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Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has released a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages...

An excerpt from Christopher Paul’s “Parsing PWM (DAC) performance: Part 1—Mitigating errors”:

 “I was surprised to discover that when an output of a popular µP I’ve been using is configured to be a constant logic low or high and is loaded only by a 10 MΩ-input digital multimeter, the voltage levels are in some cases more than 100 mV from supply voltage VDD and ground…Let’s call this saturation errors.”

Wow the engineering world with your unique design: Design Ideas Submission Guide

The accuracy of PWM DACs depends on several factors, but none is more important than their analog switching elements’ ability to reliably and precisely output zero and reference voltage levels in response to the corresponding digital states. Sometimes however, as Christopher Paul observes in the cited design idea (Part 1 of a 4-part series), they don’t. The mechanism behind these deviations isn’t entirely clear, but if they could be reliably eradicated, the impact on PWM performance would have to be positive. Figure 1 suggests a (literally) brute-force fix.

Figure 1 U1 is a multi-pole (e.g., 74AC04 hex inverter) PMW switch where op-amp A1 forces switch zero state to accurately track 0 = zero volts, op-amp A2 does the job for 1 = Vdd.

U1 pin 5’s connection to pin 14 drives pin 6 to logic 0, sensed by A1 pin 6. A1 pin 7’s connection to U1 pin 7 forces the pin 6 voltage to exactly zero volts, and thereby forces any U1 output to the same accurate zero level when the associated switch is at logic 0.

Similarly, U1 pin 13’s connection to pin 7 drives pin 12 to logic 1, sensed by A2 pin 2. A2 pin 1’s connection to U1 pin 14 forces the pin 12 voltage to exactly Vdd, and thereby forces any U1 output to the same accurate Vref level when the associated switch is at logic 1.

Thus, any extant “saturation errors” are forced to zero, regardless of the details of where they’re actually coming from.

Vdd will typically be c.a. 5.00V. And V+ and V- can come from a single 5-V supply via any of a number of discrete or monolithic rail boost circuits. Figure 2 is one practical possibility.

Figure 2 A practical source for V+ and V- set R1 and R2 = 200k for ∆ = 1volt.

The Figure 2 circuit was originally described in “Efficient digitally regulated bipolar voltage rail booster”.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

Related Content

• Parsing PWM (DAC) performance: Part 1—Mitigating errors
• Efficient digitally regulated bipolar voltage rail booster
• Cancel PWM DAC ripple with analog subtraction—revisited
• Fast-settling synchronous-PWM-DAC filter has almost no ripple
• Minimizing passive PWM ripple filter output impedance: How low can you go?
• Fast PWM DAC has no ripple
• LTC Design Note: Accurate, fast settling analog voltages from PWM signals

The post Brute force mitigation of PWM Vdd and ground “saturation” errors appeared first on EDN.

Novel Crystal Technology Inc (NCT) of Saitama, Japan, which develops and sells gallium oxide wafers, says that an R&D project related to beta-phase gallium oxide (β- Ga2O3) was adopted by Japan’s New Energy and Industrial Technology Development Organization (NEDO). The project ‘Development of Material Technology for High-Output and High-Efficiency Power Devices/High-Frequency Devices’ is part of the ‘Key and Advanced Technology R&D through Cross Community Collaboration Program’ (K Program) promoted by Japan’s Cabinet Office (CAO), the Ministry of Education, Culture, Sports, Science and Technology (MEXT), and the Ministry of Economy, Trade and Industry (METI)...

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Raspberry Pi, globally recognized for its single-board computers, has revolutionized the education and hobbyist sectors and found applications in industrial equipment. Their versatile products are now included in the TME product catalogue, making advanced technological solutions more accessible. 

Diverse Product Range 

Raspberry Pi’s offerings extend well beyond their renowned single-board computers. Their motherboards feature essential ports like USB, HDMI, and Ethernet, along with SD card slots and GPIO connectors for versatile project integration. The latest Raspberry Pi 5 model introduces a dual-core 64-bit Broadcom BCM2712 processor, up to 8 GB RAM, and enhanced features such as PCIe extension ports, a power switch, and an RTC clock system.  

Innovative Models 

Raspberry Pi 5: It is equipped with the dual-core, 64-bit Broadcom BCM2712 system, based on the Arm Cortex-A76 architecture and clocked at 2.4 GHz. So it deivers a 2-3x increase in CPU performance relative to Raspberry Pi 4. Moreover, the computer can be fitted with operating memory up to 8 GB RAM and a graphic processor (GPU VideoCore 7) supporting the OpenGL and Vulkan technologies.  

Raspberry Pi 400: This model integrates the RPi 4 board into a keyboard housing, reminiscent of classic microcomputers. It comes with a mouse, power supply, pre-installed operating system, and a detailed manual, making it particularly appealing to beginners and younger users.

Raspberry Pi Zero: Known for its compact size and energy efficiency, the Raspberry Pi Zero is ideal for mobile devices and IoT projects. Despite its smaller form factor, it includes essential features like an HDMI connector, USB output, SD card slot, CSI port, and a built-in wireless communication module (Zero W variant).

For projects requiring different formats or more powerful processing capabilities, Raspberry Pi offers Compute Modules. These miniaturized versions provide the core motherboard components without additional ports, allowing for custom configurations via high-density connectors. The CM4 variants offer SMD board-to-board connectors for an even lower profile, enhancing their flexibility for various applications.

RP2040 Microcontroller

Recognizing the need for simpler projects, Raspberry Pi developed the RP2040 microcontroller, based on the Cortex M0+ architecture. This microcontroller, featured in the Raspberry Pi Pico module, includes 264 kB RAM, supports external memory up to 16 MB, and integrates various peripherals such as serial bus controllers, ADC converters, and PWM generators. The Pico module, with its small size and ease of use, is ideal for a wide range of applications.

Comprehensive Accessories

Raspberry Pi also offers a wide range of accessories, including power supply modules and enclosures designed to ensure trouble-free operation and practical usability. Enclosures protect the PCB and components while providing access to all necessary ports and connectors. Raspberry Pi also manufactures peripherals like mice and keyboards, as well as the Raspberry Pi Touch Display, a 7-inch screen with a touch panel that connects via DSI and is powered through GPIO.

The inclusion of Raspberry Pi products in the TME catalogue significantly broadens the availability of cutting-edge technology for educators, hobbyists, and industrial designers. With TME’s extensive inventory, the latest Raspberry Pi solutions are now within easy reach, ready to bring your ideas to life.

Learn More

The post Raspberry Pi Products Now Available at TME appeared first on EDN.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s new report titled “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications” explores advanced packaging’s current landscape while going into detail about emerging technologies such as 2.5D and 3D packaging.

Figure 1 2.5D and 3D packaging facilitate greater interconnection densities for chips serving applications like AI, data centers, and 5G. Source: IDTechEx

After fabs manufacture chips on silicon wafers through various advanced processes, packaging facilities receive completed wafers from fabs, cut them into individual chips, assemble or “package” them into final products, and test them for performance and quality. These packaged chips are then shipped to original equipment manufacturers (OEMs).

That’s part of the traditional semiconductor manufacturing value chain in which engineers build system-on-chips (SoCs) on silicon wafers and then move them to conventional packaging processes. Enter chiplets, manufactured of individual system modalities as standalone chips or chiplets on a wafer, then integrating these separate functionalities into a system through advanced packaging.

This premise brings advanced packaging to the forefront of semiconductor manufacturing innovation. In fact, the future of chiplets is intertwined with advancements in advanced packaging, where 2.5D and 3D technologies are rapidly taking shape to facilitate the commercial realization of chiplets.

2.5D and 3D packaging

While 1D and 2D semiconductor packaging technologies continue to dominate many applications, future advancements relate to 2.5D and 3D packaging to achieve the realization of more-than-Moore semiconductor realm. These technologies leverage wafer-level integration for miniaturization of components, leading to greater interconnection densities.

Figure 2 Advanced packaging techniques like 2.5D and 3D improve system bandwidth and power efficiency by increasing I/O routing density and reducing I/O bump size. Source: Siemens EDA

2.5D technology, which facilitates larger packaging areas, mandates a shift from silicon interposers to silicon bridges or other alternatives such as high-density fan-out. But packaging components of different materials together also leads to many challenges. The IDTechEx report asserts that finding the right materials and manufacturing techniques is critical for 2.5D packaging adoption.

Next, 3D packaging brings new structures into play. That includes integrating one active die on top of another active die and reducing bump pitch distance. This 3D technique—called hybrid bonding—can be used for applications such as CMOS image sensors, 3D NAND flash and HBM memory, and chiplets. However, like 2.5 packaging, 3D packaging entails manufacturing and cost challenges as techniques like hybrid bonding demand new high-quality tools and materials.

OSAT and EDA traction

The development of an ecosystem often offers vital clues about the future of a nascent technology like advanced packaging. While challenges abound, recent semiconductor industry announcements bode well for IC packaging capabilities in the 2.5 and 3D eras.

Amkor, a major outsourced semiconductor assembly and test (OSAT) service provider, is investing approximately $2 billion to build an advanced packaging and test facility in Peoria, Arizona. The 55-acre site will be ready for production in a couple of years.

Then there is Silicon Box, an advanced panel-level packaging foundry focusing on chiplet integration, packaging, and testing. After setting up an advanced packaging facility in Singapore, the company is building a new site in Northen Italy to better serve fabs in Europe.

EDA toolmakers are also paying attention to this promising new landscape. For instance, Siemens EDA is working closely with South Korean OSAT nepes to expand its IC packaging capabilities for the 3D-IC era. Siemens EDA is providing nepes tools to tackle the broad range of complex thermal, mechanical, and other challenges associated with developing advanced 3D-IC packages.

Figure 3 Innovator3D IC software delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. Source: Siemens EDA

Siemens EDA’s Innovator3D IC toolset shown above uses a hierarchical device planning approach to handle the massive complexity of advanced 2.5D/3D integrated designs with millions of pins. Here, designs are represented as geometrically partitioned regions with attributes controlling elaboration and implementation methods. That, in turn, allows critical updates to be quickly implemented while matching analytic techniques to specific regions, avoiding excessively long execution times.

Meanwhile, new materials and manufacturing processes will continue to be developed to confront the challenges facing 2.5D and 3D packaging. Perhaps another update before Christmas will provide greater clarity on where advanced packaging technology stands in 2024 and beyond.

Related Content

• How the Worlds of Chiplets and Packaging Intertwine
• TSMC crunch heralds good days for advanced packaging
• Intel and FMD’s Roadmap for 3D Heterogeneous Integration
• Heterogeneous Integration and the Evolution of IC Packaging
• Samsung’s advanced packaging pivot with Nvidia production win

The post Will 2024 be the year of advanced packaging? appeared first on EDN.

In 2024, the 10 major lithium-ion battery companies in India are as follows:

1. Battrixx

It is a division of Kabra Extrusiontechnik Ltd. The latter is one of the two constituent companies of the Kolsite Group. The other company is Plastiblends India Ltd.

It was founded in 2009. It is based out of Andheri (West), Mumbai, Maharashtra.

It has established a state-of-the-art plant for design, development and production at Chakan, Pune.

It focuses on developing future technologies, such as green energy systems and solutions. Its products provide batteries to electric vehicles and green energy storage system.

Its flagship products are lithium-ion battery packs and modules for e-vehicles.

It manufactures lithium ion batteries for application in a wide range of appliances in the e-mobility sector. Its lithium-ion batteries find application in electric bikes, two-wheel electric vehicles, three-wheel electric vehicles, electric cars, electric passenger vehicles, light commercial electric vehicles, and electric tractors.

Besides, it also manufactures lithium ion batteries for application in electric forklift, electric golf cart, and devices used in the marine environment.

2. Contemporary Amperex Technology Co. Ltd. (CATL)

It is a Chinese lithium-ion battery manufacturing company. It was founded in 2011. It is based out of the city of Ningde, which is situated in the Fujian province of China.

This company started as a spin-off of Amperex Technology Limited (ATL), which was founded in 1999.

It specialises in the manufacturing of lithium-ion batteries for electric vehicles, energy storage systems, and battery management systems.

As per the data available from 2023, it is the world’s largest lithium-ion battery manufacturer for electric vehicles. Its global market share was around 37%.

It has established 13 manufacturing plants and six research and development centres across the world. However, it does not have any manufacturing plant in India. It is merely a supplier of lithium-ion batteries in India.

3. Exicom Tele-Systems Limited

It was founded in 1994. Its head-office is in Gurugram, Haryana.

It provides state-of-the-art lithium-ion cells for EV chargers, battery systems, and industrial power systems.

It exports lithium-ion cells to 15 countries in the world.

Its specialisation is in the production of lithium-ion cells for the telecom industry.

4. Grinntech Motors & Services Pvt. Ltd.

It was founded by two entrepreneurs, Mr. Puneet Jain and Mr. Nikhilesh Mishra. It is based out of Chennai, Tamil Nadu.

It has established a state-of-the-art lab for developing new advanced lithium-ion cells. It puts into application data driven advanced algorithms.

It specialises in developing high-quality and affordable energy storage solutions. It is vociferously working towards fulfilling the aim of electrification of all mobility vehicles.

It manufactures lithium-ion cells for electric cycles, robots, 2-wheeler automobiles, 3-wheeler automobiles, small commercial vehicles, light commercial vehicles, heavy commercial vehicles, etc.

5. Panasonic Life Solutions India Pvt. Ltd.

It was established on 14 July, 2006, as Panasonic India Private Limited. With effect from 1 August, 2022, it changed its nomenclature to Panasonic Life Solutions India Private Limited. It was done to bring all businesses of the Panasonic Group in India under one roof.

It is the Indian subsidiary company of the Panasonic Group, which is based out of Kadoma, Osaka, Japan.

Its head-office is in Gurugram, Haryana.

It specialises in the production of lithium-ion cells for use in the automotive industry.

It has formed a joint venture with the Indian Oil Corporation Ltd. (IOCL) to manufacture cylindrical lithium-ion batteries. Such batteries are used in electric vehicles, power tools, and consumer electronics.

6. Gotion Inc.

It is a multi-national lithium ion battery manufacturing company. It aims to create the next generation of battery technologies for all new energy automotive.

It is a conglomeration of many battery developing technology companies. Its largest stakeholder is the German automaker Volkswagen.

Its head-office is in Fremont, California, United States of America.

It has six manufacturing plants spread across five countries of the world- namely, the USA, Germany, Japan, China, and Singapore.

It has established its R&D centre in Hefei, China. It researches new technology for the production of lithium ion batteries.

It does not manufacture any lithium ion batteries in India. It merely supplies lithium ion batteries in India.

In June, 2024, Indian lithium ion battery manufacturer, Amara Raja Energy and Mobility Ltd., signed a licensing agreement with Gotion Inc., for the indigenous production of lithium-ion batteries using iron phosphate as a raw material.

7. LG Energy Solution Ltd.

LG Energy Solution Ltd. is the successor company of LG Chem Energy Solution Business Division. The latter was established in 1992. It was functional till 2020. It had begun research on lithium-ion batteries in 1992.

In 2020, LG Chem approved the split-off of its battery business. Resultantly, after the split, LG Energy Solution Ltd. was established. It is based out of Seoul, South Korea.

It manufactures lithium-ion batteries for application across all dimensions, spanning across land, sea, air, and space.

It manufactures lithium-ion batteries for three segments- advanced automotive battery, mobility and IT battery, and ESS battery enterprises.

It is the first supplier of lithium-ion batteries for battery-powered spacesuits manufactured for use by the National Aeronautics and Space Administration (NASA).

Besides, it is the supplier of lithium-ion batteries for the world’s first eco-friendly hybrid ship made by a Norwegian shipbuilding company. Also, it supplies lithium-ion batteries for drones.

In 2020, LG Chem and General Motors entered into collaboration and established Ultium Cells, a joint venture for the production of lithium-ion batteries for electric vehicles.

8. Samsung SDI India Pvt. Ltd.

It is the Indian subsidiary company of Samsung SDI Co., Ltd. Its parent firm is headquartered in Yongin, Gyeonggi-do, South Korea. It is a battery and electronic materials manufacturing company.

It has a manufacturing plant in Noida, Uttar Pradesh. Besides, it has a sales network office in Bengaluru, Karnataka.

It manufactures lithium-ion cells in all sizes, ranging from small, mid to large-sized cells.

They are used in a wide range of applications. For instance, electric vehicles, energy storage systems, power devices, IT devices, micro mobility purposes such as electric bikes, electric scooters, electric motorcycles, and robots.

9. Toshiba India Pvt. Ltd.

It is the Indian subsidiary company of the Toshiba Group. It is headquartered in Gurugram, Haryana.

In 2018, Suzuki, Toshiba and Denso founded a joint venture company, TDS Lithium-Ion Battery Gujarat Private Limited (TDSG), for the production of automotive lithium-ion-battery packs in India.

In 2023, the battery division of Toshiba India Pvt. Ltd. signed an agreement with EVage. The latter is a key supplier for electric commercial vans. As per the agreement, it will supply SCiBTM lithium-ion batteries. They would be used for a wide range of applications. For instance, electric vehicles such as electric buses, electric cars, industrial applications such as power plants, elevators, infrastructure applications such as in container cranes, and data centres.

10. Okaya EV Private Limited

It is a subsidiary company of the Okaya Power group. It specialises in producing lithium-ion batteries for electric vehicles, charging, and battery swapping solutions.

It produced India’s first lithium-ion battery. It gave it the name Okaya Royale. It is produced in two variants. First, Okaya Royale. And second, Okaya Royale XL.

Its production process is certified as per the ISO 14001:2004 certification.

It is the third-largest battery manufacturer in India. Besides, it is the leading charging station manufacturer in India.

The lithium-ion batteries produced by Okaya EV Private Limited have the following special features:

First, less weight and compact size.

Second, it recharges at a very fast rate.

Third, it has a longer life-span.

Fourth, it provides a longer back up.

Fifth, it is almost maintenance-free. Hence, it is highly durable.

It specialises in the production of batteries for electric vehicles.

 

The post 10 Major Lithium-ion Battery Companies in India in 2024 appeared first on ELE Times.

submitted by /u/Linker3000 [link] [comments]

Chemical vapor deposition (CVD)-based synthetic diamond materials firm Element Six of Oxford, UK (E6, part of the De Beers Group) is leading a program under the UWBGS (Ultra-Wide BandGap Semiconductors) initiative, established by the United States Defense Advanced Research Projects Agency (DARPA), to enable the next generation of semiconductor technologies...

Let’s see how you can effectively double the output sink current of the plain old 555 timer. 

Wow the engineering world with your unique design: Design Ideas Submission Guide

From the block diagram in Figure 1 taken from the datasheet of the ST’s TS555 low power single CMOS timer) we can see that the Discharge pin (pin7) repeats the Output pin (pin3). In reality, they are only in the “Low” state at the same time. This differs for the “High” state where the Output pin can produce a source current while the Discharge pin is of Open Drain (or Open Collector for old 555s).   

Figure 1: Block diagram of the TS555 lower power single CMOS timer. Source: STMicroelectronics

The circuit in Figure 2 combines the sink currents of both the Output and the Discharge pins, which allows us to double the output current. Resistors R3 and R4 are part of the load, they limit the sink current to a safe value.

Figure 2: Circuit that combines the sink currents of the Output and Discharge pin of the TS555, doubling the output current.

The price for this doubling is some accuracy degradation: Now, the circuit is a bit more susceptible to the power voltage variations. Nevertheless, this downside accuracy a satisfactory tradeoff for many applications.

Now, let’s try to use the new circuit of the 555 for something useful. The measurement of a capacitor’s equivalent series resistance (ESR) may become a problem since the ESR can be very low, about tens of milliohms. Hence the current should be sufficiently high to measure it reliably. An application circuit for this is shown in Figure 3.

Figure 3: Application circuit for measuring the ESR of a capacitor using the concept introduced in Figure 2.

The circuit produces short (less than 1 µs) current pulses through the capacitor Cx with a period of about 10 µs; the voltage drop on the capacitor (Vesr) is proportional to its ESR. So, comparing this voltage drop with voltage (V) on R3, Cx you can calculate the ESR: 

r = R3 * Vesr / 2*(V – Vesr),

or you can simply select the capacitor with the lowest ESR amongst several candidates.

—Peter Demchenko studied math at the University of Vilnius and has worked in software development.

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The post Mighty 555 and ESR-meter appeared first on EDN.

I've bought these female type C breakouts a while ago to convert some of my stuff to type C from type A or Micro USB. However they've only ever worked with a-to-c cables, native type C chargers never recognized them. There is a pair of pads for a resistor to indicate expected currents to the charger but it never made a difference. And then I've found the problem: the CC lines are connected together. In order to be compliant these lines should be pulled down (or up, if it is a power source) separately. (source) By modifying the PCB I could isolate the two CC lines, and created a ground track right in front of the CC pins. The second picture shows the action plan: cut along the red lines, scrape the circled areas to expose some copper, and short the original R1 pads. The third picture shows the resulting circuit (Red is VCC, light blue is GND, yellow are data lines, and green are CC lines) After this I could solder some 0603 5.1k resistors directly to the CC pins and the newly exposed copper lines to pull them down individually as seen on the first photo. You need some patience and stable hands, but in the end you can make these work with anything! submitted by /u/rOzzy87 [link] [comments]

Premier microwave, RF, wireless and radar players gather in the city of light for the European Microwave Week (EuMW). Industry-leading T&M specialist Rohde & Schwarz will present a radiating portfolio of products and solutions in Paris for various application fields, pushing the limits in the Gigahertz to Terahertz frequency ranges.

Rohde & Schwarz will showcase its latest RF and microwave portfolio and solutions following the motto “From Gigahertz to Terahertz” at this year’s European Microwave Week in Paris. At the exhibition, taking place from September 24 to 26, 2024 in the Paris Expo Porte de Versailles venue, visitors can learn at booth 401L about the company’s top-notch applications to solve pressing test challenges RF engineers are facing right now in component design and next generation wireless, as well as in the automotive and aerospace and defense industries. Highlights will include EVM measurements and wideband modulated load pull analysis for RF frontends. A system for 6G wireless data transmission based on photonics will address state-of-the-art research for next generation wireless technologies. And disruptive innovations in automotive radar production and testing as well as industry leading-solutions for 5G NTN satellite testing will round out the company’s display at the EuMW 2024.

Wide spectrum of RF and microwave component testing

Active components such as power amplifiers are integral for any RF frontend design. With increasing data rates, complex modulation schemes are becoming critical in wireless connectivity applications. A low error vector magnitude (EVM) at both the component and system levels is key to ensuring that these modulation schemes are robust and stable. Given the unprecedented performance levels of these power amplifiers, EVM measurements are a challenging task in RF frontend design. Rohde & Schwarz will present at the EuMW its updated R&S SMW200A vector signal generator which comes with enhanced performance and unparalleled flexibility to meet the most demanding EVM requirements ideal for power amplifier verification. Equipped with the new linearize RF path software option, the signal generator enables better EVM/ACLR at high output power with digital pre-distortion-based optimization. The high-end instrument perfectly matches the industry-leading R&S FSW signal and spectrum analyzer. At the EuMW, however, the setup features the powerful R&S FSVA3000 on the analysis side, including its unique IQ noise cancellation software-based feature to achieve outstanding EVM measurement performance thanks to a noise corrected measurement path.

Besides EVM, power amplifier efficiency is key in RF frontend design. The RF frontend drives signals into an antenna for wireless transmissions in its intended application. These antennas are designed to have a nominal impedance of 50 Ohms. However, due to their wide frequency coverage, the actual impedance can often deviate significantly from 50 Ohms. The impedance encountered by the RF frontend greatly influences its performance, while the influence on its performance and efficiency is unpredictable. Therefore, it’s crucial to verify the performance across a range of impedance variations. To ensure the power amplifier’s target specifications like minimized power consumption or optimized modulation performance, wideband modulated load pull analysis is a vital method for characterizing nonlinear devices. At the EuMW, Rohde & Schwarz will demonstrate a new setup for wideband modulated load pull, featuring the R&S SMW200A vector signal generator in combination with the R&S RTP164 oscilloscope. With this setup, RF engineers can verify the system level performance of the RF frontend with different impedances and verify KPIs such as gain, EVM and ACLR across varying impedance conditions.

For high-throughput RF component verification, Rohde & Schwarz demonstrates for the first time the PVT360A performance vector tester equipped with a new high-power option. The single-box tester combines two independent vector signal generators and vector signal analyzers in one instrument and provides outstanding measurement speed, making it ideal for characterization and production environments. The new option will provide up to 20 dBm RMS output power, making it well-equipped for any applications where high input power to the DUT is required or where high losses can be expected. It now covers a frequency range up to 8.5 GHz for additional potential frequency bands for the lower parts of 5G NR FR3 (7.125 GHz to 24.25 GHz). At the EuMW, visitors can get a first glimpse of the upgraded instrument version, which will be available soon.

Also measuring jitter for clocks in high-speed digital designs is addressed at the Rohde & Schwarz booth. With increasing data rates, the limits for overall system jitter become ever tighter, especially for the various components of the clock tree. Phase noise analyzers are the instruments of choice for verifying the jitter performance of clocks. With the R&S FSWP, Rohde & Schwarz will demonstrate at the EuMW the best phase noise analyzer on the market, featuring highest sensitivity. It is ideal for super low phase noise and jitter measurements even at frequencies above 50 GHz as needed for common electrical interface OIF CEI-224G (56 GHz) or ultra-fast LAN IEEE 802.3dj (53 GHz). At EuMW, it is shown analyzing beyond 50 GHz with cross correlation, achieving most accurate results that reflect the true DUT performance.

Another  demo will cover intermodulation (IM) measurements for 6G D band components. When characterizing components for tomorrow’s 6G communications systems, developers have to test the intermodulation of the active device in addition to the S-parameters. The R&S ZNA67 vector network analyzer in combination with the R&S ZCDS170 dual source converters allows a simplified measurement setup that directly provides a two-tone output signal for IM testing up to 170 GHz.

Next generation wireless technologies

The door to the 6G era has been opened and it will enable new application scenarios in industry, medical technology and everyday life. This will bring about new requirements for latency and data transmission rates. While sub-THz frequencies up to 300 GHz for communication within 6G networks will potentially be introduced at a later stage, this frequency band will be indispensable to realize the full potential of the metaverse and extended reality (XR) applications. On the path to 6G, it is important to create THz transmission sources that offer high signal quality and cover as wide a frequency range as possible. In the future, this might be achieved by integrating optical technologies with electronics. Such THz components could be used beyond communications and data transmission, finding applications in sensing and imaging. At the EuMW, Rohde & Schwarz will present its proof-of-concept for an ultra-stable tunable THz system for 6G wireless data transmission based on photonics. Developed within the 6G-ADLANTIK project funded by the Federal Ministry of Education and Research of Germany (BMBF), it enables the photonic generation of THz signals based on frequency comb technology. In this approach, a photodiode efficiently converts an optical beat signal derived from lasers at slightly different optical frequencies into an electrical signal via a photomixing process. The antenna structure surrounding the photomixer translates the oscillating photocurrent into a THz wave. The resulting signals can be modulated and demodulated for 6G wireless communications and can be tuned easily over a wide frequency range. The presented system also can be extended for component characterization with coherently received THz signals. A THz waveguide architecture simulation and design as well as the development of ultra-low phase noise photonic reference oscillators are also part of the scope-of-work for this project.

Another highlight at the Rohde & Schwarz booth will be a setup for wideband signal generation and analysis in the H band, featuring the new R&S SFI100A wideband IF vector signal generator combined with the new R&S FC330ST/SR frequency converters. The signal generator generates signals with up to 10 GHz RF modulation bandwidth, the frequency converters are designed to up- and down-convert the intermediate frequency (IF) signals to and from the RF frequency range of 220 to 330 GHz, known as H band. Their high-performance balanced mixer with low conversion loss ensures precise measurements. An additional integrated IF amplifier helps to achieve exceptional sensitivity and signal performance. The solution supports an IF range of up to 35 GHz, allowing for ultra-wide bandwidth signals to be transmitted and received. The R&S RTP oscilloscope is used in the demo setup to receive the down-converted IF signals. Equipped with the versatile R&S VSE signal analysis software the baseband signals can be analyzed directly on the instrument. The H band is gaining importance for various applications not just for 6G research but also in radar technology or advanced imaging for security and healthcare.

Next level automotive radar production testing

Next-generation radar, pivotal for the evolution of ADAS and autonomous driving, requires test solutions that deliver unrivalled accuracy, efficiency and reliability. To drive this development further, Rohde & Schwarz will bring two radical innovations in automotive radar production testing to the EuMW, offering the industry a hitherto unseen price-performance point. The R&S RadEsT (Radar Essential Tester) automotive radar target simulator emerges as an ultra-compact, versatile tool designed to meet a wide array of vehicle manufacturer testing needs, from lab-based functional testing to vehicle-level production checks. With its impressive array of features and exceptional value, it opens up new possibilities for precise, reliable, and dynamic radar testing. The Radar Essential Tester addresses a wide spectrum of use cases, from system checks and debugging of radar module reference designs to software verification and functional tests on the radar module. It is an ideal fit for OEM end-of-line testing, that provides advanced testing capabilities for radar alignment and calibration as well as functional check during production beyond the limited functionality of passive reflective elements that have historically been used. Furthermore, the R&S RadEsT has the capability to test advanced driver-assistance systems (ADAS) and autonomous driving (AD) functions.

In addition, Rohde & Schwarz also introduces new “mini”, “golden”, “pro” and “golden-pro” versions of its automotive world’s leading radar echo generator R&S AREG800A. The resulting new R&S AREG-P target generator helps Tier1 automotive radar manufacturers to increase throughput, reduce costs and reduce end-of-line test time. EuMW visitors can learn how the solution creates the perfect environment for the radar sensor’s seamless transition from R&D to production, optimizing OPEX, CAPEX and time to market.

Cutting-edge solutions for aerospace and defense

To ensure that communications systems based on 5G non-terrestrial networks (NTN) and LEO constellations work reliably and efficiently, testing is crucial. To this end, Rohde & Schwarz will present dynamic fading test scenarios for LEO satellites and terminals that mimic realistic LEO and MEO satellite trajectories at the EuMW. With a new software update, the R&S SMW200A vector signal generator now allows for Doppler shifts of up to 1.9 MHz, enhancing the simulation of high-speed satellite movement. A new user-friendly software makes creating and uploading fading profiles easy. In combination with the instrument’s frequency range up to 67 GHz, it opens up new possibilities to develop extremely-high-frequency satellite communications. The same setup also demonstrates testing of Ka-band power amplifiers in development and verification. For this application, generating multi-carrier CW signals up to 2 GHz bandwidth is vital in order to obtain repeatable test results. Additionally, generating realistic test signals such as DVB-S2/S2X/RCS2 and custom OFDM allow the analysis of the power amplifier under real-world satellite scenarios. The R&S FSW signal and spectrum analyzer equipped with an amplifier measurement application is ideal for analyzing the characteristics of these devices, providing insights into various parameters such as Error Vector Magnitude (EVM), AM/AM and AM/PM distortion, group delay, and Adjacent Channel Leakage Ratio (ACLR), which are critical for assessing the performance and reliability of communication equipment.

mmWave imaging technology with ISAR processing

Rohde & Schwarz continues to evolve its millimeter wave imaging technology for different use cases. At the EuMW, the company will exhibit its imaging capabilities that leverages hundreds of receive and transmit antennas to quickly characterize materials in a new context. The solution is ideal for detecting quality issues of packaged goods such as leakage, missing or incorrect items as well as unwanted particles within the package through real-time analysis. This in-line quality inspection method works with non-ionizing radiation and provides users with another form of non-destructive testing, complementing current methods such as cameras, X-rays or scales in logistics, food or pharmaceutical environments. The new R&S IMAGER presented in Paris uses live inverse synthetic aperture radar (ISAR) processing, which reveals details and defects that cannot easily be detected with alternative testing methods.

Service and calibration in great hands

Leading-edge technology belongs in expert hands. The Rohde & Schwarz support network spans multiple time zones and reaches all corners of the world. At the EuMW, Rohde & Schwarz will also spotlight its comprehensive service portfolio. Visitors can learn about accredited calibration services, repair services directly from Rohde & Schwarz, training courses and industry insights from the R&S Technology Academy, and the 24/7 hotline service as well as on-site support.

Rohde & Schwarz will be exhibiting at booth 401L in Paris Expo Porte de Versailles from September 24 to 26, 2024. In addition, experts from the company will contribute with presentations and workshops to the program of the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), as well as the Defense, Security and Space Forum. Information on the company’s demonstrations, including the possibility to register for free exhibition tickets, is also available at: https://www.rohde-schwarz.com/eumw

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For its fiscal full year (to end-June), Wolfspeed Inc of Durham, NC, USA – which makes silicon carbide materials as well as silicon carbide (SiC) and gallium nitride (GaN) power-switching & RF semiconductor devices – has reported annual revenue growth of 6.4%, from $758.5m in fiscal 2023 to $807.2m for fiscal 2024. Specifically, Materials Products revenue rose by 12.1% from $349.3m to $391.6m, and Power Products revenue by 1.6% from $409.2m to $415.6m...

u-blox CloudTrack combines reliable positioning with data communication, cloud intelligence, and best-in-class energy savings into an all-in-one service.

u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced CloudTrack, a unique end-to-end asset tracking service that breaks new ground for the Internet of Things (IoT) landscape. The all-in-one service provides the ultimate in ultra-low-power positioning, global connectivity and cloud integration. CloudTrack simplifies IoT asset tracking with contractless per-location-request plans accessible worldwide, offering businesses a predictable pay-as-you-go pricing model without hidden costs or worries about data usage.

The most significant advantage of CloudTrack is its exceptional 6X energy savings, compared to a standalone GNSS fix with a cold start and transmitting data securely over the internet. The service leverages the best of u-blox expertise and technology to intelligently calculate the position using a combination of available data from GNSS, cellular, and Wi-Fi sources. Businesses can locate assets in poor or non-existing GNSS signal conditions or even indoors, where it would otherwise be challenging to get a location fix and would quickly drain battery.

u-blox CloudTrack enables customers to eliminate the complexity and inconvenience of dealing with multiple location data and connectivity providers. This single-provider solution with a straightforward per-location-request pricing model streamlines the asset-tracking process for businesses. Moreover, with a single Thingstream SIM card that operates everywhere, IoT devices can span the globe using one stock-keeping unit (SKU), eliminating the need for regional SKUs. The Thingstream cloud platform makes it easy for businesses to transform and integrate their data with tracking dashboards, major cloud platforms, and enterprise backend systems.

CloudTrack works optimally with u-blox cellular ”combo” modules, including the LENA-R8 LTE Cat 1bis module with integrated M10 GNSS receiver, to deliver an all-in-one ultra-low-power global IoT asset tracking solution that is unmatched in the industry. This synergy of hardware, location and data communication services, cloud intelligence, and best-in-class energy savings exemplifies u-blox’s mission to ”reliably locate and connect every thing”.

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Collaboration looks to develop future-ready talent pool to support chip industry growth

Applied Materials India Private Limited has signed a Memorandum of Understanding (MOU) with the Tamil Nadu Government whereby Applied intends to establish an advanced AI-enabled technology development Center of Excellence focused on semiconductor manufacturing and equipment at Chennai. This Center will aim to work with local universities and industry partners to strengthen the semiconductor ecosystem in Tamil Nadu and help develop a future-ready talent pool to support chip industry growth. As part of this effort, Applied Materials plans to grow its workforce in the state to more than 500 technical jobs over the next few years.

The MOU was signed in San Francisco in the presence of Hon’ble Chief Minister of Tamil Nadu, Mr. M.K. Stalin and Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, Inc..

Hon’ble Chief Minister Mr. M K Stalin said, “Investment in key sectors such as advanced electronics and semiconductors will help us achieve the $1 trillion economy goal by 2030. We want to make Tamil Nadu the most advanced knowledge and innovation hub in South Asia.”

Speaking on the MOU, Minister for Industries Dr. T R B Rajaa said, “Tamil Nadu aims to grow the semiconductor ecosystem by fostering industry partnerships, cultivating a research-oriented culture, and developing a skilled workforce. I believe this collaboration with Applied Materials will help us create the right talent and play a strong role in Tamil Nadu’s journey to becoming a leading hub for semiconductor manufacturing.”

Commenting on the MOU signing, Dr. Prabu Raja, President, Semiconductor Products Group, Applied Materials, Inc. said, “Tamil Nadu is one of India’s most industrialized states with a thriving manufacturing sector and an impressive scientific talent pool. Applied Materials looks forward to growing our presence in Chennai and working with the government to bring AI capabilities and advanced analytics to the local semiconductor manufacturing and equipment ecosystem.

The planned Center will further strengthen Applied Materials’ existing collaborations with academic institutions in Tamil Nadu, which aim to advance research in AI, machine learning and data science for the semiconductor equipment sector.

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SPE campaign opens curtain on new dawn of Ethernet connectivity

element14 has assembled an elite group of industry leading suppliers to support a campaign to highlight the multiple advantages of Single Pair Ethernet (SPE) solutions.

The campaign, adopted by Amphenol, ADI, Harting, Microchip, Molex, Phoenix, Weidmuller and Wurth Electronik, is designed to inspire IIoT developers and industrial designers to switch to SPE products and protocols, to not only foster innovation but to also make their professional lives easier, more productive and produce more reliable results.

Ben Morgan, Product Segment Leader for SPE Connectors at element14 said, “We firmly believe that the future of industrial network connectivity lies with Single Pair Ethernet. IoT design engineers fully understand the current struggle of balancing space limitations with increasing data demands, however SPE is a compact, efficient technology that delivers full Ethernet performance with a single, twisted-pair cable.”

Among the many benefits of SPE is that it vastly reduces the need to allow for bulky and intricate bundles that waste valuable installation real estate space. Using SPE products for such installations streamlines a network and reduces costs, enabling professional developers to focus on maximising the power of connected devices to their fullest potential.

SPE does this by simplifying the IIoT and industrial automation design process by providing a single, high-speed connection that’s perfect for Edge devices, especially those that are often destined for tight, compromised spaces. SPE has proven to be sleek, elegant and reliable solutions that ensure devices are always connected, and always performing at their best.

Morgan added, “We are delighted to be joined by so many of key supplier in this initiative, which we think heralds a new dawn in what is achievable in network connectivity, which comes at a crucial moment to meet the demands of an increasingly interconnected world.”

SPE products from Amphenol, ADI, Harting, Microchip, Molex, Phoenix, Weidmuller and Wurth Electronik will be available from Farnell in EMEA, Newark in North America and element14 in APAC.

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My longstanding streak of not being infected by COVID-19 (knowingly, at least…there’s always the asymptomatic possibility) came to an end earlier this year, alas, doubly-unfortunately timed to coincide with the July 4th holiday weekend:

I’m guessing I caught one of the latest FLiRT variants, which are reportedly adept at evading vaccines (I’m fully boosted through the fall 2023 sequence). Thankfully, my discomfort was modest, at its worst lasting only a few days, and I was testing negative again within a week:

although several weeks later I still sometimes feel like I’ve got razor blades stuck in my throat.

One upside, for lack of a better word, to my health setback is that it finally prompted me to put into motion a longstanding plan to do a few pandemic-themed teardowns. Today’s victim, for example, is a pulse oximeter which I’d actually bought from an eBay seller (listed as a “FDA Finger tip Pulse Oximeter Blood Oxygen meter O2 SpO2 Heart Rate Monitor US”) a year prior to COVID-19’s surge, in late April 2019, for $11.49 as a sleep apnea monitoring aid. A year later, on the other hand…well, I’ll just quote from a writeup published by Yale Medicine in May 2020:

According to Consumer Reports, prices for pulse oximeters range from $25 to $100, if you can find one, as shortages have been reported.

This unit, a Volmate VOL60A, recently began acting wonky, sometimes not delivering definitive results at all and other times displaying data that I knew undershot reality. So, since prices have retracted to normalcy ($5 with free shipping, in this particular case, believe it or not), I’ve replaced it. Therein today’s dissection, which I’ll as-usual kick off with a series of box shots:

Let’s dive inside. The plastic tray houses our patient alongside a nifty protective case:

Underneath the tray is some literature:

The user manual is surprisingly (at least to me) quite info-thorough and informative, but I can’t find it online (the manufacturer seems to no longer be in business, judging from the “dead” website), so I’ve scanned and converted it to PDF. You can access it here. 

And there’s one more sliver of paper under the case (which also contains a lanyard):

Here’s the guest of honor, as usual alongside a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes (the VOL60A has dimensions of 62 x 35 x 31 mm and weighs 60 g including batteries):

Before cracking the unit open, and speaking of batteries, I thought I’d pop a couple of AAAs in it so you can see it in action. Here’s the sequence-of-two powerup display cadence, initiated by a press of the grey button at the bottom:

Unless a finger is preinserted in the pulse oximeter prior to powerup, the display (and broader device) will go back to sleep after a couple of seconds. Conversely, with a finger already in place:

As you can see, it measures both oxygen saturation (SpO2), displayed at the top, and pulse rate below. Good news: my actual oxygen saturation is not as low as the displayed 75%, which had it been true would have me in the hospital if not (shortly thereafter) the morgue. Bad news: my actual resting pulse rate is not as low as 28 bpm, which if true would mean I was very fit (not to mention at lower elevation than my usual 7,500’ residence location)…or conversely, I suppose, might also have me in the hospital if not (shortly thereafter) the morgue. Like I said, this unit is now acting wonky, sometimes (like this time) displaying data that I know undershoots reality.

Let’s next flip it over on its back:

The removable battery “door” is obvious. But what I want to focus in on are the labels, particularly the diminutive bright yellow one:

Here’s what it says:

AVOID EXPOSURE

LASER RADIATION IS EMITTED FROM THIS APERTURE

LED Wavelengths

	Wavelength	Radiant Power
Red	660 ± 2nm	1.5 mW
IR	940 ± 10nm	2.0 mW

I showcase this label because it conveniently gives me an excuse to briefly detour for a quick tutorial on how pulse oximeters work. This particular unit is an example of the most common technique, known as transmissive pulse oximetry. In this approach, quoting Wikipedia:

One side of a thin part of the patient’s body, usually a fingertip or earlobe, is illuminated, and the photodetector is on the other side…other convenient sites include an infant’s foot or an unconscious patient’s cheek or tongue.

The “illumination” mentioned in the quote is dual frequency in nature, as the label suggests:

More from Wikipedia:

Absorption of light at these wavelengths differs significantly between blood loaded with oxygen and blood lacking oxygen. Oxygenated hemoglobin absorbs more infrared light and allows more red light to pass through. Deoxygenated hemoglobin allows more infrared light to pass through and absorbs more red light. The LEDs sequence through their cycle of one on, then the other, then both off about thirty times per second which allows the photodiode to respond to the red and infrared light separately and also adjust for the ambient light baseline.

Here’s what the dual-LED emitter structure looks like in action in the VOL60A; perhaps obviously, the IR transmitter isn’t visible to the naked eye (and my smartphone’s camera also unsurprisingly apparently has an IR filter ahead of the image sensor):

Note that in this design implementation, the LEDs are on the bottom half of the pulse oximeter, with their illumination shining upward through the fingertip and exiting via the fingernail to the photodetector above it. This is different than the conceptual image shown earlier from Wikipedia, which locates the LEDs at the top and the photodetector at the bottom (and ironically matches the locations shown in the conceptual image in the VOL60A user manual!).

Note, too, that the Wikipedia diagram shows a common photodetector for both LED transmitters. I’ll shortly show you the photodetector in this design, which I believe has an identical structure. That said, other conceptual diagrams, such as the one shown here:

have two photodetectors (called “sensors” in this case), one for each LED (IR and red).

In the interest of wordcount efficiency, I won’t dive deep into the background theory and implementation arithmetic that enable the pulse oximeter to ascertain both oxygen saturation and pulse rate. If you’d like to follow in my research footsteps, Google searches on terms and phrases such as pulse oximeter, pulse oximetry and pulse oximeter operation will likely prove fruitful. In addition to the earlier mentioned Wikipedia entry, two other resources I can also specifically recommend come from the University of Iowa and How Equipment Works.

What I will say a few more words about involves the inherent variability of a pulse oximeter’s results and the root causes of this inconsistency, as well as what might have gone awry with my particular unit. These root-cause variables include amount and density of both fat, muscle, skin and bone in the finger, any callouses or scarring of the fingertip, whether the user is unduly cold at the time of device operation, and the amount and composition of any fingernail polish. While, as Wikipedia notes:

Taking advantage of the pulsate flow of arterial blood, it [the pulse oximeter] measures the change in absorbance over the course of a cardiac cycle, allowing it to determine the absorbance due to arterial blood alone, excluding unchanging absorbance [due to the above variables].

Those sample-to-sample unchanging variables can still affect the baseline measurement assumptions, therefore the broader finger-to-finger, user-to-user, and test-to-test results.

And in my particular case, while I don’t think anything went wonky with the arithmetic done on the sensed data, the data itself is suspect in my mind. Note, for example, that oxygenated blood assessment is disproportionately reliant on successful passage of red visible spectrum light. If the red LED has gone dim for some reason, if its transmission frequency has wandered from its original 660 nm center point, and/or if the photosensor is no longer as sensitive to red light as it once was, the pulse oximeter would then deliver lower-than-accurate oxygen saturation results.

Tutorial over, let’s get back to tearing down. Here are left- and right-side views, both with the front and back halves of the device “closed”:

and “open”, i.e., expanded as would be the case when the finger is inserted in-between them:

What I’m about to say might shock my fellow electrical engineers reading these words, but frankly one of the most intriguing aspects of this design (maybe the most) is mechanical in nature; the robust hinge-and-spring structure at the top, supporting both linear expansion and pivot rotation, that dynamically adapts to both finger insertion and removal and various finger dimensions while still firmly clinging to the finger during measurement cycles. You can see more of its capabilities in these top views; note, too, the flex cable interconnecting the two halves:

And, last but not least, here’s a bottom-end perspective of the device:

Accessing the backside battery compartment reveals two tempting screw candidates:

You know what comes next, right?

A couple of retaining tabs also still need to be “popped”:

And voila, our first disassembly step is complete:

As you’ll see, I’ve already begun to displace the slim PCB in the center from its surroundings:

Let’s next finish the job:

This closeup showcases the two transmission LEDs, one red and the other IR and with the cluster protected from the elements by a clear plastic rectangular structure, that shine through the back-half “window” shown in the previous shot and onto the user’s fingertip underside:

Chronologically jumping ahead briefly, here’s a post-teardown re-enactment of what it looks like temporarily back in place (and this time not illuminated):

And here’s another view of that flex PCB, which (perhaps obviously) routes both power and the LEDs’ output signals to (presumably) processing circuitry in the pulse oximeter’s front half:

Speaking of which, let’s try getting inside that front half next. In previous photos, you may have already noticed two holes at the top of the device, along with one toward the top on each side. They’re for, I believe, passive ventilation purposes, to remove heat generated by internal circuitry. But there are two more, this time with visible screw heads within them, potentially providing a pathway to the front-half insides:

Yep, you guessed it:

Again, the spudger comes through in helping complete the task:

The display dominates the landscape on this half of the PCB, along with the switch at bottom:

But I bet you already saw the two screws at the bottom, on either side of the switch, right?

With them removed, we can lift the PCB away from the chassis, exposing its back for inspection:

The large IC at the top (bottom of the PCB when installed) is the STMicroelectronics-supplied system “brains”. Specifically, it’s a STM32F100C8T6B Arm Cortex-M3-based microcontroller also containing 32 KBytes of integrated flash memory. And below it, in the center, is the three-lead photosensor, surrounded by translucent plastic seemingly for both protective and lens-focusing functions. In the previous photo, you’ll see the plastic “window” in the chassis that it normally mates with. And, in closing, here’s another after-the-fact re-assembly reenactment:

Note, too, the “felt” lining this upper-half time, presumably to preclude nail polish damage? Your thoughts on this or anything else in this piece are as-always welcome in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• Learning and working in the era of COVID-19
• Simple pulse oximetry for wearable monitor
• Pulse oximetry basics and MCUs
• Signal processing and calibration improve blood measurements
• Pulse oximetry benefits from the latest programmable SoCs
• Teardown: Inside the art of pulse oximetry

The post Peering inside a Pulse Oximeter appeared first on EDN.

Following its recent relocation to larger premises (supporting ongoing growth and expanding operations), Sheffield University spin-off Phlux Technology —which designs and manufactures 1550nm avalanche photodiode (APD) infrared sensors — has appointed Christian Rookes as VP of marketing, Brian Williams as VP of operations, and John Fuller as director of engineering...

• Solution identifies subtle defects such as wire sag, near shorts, and stray wires for comprehensive assessment of wire bond integrity
• Advanced capacitive-based test methodology enables superior defect detection
• Test platform is high volume manufacturing ready, capable of testing 20 integrated circuits simultaneously for throughput of up to 72,000 units per hour

INDIA – Keysight Technologies, Inc. introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components.

The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.

The EST addresses these testing challenges by using cutting-edge nano Vectorless Test Enhanced Performance (nVTEP) technology to create a capacitive structure between the wire bond and a sensor plate. Using this method the EST can identify subtle defects such as wire sag, near shorts, and stray wires to enable comprehensive assessment of wire bond integrity.

Key benefits of the EST include:

• Advanced defect detection – Identifies a wide range of wire bond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns to ensure the functionality and reliability of electronic components.
• High volume manufacturing ready – Enables throughput of up to 72,000 units per hour through the ability to test up to 20 integrated circuits simultaneously, which boosts productivity and efficiency in high-volume production environments.
• Big data analytics integration: Captures defects and enhances yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT), and real-time part averaging test (RPAT).

Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence, Keysight, said: “Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”

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