs appeared first on EDN.