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Avnet Adds New Features to Second Release of its IoTConnect Platform on AWS

ELE Times - Срд, 08/02/2023 - 12:28

Enables simple, fast, and secure IoT implementations for OEMs

Avnet’s second release of IoTConnect on Amazon Web Services (AWS) allows Original Equipment Manufacturers (OEMs) to build intelligent Internet of Things (IoT) devices faster. This full-featured release now incorporates key features such as support for AWS IoT Greengrass, built-in dynamic dashboards, a smart rules engine, and Artificial Intelligence (AI) model management and deployment. These features benefit OEMs by allowing them to focus on the development of features and applications that truly elevate their connected products.

Building on the first release of IoTConnect on AWS launched in February, this second release helps OEMs of IoT solutions design their products more efficiently and reduce their time to market by more than 50%.

Avnet’s IoTConnect platform is created to seamlessly connect devices and gain insights from the collected data to make better business decisions. This full-fledged platform as a Service (PaaS) allows for device communication and management, data storage, app creation, and enablement of robust security protocols.

Clear-Vu, a market leader in the design, development, and manufacturing of innovative LED lighting, is embracing Avnet’s IoTConnect. “We are excited to work with Avnet and leverage the power of AWS, as their robust hardware and cloud capabilities are poised to accelerate our continual journey towards creating innovative lighting solutions,” said Nick Russo, national director of Sales at Clear-Vu. “Their combined expertise in creating connected solutions and scalable infrastructure should enable us to enhance our product offerings and create transformative experiences for our customers.”

This IoTConnect platform addresses the challenges that come with cloud-connected solutions like scalability, reliability, maintenance, and security, making it easier for OEMs to bring their products to market quickly and successfully.

“Today’s second release of IoTConnect on AWS significantly expands the features available for OEMs to design, build, deploy, and manage cloud-connected devices, applications, and solutions at scale,” said Lou Lutostanski, vice president of IoT, Avnet. “To further reduce OEMs’ development time, Avnet has also teamed up with leading microcontroller manufacturers to pre-connect their hardware solutions to IoTConnect.”

“Collaboration with Avnet is instrumental in AWS’s mission to accelerate and empower customers with IoT solutions that mitigate the complexities that hinder their journey to market,” said Yasser Alsaied, vice president of IoT at AWS. “Together, we are driving innovation, enabling OEMs to build IoT solutions from edge to cloud with ease and at scale.”

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Kollmorgen expands its line of certified explosion proof products with new ATEX and IECEx/cETLus status for Goldline high-voltage servo motors

ELE Times - Срд, 08/02/2023 - 12:18

For hazardous locations that require use of an explosion-proof motor, Kollmorgen’s Goldline EB series of ATEX Certified and IECEx/cETLus Listed servo motors now includes the 480 Vac Goldline EBH.

Kollmorgen, a global leader in motion control systems, announced ATEX certification and IECEx/cETLus listing for the explosion-proof Goldline EBH 480 Vac servo motor. These new explosion-proof approvals for the high-voltage Goldline EBH servo motor exemplify Kollmorgen’s commitment to advancing the state of the art in motion control and meeting the most demanding application requirements. The high-voltage Goldline EBH servo motor joins a broad selection of Kollmorgen explosion-proof motors certified and listed according to UL, ATEX, IECEx, and/or CSA standards. Explosion-proof motors are required in hazardous locations where flammable gases, mists, or vapors may exist in explosive or ignitable concentrations. Such environments are often found in mines, oil & gas refineries, textile mills, and industrial paint booths.

For high-voltage applications in hazardous locations, Goldline EBH servo motors offer speeds up to 7,500 rpm with exceptionally high torque density for maximum performance in a minimal installation footprint. Rugged resolver feedback and a built-in thermostat support reliable operation under harsh environmental conditions. Goldline EBH servo motors in frame sizes 1 – 6 join other explosion-proof motors in the Goldline EB family that meet ATEX/IECEx standards, and more specifically CE 0081 Ex II 2 G Ex d IIB T3 Gb –40ºC ≤ Ta ≤ 40ºC. This classification indicates that the motors are suitable for use in any above-ground industry where easily ignited gases such as ethylene are likely to be present in the atmosphere for 10 to 1,000 hours/year during normal operation (Zones 1 and 2). Kollmorgen applies a flameproof method of protection to the motor so that any internal ignition is contained within the motor housing without the possibility of escape into the external atmosphere. The maximum surface temperature of the motor under fault conditions is 200°C.

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Netskope Introduces SkopeAI: Revolutionary AI-Driven Security for the Future of Data Protection and Cyber Threat Defense

ELE Times - Срд, 08/02/2023 - 12:03

Overcoming complexity and the limitations of legacy tools unable to keep pace with the speed of AI, SkopeAI democratizes advanced data protection for every user

Netskope, a leader in Secure Access Service Edge (SASE), announced new solution offerings from SkopeAI, the Netskope suite of artificial intelligence and machine learning (AI/ML) innovations available across the Netskope portfolio. SkopeAI capabilities use AI/ML to deliver modern data protection and cyber threat defense, overcoming the limitations of conventional security technologies and providing protection using AI-speed techniques not found in products from other SASE vendors.

The role of AI/ML innovation in improving data protection and threat defense is urgent and pervasive. According to IDC projections, nearly 80% of an estimated 175 zettabytes of data by 2025 will be unstructured, meaning the data will be in such forms as screenshot images, generative AI application prompts, messages in collaboration apps, and numerous others that legacy protection tools can’t adequately identify or analyze, let alone protect.

At the same time, the continued enactment of privacy compliance regulations makes the safeguarding of sensitive data non-negotiable for every business, even as enterprises worldwide also confront critical questions of effectively using AI while safeguarding against its dangers. According to data from Netskope Threat Labs’ latest Cloud & Threat Report, generative AI app use in the enterprise is rapidly increasing—up 22.5% over the past few months—with organizations of 10,000 users or more accessing at least five generative AI apps daily. Among those users, source code is being posted to the most popular generative AI app, ChatGPT, at a concerning rate of 158 incidents per month.

Enter SkopeAI. SkopeAI innovations in the Netskope unified SASE platform use AI/ML to leapfrog traditional security, protect enterprises from AI-generated threats and data loss from the misuse of ChatGPT and other popular generative AI tools, and bring data protection and threat defense techniques into the modern era with unprecedented speed and simplicity. Unique SkopeAI capabilities include:

  • Deep contextual awareness enabling advanced DLP to identify, analyze, and protect structured and unstructured data
  • Automated ML data classification and Train Your Own Classifiers (TYOC) technology, which automatically identifies and categories new data based on a “train-and-forget” approach, ensuring data protection adapts and applies well beyond what standard data identification can achieve
  • AI-based threat protection, which provides unparalleled speed and exceptional results in detecting a wide range of threats, including multifarious attacks, polymorphic malware, novel phishing web domains, zero-day threats, and malicious web content
  • The recent expansion of Netskope Intelligent SSE to provide safe enterprise enablement of generative AI applications such as ChatGPT using advanced data protection techniques
  • AI-driven SD-WAN operations, which proactively monitor the network, provide predictive insights, simplify management, minimize support tickets, and troubleshoot devices remotely, resulting in improved network performance and user experience.

“Forward-thinking technology companies such as Netskope were using AI and ML for security innovation long before it was trendy to say so—it’s been in our products since the day Netskope was founded,” said Sanjay Beri, CEO and co-founder, Netskope. “But only Netskope has fully aligned the use of AI/ML with the needs of modern security and threat defense—democratizing access to data security techniques that move at speeds the era of AI now requires. SkopeAI unleashes the power of AI/ML to protect structured and unstructured data and defend enterprises from ever-evolving threats.”

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Coherent appoints Christopher Dorman as executive VP, Lasers Business

Semiconductor today - Срд, 08/02/2023 - 11:48
Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA says that Dr Christopher Dorman has been named executive VP, Lasers Business. He is responsible for the Lasers Segment across the markets of precision manufacturing, semiconductor & display capital equipment, life sciences, and scientific instruments, driving operational excellence and customer focus...

Coherent ships 200 billionth VCSEL emitter for sensing

Semiconductor today - Срд, 08/02/2023 - 11:31
Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA (formerly II-VI Inc before it acquired Coherent in July 2022) says that it has now shipped more than 200 billion vertical-cavity surface-emitting laser (VCSEL) emitters to date for sensing applications...

OMRON Automation Launches New Collaborative Robot TM20 for Heavy Payloads in India

ELE Times - Срд, 08/02/2023 - 10:43

OMRON, a leading provider of end-to-end industrial automation solutions, has announced the launch of its new OMRON TM20 cobot with a payload of 20 kg. The new cobot is well-equipped to automate palletizing, machine tending, and material handling whilst managing heavy payloads.

The robot is the latest addition to the OMRON family of TM cobots, which are well renowned for their ease of use, reliability, and safety in industries such as food & beverage manufacturing, environment mobility, end-of-line packaging solution makers, and logistics solution providers to name just a few. Just like other robots of OMRON, this is also designed to work seamlessly with other OMRON products including sensors, controllers, and software, to provide a comprehensive automation solution for manufacturers.

Other unique traits of OMRON TM20 are its lightweight design- weighing in at just 33 kg, small footprint, and a reach of 1.3 meters that make it easier to integrate with mobile robots, providing greater flexibility and efficiency in industrial environments. The robot also comes equipped with special joint covers to protect it from cutting oil and other hazardous materials, making it suitable for use in machine tending applications, and an integrated camera (as an option) to identify & differentiate infeed production flow from mixed production lines.

Sameer Gandhi, MD, OMRON Automation expressed his enthusiasm for the launch of the OMRON TM20. “This new addition to our cobot family is to strengthen the value generation for our customers to make them automate heavy payload applications and achieve more out of their operations. It provides operators with relief from tasks that involve heavy lifting while ensuring that it operates safely alongside people. We look forward to collaborating with the right solution partners to co-create & develop advanced industrial solutions based on the human-machine collaborative technology the robot offers,” he shared.

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Renesas Embraces Microsoft Visual Studio Code Across Its Entire Industry-Leading MCU and MPU Lineup

ELE Times - Срд, 08/02/2023 - 10:35

Customers can now design and debug software for Renesas Embedded Processors in VS Code; Complements Renesas’ Own e2 studio IDE

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that customers can now use Microsoft® Visual Studio Code (VS Code) to program the complete line of Renesas microcontrollers (MCUs) and microprocessors (MPUs). Renesas has added tool extensions for all of its embedded processors to the Microsoft VS Code website, enabling a huge base of designers comfortable with the popular Integrated Development Environment (IDE) and code editor to work in their preferred environment.

The popular VS Code IDE simplifies and accelerates code editing across a variety of platforms and operating systems. By providing support for VS Code, Renesas now enables a vast number of designers to create efficient embedded solutions with Renesas devices. VS Code support complements Renesas’ own powerful and flexible e2 studio IDE used by thousands of designers worldwide.

Renesas now enables customers to develop and debug embedded software using Visual Studio Code for its 8/16-bit RL78 and 32-bit RA, RX, and RH850 MCUs, as well as its 64-bit RZ MPUs and R-Car family SoCs. Renesas embedded processors are targeted at automotive, IoT, industrial automation, home appliance, health care, and other applications.

“As the world’s leading MCU supplier, Renesas has a huge and loyal customer base, most of whom use our powerful e2 studio IDE to develop their applications,” said Akiya Fukui, Vice President and Head of the Software Development Division at Renesas. “By providing support for VS Code, we enable an even larger group of designers to develop embedded applications with Renesas embedded processors.”

“We welcome Renesas, a leader in the embedded processor market, to the Visual Studio Code community,” said Marc Goodner, Principal Product Manager, Microsoft. “The millions of developers using VS Code now have access to the very broad and efficient line of MCUs and MPUs from Renesas.”

Users can download VS Code free of charge, including access to the source code. They can use the GitHub pull request extension to make a source repository, then review and edit source code using VS Code. They can also utilize evolving extension features with simple user interface or flexible command interfaces.

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Wipro’s State of Cybersecurity Report Highlights the Emerging Challenges for CISOs

ELE Times - Срд, 08/02/2023 - 10:17

The rapid rollout of AI and other disruptive technologies is creating unprecedented cybersecurity challenges for enterprises in all industries

Wipro Limited, a leading technology services and consulting company, released the 2023 edition of its State of Cybersecurity Report (#SOCR). The report presents an in-depth look at cybersecurity trends across three geographies and seven industry sectors. It gives security leaders valuable insights on industry trends, allowing them to benchmark their cyber journey against their peers and determine actions they need to take to achieve cyber resilience in the future.

“CISOs are facing unprecedented disruptive changes across the cybersecurity landscape,” said Tony Buffomante, Senior Vice President & Global Head – Cybersecurity & Risk Services (CRS), Wipro Limited. “Just as the cloud adoption journey is starting to mature, the new frontier of generative AI has data flowing faster in an environment without boundaries or developed controls. Wipro is uniquely positioned to help clients navigate this new frontier.”  

Wipro’s findings summarize the current state of cybersecurity within four pillars of resilience:

  • Cyber-attacks, breaches, and law
  • Enterprise cyber capabilities
  • Collaboration
  • Future of cybersecurity

“Political and economic uncertainties, coupled with the rise of sophisticated new technologies, including generative AI and machine learning, is creating a widening cyber resiliency gap within many enterprises,” said Josey George, SOCR Editor, General Manager, Strategy and M&A, Wipro CRS. “The insights and recommendations in the SOCR will help organizations identify security, risk, and compliance concerns and provide a path to achieving more resilient operations that can support strategic, business-aligned objectives.”

The report included responses from the security leadership of 345 organizations across the US, Europe, Asia Pacific Middle East, and Africa regions, who responded to 30 questions around trends, governance, security practices, collaboration, and best practices. The Wipro analysis of nation-state attacks is based on 1,110+ attack data points gathered by the Council on Foreign Relations. Insights on breach notification and global data-transfer laws are based on data aggregated from multiple laws and government websites regarding regulations in 23 countries. Finally, the Wipro research team analyzed more than 24,900 global patent filings across 21 countries.

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Advanced Packaging Inspection at SEMICON Taiwan 2023

ELE Times - Срд, 08/02/2023 - 09:44

[July 31, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 6 – 8, 2023. Visit booth #I2800 to experience the latest in Smart Factory Semiconductor Inspection.

TRI’s AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

Image 2

TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI’s latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI’s innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

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Visit TRI’s Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI’s SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.

About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.

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Startup HaiLa Aims Its Ambient IoT Tech at a ‘No Batteries’ IoT Future

AAC - Срд, 08/02/2023 - 02:00
Emerging from stealth mode, HaiLa believes they can enable a future of IoT nodes without batteries.

Take Our 2023 EETech Global Engineering Survey

AAC - Втр, 08/01/2023 - 22:00
We’d like you to join your engineering community peers and take our EETech 2023 Global Engineering Survey. You’ll get a summary of the results once they’re released. Do it, and you’ll be entered for a chance to win an Amazon card prize!

Graphene FET Tests Multiple Diseases On Chip at Once

AAC - Втр, 08/01/2023 - 20:00
Archer Materials’ latest device uses ultra-thin graphene to detect multiple diseases on one chip. The next goal: a reconfigurable biochip.

Extending the resolution of a peripheral DAC

EDN Network - Втр, 08/01/2023 - 17:27

The 8-bit resolution of a peripheral DAC (such as the ATtiny family, for instance) is often insufficient. Let’s see how the problem can be solved using on-chip resources.

The circuit in Figure 1 shows a method to improve the resolution of a peripheral DAC. The circuit also reduces output resistance of the DAC and can reduce its offset (which is rather pronounced for ATtinyx17).

Figure 1: Circuit used to improve the resolution of a peripheral DAC while also reducing the output resistance and offset of the DAC.

Wow the engineering world with your unique design: Design Ideas Submission Guide

This simple approach is fully static (needs no additional capacitors with their imperfections and charge refreshing), it preserves the monotonicity of the original DAC, but may require some tuning to achieve the best linearity.

To add one more bit you can use any free port of your MPU, in Figure 1, this port is marked as Pxn (x=A … C, n=0 … 7). (And yes, you can add more than one bit this way.)

Note: The port Pxn should be configured as an output before using it as an extra bit for the DAC. Also have in mind those very useful instructions in AVR ASM, which can selectively change one bit in a row.  

The bit of the Pxn can be used as a new most significant bit (MSb), or a new least significant bit (LSb)—a detailed description of the last case is given below.

To maintain the integrity of the output, both the DAC0 and the Pxn should have the same headroom on their outputs. The easiest way to secure this is to choose +VDD as VREF for the DAC. Of course, the value of +VDD has to be well-regulated in this case.

The op amp should provide sufficient speed and precision where the total added error at the output of the op amp is:

Er = Vos * (1 + R5 / Req),

where Vos is the offset voltage of op amp and Req = R1||R3 (approximately).

The value of Er should be at least less than 1 LSb of the modified DAC.

The minimal voltage on DAC0 OUT is about 0.2 V (for ATtinyx17).  If this offset is okay for your application, you can exclude resistors R3 and R4, and use only one +E supply, nevertheless, the op amp should have: a rail-to-rail output, a sufficient precision, and be able to work with near zero input.

To reduce the minimal value of e0 to zero, you must zero the output with the resistors R3 and R4 while DAC0 gets its zero code.

The values of all resistors can be calculated as follows:

R1 ≥ 5.6k (the requirement from the datasheet of  ATtinyx17).

Let N bits be the original DAC resolution. Then:  

R2 = R1 * 2^(N+1) (some final tuning may provide the better result).

Since the minimal voltage on DAC0 OUT is about 0.2 V,  

R3 + (R4/2) = 5*R1 / 0.2 (If VDD = E = 5 V)

R3 = 0.8*(5*R1 / 0.2)

R4 = R3 / 2 (R4 is a multi-turn pot).

The resistor R5 can easily conform the DAC output to the values expected by an application.  

Some efforts may be required in the program code to synchronize the DAC0 OUT and Pxn, albeit there are applications which can tolerate the de-synchronization if it is not very large (less than tens of microseconds).

Note: the output of the op amp is inverted compared to the DAC0 OUT (hence the sign “-” before e0 in Figure 1).  You can cope with this by adding an inverter (op amp) to the output, or by making a change in the code, which may be a better solution.

You should not expect that the previous maximal value of the conversion rate would be left unchanged. Every next added bit means a resistance that is twice as large as well as some added capacitance in the summing node.

So, the settling time will be unavoidably larger with every expansion bit added.  

To reduce a parasitic capacitance in the inverting node of the op amp the resistors R1, R2, R3, and R5 should be placed close to the inverting input.  

Sometimes to optimize the performance of the DAC (to compensate the amplifier), the capacitor C3 (10-40 pF) has to be connected in parallel with R5.  

Peter Demchenko studied math at the University of Vilnius and has worked in software development.

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Fraunhofer IAF-led GaN4EmoBiL project targets bidirectional charging for EVs

Semiconductor today - Втр, 08/01/2023 - 15:43
Funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK) as part of the Elektro-Mobil program, the three-year research project ‘GaN4EmoBiL — GaN power semiconductors for electro-mobility and system integration through bidirectional charging’ was launched in mid-July, led by Fraunhofer Institute for Applied Solid State Physics IAF and joined by consortium partners the University of Stuttgart, Robert Bosch GmbH and Ambibox GmbH...

Applied Materials Announces Engagement with Industry Stakeholders for Its Planned Collaborative Center in India

ELE Times - Втр, 08/01/2023 - 14:36

Planned center to bring together global and domestic suppliers and academic institutions to accelerate the development and commercialization of technology for semiconductor manufacturing equipment, enabling India’s readiness for a high-volume manufacturing ecosystem

Applied Materials, Inc. announced the company’s engagement with more than 40 suppliers and academic institutions as part of the company’s planned collaborative engineering center in Bengaluru. Participating at SemiconIndia 2023, the company is focusing on close collaboration among the country’s top engineers, academia, and suppliers to accelerate innovation in semiconductor manufacturing equipment technologies and build a robust domestic semiconductor ecosystem. The planned center aims to harness the collective expertise of the industry stakeholders and spearhead breakthrough ideas related to India’s domestic semiconductor supply chain and talent development.

Applied aims to reduce the time to commercialization and develop a sustainable semiconductor ecosystem in India. Through its engagement with leading global semiconductor supplier organizations, the center will be designed to provide access to advanced equipment and processes for suppliers to test and validate their solutions, while also creating opportunities to co-innovate, develop, and test equipment subsystems and components to accelerate cycles of learning and speed up the adoption of new concepts. Supporting the objective, Applied is also partnering with top-tier universities and institutions both for innovation and to help develop a capable workforce to support the domestic semiconductor ecosystem.

“This is a pivotal moment for India to position itself as a key player in the global semiconductor landscape,” said Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “The establishment of Applied’s collaborative engineering center will be a significant milestone in our commitment to fostering innovation and collaboration in the semiconductor ecosystem in India. The center will promote synergy among industry stakeholders and cultivate a culture of technical research, skill development, and knowledge sharing.”

“We have embarked on a transformative journey to power India’s semiconductor mission,” said Srinivas Satya, Country President of Applied Materials India. “Our objective is to change the way we engage with chipmakers, universities, and other partners to enhance time to market, reduce R&D costs and increase the overall success rate of new technologies. Simultaneously, the center will provide guidance and technical expertise to semiconductor companies, assisting them in developing high-quality, cost-effective semiconductor products that cater to global and domestic markets while generating employment opportunities across various skill levels.”

Applied’s planned center is an integral part of the company’s global innovation approach and is designed to fundamentally change the way chips are made. The benefits of establishing the center in India will extend beyond the country’s domestic semiconductor ecosystem and contribute actively to the global semiconductor industry. With its rich pool of skilled engineers, strong academic foundation, and strategic supply chain partners, India is well-positioned to drive innovation in the global market. In its first five years of operation, the center is expected to create at least 500 new advanced engineering jobs along with potentially another 2,500 jobs in the manufacturing ecosystem.

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SEMI Announces Intent to Host SEMICON India in Partnership with India Semiconductor Mission (ISM), India

ELE Times - Втр, 08/01/2023 - 14:02

India Semiconductor Mission (ISM) Provides Key Endorsement of Event

SEMI announced its intent to support the India Semiconductor Mission (ISM) in creating a vibrant semiconductor manufacturing and design ecosystem in India. The collaboration would build on the successful execution of ISM’s two editions of SemiconIndia and continue SEMI’s tradition of bringing together stakeholders in the global end-to-end semiconductor ecosystem. A Memorandum of Understanding (MOU) is under development.

SEMI is in discussions with Electronic Industries Association of India (ELCINA) and Messe München India (MMI) as key partners to stage its flagship event.

The ISM has noted that SEMICON India would be highly complementary to efforts by the government of India to advance the domestic semiconductor ecosystem and connect to the global industry.

“For more than 50 years, the SEMICON platform has connected companies from across the global semiconductor industry to uncover new business opportunities, gain insights into market and technology trends, and collaborate to drive innovation and address top electronics industry challenges,” said Ajit Manocha, SEMI President and CEO. “With SEMI recognized worldwide as a key enabler of industry growth, the establishment of SEMICON India marks a significant step forward for the region.”

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The partnership will give Indian semiconductor and electronics companies access to more than 2,500 SEMI member companies across the global semiconductor and electronics manufacturing and design supply chain. Additionally, SEMICON India will provide a platform for stakeholder participation in critical SEMI initiatives across areas including Workforce Development, Sustainability and Supply Chain Management to advance industry growth.

“India is all set as the next destination on the global map for semiconductor manufacturing,” said Bhupinder Singh, CEO of Messe München India. “We applaud initiatives by the India Semiconductor Mission to establish semiconductor design, manufacturing, packaging, capacity building as well as R&D in the region. Messe München India looks forward to work with SEMI to organize SEMICON India in collaboration with ELCINA, a partnership that is a natural extension of the longstanding work between Messe München and SEMI to stage events in Europe and China. Staying true to our purpose of enabling meaningful handshakes and unlocking business opportunities. This platform will integrate upstream and downstream value chains for wafer fabs and OSATs and help the India semiconductor and electronics industry become more self-reliant.”

“The semiconductor industry has taken centre stage in the electronic systems design and manufacturing ecosystem,” said Sanjay Agarwal, President of ELCINA and Managing Director at Globe Capacitors Ltd. “The industry is a strategic, vital enabler of economic growth in India. Coming together with SEMI as our partner is of great value as together we can strengthen the semiconductor industry in India and become a trusted partner to chip companies worldwide. We look forward to working with SEMI and leveraging our existing partnership with Messe München to make SEMICON India a grand success.”

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